M424336 五、新型說明： 【新型所屬之技術領域】 一種電鍵裝置’特別疋指一種電鑛槽。 【先前技術】 於一般電鍍加工作業中’即指一種藉助外界直 流電之作用’於溶液中進行電解反應，以使導電體 表面沉積金屬或合金層。而在進行電鍍加工作業 時，主要係利用電極之正極（陽極）接續於電鍍液 中’並將電極之負極（陰極）與具導電性之被加工物 相接續’當電流導通時’可藉由陽極導體之作用， 使電路回路接通，並使溶液中帶有正電之金屬離子 (陽離子）朝向電路之負極游動，並在被加工物之表 面（陰極）還原’以在適當時間之作用下構成一足以 將被加工物表面覆蓋之電鍍層。 然而，由於在一般電鍍槽中，其電流之負極（陰 極）係與被加工物一同沉浸在中央位置處，而電流之 正極（陽極）接續於電鍍槽中相對應於被加工物之外 側位置處，以至於電流導通時無法有效控制陽離子 之游移方向’而容易因為邊際效應的作用，使電錄 層集令在被加工物與電流正極距離最近之位置處， 而造成電鍍層不均勻的現象，影響整體電鍍加工之 品質。 此外’由於使用於電路板之主要電鍍材為金或 3 M424336 銅，隨著電鍍材價格因供需需求不足而逐年上昇， 而電鍍材主要係供電鐘於電路板之正s係'可發揮其 功此，右電鍍於電路板之背面，則僅造成電鍍材之 耗4貝及成本的上昇。 【新型内容】 本創作之主要目的，旨在提供一種電鍍槽其 可藉由調整元件來調整陰極電鍍板與陽極電鍍板之 間距’使電鍍層能均勻電鍍於電路板上。 為達上述目的’本創作之電鍍槽，其係包含一 槽體、一陽極電鑛板及一陰極電鍍板。該槽體供容 置一電鍍液。該槽體之兩側邊分別形成一插槽。該 陽極電鍍板係設置於該槽體内。該陰極電鑛板設置 於該槽體内’該陰極電路板包括一予桿及一電路板 承載體。該吊桿之兩端分別架設於該插槽内β該電 路板承載體係掛設於該吊桿上，當該陰極電鍍板置 於該槽體内時，該陰極電鑛板係將該槽體分隔成兩 區域。 其中’該電鍍槽更具有至少一電鍍液導流裝 置，該電鍍液導流裝置係設於該陽極電鍍板之一側。 其中，該電鍍液導流裝置具有一喷嘴及一孔 蓋，該孔蓋係蓋設於該喷嘴之一側。 實施方式】 為使貴審查委員能清楚了解本創作之内容，謹 以下列説明搭配圖式，敬請參閱。 請參閱第1圖、第2圖及第3圖所示，其係為 本創作電鍍槽之結構示意圖、其陰極電路板示意圖 及其電鍍液導流裝置示意圖。圖中，該電鐘槽1包 含--槽體11、複數彳固極電錄板12、一陰極電鍵板 i 3及複數個電鍍液導流裝置14。 該槽體11係供容置一電鍍液2,且該槽體21之 兩側邊係分別形成一插槽111。 該等陽極電鍍板12設置於該槽體11内，並部 份浸泡於該電鍵液2内’且該等陽極電路板12係掛 設於一陽極棒3上。其中，每一該等陽極電鍍板12 設有一電網1 21 ’該電網1 2 1係呈網格狀。 該陰極電路板13設於該槽體11内，部份浸泡 於該電鍍液2内’並位於該等陽極電鍍板I]之間， 且該陰極電路板1 3與一陰極棒4電性連接。其中， 該陰極電链板13包括一予桿131及一電路板承載體 132。其中，該陽極棒3及該陰極棒4係電性連接一 供電設備（圖未示）上，以提供該陽極電鍍板12及該 陰極電鍍板13所需之電力。 該吊桿131係掛設於該陰極棒4上。該電路板 承載體132則掛設於該吊桿131上，可供承載一電 路板5,該電路板承載體132更具有一框體i32i。 M424336 其中’該電路板承載體132之寬度約等於或略小於 該槽體11之寬度，而可供當該電路板承載體132插 設於該槽體11内時，洽可將該槽體u分隔成兩區 域。 每一該等電鍍液2導流裝置，該電鍍液導流裝 置14係設於其中一該陽極電鍍板I]之一側。其中， 每一該電鍍液導流裝置14具有一喷嘴141及一孔蓋 142。該孔蓋142蓋設於該喷嘴ι41之一側，且該孔 蓋142相對該喷嘴i 4丨之側壁面形成一導流曲面 1421。 請一併參照第4圖及第5圖，其係為本創作電 鍵槽作動示意圖及陰極電鍍板排液示意圖。當該電 鍵槽1開始運作時’則該電鍍液導流裝置1 4之喷嘴 朝該陽極電鍍板12及該陰極電鍍板13喷射電鍍 液’使该電錄液2回流流動於該電鍍槽1内。此時， 電鑛液1内之金屬陽離子，受到該等陽極電鍵板12 及該陰極電鍍板13之電極電性作用，朝該陰極電鍍 板13游移’而電鍍至位於該電路板上。由於該電鍍 板承載體132係將該槽體11分隔成兩區域，以避免 位於該電路板5正面之電鍍液迴流至該電路板5之 背面’以減少電鍍基材電鍍於該電路板5背面之厚 度’藉以解省電鍍耗材’降低生產成本。 此外，由於設置於該陽極電鍍板12之電網呈網 格狀，而能發揮擾流作用，使由該電鑛液導流裝置 6 M424336 14所喷出之電鍍液受擾流後均勻擴散至該電路板5 之周圍。 綜上所述’本創作電鍍槽，其功效在於藉由使 陰極電鍍板置入電鍍槽時’將電鍍槽分隔成兩區 域’使大部份之電解基材均電鍍於電路板之正面 上’減少電路板背面電鍍層之厚度，以減少電鍍基 材之耗費，進而降低製造成本。 唯，以上所述者，僅為本創作之較佳實施例而 已，並非用以限定本創作實施之範圍，在不脫離本 創作之精神與範圍下所作之均等變化與修飾，皆應 涵蓋於本創作之專利範圍内。 综上所述，本創作之電鍍槽，係具有專利之創 作性’及對產業的利用價值；巾請人爰依專利法之 規疋向狗局提起新型專利之申請。 M424336 【圖式簡單說明】 第1圖，為本創作電鍍槽之結構示意圖。 第2圖，為本創作電鍍槽其陰極電路板示意圖。 第3圖，為本創作陰極電路槽之電路液導流裝置示 意圖》 第4圖，為本創作電鍍槽使用狀態示意圖。 第5圖，為本創作電鍍槽陰極電鍍板之導液斜面示 意圖。 【主要元件符號說明】 I 電鍍槽 II 槽體 12 陽極電鍍板 13 陰極電鍍板 1 3 1 吊桿 132 電路板承載體 1321 框體 14 電鍍液導流裝置 141 喷嘴 142 孔蓋 1421 導流曲面 2 電鍍液 3 陽極棒 陰極棒 4M424336 V. New description: [New technical field] A type of electric key device 'specially refers to an electric ore tank. [Prior Art] In a general electroplating process, an electrolysis reaction is carried out in a solution by means of the action of external DC current to deposit a metal or alloy layer on the surface of the conductor. In the electroplating process, the positive electrode (anode) of the electrode is connected to the electroplating solution and the negative electrode (cathode) of the electrode is connected to the electrically conductive workpiece. When the current is turned on, The function of the anode conductor is to make the circuit loop open, and the positively charged metal ions (cations) in the solution swim toward the cathode of the circuit and restore on the surface (cathode) of the workpiece to act at the appropriate time. The lower layer constitutes a plating layer sufficient to cover the surface of the workpiece. However, since in the general plating bath, the negative electrode (cathode) of the current is immersed in the central position together with the workpiece, and the positive electrode (anode) of the current continues in the plating bath corresponding to the outer side of the workpiece. Therefore, the current cannot be effectively controlled when the current is turned on, and it is easy to make the electro-recording layer gather at the position closest to the current positive electrode due to the effect of the marginal effect, thereby causing uneven plating phenomenon. Affect the quality of the overall plating process. In addition, because the main plating material used for the circuit board is gold or 3 M424336 copper, the price of the plating material is increasing year by year due to insufficient supply and demand, and the plating material is mainly the power supply clock in the positive s of the circuit board. Therefore, the right plating on the back side of the circuit board only causes the plating material to consume 4 lbs and the cost rises. [New content] The main purpose of this creation is to provide a plating bath which can adjust the spacing between the cathode plating plate and the anode plating plate by adjusting the components to enable the plating layer to be uniformly plated on the circuit board. In order to achieve the above purpose, the electroplating bath of the present invention comprises a tank body, an anode electrode plate and a cathode plating plate. The tank is provided with a plating solution. A slot is formed on each side of the slot body. The anodized plate is disposed in the tank. The cathode electrode plate is disposed in the tank body. The cathode circuit board includes a pre-rod and a circuit board carrier. The two ends of the boom are respectively mounted in the slot. The circuit board carrying system is mounted on the boom. When the cathode plating plate is placed in the slot, the cathode plate is the slot. Divided into two areas. Wherein the plating bath further has at least one plating liquid guiding device, and the plating liquid guiding device is disposed on one side of the anode plating plate. Wherein, the plating liquid guiding device has a nozzle and a hole cover, and the hole cover is disposed on one side of the nozzle. Implementation Mode] In order to make your reviewer understand the content of this creation, please refer to the following description. Please refer to Fig. 1, Fig. 2 and Fig. 3, which are schematic diagrams of the structure of the electroplating bath, schematic diagram of the cathode circuit board and schematic diagram of the electroplating liquid guiding device. In the figure, the electric clock slot 1 comprises a trough body 11, a plurality of crucible solid magnetic recording plates 12, a cathode electric key plate i3 and a plurality of electroplating liquid guiding devices 14. The tank body 11 is for accommodating a plating solution 2, and the two sides of the tank body 21 respectively form a slot 111. The anode plating plates 12 are disposed in the tank body 11 and partially immersed in the electric button liquid 2, and the anode circuit boards 12 are attached to an anode rod 3. Each of the anode plated plates 12 is provided with a grid 1 21 '. The grid 1 2 1 is in a grid shape. The cathode circuit board 13 is disposed in the tank body 11 and partially immersed in the plating solution 2 and located between the anode plating plates I], and the cathode circuit board 13 is electrically connected to a cathode rod 4. . The cathode electric chain plate 13 includes a pre-lature 131 and a circuit board carrier 132. The anode rod 3 and the cathode rod 4 are electrically connected to a power supply device (not shown) to provide power required for the anode plated plate 12 and the cathode plated plate 13. The boom 131 is suspended from the cathode rod 4. The circuit board carrier 132 is mounted on the boom 131 for carrying a circuit board 5. The circuit board carrier 132 further has a frame i32i. M424336, wherein the width of the circuit board carrier 132 is approximately equal to or slightly smaller than the width of the slot body 11, and the slot body u can be used when the circuit board carrier 132 is inserted into the slot body 11. Divided into two areas. Each of the plating solution 2 flow guiding devices 14 is disposed on one side of one of the anode plating plates I]. Each of the plating liquid guiding devices 14 has a nozzle 141 and a hole cover 142. The hole cover 142 is disposed on one side of the nozzle ι41, and the hole cover 142 forms a flow guiding surface 1421 with respect to the side wall surface of the nozzle i4. Please refer to Fig. 4 and Fig. 5 together, which is a schematic diagram of the operation of the creative keyway and a schematic diagram of the discharge of the cathode plating plate. When the keyway 1 starts to operate, the nozzle of the plating liquid guiding device 14 sprays the plating solution toward the anode plating plate 12 and the cathode plating plate 13 to cause the electric recording liquid 2 to flow back into the plating tank 1. . At this time, the metal cations in the electro-mineral liquid 1 are electrically affected by the electrodes of the anode key plates 12 and the cathode plating plate 13, and are moved toward the cathode plating plate 13 to be plated onto the circuit board. Since the plating plate carrier 132 separates the groove body 11 into two regions, the plating solution located on the front surface of the circuit board 5 is prevented from flowing back to the back surface of the circuit board 5 to reduce plating of the plating substrate on the back surface of the circuit board 5. The thickness 'to save on plating consumables' reduces production costs. In addition, since the power grid disposed on the anode plating plate 12 is in a grid shape, the turbulence effect can be exerted, and the plating solution sprayed by the electric mineral liquid guiding device 6 M424336 14 is uniformly diffused to the plating solution. Around the board 5. In summary, the effect of the present electroplating bath is that by placing the cathode plating plate into the plating bath, the electroplating bath is divided into two regions, so that most of the electrolytic substrate is plated on the front side of the circuit board. The thickness of the plating layer on the back side of the circuit board is reduced to reduce the cost of the plating substrate, thereby reducing the manufacturing cost. The above descriptions are only for the preferred embodiment of the present invention, and are not intended to limit the scope of the present invention, and the equivalent changes and modifications made without departing from the spirit and scope of the present invention should be included in the present disclosure. Within the scope of the creation of the patent. In summary, the electroplating tank of this creation has the patented creation 'and the value of the use of the industry; the towel invites people to apply for a new type of patent to the dog bureau according to the rules of the patent law. M424336 [Simple description of the diagram] Figure 1 is a schematic diagram of the structure of the electroplating bath. Figure 2 is a schematic diagram of the cathode circuit board of the electroplating bath. Fig. 3 is a schematic view of the circuit liquid guiding device of the cathode circuit slot of the present invention, and Fig. 4 is a schematic view showing the state of use of the electroplating bath. Fig. 5 is a schematic view showing the liquid guiding slope of the cathode plating plate of the electroplating bath. [Main component symbol description] I Plating tank II Tank 12 Anode plating plate 13 Cathodic plating plate 1 3 1 Boom 132 Circuit board carrier 1321 Frame 14 Plating liquid guiding device 141 Nozzle 142 Hole cover 1421 Guide surface 2 Plating Liquid 3 anode rod cathode rod 4