M400483 五、新型說明：M400483 V. New description:
[0001] 【新型所屬之技術領域】 本新型涉及電鍍技術領域，尤其涉及 勻性之電鍍裝置。 一種可提高電鍍均 【先前技術】 剛電㈣、指剌電解裝£，湘氧化還觀縣理將包括 陽極金屬之㈣電鍍液中之陽極，離子還原成金屬單 質’並使金屬單質沈積於待絲工件表㈣成錄層之表 面加工方法。所述電解裝置包括與電源正極相連通之陽 極、與電源負極相連通之陰極以及用於盛裝電鍍液之電 鍵槽。通常，所述陽極為陽極金屬棒1述陽極金屬棒 浸沒於電舰中，料生成郝輕離子，並補充電錢 液中之陽極金屬離子含量’從而維持電錢液中之陽極金 屬離子濃度處於預定範圍内。 [0003]電鍍工藝廣泛用於製作電路板，詳情可參見文獻：[0001] Technical Field of the Invention The present invention relates to the field of electroplating technology, and more particularly to a plating apparatus for uniformity. One can improve electroplating. [Prior Art] Just electric (four), refers to the electrolysis of nickel, and the oxidation of the county will include the anode of the anode metal (4) electroplating solution, the ion is reduced to a metal element and the metal element is deposited. Wire workpiece table (4) Surface processing method for recording layer. The electrolysis device includes an anode in communication with the positive electrode of the power source, a cathode in communication with the negative electrode of the power source, and a keyway for holding the plating solution. Usually, the anode is an anode metal rod, and the anode metal rod is immersed in the electric ship to generate Hao light ions and supplement the anode metal ion content in the liquid money liquid to maintain the anode metal ion concentration in the liquid money liquid. Within the predetermined range. [0003] Electroplating processes are widely used to make circuit boards. For details, see the literature:
Cobley, D.R. Gabe； Methods f〇r achieving high speed acid copper electroplating in the PCB industry; Circuit World； 2〇〇l, Volume 27, Issue 3’ Page:19 _ 25。現有之待鍍基板常借 助於治具連接於陰極。所述治具具有與㈣基板接觸之 夾點。電鍵時’所述治具連接於電錄裝置之陰極，電流 可藉由治具之夾點到達待鍍基板表面以進行電鍵。惟， 電流自治具流入待鍍基板過程中存在電流密度不均現象 ，即，待鑛基板邊緣靠近治具夾點處之電流密度較大， 待鍍基板中心遠離治具夾點處之電流密度較小。根據法 表單煸號Α0101 第4頁/共24頁 I 099年 10月 拉第疋律，待鑛基板表面不同區域電流密度差異直接導 致形成於該待鍍基板表面之鍍層厚度分佈不均，即，待 鍍基板邊緣處鍍層之厚度較大，而待鍍基板中心處之厚 度較小。 【新型内容】 [0004] 有鑑於此，提供一種電鍍裝置，以提高電鍍之均勻性實 為必要。 [0005] 一種電鍍裝置，用於在基板之待鍍表面形成金屬鍍層， 所述電鍍裝置包括盛有電鍍液之電鍍槽、至少一陰極導 電桿、複數陽極導電桿與複數輔助陽極。所述至少一陰 極導電彳干、複數陽極導電桿與複數輔助陽極均浸沒於所 述電鑛液中。所述複數陽極導電桿依次平行排列。每一 陽極導電桿均設置有至少—輔助陽極，且該至少一輔助 陽極可沿陽極導電桿長度方向移動。所述触導電桿基 本垂直於複數陽極導電桿，所述陰極導電桿驗設置所 述基板，以使所述基板浸没於所述電鑛液中，且其待鍵 表面與複數陽極導電桿上之複數輔助陽極相對。 [剩纟技術方案之電鍵裝置之每一陽極導電桿均可移動地設 置有至少一輔助陽極，所迷基板之一待鑛表面正對複數 輔助陽極’從而使用該電越裝置時，可藉由調節正對待 錄表面之不同區域之輔助陽極與基板之間距而調節待鍍 表面不同區域之鑛層金屬之沈積量，使得待鑛表面之= 層金屬厚度均勻。 " 【實施方式】 表草編號麵1 丨5頁/共24頁 脚0483 [G33年10月12日按正替換ΐ _7]以下將結合關與實_，對本技術方案提供之電鍵裝 置進行詳細描述。 _8]本技術方案實_提供—種钱裝川，用於在基板之 待鍵表面形成金屬錢層。請一併參閱圖】至圖3，所述電 鍍裝置10包括盛有電鍍液1〇〇之電鍍槽丨丨、複數陽極匯流 桿12、複數陽極導電桿13、複數辅助陽極14、至少一陰 極導電桿15與至少-擋桿16。所述複數陽極匯流桿12、 複數陽極導電桿13、複數輔助陽極14、至少一陰極導電 才千15與至少一擋桿16均浸沒於所述電鑛液丨〇〇中。 _]所述電錄槽11可為一端不封口之長方形槽體。所述電鍍 槽11之橫截面為長方形，其具有一長度方向χ與一寬度方 向Υ。所述電鍍槽11還具有二深度方向Ζ,:。所述電鍍槽i丄 包括底板111、第一側板112、第二側板113、第三側板 114與第四側板115。所述第一側板112、第二側板113、 第二側板114與第四側板π 5首尾相接，所述底板111連 接於所述第一側板112、第二側板113、第三側板n4與 第四側板115之同一端。所述第一側板112與第三側板 114均沿長度方向X設置。所述第二側板11 3與第四側板 115均沿寬度方向γ設置。所述電鍵槽I!内之電銀液丨〇〇 之量以^沒所述複數％極匯流桿12 '至少一陰極導電桿 15、複數陽極導電桿13與複數輔助陽極14為宜。所述電 鍍液100可含硫酸銅。 [0010]所述複數陽極匯流桿12用於電連接於電源之正極。本實 施例中’所述陽極匯流桿12之數量為兩個，均沿所述電 錄槽11之長度方向X設置，其中一陽極匯流桿12靠近所述 表單編號A0101 第6頁/共24頁 [0011] 099年1〇月12日修正替换頁 第一側板112，另一陽極匯流桿丨2靠近第三侧板114 ◊所 述兩個陽極匯流桿12均為導電之長方體形桿，可藉由焊 接或螺釘固定於所述電鍍槽n之第二側板113與第四側板 115。 所述複數陽極導電桿13依次平行排列。每—陽極導電桿 13均包括導電桿體130、第一滑動結構131與第二滑動結 構132。所述陽極導電桿丨3可為長·方形桿。所述第一滑動 結構131包括自所述導電桿體13〇之一端垂直延伸之兩個 第一止播塊133，所述兩個第一止擋塊133與所述導電桿 體130之間共同構成第一滑槽134。所述第二滑動結構 1 3 2與所述第一滑動結構1 31相對。所述第二滑動結構 132包括自所述導電桿體130之另一端垂直延伸之兩個第 二止擋塊135，所述兩個第二止擋塊135與所述導電桿體 13 0之間共同構成第二滑槽1 3 6。使所述第一滑動結構 131之第一滑槽134與所述陽極匯流桿丨2相配合，從而將 所述第一滑動結構131可移動地結合於—陽極匯流桿12之 上方。使所述第二滑動結構132之第二滑槽136與另一陽 極匯流桿12相配合，從而將所述第二滑動結構132可移動 地結合於另一陽極匯流桿12之上方。優選地，所述第一 滑槽134與第二滑槽136之形狀分別與一陽極匯流桿12與 另一陽極匯流桿12之形狀相對應，從而第一滑動結構131 與一陽極匯流桿12之間' 第二滑動結構132與另一陽極匯 k杯12之間之配合更為牢固。本實施例中，所述陽極導 電桿13之數量為五個，該五個陽極導電桿13於所述兩個 陽極匯流桿12之間等間距排布。 表單編號Α0101 第7頁/共24頁 M400483 I 099年10月12 B癀正替換頁 [0012] 每一陽極導電桿1 3均可移動地設置有至少一輔助陽極1 4 ，所述基板之一待鍍表面正對複數輔助陽極14。每一輔 助陽極14均包括一收容筐140、至少一第一掛鈎141與複 數金屬塊（圖未示）。所述收容筐140可為一端不封口之 圓筒形狀，其包括相連接之側璧與底壁a所述侧壁與底 壁均為網狀，且均採用不銹鋼製成。所述側壁與底璧表 面鍍有金屬鈦以避免所述收容筐140本身沈積鍍層。所述 至少一第一掛鈎141自所述收容筐140不封口之一端延伸 ，用於與所述陽極導電桿13相結合。本實施例中，所述 第一掛鈎141之數量為兩個。所述複數金屬塊均收容於所 述收容筐140，所述複數金屬塊用於在電鍍液之作用下產 生金屬陽離子。由於所述複數陽極導電桿13均可移動之 設置於所述兩個陽極匯流桿12之間，可藉由調節所述複 數陽極導電桿13於陽極匯流桿12長度方向之位置，使所 述複數陽極導電桿13於陽極匯流桿12長度方向之分佈範 圍大於或等於所述基板沿陽極匯流桿12長度方向之長度 ，從而使得基板之一待鍍表面正對多根陽極導電桿13上 之複數輔助陽極14。本實施例中，每一陽極導電桿13上 均設置有兩個輔助陽極14，所述兩個輔助陽極14分別位 於所述基板之相對之兩側，如此，可便於對基板之相對 之兩個待鍍表面進行電鍍。當然，每一陽極導電桿13上 亦可設置一輔助陽極14，如此可對基板之一待鍍表面進 行電鍍。若每一陽極導電桿13上設置三個或者更多輔助 陽極14，僅需增加陽極導電桿13之長度，並增設陰極導 電桿15，即可實現對同時多塊基板之複數待鍍表面進行 電鍍* 表單編號Α0101 第8頁/共24真 [0013] 099年10月12日修正 所述陰極導電桿15用於電連接於電源之負極。所述陰極 導電桿15基本垂直於複數陽極導電桿13，所述陰極導電 才干15用於設置所述基板，以使所述基板浸沒於所述電鍍 液100中’且其待鍍表面與複數陽極導電桿13上之複數輔 助陽極14相對。所述陰極導電桿15亦沿所述電鍍槽11之 長度方向X設置’且所述陰極導電桿15於電鍍槽丨丨之深度 方向z上應與所述兩個陽極匯流桿12位於同一高度或比所 述兩個陽極匯流桿12更靠近電鍍槽丨丨之底板1U。本實施 例中’所述陰極導電桿15亦為導電之長方體形桿，其於 電錄槽11之深度方向Z比所述兩個陽極匯流桿丨2更靠近電 鍍槽11之底板111。 [0014] 所述至少一擋桿16與所述至少一輔助陽極14 一一對應， 所述至少一擋桿16用於限制所述至少一輔助陽極Η與所 述陰極導電桿15之間距，以避免輔助陽極14過於靠近所 述陰極導電桿15而發生短路之現象β所述擋桿16為絕緣 材質’可採用丙烯腈-丁二烯-笨乙烯（Acryl〇nitrile butadiene styrene ’ ABS)或聚氣乙烯（Polyvinyh chloride ’ PVC)等製成。所述擋桿16亦沿所述電鍍槽 U之長度方向X設置，且所述撞桿16於電鍵槽Η之深度方 向Z上應與所述兩個陽極匯流桿12位於同一高度或比所述 兩個陽極匯流桿12更靠近電鍍槽11之底板hi。本實施例 中’所述擋桿16為圓柱體形’其於電鍍槽11之深度方向z 上比所述兩個陽極匯流桿12更靠近電鍍槽11之底板hi。 本實施例中，所述擋桿16之數量為兩個，分別位於所述 陰極導電桿15之兩側，且所述擋桿16於電鍍槽丨丨之深度 表單編珑A0101Cobley, D.R. Gabe; Methods f〇r achieving high speed acid copper electroplating in the PCB industry; Circuit World; 2〇〇l, Volume 27, Issue 3' Page: 19 _ 25. Existing substrates to be plated are often attached to the cathode by means of a fixture. The jig has a pinch point in contact with the (d) substrate. When the key is pressed, the jig is connected to the cathode of the electric recording device, and the current can reach the surface of the substrate to be plated by the pinch point of the jig to perform a key. However, the current density of the current autonomous device flowing into the substrate to be plated is uneven, that is, the current density at the edge of the substrate to be polished near the fixture is large, and the current density of the substrate to be plated is far from the clamp pin. small. According to the law form 煸 Α 0101 page 4 / total 24 pages I 099 October Ladrang law, the difference in current density in different areas of the surface of the substrate directly results in the uneven distribution of the thickness of the plating formed on the surface of the substrate to be plated, ie, The thickness of the plating layer at the edge of the substrate to be plated is large, and the thickness at the center of the substrate to be plated is small. [New Content] [0004] In view of the above, it is necessary to provide an electroplating apparatus to improve the uniformity of electroplating. [0005] A plating apparatus for forming a metal plating layer on a surface to be plated of a substrate, the plating apparatus comprising a plating tank containing a plating solution, at least one cathode conductive rod, a plurality of anode conductive rods, and a plurality of auxiliary anodes. The at least one cathode conductive dry, the plurality of anode conductive rods and the plurality of auxiliary anodes are both immersed in the electro-mineral liquid. The plurality of anode conductive rods are sequentially arranged in parallel. Each of the anode conductive rods is provided with at least an auxiliary anode, and the at least one auxiliary anode is movable along the length of the anode conductive rod. The contact conductive rod is substantially perpendicular to the plurality of anode conductive rods, and the cathode conductive rod is arranged to set the substrate such that the substrate is immersed in the electric ore liquid, and the surface to be bonded and the plurality of anode conductive rods The plurality of auxiliary anodes are opposite. [Every anode conductive rod of the remaining key device of the technical solution can be movably provided with at least one auxiliary anode, and one of the substrates to be surfaced facing the plurality of auxiliary anodes can be used by using the electric device Adjusting the distance between the auxiliary anode and the substrate in different regions of the surface to be recorded and adjusting the deposition amount of the ore layer metal in different regions of the surface to be plated, so that the thickness of the layer to be ore is uniform. " [Implementation] Table grass number surface 1 丨 5 pages / total 24 pages foot 0483 [G33 October 12th, according to the replacement ΐ _7] The following will be combined with the actual _, the key device provided by this technical solution is detailed description. _8] This technical solution _ provides - a kind of money for the formation of a metal money layer on the surface of the substrate to be bonded. Referring to FIG. 3 to FIG. 3, the electroplating apparatus 10 includes a plating tank containing a plating solution, a plurality of anode bus bars 12, a plurality of anode conductive rods 13, a plurality of auxiliary anodes 14, and at least one cathode conductive. Rod 15 and at least - a lever 16. The plurality of anode bus bars 12, the plurality of anode conductive rods 13, the plurality of auxiliary anodes 14, the at least one cathode conductive electrode 15 and the at least one blocking rod 16 are both immersed in the electric slag. The electric recording groove 11 can be a rectangular groove body whose one end is not sealed. The plating tank 11 has a rectangular cross section with a length direction χ and a width direction Υ. The plating tank 11 also has two depth directions Ζ, . The plating tank i丄 includes a bottom plate 111, a first side plate 112, a second side plate 113, a third side plate 114, and a fourth side plate 115. The first side plate 112, the second side plate 113, and the second side plate 114 are in contact with the fourth side plate π 5 , and the bottom plate 111 is connected to the first side plate 112 , the second side plate 113 , the third side plate n4 and the first side plate The same end of the four side plates 115. The first side plate 112 and the third side plate 114 are both disposed along the length direction X. The second side plate 11 3 and the fourth side plate 115 are both disposed in the width direction γ. The amount of the electro-silver liquid in the key slot I! is preferably such that the plurality of pole-shaped bus bars 12' are at least one of the cathode conductive rods 15, the plurality of anode conductive rods 13, and the plurality of auxiliary anodes 14. The plating bath 100 may contain copper sulfate. [0010] The plurality of anode bus bars 12 are for electrical connection to the positive pole of the power source. In the present embodiment, the number of the anode bus bars 12 is two, which are all disposed along the length direction X of the electric recording slot 11, wherein an anode bus bar 12 is close to the form number A0101, page 6 of 24 [0011] The first side plate 112 of the replacement page is corrected on January 12, 2010, and the other anode bus bar 2 is adjacent to the third side plate 114. The two anode bus bars 12 are electrically conductive cuboid rods, which can be borrowed. The second side plate 113 and the fourth side plate 115 of the plating tank n are fixed by welding or screwing. The plurality of anode conductive rods 13 are sequentially arranged in parallel. Each of the anode conductive rods 13 includes a conductive rod body 130, a first sliding structure 131 and a second sliding structure 132. The anode conductive rod 丨3 may be a long square rod. The first sliding structure 131 includes two first stopping blocks 133 extending perpendicularly from one end of the conductive rod body 13 , and the two first stopping blocks 133 and the conductive rod body 130 are common The first chute 134 is formed. The second sliding structure 133 is opposite to the first sliding structure 1 31. The second sliding structure 132 includes two second stopping blocks 135 extending perpendicularly from the other end of the conductive rod body 130, and between the two second stopping blocks 135 and the conductive rod body 130 Together, they form a second chute 1 36. The first sliding slot 134 of the first sliding structure 131 is engaged with the anode bus bar 2 to movably couple the first sliding structure 131 above the anode bus bar 12. The second sliding groove 136 of the second sliding structure 132 is engaged with the other anode bus bar 12 to movably couple the second sliding structure 132 above the other anode bus bar 12. Preferably, the shapes of the first sliding slot 134 and the second sliding slot 136 respectively correspond to the shape of one anode bus bar 12 and the other anode bus bar 12, so that the first sliding structure 131 and the anode bus bar 12 are The fit between the second sliding structure 132 and the other anode sink cup 12 is more robust. In this embodiment, the number of the anode conductive rods 13 is five, and the five anode conductive rods 13 are equally spaced between the two anode bus bars 12. Form No. Α0101 Page 7 of 24 M400483 I October 12, 2008 B癀正正换页 [0012] Each anode conductive rod 13 is movably provided with at least one auxiliary anode 14 , one of the substrates The surface to be plated faces the plurality of auxiliary anodes 14. Each of the auxiliary anodes 14 includes a receiving basket 140, at least one first hook 141 and a plurality of metal blocks (not shown). The receiving basket 140 may be in the shape of a cylinder whose one end is not sealed, and includes a side wall and a bottom wall a which are connected to each other. The side wall and the bottom wall are both mesh-shaped, and both are made of stainless steel. The side walls and the bottom surface are plated with titanium metal to prevent the receiving basket 140 from depositing a plating layer. The at least one first hook 141 extends from one end of the receiving basket 140 without sealing for coupling with the anode conductive rod 13. In this embodiment, the number of the first hooks 141 is two. The plurality of metal blocks are housed in the receiving basket 140, and the plurality of metal blocks are used to generate metal cations by the plating solution. Since the plurality of anode conductive rods 13 are movable between the two anode bus bars 12, the plural number can be adjusted by adjusting the position of the plurality of anode conductive rods 13 in the longitudinal direction of the anode bus bar 12 The distribution range of the anode conductive rod 13 in the longitudinal direction of the anode bus bar 12 is greater than or equal to the length of the substrate along the length direction of the anode bus bar 12, so that one of the substrates to be plated faces the plurality of anode conductive rods 13 Anode 14. In this embodiment, each of the anode conductive rods 13 is provided with two auxiliary anodes 14 respectively located on opposite sides of the substrate, so that two opposite substrates can be facilitated. The surface to be plated is plated. Of course, an auxiliary anode 14 may also be disposed on each of the anode conductive rods 13, so that one of the substrates to be plated may be plated. If three or more auxiliary anodes 14 are disposed on each of the anode conductive rods 13, only the length of the anode conductive rods 13 is increased, and the cathode conductive rods 15 are added, so that the plurality of substrates to be plated at the same time can be plated. * Form No. Α0101 Page 8/Total 24 [0013] The cathode conductive rod 15 was modified for electrical connection to the negative pole of the power supply on October 12, 099. The cathode conductive rod 15 is substantially perpendicular to the plurality of anode conductive rods 13 for arranging the substrate in the plating solution 100 and the surface to be plated and the plurality of anodes The plurality of auxiliary anodes 14 on the conductive rod 13 are opposed. The cathode conductive rod 15 is also disposed along the length direction X of the plating tank 11 and the cathode conductive rod 15 should be at the same height as the two anode bus bars 12 in the depth direction z of the plating tank or It is closer to the bottom plate 1U of the plating tank than the two anode bus bars 12. In the present embodiment, the cathode conductive rod 15 is also a conductive rectangular parallelepiped rod which is closer to the bottom plate 111 of the plating bath 11 than the two anode bus bars 2 in the depth direction Z of the electroless recording groove 11. [0014] the at least one baffle 16 is in one-to-one correspondence with the at least one auxiliary anode 14 , and the at least one baffle 16 is configured to limit a distance between the at least one auxiliary anode Η and the cathode conductive rod 15 Avoiding the phenomenon that the auxiliary anode 14 is too close to the cathode conductive rod 15 to cause a short circuit. The blocking rod 16 is made of an insulating material. Acryl〇nitrile butadiene styrene 'ABS or agglomerated gas can be used. Made of ethylene (Polyvinyh chloride 'PVC). The blocking rod 16 is also disposed along the length direction X of the plating tank U, and the ram 16 should be at the same height or higher than the two anode bus bars 12 in the depth direction Z of the key slot The two anode bus bars 12 are closer to the bottom plate hi of the plating bath 11. In the present embodiment, the said stopper rod 16 has a cylindrical shape which is closer to the bottom plate hi of the plating tank 11 than the two anode bus bars 12 in the depth direction z of the plating tank 11. In this embodiment, the number of the blocking bars 16 is two, which are respectively located at two sides of the cathode conductive rod 15, and the depth of the blocking rod 16 is in the depth of the plating tank.
第9頁/共24頁 L〇S9年:ί〇月12日孩正替接頁 方向Ζ上與所述陰極導電桿15平齊。 [0015] [0016] [0017] 本技術方案還提供_種電鑛方法，可包括以下步驟： 首先’請參閱圖4，提供基板與掛架咖，將所述基板 200固定於所述掛架3〇〇。 所述基板2GG具有相對之第一待财面如與第二待錄表 面⑽。所述基板m還具有兩個貫穿相對的第—待鍵表 面2〇1與第二待錄表面2〇2之第一固定孔2〇3。所述兩個 第-固定孔203相對設置，每―第—固定孔2Q3均靠近所 述基板200之-邊緣。所述基板則可包括依次堆爲之第 一銅箱層、絕緣層與第二銅制。所述革-魏表面201 與第二待鍵表面202分別為第贿屬與第二銅箱層之表 面。 v 二一 [0018] ㈣掛架則包括-固定框31〇、兩個第二掛钩32〇與複 數固定件330。所述固定框31〇包括依次相連之第一橫桿 311、第-縱桿312、第二橫桿313與第二縱桿314。所述 第-橫桿3U與第二橫桿313平行相對，所述第—縱桿 3!2與第二縱桿314平行相對。所述第—縱桿312斑第二 縱桿m上分別開設有-第二固定孔315。所述兩個第二 掛鈎320均連接於所述固定框31Q，具體地，所述兩個第 二掛钩320均連接於所述第—橫桿31卜所述複數固定件 330可為與所述第-固定孔2〇3與第二固定孔315相匹配 之導電螺釘’其數量亦為兩個。所述固定框31〇與兩個第 二掛鈎32G亦均為導電材質，為便於安全操作’所述固定 框310與兩個第二掛鈎320外可包覆絕緣材料層。使所述 表單編號A0101 第丨0頁/共24頁 099年10月12日修正替換頁 兩個固定件330依次與所述基板200之第-固定孔203與 口疋枢310之第—固定孔川將配合，從而將所述基板 2〇0固定於所述掛架300。本實施例中，所述掛架僅 固定了-塊基板200。當然，只要電_u之深度及固定 枢之長度允許，所述掛架3〇〇上開設多於兩個之第二固定 孔315，即可實現一次固定& & 风兄人口又兩呔、三塊或更多塊基板20〇 〇 刚_，請-併參閱圖5與圖6，提供如上所述之電鍵裝置 10，將所賴_〇掛設於所述陰料電桿15，並使所述 基板200浸置於所述電鍍液100中。具體地，藉由所述掛 架300之第一掛釣32G將固定有基板2G()之所述掛架3〇〇结 合於所述陰極導電桿15。 _]其次，調節所述複數陽極導電桿13於陰極導電㈣長度 方向之位置’使所述複數陽極導電桿13於陰極導電桿Η 長度方向之刀佈範圍大於或等於所述基板測沿陰極導電 桿15長度方向之長度。 _]再次，調節所述複數輔助陽極14於所述複數陽極導電桿 13上之位置，使複數輔助陽極14中之至少部分輔助陽極 14與基板200之第一待鑛表面2〇丨相對，且該至少部分輔 助陽極14中，與第一待鍍表面2011>心區域相對之輔助陽 極14與所述基板200之間距小於與第一待鍍表面2〇丨邊緣 區域相對之輔助陽極14與所述基板2〇〇之間距。本實施例 中，正對第一待鍵表面201之五個輔助陽極η中，正對第 一待鍍表面201中心之一輔助陽極14與基板2〇〇之間距最 小，正對基板200之第一待鍍表面2〇】邊緣之兩個輔助陽 表單編號A0101 第丨1頁/共24頁 I uyyap 丄u月丄Z |j 極14與基板200之間距最大，正對第一待鍍表面201之中 心與邊緣連接處之兩個輔助陽極14與基板2 0 0之間距大小 位於上述二者之間。 [0022] 所述複數輔助陽極14中，其餘之輔助陽極14與所述第二 待鍍表面202相對。調節其餘之輔助陽極14於所述複數陽 極導電桿13上之位置，使所述其餘之輔助陽極14中，與 第二待鍍表面2 02中心區域相對之輔助陽極14與所述基板 200之間距小於與第二待鍍表面202邊緣區域相對之輔助 陽極14與所述基板200之間距。本實施例中，正對第二待 鍍表面202之五個輔助陽極14中，正對第二待鍍表面202 中心之一輔助陽極14與基板200之間距最小，正對基板 200之第二待鍍表面202邊缘之兩個輔助陽極14與基板 200之間距最大，正對第二待鍍表面202之中心與邊緣連 接處之兩個輔助陽極14與基板200之間距大小位於上述二 者之間。 [0023] 最後，對基板200之第一待鍍表面201與第二待鍍表面 202進行電鍍。分別將所述兩個陽極匯流桿12與陰極導電 桿15連接於電源之正極與負極，開啟電源，此時，電流 經過陰極導電桿15以及掛架300到達所述第一待鍍表面 201與第二待鍍表面202。電鍍液100中之陽離子於第一 待鍍表面201與第二待鍍表面202發生還原反應而沈積。 電鍍過程中，輔助陽極14之金屬塊不斷溶解於電鍍液100 中而產生之陽離子。電流密度自第一待鍵表面201與第二 待鍍表面202邊緣向第一待鍍表面201與第二待鍍表面 202中心處依次減小。於本技術方案提供之電鍍裝置10中 表單編號A0101 第12頁/共24頁 M400483 099年10月12日按正替換頁 ’正對第一待链表面201與第二待鍍表面202中心之輔助 陽極1 4與所述基板2 0 〇之間距小於正對第一待鍍表面2 〇 1 與第二待鑛表面202邊緣之輔助陽極14與所述基板2〇〇之 間距。由於與輔助％極1 4間距較小，於相同之時間内， 第一待鍍表面201與第二待鍍表面2〇2中心處可沈積較多 之金屬，如此，可抵消電流密度之差異導致之第一待鍍 表面201與第二待鑛表面202邊緣處沈積之金屬較厚，使 得第一待鍍表面201與第二待鍍表面2〇2形成金屬鍍層之 厚度更加均勻。 [0024] 本實施例中，所述複數陽極導電桿13之數量為五個，基 板200之第一待鍍表面201與第二待鍍表面2〇2分別正對 五個輔助陽極14 »可理解，還可調整所述複數陽極導電 桿13之間距，使得基板200之第一待鍍表面,2〇丨與第二待 鍍表面202分別正對更複數輔助陽極14，如此，可使得第 一待鍍表面201與第二待鍍表面2〇2形成鍍層之厚度更趨 均勻p此外，沿所述電鍍槽丨丨之長度方向χ還可再設置多 根陽極導電桿13及複數輔助陽極14，並於陰極導電桿15 上相應設置掛架3GG，從而可對複數掛架_上之基板 200進行電鍍，達到提高生產效率之目之。 [0025] 本技術方案之電㈣置之複數陽極導電桿可移動地設置 於兩個陽極匯流桿之間，從而使用該電鑛裝置時，可藉 由調節複數陽極導電椁之位置來適應不同長度/寬度之基 板。另外，每-陽極導電桿均可移動地設置有至少一輔 助陽極，所述基板之-待鍵表面正對複數輔助陽極，從 而使用該謝置時’可藉由調節正對待鑛表面之不同 表單編號Α0101 第13頁/共24頁 M400483Page 9 of 24 L〇S9: On the 12th of the month, the child is on the same page as the cathode conductive rod 15. [0017] [0017] The present technical solution further provides an electric ore method, which may include the following steps: First, please refer to FIG. 4, providing a substrate and a cradle, and fixing the substrate 200 to the pylon 3〇〇. The substrate 2GG has a first waiting surface such as a second to-be-recorded surface (10). The substrate m further has two first fixing holes 2〇3 penetrating through the opposite first to-be-keyed surface 2〇1 and the second to-be-recorded surface 2〇2. The two first fixing holes 203 are oppositely disposed, and each of the first fixing holes 2Q3 is close to the edge of the substrate 200. The substrate may include a first copper box layer, an insulating layer and a second copper. The leather-Wei surface 201 and the second to-be-bonded surface 202 are surfaces of the first bribe and the second copper box layer, respectively. v 二一 [0018] (4) The pylon includes a fixing frame 31 〇, two second hooks 32 〇 and a plurality of fixing members 330. The fixing frame 31 includes a first cross bar 311, a first vertical bar 312, a second cross bar 313 and a second vertical bar 314 which are sequentially connected. The first crossbar 3U is parallel to the second crossbar 313, and the first longitudinal bar 3!2 is parallel to the second longitudinal bar 314. A second fixing hole 315 is defined in the second longitudinal rod m of the first longitudinal rod 312. The two second hooks 320 are connected to the fixing frame 31Q. Specifically, the two second hooks 320 are connected to the first cross bar 31. The plurality of fixing members 330 can be The number of the conductive screws ′ that the first fixing hole 2〇3 and the second fixing hole 315 match are also two. The fixing frame 31〇 and the two second hooks 32G are also electrically conductive materials, and the insulating frame 310 and the two second hooks 320 may be covered with an insulating material layer for safe operation. The form number A0101 is the first page of the first and second pages of The pump will cooperate to fix the substrate 2〇0 to the pylon 300. In this embodiment, the cradle only fixes the -block substrate 200. Of course, as long as the depth of the electric _u and the length of the fixed pivot allow more than two second fixing holes 315 to be opened on the pylon 3, a fixed time && , three or more pieces of substrate 20 ,, please - and refer to FIG. 5 and FIG. 6, providing the above-mentioned key device 10, hang the 〇 〇 所述 on the female pole 15 The substrate 200 is immersed in the plating solution 100. Specifically, the pylon 3A to which the substrate 2G() is fixed is bonded to the cathode conductive rod 15 by the first fishing line 32G of the cradle 300. </ RTI> Next, adjusting the position of the plurality of anode conductive rods 13 in the longitudinal direction of the cathode conduction (four) so that the range of the plurality of anode conductive rods 13 in the longitudinal direction of the cathode conductive rods is greater than or equal to the conductivity of the substrate along the cathode The length of the rod 15 in the longitudinal direction. _] again, adjusting the position of the plurality of auxiliary anodes 14 on the plurality of anode conductive rods 13 such that at least a portion of the auxiliary anodes 14 of the plurality of auxiliary anodes 14 are opposite to the first to-be-surfaced surface 2 of the substrate 200, and In the at least part of the auxiliary anode 14 , the auxiliary anode 14 and the substrate 200 opposite to the first to-be-plated surface 2011 & the core region are smaller than the auxiliary anode 14 opposite to the edge region of the first surface to be plated 2 The distance between the substrates 2〇〇. In this embodiment, among the five auxiliary anodes η facing the first to-be-keyed surface 201, the distance between the auxiliary anode 14 and the substrate 2〇〇 is the smallest, facing the center of the first surface to be plated 201, facing the substrate 200 A surface to be plated 2〇] Two auxiliary positive form numbers on the edge A0101 Page 1 of 24 I uyyap 丄u月丄Z |j The distance between the pole 14 and the substrate 200 is the largest, facing the first surface to be plated 201 The distance between the two auxiliary anodes 14 and the substrate 200 at the center-to-edge junction is between the above. [0022] Of the plurality of auxiliary anodes 14, the remaining auxiliary anodes 14 are opposed to the second surface to be plated 202. Adjusting the position of the remaining auxiliary anode 14 on the plurality of anode conductive rods 13 such that the distance between the auxiliary anode 14 and the substrate 200 in the remaining auxiliary anode 14 is opposite to the central area of the second surface to be plated 02 It is smaller than the distance between the auxiliary anode 14 and the substrate 200 opposite to the edge region of the second surface to be plated 202. In this embodiment, among the five auxiliary anodes 14 facing the second surface to be plated 202, the distance between the auxiliary anode 14 and the substrate 200 is the smallest in the center of the second surface to be plated 202, and the second to the substrate 200 is opposite. The distance between the two auxiliary anodes 14 at the edge of the plating surface 202 and the substrate 200 is the largest, and the distance between the two auxiliary anodes 14 and the substrate 200 at the center-to-edge junction of the second surface to be plated 202 is between the above. [0023] Finally, the first surface to be plated 201 and the second surface to be plated 202 of the substrate 200 are plated. The two anode bus bars 12 and the cathode conductive rods 15 are respectively connected to the positive and negative poles of the power source, and the power is turned on. At this time, the current passes through the cathode conductive rod 15 and the pylon 300 to reach the first surface to be plated 201 and the first Two surfaces to be plated 202. The cation in the plating solution 100 is deposited by a reduction reaction between the first surface to be plated 201 and the second surface to be plated 202. During the electroplating process, the metal block of the auxiliary anode 14 is continuously dissolved in the plating solution 100 to generate cations. The current density decreases from the edge of the first to-be-polished surface 201 and the second surface to be plated 202 toward the center of the first to-be-plated surface 201 and the second surface to be plated 202. In the electroplating apparatus 10 provided by the present technical solution, the form number A0101, page 12/24 pages, M400483, October 12, 2010, is replaced by the positive replacement page 'the front side of the first to-be-chained surface 201 and the second to-be-plated surface 202. The distance between the anode 14 and the substrate 20 〇 is smaller than the distance between the auxiliary anode 14 and the substrate 2 正 facing the edge of the first surface to be plated 2 〇 1 and the second surface to be treated 202 . Since the distance from the auxiliary % pole 14 is small, more metal can be deposited at the center of the first surface to be plated 201 and the second surface to be plated 2〇2 in the same time, so that the difference in current density can be offset. The first to-be-plated surface 201 and the metal deposited at the edge of the second to-be-polished surface 202 are thicker, such that the first to-be-plated surface 201 and the second to-be-plated surface 2〇2 form a metal plating layer having a more uniform thickness. [0024] In this embodiment, the number of the plurality of anode conductive rods 13 is five, and the first to-be-plated surface 201 of the substrate 200 and the second surface to be plated 2〇2 are respectively opposite to the five auxiliary anodes 14 » understandable The distance between the plurality of anode conductive rods 13 can also be adjusted, so that the first surface to be plated of the substrate 200, 2〇丨 and the second surface to be plated 202 respectively face the plurality of auxiliary anodes 14, respectively, so that the first waiting The thickness of the plated surface 201 and the second surface to be plated 2〇2 is more uniform. Further, a plurality of anode conductive rods 13 and a plurality of auxiliary anodes 14 may be further disposed along the length direction of the plating tank, and The pylons 3GG are correspondingly disposed on the cathode conductive rods 15, so that the substrate 200 on the plurality of pylons can be plated to achieve the purpose of improving production efficiency. [0025] The electric (four) of the plurality of anode conductive rods of the technical solution are movably disposed between the two anode bus bars, so that when the electric ore device is used, the positions of the plurality of anode conductive crucibles can be adjusted to adapt to different lengths. / Width of the substrate. In addition, each of the anode conductive rods is movably provided with at least one auxiliary anode, and the surface of the substrate to be keyed is facing the plurality of auxiliary anodes, so that when the setting is used, the different forms of the surface to be treated can be adjusted. No. 1010101 Page 13 of 24 M400483
m m mm ^ Sm m mm ^ S
Uyyitp 丄u月丄©rihW«P 區域之輔助陽極與基板之間距而調節待鍍表面不同區域 之鍍層金屬之沈積量，使得待鍍表面之鍍層金屬厚度均 勻。 [0026] 綜上所述，本新型確已符合新型專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本新型之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本新型之精神所作之等效修飾或變化 . ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0027] 圖1係本技術方案實施例提供之電鍍裝置之俯視圖。 . · · [0028] 圖2係圖1沿I I - 11線之剖面示意:圓， [0029] 圖3係f 1沿I I I - I 11線之剖面示意圖。 [0030] 圖4係將基板固定於掛架之分解示意圖。 [0031] 圖5係使用本技術方案實施例提供之電鍍裝置對基板進行 電鍍之俯視圖。 [0032] 圖6係圖5沿VI-VI線之剖面示意圖。 【主要元件符號說明】 [0033] 電鍍裝置：10 [0034] 電鍍槽：11 [0035] 陽極匯流桿：12 [0036] 陽極導電桿：13 [0037] 輔助陽極：14 表單編號A0101 第14頁/共24頁 M400483 I㈣年順日—核▲ [0038] 陰極導電桿：15 [0039] 擋桿：16 [0040] 底板：111 [0041] 第一側板：112 [0042] 第二側板：113 [0043] 第三側板：114 [0044] 第四側板：115 [0045] 導電桿體：130 [0046] 第一滑動結構： 131 [0047] 第二滑動結構： 132 [0048] 第一止擋塊：133 [0049] 第一滑槽：134 [0050] 第二止擋塊：135 [0051] 第二滑槽：136 [0052] 收容筐：140 [0053] 第一掛鈎：141 [0054] 電鍍液：100 [0055] 基板：200 [0056] 第一待鍍表面： 201 表單編號A0101 第15頁/共24頁 M400483 |uyy+丄u月 i幺ti [0057] 第二待鍍表面：202 [0058] 第一固定孔：203 [0059] 掛架：30 0 [0060] 固定框：3 1 0 [0061] 第二掛鈎：320 [0062] 固定件：3 3 0 [0063] 第一橫桿：311 [0064] 第一縱桿：312 [0065] 第二橫桿：313 [0066] 第二縱桿：314 [0067] 第二固定孔：315 表單編號A0101 第16頁/共24頁Uyyitp 丄u丄丄©rihW« The distance between the auxiliary anode and the substrate of the P region adjusts the deposition amount of the plated metal in different areas of the surface to be plated, so that the thickness of the plated metal on the surface to be plated is uniform. [0026] In summary, the present invention has indeed met the requirements of the new patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Any equivalent modifications or variations made by those who are familiar with the skill of the present invention in accordance with the spirit of the present invention shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is a plan view of a plating apparatus provided by an embodiment of the present technical solution. [0028] FIG. 2 is a cross-sectional view along line I I -11 of FIG. 1 : a circle, and FIG. 3 is a schematic cross-sectional view of f 1 along line I I I - I 11 . [0030] FIG. 4 is an exploded perspective view showing the substrate fixed to the pylon. [0031] FIG. 5 is a plan view showing electroplating of a substrate using a plating apparatus provided by an embodiment of the present technical solution. 6 is a cross-sectional view taken along line VI-VI of FIG. 5. [Main component symbol description] [0033] Electroplating device: 10 [0034] Electroplating bath: 11 [0035] Anode bus bar: 12 [0036] Anode conductive rod: 13 [0037] Auxiliary anode: 14 Form No. A0101 Page 14/ A total of 24 pages M400483 I (four) year Shunri - nuclear ▲ [0038] cathode conductive rod: 15 [0039] bar: 16 [0040] bottom plate: 111 [0041] first side plate: 112 [0042] second side plate: 113 [0043 ] Third side panel: 114 [0044] Fourth side panel: 115 [0045] Conductive rod body: 130 [0046] First sliding structure: 131 [0047] Second sliding structure: 132 [0048] First stop: 133 [0049] First chute: 134 [0050] Second stop: 135 [0051] Second chute: 136 [0052] Containment basket: 140 [0053] First hook: 141 [0054] Plating solution: 100 [0055] Substrate: 200 [0056] First surface to be plated: 201 Form No. A0101 Page 15 of 24 M400483 | uyy+丄u月i幺ti [0057] Second surface to be plated: 202 [0058] Fixing hole: 203 [0059] Hanging frame: 30 0 [0060] Fixed frame: 3 1 0 [0061] Second hook: 320 [0062] Fixing member: 3 3 0 [0063] First horizontal : 311 [0064] The first longitudinal bars: 312 [0065] second crossbar: 313 [0066] The second vertical bar: 314 [0067] the second fixing hole: 315 Form Page number 16 A0101 / 24 Total