JP2011032515A - Rack plating method and rack plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rack plating method and a rack plating apparatus in which a rack can be repeatedly used for a long period of time and good plating can be achieved by reducing the thickness distribution in an article to be plated. <P>SOLUTION: A rack 11 holding an article 1 to be plated and a rack 12 holding a metallic material 2 are immersed in a plating solution 3. In this state, the rack 11 is used as a cathode and the rack 12 is used as an anode, and the article to be plated is plated by energizing the racks. When a predetermined amount or more of the plating metal is precipitated on the rack holding the article to be plated, the rack 11 holding the article to be plated is diverted to a rack for holding the metallic material 2. The metallic material 2 is held on the diverted rack 11, and the article to be plated is held on another rack. The another rack holding the article to be plated and the diverted rack 11 holding the metallic material are immersed in the plating solution. The another rack is used as a cathode and the diverted rack 11 is used as an anode, and the article to be plated is plated by energizing the racks. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a plating method and a plating apparatus, and more particularly, to a rack plating method for plating by holding an object to be plated on a rack and a rack plating apparatus used therefor.

  When a ceramic substrate or the like is used as an object to be plated and plating is performed on the object to be plated, a rack plating method is widely used in which plating is performed while the object to be plated is held on a rack.

  As such a rack plating method and a rack plating apparatus used therefor, for example, a plating apparatus as shown in FIGS. 7 and 8 and a method of performing plating using this apparatus have been proposed (Patent Document 1). reference).

  The plating apparatus disclosed in Patent Document 1 holds an electrolytic plating bath 52 that contains an electrolytic plating solution 51, an anode 53 disposed in the electrolytic plating bath 52, and an object to be plated (printed wiring board) 54 to perform electrolytic plating. An electroplating rack 55 for fixing in the liquid 51, a pair of plating solution supply pipes 56, 57 disposed on both sides of the upper part of the electroplating rack 55, and both sides of the lower part of the electroplating rack 55 A plating solution circulation circuit that circulates the electrolytic plating solution by sending the plating solution discharged from both the plating solution discharge pipes 58 and 59 to the both plating solution supply pipes 60. A pair of partition walls 62 and 63 for guiding the electrolytic plating solution ejected from the means 61 and the plating solution supply pipes 56 and 57 downward along both side surfaces of the object to be plated 54. It is equipped with a.

  Further, as shown in FIG. 8, the electroplating rack 55 includes an outer peripheral side frame material 70 made of a stainless steel plate, a current-carrying body 71, a frame body 72 having an opening 72 a, and the like. The object to be plated 54 is held in the opening 72a, and the current object 71 and the object to be plated 54 are electrically and mechanically connected by a screw 73 so that the object to be plated 54 can be held. ing.

  In the rack plating method in which plating is performed using such a plating apparatus, variations in the plating film thickness within the object to be plated become a problem (usually, the plating film thickness is thick at the end of the object to be plated). And tends to be thinner in the center). In order to reduce the variation in the plating film thickness, it is necessary to make the current density distribution uniform. As a measure for this, an auxiliary electrode or a partition (shielding plate) is provided, or the anode shape is devised. ing.

  On the other hand, the rack for holding the object to be plated is equivalent to a cathode in electrolytic plating, and at least a part is made of a conductor so that power can be supplied to the object to be plated. The plated metal also deposits on the surface of the metal. For this reason, conventionally, after being used several times, it is exchanged, or the plating film is peeled off and used repeatedly.

  From the standpoint of extending the usable period of the rack or eliminating the need to peel off the plating film, for example, a method of coating the rack with an insulating material can be considered, but the rack has a complicated structure. In some cases, there is a trade-off between insulation and ensuring conduction, and it is difficult to completely solve this problem by a method of coating the rack with an insulating material.

JP-A-8-81799

  The present invention solves the above-described problems, and can be used for a long time by repeating the rack. Furthermore, it is possible to reduce the film thickness distribution in the object to be plated and perform good plating. An object of the present invention is to provide a simple rack plating method and a rack plating apparatus that can be used preferably.

In order to solve the above problems, the rack plating method of the present invention is:
(a) While holding the object to be plated in a rack configured to be able to hold the object to be plated in an electrically conductive manner,
A step of holding the metal material in a rack configured to be able to hold the metal material that is a metal supply source to be plated on the object to be plated in an electrically conductive manner;
(b) In a state where the rack holding the object to be plated and the rack holding the metal material are immersed in a plating solution, the former is used as a cathode and the latter is used as an anode. Performing a plating process on the object to be plated;
(c) When a predetermined amount or more of plating metal is deposited on the rack holding the object to be plated, the rack holding the object to be plated is diverted as a rack for holding the metal material. And holding the metal material in the diverted rack and holding the object to be plated in another rack;
(d) By immersing the other rack holding the object to be plated and the diversion rack holding the metal material in a plating solution and energizing the former with the cathode as the cathode and the latter as the anode. And a step of performing a plating process on the object to be plated
It is characterized by having.

  The rack plating method of the present invention is characterized in that the steps (c), (d), and (e) are repeated after the step (d).

  In the rack plating method of the present invention, as the rack for holding the object to be plated and the rack for holding the metal material, the same shape and size are used, and the metal material is the same as the object to be plated. It is desirable to use a shape and size.

  In the rack plating method of the present invention, the rack that holds the object to be plated on which the plated metal is deposited is diverted as a rack that holds the metal material, and the metal material is used as the diverted rack. It is desirable to use a rack that holds the metal material as another rack when the object to be plated is held in another rack.

  In the rack plating method of the present invention, a pair of racks holding the metal material are arranged so as to face at least one of the one main surface and the other main surface of the rack holding the object to be plated. It is desirable to perform the plating process in the installed state.

  Further, in the rack plating method of the present invention, the rack in which the plating metal is deposited and holding the object to be plated is diverted as a rack for holding the metal material, and the metal material is used in the diverted rack. And holding the object to be plated in another rack to perform plating so that the rack in which all of the plating metal deposited on the rack holding the object to be plated has been consumed is removed. It is desirable to use it as a rack for holding a plated product.

In addition, the rack plating apparatus of the present invention,
Immerse the rack holding the object to be plated and the rack holding the metal material that is the source of metal to be plated on the object to be plated with the former as the cathode and the latter as the anode. A plating apparatus used for performing the plating process on the object to be plated,
A plurality of racks configured to be able to hold both the object to be plated and the metal material in an electrically conductive manner;
A plating tank for storing a plating solution in which the rack holding the object to be plated and the rack holding the metal material are immersed;
An energization means for energizing between the rack holding the object to be plated and the rack holding the metal material in a plating solution with the former as a cathode and the latter as an anode And
The rack that holds the object to be plated can be used as a rack that holds the metal material, and the rack that holds the metal material can be used as a rack that holds the object to be plated. It is characterized by being.

  Further, in the rack plating apparatus of the present invention, the plurality of racks have the same shape and dimensions, and when using the same shape and dimensions as the object to be plated and the metal material, It is desirable that each of the metal material and the object to be plated be configured to be held in the same manner.

The rack plating method of the present invention includes: (a) holding the object to be plated in the rack and holding the metal material in the rack; and (b) plating the rack holding the object to be plated and the rack holding the metal material. In the state of being immersed in the substrate, the former is the cathode and the latter is the anode, and the plating is applied to the object to be plated, and (c) a predetermined amount or more of the plated metal is placed on the rack holding the object to be plated. At the time of deposition, the rack holding the object to be plated is diverted as a rack for holding the metal material, and the diverted rack holds the metal material and the object to be plated is held in another rack. (D) A separate rack holding the object to be plated and a diversion rack holding a metal material are immersed in the plating solution, and the former is used as the cathode and the latter as the anode, and electricity is passed between them. In addition, the plating treatment is performed on the object to be plated, and the rack on which the plating metal adheres by using it on the cathode side is diverted as the rack for holding the metal material, and the plating metal attached on the anode side is used by using it on the anode side. It becomes possible to dissolve and remove in the plating process, and it is possible to efficiently extend the usable time of the rack without requiring a separate process for removing the plating metal adhering to the rack, Productivity can be improved.
In the present invention, the time when a predetermined amount or more of the plated metal has been deposited is that the plated metal deposited on the rack has a risk of preventing good plating on the object to be plated. This is a concept that means a point in time, and is usually judged from the viewpoint of carrying out rack plating efficiently and stably.

  Further, by repeating the steps (c) and (d) after the step (d), the rack can be repeated without requiring another step for removing the metal adhering to the rack. Thus, it can be used stably for a long period of time, and the present invention can be made more effective.

  In addition, a rack that holds the object to be plated and a rack that holds the metal material have the same shape and dimensions, and the metal material has the same shape and dimensions as the object to be plated. In this case, the rack for holding the object to be plated can be diverted as a rack for holding the metal material smoothly without sacrificing workability, and the present invention can be further effectively realized. .

  Also, the rack on which the plating object is deposited and holding the object to be plated is diverted as a rack that holds the metal material, the metal material is held in the diverted rack, and the object to be plated is held in another rack. If a rack that holds metal material is used as another rack when performing the process, the rack can be reused and efficient and stable plating can be performed with fewer racks. become.

  In addition, when the plating process is performed in a state where a pair of racks holding a metal material are arranged so as to face at least one of the one main surface and the other main surface of the rack holding the object to be plated In addition, it is possible to suppress the variation in current density and perform good plating with little variation in the plating film thickness within the object to be plated. When plating on both surfaces of the object to be plated, a pair of racks holding a metal material are arranged so as to face each of the one main surface and the other main surface of the rack holding the object to be plated. It is desirable to install. On the other hand, when plating is performed only on one main surface side of an object to be plated, a rack holding a metal material is usually disposed only on the main surface on which plating is performed.

  In addition, when the rack that holds the object to be plated is diverted as a rack that holds the metal material, the rack in which the plating metal deposited on the rack in the subsequent plating step is consumed is replaced with the object to be plated. Compared to the case where a rack from which only a part of the attached plating metal is removed is used as a holding rack, the time required until a predetermined amount of plating metal is deposited on the rack in the plating process (usable) (Time) can be lengthened, and the present invention can be made more effective.

  In addition, the rack plating apparatus of the present invention holds a plurality of racks configured to be able to hold both the object to be plated and the metal material in an electrically conductive manner, and the object to be plated. A plating bath for storing a plating solution in which a rack in which the metal material is held and a rack in which the metal material is held is immersed; a rack in which the object to be plated is held; and a rack in which the metal material is held are immersed in the plating solution. In the state, the former is a cathode, the latter is an anode, and a current-carrying means for energizing between the two is provided. A rack that holds an object to be plated is used as a rack that holds a metal material. Since the rack that has been held is configured to be used as a rack that holds the object to be plated, the plating process is continuously performed and the rack that holds the object to be plated is predetermined. When it came to the plating metal is deposited above, it is possible to divert the rack is holding the plated product as a rack for holding the metal material.

  Therefore, by using the rack plating apparatus of the present invention, the rack plating method of the present invention can be carried out efficiently and reliably, and a separate process for removing the plating metal adhering to the rack is required. Therefore, stable rack plating can be performed continuously, and productivity can be improved.

  Also, when a plurality of racks having the same shape and dimensions are used, and when using the same shape and dimensions as the object to be plated and the metal material, the same applies to each of the metal material and the object to be plated. The rack that holds the object to be plated is used as the rack that holds the metal material, and the rack that holds the metal material is used as the rack that holds the object to be plated. The invention of the plating rack apparatus of the present invention premised on the use can be more effectively presented.

(a) is the front view which shows the state which hold | maintained the alumina substrate which is a to-be-plated object in the rack which comprises the rack plating apparatus of this invention, (b) is the top view. (a) is the front view which shows the state which hold | maintained the plate-shaped metal Ni plate which is a metal material in the rack which comprises the rack plating apparatus of this invention, (b) is the top view. It is a figure which shows schematic structure of the rack plating apparatus concerning one Example of this invention. (a) is the front view which shows the state which diverted the rack where the metal to be plated which was to be plated was deposited as a rack for holding the metal material, and (b) is a plan view thereof. (a) is the front view which shows the state which diverted the rack which hold | maintained the metal material as a rack for hold | maintaining a to-be-plated thing, (b) is the top view. FIG. 1 is a diagram showing a schematic configuration of a rack plating apparatus according to an embodiment of the present invention, in which a plated metal deposited deposit that holds an object to be plated is diverted as a rack for holding a metal material; And it is a figure which shows the state which diverted the rack which hold | maintained the metal material as a rack for hold | maintaining a to-be-plated thing. It is a figure which shows the conventional rack plating apparatus. It is a figure which shows the structure of the rack currently used in order to hold | maintain a to-be-plated object in the conventional rack plating apparatus.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

  In this embodiment, an alumina substrate is used as an object to be plated, and a rack plating apparatus used when Ni plating is performed on the surface of an Ag electrode formed on the alumina substrate, and rack plating is performed using the rack plating apparatus. A rack plating method will be described as an example.

[Configuration of rack plating equipment]
FIG. 1A is a front view showing a state in which an alumina substrate as an object to be plated is held on a rack constituting the rack plating apparatus of the present invention, FIG. 1B is a plan view thereof, and FIG. FIG. 2 is a front view showing a state in which a rack-like metal Ni plate that is a metal material is held in a rack, FIG. 2B is a plan view thereof, and FIG. 3 is a schematic configuration of a rack plating apparatus according to an embodiment of the present invention. FIG.

  As shown in FIG. 3, the rack plating apparatus of this embodiment includes a rack 11 for holding an object to be plated (alumina substrate) 1, a rack 12 for holding a metal material (metal Ni plate) 2, and a plating solution 3. In a state where the plating tank 4 to be accommodated, the rack 11 holding the object 1 to be plated, and the rack 12 holding the metal material 2 are immersed in the plating solution 3, the former is used as the cathode and the latter is used as the anode. And an energizing means 5 for energizing between them.

And as the rack 11 which hold | maintains the to-be-plated object (alumina substrate) 1 and the rack 12 which hold | maintains metal material (metal Ni board) 2 which comprise this rack plating apparatus, the rack which has the same structure and the same dimension A jig is used.
As shown in FIGS. 1 (a) and 1 (b), a rack 11 for holding an object to be plated 1 includes six rod-like members 11a made of stainless steel having a U-shaped cross section in a direction perpendicular to the longitudinal direction. It is formed by arrange | positioning. The six rod-shaped members 11a are arranged as two pairs so that the openings 11b face each other, and the object to be plated 1 is sandwiched between the U-shaped portions of the pair of rod-shaped members 11a. The object to be plated 1 is held by the rack 11 by being slid from the upper end and inserted.

  A spring made of a conductive material (not shown) is disposed inside the U-shaped portion of the rod-shaped member 11a, and the object to be plated 1 is sandwiched between the U-shaped portions of the pair of rod-shaped members 11a. When inserted into the region, the object to be plated 1 is held by a spring, and power is reliably supplied to the object to be plated through the rod-shaped member 11a.

  In this embodiment, as shown in FIGS. 1A and 1B, three objects to be plated 1 are held by a pair of rod-shaped members 11a, and as a whole, by three pairs of rod-shaped members 11a, A total of nine workpieces 1 are held.

  The rack 12 for holding the metal material 2 is similar to the rack 11 for holding the workpiece 1 shown in FIGS. 1 (a) and 1 (b), as shown in FIGS. 2 (a) and 2 (b). As shown in FIG. 5, the rod-shaped member 12a made of stainless steel having six U-shaped cross-sections in the direction orthogonal to the longitudinal direction is provided. The six rod-shaped members 12a are arranged as a pair so that the openings 12b face each other, and a spring made of a conductive material (not shown) is provided inside the U-shaped portion. ing. Then, by sliding the metal material 2 from the upper end into the region sandwiched between the U-shaped portions of the pair of rod-shaped members 12a, the metal material 2 is held by a spring and reliably passed through the rod-shaped member 12a. The power supply is configured to be performed.

  2A and 2B, three metal materials 2 are held by a pair of rod-shaped members 12a, and a total of nine metal materials 2 are held by three pairs of rod-shaped members 12a as a whole. It is configured to be.

  The racks 11 and 12 are made of the same stainless steel as described above, and not only have the same configuration but also have the same shape and the same dimensions.

In this embodiment, an alumina substrate having a square shape of 100 mm × 100 mm and a thickness of 1 mm is used as the object to be plated (alumina substrate) 1.
As the metal material 2, a metal nickel plate having the same shape and the same dimensions as the object to be plated (alumina substrate) 1 and having a square shape of 100 mm × 100 mm and a thickness of 1 mm is used. The racks 11 and 12 are configured such that when the object 1 and the metal material 2 are held, they can be held in exactly the same manner.

[Rack plating method using the above rack plating apparatus]
Next, a method for performing rack plating using this rack plating apparatus will be described.
(1) First, as shown in FIG. 1, the object to be plated (alumina substrate) 1 is held on the rack 11 in such a manner as to be electrically conductive. At this time, nine objects (alumina substrates) 1 to be plated are held on the rack 11.
In addition, as shown in FIG. 2, a metal material (metal Ni plate) 2 that is a supply source of a metal to be plated on the object to be plated 1 is held on the rack 12 in such a manner that it is electrically conductive. At this time, nine metal materials 2 are held in the rack 12.

  (2) Then, as shown in FIG. 3, with the rack 11 holding the object to be plated 1 and the rack 12 holding the metal material 2 immersed in the plating solution 3, the former is the cathode and the latter is As the anode, the plating object 1 is plated by energizing the energizing means 5 between them. At this time, the plating process is performed in a state in which a pair of racks 12 holding the metal material 2 are disposed so as to face each of the one main surface and the other main surface of the rack 11 holding the workpiece 1. I do.

(3) When a predetermined amount or more of the plating metal is deposited on the rack 11 holding the object 1 to be plated, the rack 11 holding the object 1 and the rack holding the metal material 2 12 is removed from the plating solution 3, the object to be plated 1 and the metal material 2 are removed from the racks 11 and 12, and the rack 11 on which the plating metal is deposited is diverted as a rack (anode side rack) for holding the metal material 2. 4, the metal material 2 is held in the diverted rack 11.
At this time, the rack 12 holding the metal material 2 is diverted as a rack (cathode rack) for holding the object to be plated, and as shown in FIG. 2 is held in the rack 12 used to hold 2.

  (4) Then, as shown in FIG. 6, a rack 12 holding the object to be plated 1 and a rack (transfer rack) 11 holding the metal material 2 are immersed in the plating solution 3, and the former is a cathode, The plating object 1 is plated by energizing the latter with the latter as the anode.

(5) After that, when a predetermined amount or more of plating metal is deposited on the rack 12 holding the object 1 to be plated, the rack 12 holding the object 1 and the rack holding the metal material 2 11 is removed from the plating solution 3 and the object 1 and the metal material 2 are removed from the racks 12 and 11. In addition, when a predetermined amount or more of plating metal is deposited on the rack 12 holding the object 1 to be plated, usually on the rack 11 holding the metal material 2 (rack where the plating metal has been deposited). The plated metal is almost dissolved and removed in the previous plating process.
In the present invention, the time when a predetermined amount or more of the plated metal has been deposited is that the plated metal deposited on the rack has a risk of preventing good plating on the object to be plated. It is a concept that means time. And until it reaches such a state, for example, as described above, the plating metal on the rack 11 (the rack on which the plating metal has been deposited) holding the metal material 2 is dissolved in the plating step. It is also possible to wait for diversion of the rack until it is removed.
Then, the rack 12 on which the plating metal is deposited, which holds the object 1 to be plated, is used (reused) as a rack (anode side rack) for holding the metal material 2, and as shown in FIG. A rack 11 holding the material 2 on the rack 12 and holding the metal material 2, wherein the rack 11 from which the plating metal deposited on the surface has been dissolved and removed in the previous plating process is removed from the rack 11. 1 is used as a rack for holding 1 (cathode rack), and as shown in FIG.

  (6) Then, as shown in FIG. 3, with the rack 11 holding the workpiece 1 and the rack 12 holding the metal material 2 immersed in the plating solution 3, the former is the cathode and the latter is As the anode, the plating object 1 is plated by energizing the energizing means 5 between them.

  According to the above-described rack plating method, the rack on which the plating metal is deposited by holding the object to be plated 1 is used as a rack (anode side rack) for holding the metal material. The racks 11 and 12 can be used repeatedly and stably for a long period of time without requiring a separate process for removing the metal adhering to the metal, thereby improving the productivity.

  In this embodiment, the racks 11 and 12 having the same shape and the same dimensions are used as the rack for holding the object to be plated 1 and the rack for holding the metal material 2. Since the same shape and the same size as the object 1 are used, even when the rack is used as a rack for holding either the object to be plated 1 or the metal material 2, the metal material 2 or The workpiece 1 can be held.

  Further, plating is performed in a state in which a pair of racks 12 or 11 holding the metal material 2 is disposed so as to face the one main surface and the other main surface of the rack 11 or 12 holding the object 1 to be plated. Since the treatment is performed, it is possible to suppress a variation in current density and perform good plating with little variation in the plating film thickness in the object to be plated.

  In the above embodiment, the case where the alumina substrate is used as the object to be plated and Ni plating is applied to the surface of the Ag electrode formed on the alumina substrate has been described as an example. There are no special restrictions.

  Moreover, in the said Example, although the metal nickel plate is used as a metal material, the kind of metal (namely, plating metal) which comprises a metal material is not restricted to Ni, For example, plating, such as Cu and Sn When performing the above, it is also possible to use a Cu plate or Sn plate as the metal material.

  Further, the configuration of the racks 11 and 12 constituting the rack plating apparatus is not limited to the above configuration, and holds and fixes an object to be plated (for example, a plate-like member such as an alumina substrate). As long as it can be connected to the object to be plated and the metal material, various structures made of various materials can be used.

  The present invention is not limited to the above embodiment in other points as well, and the present invention relates to the type of the object to be plated, the specific shape and dimensions, the shape and dimensions of the metal material, the plating conditions, and the like. Various applications and modifications can be added.

1 Object to be plated (alumina substrate)
2 Metal material (metal Ni plate)
DESCRIPTION OF SYMBOLS 3 Plating solution 4 Plating tank 5 Current supply means 11, 12 Rack 11a, 12a Bar-shaped member 11b, 12b with a U-shaped cross section

Claims (8)

(a) While holding the object to be plated in a rack configured to be able to hold the object to be plated in an electrically conductive manner,
A step of holding the metal material in a rack configured to be able to hold the metal material that is a metal supply source to be plated on the object to be plated in an electrically conductive manner;
(b) In a state where the rack holding the object to be plated and the rack holding the metal material are immersed in a plating solution, the former is used as a cathode and the latter is used as an anode. Performing a plating process on the object to be plated;
(c) When a predetermined amount or more of plating metal is deposited on the rack holding the object to be plated, the rack holding the object to be plated is diverted as a rack for holding the metal material. And holding the metal material in the diverted rack and holding the object to be plated in another rack;
(d) By immersing the other rack holding the object to be plated and the diversion rack holding the metal material in a plating solution and energizing the former with the cathode as the cathode and the latter as the anode. And a step of performing a plating process on the object to be plated
A rack plating method characterized by comprising:   The rack plating method according to claim 1, wherein the steps (c) and (d) are repeated after the step (d).   The rack for holding the object to be plated and the rack for holding the metal material are of the same shape and size, and the metal material is of the same shape and size as the object to be plated. The rack plating method according to claim 1 or 2, characterized in that:   The rack that holds the object to be plated on which the plated metal is deposited is diverted as a rack that holds the metal material, the metal material is held in the diverted rack, and the object to be plated is separated. The rack plating method according to any one of claims 1 to 3, wherein a rack in which the metal material is held is used as another rack when the rack is held in the rack.   The plating process is performed in a state in which a pair of racks holding the metal material is disposed so as to face at least one of the one main surface and the other main surface of the rack holding the object to be plated. The rack plating method according to any one of claims 1 to 4.   The rack in which the plating metal is deposited and holding the object to be plated is diverted as a rack for holding the metal material, the metal material is held in the diverted rack, and the object to be plated is separated. A rack in which all of the metal deposited on the rack holding the object to be plated is consumed as a rack for holding the object to be plated is obtained by performing the plating while being held in the rack. The rack plating method according to any one of claims 1 to 5. Immerse the rack holding the object to be plated and the rack holding the metal material that is the source of metal to be plated on the object to be plated with the former as the cathode and the latter as the anode. A plating apparatus used for performing the plating process on the object to be plated,
A plurality of racks configured to be able to hold both the object to be plated and the metal material in an electrically conductive manner;
A plating tank for storing a plating solution in which the rack holding the object to be plated and the rack holding the metal material are immersed;
An energization means for energizing between the rack holding the object to be plated and the rack holding the metal material in a plating solution with the former as a cathode and the latter as an anode And
The rack that holds the object to be plated can be used as a rack that holds the metal material, and the rack that holds the metal material can be used as a rack that holds the object to be plated. The rack plating apparatus characterized by being made.   The plurality of racks have the same shape and dimensions, and when the same object and the same metal material are used as the object to be plated and the metal material, the same applies to the metal material and the object to be plated. The rack plating apparatus according to claim 7, wherein the rack plating apparatus is configured so as to be held in the manner described above.

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