200921866 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電鍍裝置，更詳言之，係有 一種在電解電鍍時能夠得到均勻的電鍍厚度之電參 5 又裝置。 【先前技術】 電解電鍵並非只使用於金屬性的裝飾或表面保護，，、 被使用於電子組件、印刷電路基板及半導體元件的電路亦 成等各式各樣的領域。 $ 電解電鍍係將欲電鍍的被電鍍體投入電鍍液，、 亚以被 電鐘體作為陰極（cathode) ’以欲電極沈積的金屬作為陽極 (anode)，且通電使需要的金屬離子析出至被電鍍體的表面 來形成電鍍膜。被電鍍體係具有傳導性時，能夠將被電鍍 體直接作為陰極來進行電鍍，但是如電路基板係由絕緣材 所構成時，係先利用無電解化學電鍍在絕緣材上形成作為 電解電鍍的電極之種晶層（seed layer)，將該種晶層作為電 極進行電解電鍍來形成電鍍膜。 第1圖係表示先前技術的電鍍裝置之平面圖。第2圖 係先前技術的電鍍裝置之使用狀態圖。參照第丨〜2圖，將 複數片基板108成批地投入電鑛槽並對複數片基板 108進行電鍵時’係將固定有複數片基板1〇8之夾具 l〇6(jig)配置在電鍍槽〗02的中央，並以與各基板1〇8的雙 面各自相向的方式配置陽極丨〇4，來對基板1〇8的雙面進 行電鑛。在此’在基板1〇8的電鍍面所欲電極沈積的金屬 200921866 係成為陽極104’基板108係成為陰極。基板i〇8係由具 有導電性的金屬所構成時’能夠直接使用作為陰極，但是 係絕緣性的基板1 〇 8時，係預先在基板1 〇 8的電鑛面形成 導電性的種晶層用以作為電解電鍍的電極，並將其使用作 為陰極。 但是’依照先前技術之電鍍裝置，如第2圖所示，將 複數片基板108成批地投入電鍍槽1〇2而同時對多片基板 108進行電鍍時，會有從陽極1〇4游離出來的金屬離子u〇 電極沈積於與相鄰的陽極1〇4相向的基板108上，造成電 銀厚度與設計時的電鍍厚度相異，而發生電鍍偏差這樣的 問題點。特別是在基板i 08的端部，因為容易產生電鍍電 流的集中，從陽極104游離出來的金屬離子110集中地電 極沈積於與相鄰的陽極1〇4相向的基板108的端部，而產 生重大的電鍵偏差’所以會有無法得到均勻的電鍍厚度這 樣的問題。 此種電鍍偏差會導致使電路基板中的電特性變差、或 是使焊錫球（solder ball)等分離等的慢性不良，特別是最近 因為電子組件的小型化及高積體化而對電路基板要求微細 電路’但是因為此種電鍍偏差，會有製造精密的電路基板 變為困難之問題點。 【發明内容】 [發明所欲解決之問題] 馨於此種先前技術的問題點，本發明的目的係提供一 6 200921866 種電鍍裝置，在將複數片基板成批地電鍍時， 陽極游離出來的金屬離子到達與相鄰的陽極相 而能夠得到均勻的電鍍厚度° [解決問題之技術手段] 若依照本發明的〆個實施形態，提供一種 係將複數片基板成批地電鍍之裝置，其特徵係 槽，其係用以投入複數片基板；陽極，其係被 與複數片基板各自相向；及分割板，其係將複 離’用以防止從相鄰的陽極游離出來的金屬離 另一方面，能夠更含有遮蔽板，其係介於 極相向之基板之間，且在與基板相向的面形成 又’能夠更含有陽極導引件（anode guide)，其 陽極游離出來的金屬離子誘導至相向之基板。 陽極導引件包含相互隔離的一對導引板， 並使陽極的單面朝向相向之基板。 陽極能夠包含用以投入電鍍金屬之陽極藍 電鑛金屬能夠含有選自由銅 '鎳、錫、銀 鋅所組成群組之至少一種以上。 分割板可以由絕緣物質所構成e 陽極係位於與基板的雙面各自相向之位置 複數片基板’可以是其各基板的一邊係線 被投入，此時，分割板，相對於上述配列，可 於相鄰的基板之間。 藉由防止從 向之基板’ 電鍍裝置’ 包含：電鍍 設置成可以 數片基板隔 子到達。 陽極及與陽 有開口部。 係用以將從 收容陽極， 〇 、鉑、金及 形地配列而 以垂直地介 7 200921866 [功效] 依照本發明，藉由防止從陽極游離出來的金屬離子到 達與相鄰的陽極相向之基板，能夠得到均勻的電鍍厚度， 藉此，能夠提升電鍍的信賴性，而能夠生成高品質的電鍍 製品。 【實施方式】 因為本發明可作多種變換而具有各式各樣實施例，所 以在本申請案中例示圖示來詳細地說明本發明的特定實施 例。但是本發明未限定於此特定實施例，應理解為本發明 係包含在本發明的思想及技術範圍所包含之所有變換、均 等物及代替物。在說明本發明時，當判斷為若對相關之眾 所周知的技術具體地說明時，反而會使本發明的要旨變成 不清楚的情形，則省略其詳細說明。 本發明所使用的用語，係只是用來說明特定的實施 例，而不是限定本發明之物。單數的表現，只要文中未清 楚表現時，亦包含複數的表現。在本發明中，「含有」或「具 有」等用語，應理解為：係用來指定被記載於說明書上之 特徵、數字、階段、動作、構成要素、組件、或組合該等 而成者之存在，但是並未預先排除一個或一個以上之其他 特徵、或數字、階段、動作、構成要素、組件、或組合該 等而成者之存在或附加的可能性。 以下，參照附加圖示來詳細地說明本發明的電鍍裝置 之較佳實施例，且在參照附加圖示說明時，同一且對應的 8 200921866 構成要素係附加同一圖示的符號並省略了對其重複說明。 第3圖係表示本發明的一個實施例的電鍍裝置之斜視 圖。第4圖係表示本發明的一個實施例的電鍍裝置之平面 圖。第5圖係本發明的一個實施例的電鍍裝置之使用狀態 圖。參照第3 ~5圖，係顯示電鍍槽12、陽極籃14、電鍍 金屬16、陽極1 8、金屬離子19、分割板20、開口部22、 遮蔽板24、爽具26及基板28。 本實施例的電鍍裝置，其係以電鍍槽1 2、陽極1 8及 分割板2 0作為構成要素；該電鍍槽1 2係用以投入複數片 基板2 8 ;該（複數個）陽極1 8係被設置成可以各自與複數 片基板2 8相向；而該分割板2 0，其係將複數片基板2 8隔 離，用以防止從相鄰的陽極1 8游離出來的金屬離子1 9到 達；在將複數片基板2 8成批地電鍍時，因為可防止從陽極 18游離出來的金屬離子19到達與相鄰的陽極18相向之基 板2 8，所以在複數片基板2 8上，能夠得到均勻的電鍍厚 度。 在電鍍槽12内，添加電鍍所必要的電鍍液，且具有能 夠同時投入複數片基板2 8之大小。在此，基板2 8係意味 著不只是形成有電路的絕緣體，亦包含其他的要被鍍辞之 鋼板、矽晶圓等的板狀形態的被電鍍體。 在電鍍槽12内，亦可具備喷嘴（未圖示），用以喷射電 鍍液，藉由從噴嘴喷射出來的電鍍液，電鍍液能夠被攪拌 而不停滯。又，亦可使電鑛液從電鐘槽1 2溢流（overflow)、 或是通過吸取（suction)使其流出而進行再循環。 200921866 陽極18係被設置成可以各自與複數片基板28相向， 來使從陽極18的電鍍金屬16游離出來的金屬離子19，容 易地電極沈積於基板28。陽極1 8能夠由陽極籃14(an〇de basket)及被投入陽極籃14中的電鍍金屬16所構成。陽極 籃14係多孔性網狀形態，來使從電鍍金屬1 6游離出來的 金屬離子1 9能夠容易地流出。 電鍍金屬1 6係被製作成球（ball)形態’且能夠投入陽 極籃14中。電鍍金屬16係要被電極沈積於基板28上之金 屬’電鍍金屬16不只是純金屬，亦可以是合金。電鍍金屬 16可包含選自由銅、鎳、錫、銀、鉑、金及鋅所組成群組 之至少一種以上。可將銅 '鎳、錫、銀、鉑、金及鋅各自 作為電鍍金屬16來進行電鍍，亦可以將這些金屬的合金作 為電鑛金屬16。例如欲使用銅（Cu)在基板28上形成電路 時，能夠使用鋼球來作為電鍍金屬16。此外，欲在鋼板上 電鑛辞時’月b夠使用鋅作為電鍍金屬16。又，亦可使用鋼 與辞的合金也就是黃銅來作為電鍍金屬16。 另一方面’欲利用一個電鍍槽12同時電鍍基板23的 雙面時，如第4圖所示，陽極18能夠設置在各自與基板 28的雙面相向之位置。 右將私極18與陰極連結於整流器（rectifier)t而通電 時’電鍵金屬16會被電分解，且陽極18的電鍍金屬16 的金屬離子19會游離至電鍍液，而且電子會通過整流器而 移動至陰極。游離至電鍍液中的金屬離子19,在陰極也就 是基板28表面’係與移動來的電子結合來進行電鍍。 10 200921866 分割板2 0係用以防止從相鄰的陽極1 8游離出來的金 屬離子1 9到達，並將複數片基板2 8各自隔離。複數片基 板2 8係對應與各自相向的陽極1 8，若使從對應各基板2 8 之陽極18游離出來的金屬離子19，在相向基板28上析出 時，則能夠得到與設計時相同之均勻的電鍍厚度。但是， 若是除了從對應之陽極18游離出來的金屬離子19以外， 從相鄰的陽極1 8游離出來的金屬離子1 9到達基板時，會 有比設計時的金屬離子1 9更多的金屬離子1 9到達相鄰的 基板28，致使電鍍厚度產生偏差。特別是在基板28的端 部，容易產生電鍍電流的集中，從陽極18游離出來的金屬 離子19會集中地電極沈積在與相鄰的陽極18相向的基板 2 8之端部，致使電鍍偏差增大而無法得到均勻的電鍍厚 度。因而，在本實施例中，具備分割板2 0來隔離各基板 28，用以防止從陽極18游離出來的金屬離子19到達與相 鄰的陽極18相向之基板28。 如第4圖所示，將各基板2 8的一邊係線形地配列而成 的複數片基板2 8，投入電鍍槽12時，分割板2 0，相對於 相互相鄰的基板 2 8間的配列，能夠垂直地介於中間。在 此，所謂的垂直地介於中間，不只是幾何學上的基板2 8 的配列與分割板2 0係呈垂直，亦包含考慮製造誤差，實質 上基板2 8的配列與分割板2 0係呈垂直的情況。 分割板2 0可以是與將各基板2 8完全獨立地隔離，或 是如第4圖所示，亦能夠設置在從電鍍槽12的兩壁面算 起，隔開一定距離的位置上，使得電鍍液可以在複數片基 11 200921866 板2 8之間移動。亦即，將複數片基板2 8各自隔離的意思， 係意味著將各基板28完全獨立地隔離、或是以電鍍槽12 内的電锻液能夠流動的方式將各基板2 8的電鍵處理區域 加以區隔。 另一方面，如第4圖所示，以電鍍槽12内的電鍍液能 夠流動的方式設置分割板2 0時，「防止從相鄰的陽極 1 8 游離出來的金屬離子1 9到達」之意思，並非意味著從陽極 18游離出來的金屬離子19完全未到達與相鄰的陽極18相 向之基板2 8。亦即，係意味著以從相鄰的陽極1 8游離出 來的金屬離子19對與相鄰的陽極18相向之基板28進行電 鍍的厚度不會產生電鍍偏差之程度，來防止從相鄰的陽極 18游離出來的金屬離子19到達。只要未將各基板28完全 獨立地隔離來進行電鍍，因為金屬離子19在電鍍液游離而 擴散，所以無法完全地防止金屬離子1 9到達。 在本實施例，分割板20係設置在從電鍍槽1 2的兩壁 面算起，隔開一定距離的位置上，使得電鍍槽12内的電鍍 液可以流動。第5圖係顯示設置分割板2 0時，從陽極18 游離出來的金屬離子19電極沈積於基板28上的情形。依 照第5圖，得知自各陽極1 8游離出來的許多金屬離子1 9， 由於分割板2 0而無法到達與相鄰的陽極 1 8相向之基板 2 8，而能夠有效地到達與各陽極1 8相向的基板2 8，使得 基板2 8的厚度能夠均勻的形成。 分割板2 0可以由絕緣物質所構成。分割板2 0若由傳 導性的金屬材質所構成時，有可能因通電而對電鍍產生不 12 200921866 良的影響’分割板20只要使用沒有電傳導性的絕緣物質時 荩p可。 遮蔽板24係介於陽極18及與陽極18相向的基板28 門且在與基板28相向的面形成開口部22。如上述’ 在基板28的端部容易產生電鍵電流的集中，從陽極 游離出來的金屬離子19會集中地電極沈積於基板28的 端部，彦' 售· JL *L. 里大的電鍍偏差而無法得到均勻的電鍍厚度。 因而’將形成有開口部22之遮蔽板24,設置在陽極18及 與陽極18相向的基板28之間，能夠緩和從陽極18游離出 來的金屬離子19集中於基板28的端部的情況，而能夠使 鍍厚度均勻。亦即’因為從陽極18游離出來的金屬離子 =9 if㈣σ部22而到達陰極也就是基板μ，所以藉由 調節開口部22的大小，能夠緩和金屬離子1 9集中地到達 基板2 8的端部的情况’而能夠得到均勻的電鍍厚度。 夾具26，考慮搬運本發明的基板28之方便性，作成 可安置複數片基板28而能夠容易地搬運複數片基板28。 *具26係由導電性的物質所構成，若與基板以電連接時， 能夠將陰極連接在夾具26而將其作為陰極。 第6圖係表示本路ΒΗ & p M a 發月的另外貫施例的電鍍裝置之平 圖。參照第6圖，顯示有雷鏔搞，， 丁有電鍍槽12、陽極18、分割板2〇、 開口部22、遮蔽板24、美；^ i 暴板28及陽極導引件3〇。 本實施例之特徵，係蕻A 叫吐上 f藉由將從陽極18游離出來的金属 離子誘導至與該陽極18相向之其屬 相〇之基板28,來使從陽極18 離出來的金屬離子到達盍相齟 8存 與相#的陽極18相向之基板28的 13 200921866 情況成為最小化，來使電鑛厚度均勻。 說明關於本實施例，對於與上述實施例同一構 係省略重複說明，而重點說明與上述實施例不同的 素。 陽極導引件3 0係用以將從陽極1 8游離出來的 子誘導至與該陽極18相向之基板28。如第5圖所 為從陽極18游離出來的金屬離子，係從曝露於電解 陽極1 8的各面流出，亦會對與相鄰的陽極1 8相向 28的電鍍厚度造成影響。因此，藉由設置陽極導引 用以將從陽極18游離出來的金屬離子誘導至與該1 相向之基板2 8，能夠使電鍍厚度均勻。 如本實施例，陽極導引件3 0包含互相隔離的一 板，收容有陽極1 8，並使陽極1 8的單面朝向相向 28 ° 在相互隔離的一對導引板之間，收容有陽極1 { 陽極18的單面（前面）係朝向相向的基板28之方式 從陽極1 8的側面及單面游離出來的金屬離子，全部 至相向之基板2 8。如此，使從陽極1 8游離出來的 子被誘導至與相鄰的陽極1 8相向之基板2 8的情況 小化，來使基板2 8的電鍍厚度形成均勻。 陽極導引件3 0的形態並未限定於本實施例，能 可將從陽極1 8游離出來的金屬離子誘導至相向之: 之各種形態的陽極導引件3 0，例如能夠使用單面開 盒型陽極導引件30、雙面開放型的筒型陽極導引件 成要素 構成要 金屬離 示，因 質中之 的基板 件30， 身極18 對導引 之基板 ，並以 ，使得 被誘導 金屬離 成為最 夠使用 I：板 28 放型的 30等。 14 200921866 以上係參照本發明的較佳實施例來說明，應理解若是 在該技術領域具有通常的知識者，在未悖離申請專利範圍 所記載之本發明的思想及領域的範圍内，能夠將本發明做 各式各樣地修正及變更。 【圖式簡單說明】 第1圖係表示先前技術的電鍍裝置之平面圖。 第2圖係表示先前技術的電鍍裝置之使用狀態圖。 第3圖係表示本發明的一個實施例的電鍍裝置之斜視 圖。 第4圖係表示本發明的一個實施例的電鍍裝置之平面 圖。 第5圖係表示本發明的一個實施例的電鍍裝置之使用 狀態圖。 第6圖係表示本發明的另外實施例的電鍍裝置之平面 圖。 【主要元件符號說明】 12、 102 電 鍍 槽 14 陽 極 銘 JOZZ. 16 電 鍍 金 屬 18 、 104 陽 極 19、 110 金 屬 離 子 20 分 割 板 22 開 π 部 24 遮 蔽 板 26、 106 爽 具 28 ' 108 基 板 30 陽 極 導 引件 15BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus, and more particularly to an electric galvanic apparatus capable of obtaining a uniform plating thickness during electrolytic plating. [Prior Art] Electrolytic keys are not used only for metallic decoration or surface protection, and are used in various fields such as electronic components, printed circuit boards, and semiconductor elements. $ Electroplating is to put the electroplated body to be electroplated into the plating solution, and to be used as the cathode by the electric bell body. 'The metal deposited by the electrode is used as an anode, and the current is required to cause the metal ions to be deposited to be The surface of the electroplated body is used to form a plating film. When the electroplating system is conductive, the electroplated body can be directly used as a cathode for electroplating. However, when the circuit substrate is made of an insulating material, electroless plating is first used to form an electrode for electrolytic plating on the insulating material. A seed layer is formed, and the seed layer is electrolytically plated as an electrode to form a plating film. Figure 1 is a plan view showing a prior art electroplating apparatus. Fig. 2 is a view showing the state of use of the prior art electroplating apparatus. Referring to FIGS. 2 to 2, when a plurality of substrates 108 are collectively put into an electric ore tank and a plurality of substrates 108 are electrically connected, a jig of a plurality of substrates 1 to 8 is placed in the plating. In the center of the groove 02, the anode crucible 4 is disposed so as to face each other on both sides of each of the substrates 1 to 8, and the both sides of the substrate 1 to 8 are subjected to electric ore. Here, the metal 200921866 deposited on the plating surface of the substrate 1 8 is an anode 104'. The substrate 108 is a cathode. When the substrate i 8 is made of a conductive metal, it can be used as a cathode as it is. However, when the insulating substrate 1 〇 8 is formed, a conductive seed layer is formed on the surface of the substrate 1 〇 8 in advance. It is used as an electrode for electrolytic plating and is used as a cathode. However, according to the plating apparatus of the prior art, as shown in FIG. 2, when a plurality of substrates 108 are collectively put into the plating bath 1〇2 while the plurality of substrates 108 are plated, they are released from the anodes 1〇4. The metal ion u〇 electrode is deposited on the substrate 108 facing the adjacent anode 1〇4, which causes a problem that the thickness of the electroplated silver is different from the plating thickness at the time of design, and plating deviation occurs. In particular, at the end of the substrate i 08, since the concentration of the plating current is easily generated, the metal ions 110 liberated from the anode 104 are concentratedly deposited on the end of the substrate 108 opposed to the adjacent anode 1〇4, resulting in generation. Significant key deviations' so there is a problem that a uniform plating thickness cannot be obtained. Such a plating variation causes a chronic defect such as deterioration of electrical characteristics in a circuit board or separation of a solder ball or the like, and particularly, a circuit board is recently reduced in size and high in integration of electronic components. A fine circuit is required. However, due to such plating variation, there is a problem that it is difficult to manufacture a precise circuit board. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] In view of the problems of the prior art, the object of the present invention is to provide a plating apparatus of the same type of 200921866, in which the anode is freed when a plurality of substrates are plated in batches. Metal ions reach a uniform anode phase to obtain a uniform plating thickness. [Technical means for solving the problem] According to one embodiment of the present invention, there is provided a device for batch plating a plurality of substrates, characterized in that a groove for inputting a plurality of substrates; an anode which is opposed to each of the plurality of substrates; and a dividing plate which is detached to prevent metal from being released from the adjacent anode It can further comprise a shielding plate which is interposed between the oppositely facing substrates, and is formed on the surface facing the substrate and can further contain an anode guide, and the metal ions released from the anode are induced to the opposite direction. The substrate. The anode guide member includes a pair of guide plates that are isolated from each other with one side of the anode facing the opposite substrate. The anode can comprise an anode blue ore metal for inputting a plating metal, and can contain at least one selected from the group consisting of copper 'nickel, tin, silver zinc. The split plate may be made of an insulating material. The anode is located at a position facing each other on both sides of the substrate. The plurality of substrates may be inserted into one side of each of the substrates. In this case, the split plate may be provided with respect to the arrangement. Between adjacent substrates. By preventing the substrate 'plating apparatus' from being included, electroplating is provided so that a plurality of substrate spacers can arrive. The anode and the anode have openings. Used to vertically align the anode, iridium, platinum, gold and shape from the containment anode. 2009 21866 [Effect] According to the present invention, the metal ions released from the anode are prevented from reaching the substrate facing the adjacent anode. A uniform plating thickness can be obtained, whereby the reliability of plating can be improved, and a high-quality electroplated product can be produced. [Embodiment] Since the present invention has various modifications and various embodiments, the specific embodiments of the present invention will be described in detail by the accompanying drawings. However, the present invention is not limited to the specific embodiment, and it is to be understood that the invention includes all modifications, equivalents and substitutions included in the scope of the invention. In the description of the present invention, when it is determined that the related art is specifically described, the gist of the present invention may be unclear, and the detailed description thereof will be omitted. The words used in the present invention are used to describe specific embodiments and are not intended to limit the invention. The performance of the singular, as long as the text does not clearly show the performance of the plural. In the present invention, the terms "including" or "having" are used to mean that the features, numbers, stages, actions, constituent elements, components, or combinations of those described in the specification are designated. Existence, but without prejudice to the existence or additional possibilities of one or more other features, or numbers, stages, acts, components, components, or combinations. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the plating apparatus of the present invention will be described in detail with reference to the accompanying drawings, and the same reference numerals are attached to the same and corresponding elements of the same reference numerals, and the description thereof is omitted. Repeat the instructions. Fig. 3 is a perspective view showing a plating apparatus of an embodiment of the present invention. Fig. 4 is a plan view showing a plating apparatus of one embodiment of the present invention. Fig. 5 is a view showing the state of use of the plating apparatus of one embodiment of the present invention. Referring to Figures 3 to 5, the plating bath 12, the anode basket 14, the plating metal 16, the anode 18, the metal ions 19, the split plate 20, the opening 22, the shield plate 24, the squeegee 26, and the substrate 28 are shown. In the electroplating apparatus of the present embodiment, the electroplating tank 1 2, the anode 18 and the dividing plate 20 are used as constituent elements; the plating tank 12 is used to input a plurality of substrates 28; the (plural) anodes 18 The plurality of substrates 28 are spaced apart from each other, and the plurality of substrates 28 are isolated to prevent metal ions 19 released from the adjacent anodes 18 from reaching; When the plurality of substrates 28 are plated in batches, since the metal ions 19 liberated from the anode 18 can be prevented from reaching the substrate 2 8 opposed to the adjacent anode 18, uniformity can be obtained on the plurality of substrates 28. Plating thickness. In the plating bath 12, a plating solution necessary for plating is added, and the size of the plurality of substrates 28 can be simultaneously input. Here, the substrate 28 means not only an insulator in which a circuit is formed but also a plate-like object to be plated, such as a steel plate or a tantalum wafer to be plated. A nozzle (not shown) may be provided in the plating bath 12 for ejecting the plating solution, and the plating solution can be stirred without stagnation by the plating solution ejected from the nozzle. Further, the electro-mineral liquid may be recirculated by overflowing from the electric clock slot 12 or by sucking it out. 200921866 The anodes 18 are arranged to face each of the plurality of substrates 28 such that metal ions 19 liberated from the plating metal 16 of the anode 18 are easily deposited on the substrate 28. The anode 18 can be constructed of an anode basket 14 and an electroplated metal 16 that is fed into the anode basket 14. The anode basket 14 is in a porous network form so that the metal ions liberated from the plating metal 16 can be easily discharged. The electroplated metal 16 is formed into a ball form and can be put into the anode basket 14. The electroplated metal 16 is a metal electroplated metal 16 to be electrode deposited on the substrate 28. It is not only a pure metal but also an alloy. The plating metal 16 may contain at least one selected from the group consisting of copper, nickel, tin, silver, platinum, gold, and zinc. Each of the copper 'nickel, tin, silver, platinum, gold, and zinc may be electroplated as the plating metal 16, or an alloy of these metals may be used as the electric ore metal 16. For example, when a circuit is formed on the substrate 28 using copper (Cu), a steel ball can be used as the plating metal 16. In addition, it is necessary to use zinc as the plating metal 16 when the steel plate is to be electrified. Further, an alloy of steel and rhodium, that is, brass, may be used as the plating metal 16. On the other hand, when both sides of the substrate 23 are to be simultaneously plated by one plating tank 12, as shown in Fig. 4, the anodes 18 can be disposed at positions facing each other on both sides of the substrate 28. When the right pole 18 and the cathode are connected to the rectifier t and energized, the electric key metal 16 is electrically decomposed, and the metal ions 19 of the plating metal 16 of the anode 18 are released to the plating solution, and the electrons are moved by the rectifier. To the cathode. The metal ions 19 which are released into the plating solution are electroplated at the cathode, that is, the surface of the substrate 28 is bonded to the moving electrons. 10 200921866 The splitter plate 20 is used to prevent the arrival of metal ions 19 released from the adjacent anodes 18 and to isolate the plurality of substrates 28 from each other. The plurality of substrates 28 are arranged to correspond to the anodes 18 facing each other. When the metal ions 19 released from the anodes 18 corresponding to the respective substrates 28 are deposited on the counter substrate 28, the same uniformity as in the design can be obtained. Plating thickness. However, in addition to the metal ions 19 liberated from the corresponding anodes 18, when the metal ions 19 released from the adjacent anodes 18 reach the substrate, there are more metal ions than the metal ions at the time of design. The arrival of the 19 to the adjacent substrate 28 causes a deviation in the plating thickness. In particular, at the end of the substrate 28, concentration of plating current is likely to occur, and metal ions 19 liberated from the anode 18 are concentratedly deposited on the end of the substrate 28 adjacent to the adjacent anode 18, resulting in an increase in plating deviation. Large enough to achieve a uniform plating thickness. Therefore, in the present embodiment, the dividing plate 20 is provided to isolate the respective substrates 28 for preventing the metal ions 19 liberated from the anode 18 from reaching the substrate 28 opposed to the adjacent anodes 18. As shown in Fig. 4, when a plurality of substrates 28 8 in which one side of each of the substrates 28 are linearly arranged are placed in the plating tank 12, the partitioning plate 20 is arranged with respect to the adjacent substrates 28 , can be vertically in the middle. Here, the so-called vertically interposed, not only the arrangement of the geometric substrate 28 is perpendicular to the split plate 20, but also includes the arrangement of the substrate 28 and the split plate 20 in consideration of manufacturing errors. Vertical. The dividing plate 20 may be completely isolated from the respective substrates 28 or, as shown in FIG. 4, may be disposed at a position separated from the wall surfaces of the plating tank 12 by a certain distance, so that plating is performed. The liquid can be moved between a plurality of substrates 11 200921866 plates 28. That is, the fact that the plurality of substrates 28 are separated from each other means that the respective substrates 28 are completely isolated, or the electric processing regions of the respective substrates 28 are flowed so that the electric forging liquid in the plating tank 12 can flow. Separated. On the other hand, as shown in Fig. 4, when the dividing plate 20 is provided so that the plating liquid in the plating bath 12 can flow, "the metal ions which are released from the adjacent anodes 1 are prevented from reaching 19" means It does not mean that the metal ions 19 liberated from the anode 18 do not reach the substrate 28 which is opposed to the adjacent anode 18 at all. That is, it means that the thickness of the plating of the substrate 28 opposed to the adjacent anode 18 by the metal ions 19 liberated from the adjacent anodes 18 does not cause plating deviation to prevent the anode from being adjacent. 18 free metal ions 19 arrive. As long as the respective substrates 28 are not completely isolated and electroplated, since the metal ions 19 are free to diffuse in the plating solution, the metal ions 19 cannot be completely prevented from reaching. In the present embodiment, the dividing plate 20 is disposed at a position spaced apart from the both walls of the plating tank 12 so that the plating solution in the plating tank 12 can flow. Fig. 5 shows a case where the metal ion 19 electrode which is released from the anode 18 is deposited on the substrate 28 when the dividing plate 20 is provided. According to Fig. 5, it is understood that a plurality of metal ions liberated from the respective anodes 18 are unable to reach the substrate 2 8 opposed to the adjacent anodes 18 due to the division plate 20, and can effectively reach the anodes 1 The 8 opposite substrates 2 8 are such that the thickness of the substrate 28 can be formed uniformly. The dividing plate 20 may be composed of an insulating material. When the split plate 20 is made of a conductive metal material, there is a possibility that the plating may be affected by the energization. 12 The damage of the plate 20 may be as long as the insulating material having no electrical conductivity is used. The shielding plate 24 is interposed between the anode 18 and the substrate 28 facing the anode 18, and has an opening 22 formed on a surface facing the substrate 28. As described above, the concentration of the key current is likely to occur at the end of the substrate 28, and the metal ions 19 released from the anode are concentratedly deposited on the end of the substrate 28, and the plating variation is large in the case of JL*L. Uniform plating thickness is not available. Therefore, the shielding plate 24 in which the opening 22 is formed is provided between the anode 18 and the substrate 28 opposed to the anode 18, and the metal ions 19 liberated from the anode 18 can be alleviated at the end of the substrate 28, and Can make the plating thickness uniform. That is, since the metal ion liberated from the anode 18 = 9 if (four) σ portion 22 reaches the cathode, that is, the substrate μ, by adjusting the size of the opening portion 22, the metal ions 19 can be alleviated to reach the end portion of the substrate 28 in a concentrated manner. The situation 'can achieve a uniform plating thickness. The jig 26 can be easily handled by transporting the plurality of substrates 28 in consideration of the convenience of transporting the substrate 28 of the present invention. * The device 26 is made of a conductive material. When electrically connected to the substrate, the cathode can be connected to the jig 26 to serve as a cathode. Fig. 6 is a plan view showing a plating apparatus of another embodiment of the present invention. Referring to Fig. 6, there is shown a Thunder, a plating bath 12, an anode 18, a dividing plate 2, an opening 22, a shielding plate 24, a slab, and an anode guiding member 3A. In the feature of this embodiment, the 蕻A is called spit f, and the metal ions separated from the anode 18 are induced by the metal ions released from the anode 18 to the substrate 28 opposite to the anode 18. The situation of the substrate 28 of the substrate 28 opposite to the anode 18 of the phase 8 is minimized to make the thickness of the electric ore uniform. In the description of the present embodiment, the same description as the above embodiment is omitted, and the differences from the above embodiment will be mainly described. The anode guide member 30 is for inducing a child liberated from the anode 18 to the substrate 28 opposed to the anode 18. The metal ions released from the anode 18 as shown in Fig. 5 flow out from the respective faces exposed to the electrolytic anode 18, and also affect the plating thickness of the adjacent anodes 18. Therefore, the plating thickness can be made uniform by providing the anode guiding to induce the metal ions released from the anode 18 to the substrate 2 8 facing the one side. As in the present embodiment, the anode guiding member 30 includes a plate that is isolated from each other, and houses the anode 18, and has one side of the anode 18 facing 28 degrees toward each other between the pair of guiding plates that are isolated from each other. The anode 1 {the single side (front surface) of the anode 18 is directed toward the opposite substrate 28 so that the metal ions released from the side surface and the single side of the anode 18 are all directed to the opposite substrate 28. Thus, the case where the ions liberated from the anode 18 are induced to the substrate 28 which is opposed to the adjacent anode 18 is made small, so that the plating thickness of the substrate 28 is made uniform. The form of the anode guiding member 30 is not limited to this embodiment, and the metal ions released from the anode 18 can be induced to face each other: the anode guiding member 30 of various forms can be, for example, one-sidedly opened. The box-type anode guiding member 30 and the double-sided open type cylindrical anode guiding member are formed into elements to be metal-exposed, because the substrate member 30 of the mass, the body 18 is guided by the substrate, and The induced metal separation is the most suitable for using the I: plate 28 release type. 14 200921866 The above description is based on the preferred embodiments of the present invention, and it should be understood that those skilled in the art can, without departing from the scope of the invention and the scope of the invention described in the claims The present invention has been modified and changed in various ways. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a prior art electroplating apparatus. Fig. 2 is a view showing a state of use of a prior art plating apparatus. Fig. 3 is a perspective view showing a plating apparatus of an embodiment of the present invention. Fig. 4 is a plan view showing a plating apparatus of one embodiment of the present invention. Fig. 5 is a view showing the state of use of the plating apparatus of one embodiment of the present invention. Fig. 6 is a plan view showing a plating apparatus of another embodiment of the present invention. [Main component symbol description] 12, 102 Electroplating bath 14 Anode Ming JOZZ. 16 Electroplated metal 18, 104 Anode 19, 110 Metal ion 20 Split plate 22 Open π Part 24 Screening plate 26, 106 Cooling 28 '108 Substrate 30 Anode lead Primer 15