TWI769643B - A plating apparatus having individual partitions - Google Patents

Abstract

The present invention relates to a plating apparatus having individual partitions, and more particularly, to a plating apparatus having individual partitions that is capable of forming a plating layer having a uniform thickness on a substrate held by the jig. The plating apparatus having individual partitions, according to the present invention, comprises: a continuous plating line having first anodes; a stepwise plating line disposed behind the continuous plating line and provided with second anodes; and a control unit for regulating values of the electric current applied to the first and second anodes such that the final plating thickness to be formed on a substrate is kept uniform, wherein in the continuous plating line, plating is performed while the substrate is moved; in the stepwise plating line, plating is performed while the substrate is stopped; and in the stepwise plating line, individual partitions are installed for each individual region in which an individual substrate is arranged such that when the substrate is plated in the individual region of the stepwise plating line, any interinfluence of plating between adjacent substrates with the individual partitions interposed therebetween is minimized.

Description

Electroplating equipment with individual partitions

The present invention relates to an electroplating apparatus with individual divisions, and in particular, to an electroplating apparatus with individual divisions that can form an electroplating layer with a uniform thickness on a substrate held by a jig.

In order to realize metal film patterning on the substrate, the electroplating method, which is excellent in electromigration resistance and cheaper in preparation cost, has become the first choice compared with the evaporation method.

The principle of conventional electroplating has been described in Korean Laid-Open Patent Publication No. 2010-0034318 (published on April 1, 2010), and it is recorded that a copper plate for forming an anode and a The substrate of the cathode is formed so that copper ions (Cu2+) separated from the copper plate are moved to the substrate to form a metal film.

In a common example of this electroplating method, the electroplating method using a loose hanger adopts the following principle: the object to be plated is mounted on a loose hanger, mounted on a vertical rail or a horizontal rail, and at the same time of starting, it is deposited in a container. After being placed in the electroplating solution in the electroplating tank, the electroplating object is used as the cathode, and the metal to be plated or the insoluble metal is used as the anode.

Then, when the current is supplied to the electrode through the rectifier, the metal ions contained in the plating solution are separated while the electroplating solution is electrolyzed, and adhere to the surface of the object to be plated as the cathode. After a period of time, a metal thin film is formed and the electroplating is completed.

In the future, as printed circuit boards become thinner, the plating method requires control of current density, plating thickness distribution, and the like in order to uniformly form the thickness of the metal film.

Specifically, the throwing power method, which has been hotly discussed in the past, is an example thereof.

In this throwing method, one rectifier is connected to a plurality of cathode hangars, and on the cathode hangars, the jig is divided into several branches, and the substrate is held in the form of pliers to allow current to pass.

However, this throwing method has the disadvantage that it is difficult to form a copper metal film uniformly on the substrate.

That is, the plating area of the substrate is large, the current starting on the hanger is different, and the dispersion of the plating current on the substrate occurs due to the contamination of the jig and the poor strength of the jig chuck.

Due to this difference in plating current, the circuit density on the substrate becomes non-uniform, resulting in uneven plating thickness distribution.

Therefore, the copper metal film of the printed circuit board has an uneven thickness distribution of the plating layer as a whole, which will lead to the deterioration of the surface quality and the reduction of the reliability of the printed circuit board.

prior art literature Patent Literature

Registered patent 10-1859395

Published Patent 10-2013-0071861

In order to solve the above-mentioned drawbacks of the conventional technology, the present invention provides an electroplating apparatus with individual partitions in an electroplating production line in which the substrate is continuously moved, so that the final electroplating layer formed on the substrate held by the jig has a uniform thickness.

In order to achieve the above object, the present invention provides an electroplating device with individual partitions, including: a continuous electroplating production line, which continuously moves a clamp holding a substrate along one direction at a constant speed, supplies power to a first anode, and forms an electroplating layer on the substrate a step-by-step electroplating production line, which is arranged at the rear of the continuous electroplating production line and is provided with a second anode for supplying power to the second anode. a plating layer; a control section that adjusts the current values applied to the first and second anodes to maintain a uniform final plating thickness formed on the substrate, the continuous plating line in a state in which the substrate is moved electroplating is performed in the step-by-step electroplating line that performs electroplating in a state where the substrate is stopped, the step-by-step electroplating line is provided with individual divisions in each individual area where individual substrates are arranged, so that the step-by-step electroplating line When electroplating is performed on the substrates in the individual regions of , the influence of the adjacent substrates on the plating on each other is minimized through the individual partitions.

The individual zones are arranged on the step-by-step electroplating production line along a direction intersecting at right angles to the substrate transfer direction, and the individual zones are formed between two spaced individual zones, which are configured with a substrate and the For the second anode, a through hole for transferring the substrate is formed in the individual section.

The control unit keeps the current value applied to the first anode constant in the entire section of the continuous electroplating line, while in the step-by-step electroplating line, the jig transferred by the continuous electroplating line is stopped In this state, the sub-jig adjusts the current value applied to the second anode corresponding to the jig, so that the final plating thickness formed on the substrate remains uniform.

The continuous electroplating production line is provided with a first guide rail of conductive material for transferring the clamp, the step-by-step electroplating production line is provided with a second guide rail for transferring the clamp, the second guide The rail is composed of the following components: a plurality of conductive rail fittings, which are composed of conductive conductor materials and are arranged at intervals; insulating rail fittings, which are arranged between the conductive rail fittings, and the conductive rail fittings are arranged in The individual area is electrically connected to a jig stopped in the individual area, and the control unit controls the current value applied to each second anode arranged in the individual area, respectively, in the continuous electroplating line and the individual area. The current is controlled throughout the entire section of the electroplating line so that the final combined current value applied to the individual fixtures through the first and second anodes is within a preset constant value.

It is arranged in the first anode of the continuous electroplating production line, and the upper and lower parts are provided with baffle plates, and in the second anode of the step-by-step electroplating production line, the upper part, the lower part, the left side and the right side are provided with baffle plates .

As described above, the electroplating apparatus provided with individual partitions provided by the present invention has the following technical effects.

In the present invention, a step-by-step electroplating production line is arranged at the lower part of the continuous electroplating production line, and the current value applied from the step-by-step electroplating production line to the second anode is adjusted. Even if the resistance value of each fixture is partially different, the final current value applied to the fixture can be always Keeping constant, the final plating thickness of the substrate held in the jig remains uniform.

In addition, in the step-by-step electroplating production line, the upper part, the lower part, the left side and the right side of the second anode can be provided with resist plates, which can prevent the entire edge part of the substrate from accumulating current, and prevent the thickness of the electroplating layer on the edge part of the substrate from becoming abnormally thick. The value of the current applied to the second anode can be adjusted by the control section to maintain a uniform thickness of the plating layer formed over the entire substrate.

10: Continuous electroplating production line

11: Electroplating tank

12: The first anode

17: The first rail

20: Step-by-step electroplating production line

21: Electroplating tank

22: Second anode

23: The first individual area

24: Second individual area

25: Individual partitions

26: Through hole\

27: Second rail

28: Insulation rail accessories

29: Conductor rail accessories

30: Control Department

40: Fixture transfer device

50: Fixtures

51: Substrate

52: Blocker

FIG. 1 is a plan view of an electroplating apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a state in which the jig in FIG. 1 is transferred to the first individual area by the jig transfer tool.

3 is a plan view of a state in which the jig in FIG. 2 is transferred to the first individual area and the second individual area by the jig transfer tool.

FIG. 4 shows a graph of adjusting the current value according to the embodiment of the present invention.

5 is a front view of the first anode and the second anode in the embodiment of the present invention.

As shown in FIGS. 1 to 3 , the electroplating apparatus with individual divisions according to the present invention includes a continuous electroplating line 10 , a step-by-step electroplating line 20 , a control unit 30 , a jig transfer device 40 , and the like.

The continuous electroplating production line 10 is provided with an electroplating tank 11 and a first anode 12 .

The continuous electroplating line 10 continuously moves the jig 50 holding the substrate 51 in one direction at a constant speed to supply power to the first anode 12 disposed inside the electroplating tank 11 to form a plating layer on the substrate 51 .

The continuous electroplating production line 10 is a production line for completing the electroplating of the substrate 51 while the jig 50 holding the substrate 51 continues to move in one direction without stopping.

The step-by-step electroplating production line 20 is arranged behind the continuous electroplating production line 10 and is provided with an electroplating tank 21 and a second anode 22 .

The electroplating baths 21 formed in the step-by-step electroplating line 20 extend from the electroplating baths 11 formed in the continuous electroplating line 10 .

The step-by-step electroplating production line 20 supplies power to the second anode 22 disposed inside the electroplating tank 21 , and after the continuous electroplating production line 10 completes electroplating, the substrate 51 is transferred by the fixture transfer device 40 on the substrate 51 . An additional plating layer is formed.

The step-by-step electroplating line 20 is a line that further completes electroplating on the substrate 51 in a state where the jig 50 holding the substrate 51 is stopped without moving.

That is, the continuous electroplating line 10 performs electroplating while the substrate 51 is moved, and the step-by-step electroplating line 20 performs electroplating while the substrate 51 transferred by the jig transfer device 40 is stopped. , the continuous electroplating production line 10 and the step-by-step electroplating production line 20 are not separately provided, but the step-by-step electroplating production line 20 is connected to the rear of the continuous electroplating production line 10 .

As shown in FIG. 4 , the control unit 30 adjusts the current values applied to the first anode 12 and the second anode 22 to keep the final plating thickness formed on the substrate 51 uniform.

The control unit 30 keeps the current value applied to the first anode 12 constant in the continuous electroplating line 10 regardless of the individual jig 50 holding each substrate 51, while in the step-by-step electroplating line 20, the control unit 30 keeps the current value applied to the first anode 12 constant. The individual clamps 50 individually adjust the value of the current applied to the second anode 22 in accordance therewith.

Looking more specifically at the continuous electroplating line 10, it can be seen that the control section 30 is applied to the entire section of the continuous electroplating line 10, ie, in the entire electroplating section, regardless of the plurality of individual fixtures 50. The current value of the first anode 12 is kept constant.

That is, even if there is a partial difference in the resistance values of the plurality of jigs 50 , the control unit 30 applies a constant current value to the first anode 12 over the entire section of the continuous plating line 10 regardless of this.

Therefore, when the resistance values of the plurality of clamps 50 are partially different, even if the same current value is applied to the first anode 12 , the substrate 51 held by the clamps 50 can be adjusted according to the different resistance values of the clamps 50 . Electroplating layers with different thicknesses are formed.

Furthermore, looking at the step-by-step electroplating line 20 in more detail, the control unit 30 makes each individual jig 50 in a state where the jig 50 transferred by the continuous electroplating line 10 is stopped. That is, the current value applied to the second anode 22 corresponding to the jig 50 is adjusted for each jig 50 that holds the respective substrates 51 .

That is, the control unit 30 can change and adjust the current value applied to the second anode 22 in the step-by-step electroplating production line 20 , and the second anode 22 faces the substrates 51 held by the individual fixtures 50 one by one. noodle.

Thus, in the step-by-step electroplating line 20 , the individual jigs 50 put in can change the current value applied to the second anode 22 through the control unit 30 one by one, so that the step-by-step electroplating line 20 can be formed on the substrate Additional plating layers of 51 have different thicknesses.

The control section 30 keeps the current value applied to the first anode 12 constant in the continuous electroplating line 10, and adjusts the current value applied to the second anode 22 in the step-by-step electroplating line 20, so that each The individual fixtures 50 have different resistance values, and the thickness of the electroplating layer formed on the substrate 51 can also be adjusted in the step-by-step electroplating production line 20 to keep the final plating thickness formed on the substrate 51 uniform.

At this time, in the present invention, in the section of the step-by-step electroplating production line 20 , the control unit 30 adjusts the current value to adjust the thickness of the electroplating layer formed on the substrate 51 , and the step-by-step electroplating production line 20 does not move on the substrate 51 . The electroplating is performed in the stopped state, so that the substrate 51 can be formed with a more stable electroplating layer, and the thickness of the electroplating layer can be precisely controlled.

A plurality of the second anodes 22 provided in the step-by-step electroplating production line 20 may be provided at intervals, and each of the second anodes 22 is controlled by the control unit 30 respectively.

As described above, the current values applied to the plurality of second anodes 22 are individually controlled, and the control unit 30 changes the values of the currents applied to the plurality of second anodes 22 in a state where the substrates 51 are sequentially moved and then temporarily stopped inside the step-by-step plating line 20 . The current value applied to each of the second anodes 22 changes the thickness of the plating layer formed on each substrate 51 , thereby keeping the final plating thickness formed on the substrate 51 uniform.

Regarding the current values applied to the first anode 12 of the continuous electroplating line 10 and the second anode 22 of the step-by-step electroplating line 20 , the control section 30 is in the entire area of the continuous electroplating line 10 and the step-by-step electroplating line 20 . The segment controls the current so that the final combined current value applied to the individual clamps 50 through the first anode 12 and the second anode 22 is the same as a preset constant value or within a certain range.

More specifically, in the continuous plating line 10, the control unit 30 totals the current values applied to the individual jigs 50 through the first anode 12, and calculates an intermediate total value.

Then, after the control unit 30 calculates a residual current value obtained by subtracting the intermediate total value from the final total current value, the step-by-step electroplating line 20 adjusts and controls the current value applied to the second anode 22 , so that the calculated residual current value is applied to the individual fixture 50 .

As described above, when the control unit 30 adjusts the current value, the final total current value applied to the jig 50 is always constant.

At this time, the final total current value is not the current value applied to the first anode 12 and the second anode 22 , but means the current value detected from the jig 50 by a sensor or the like.

Therefore, even if the resistance value of each jig 50 is partially different, the final current value applied to the jig 50 is always constant, thereby keeping the final plating thickness of the substrate 51 held by the jig 50 uniform.

The jig transfer device 40 forcibly transfers the jig 50 reaching the end point of the continuous electroplating production line 10 to the place where the second anode 22 of the step-by-step electroplating production line 20 is disposed.

The specific structure of the clip transfer device 40 may be conventionally known in a variety of devices, and therefore, the specific structure description thereof is omitted here.

The jig transfer device 40 transfers the jig 50 faster than the continuous electroplating line 10 transfers the jig 50 .

That is, the jig transfer device 40 transfers the jigs 50 to the step-by-step electroplating line 20 faster than the continuous plating line 10 electroplating and transferring the jigs 50 .

The step-by-step electroplating line 20 completes electroplating with the substrates 51 arranged in the step-by-step electroplating line 20 stopped until a new substrate 51 reaches the end of the continuous electroplating line 10 .

As mentioned above, since the speed of transferring the jig 50 by the jig transfer device 40 is faster than that of the continuous electroplating line 10, the jig 50 at the end of the continuous electroplating line 10 is transferred to the step-by-step electroplating line 20 After that, until the new substrate 51 reaches the end point of the continuous electroplating line 10 , the step-by-step electroplating line 20 forms an electroplating layer on the stopped substrate 51 .

The step-by-step electroplating production line 20 forms a first individual region 23 and a second individual region 24 in which individual substrates 51 are arranged along one direction.

The first individual area 23 and the second individual area 24 are just an example, and more individual areas may exist.

The first individual regions 23 and the second individual regions 24 are provided with respective second anodes 22 .

When a new substrate 51 is transferred from the continuous electroplating production line 10 to the first individual area 23 through the jig transfer device 40 , the substrate 51 located in the first individual area 23 moves with the jig transfer device 40 , is automatically moved to the adjacent second individual area 24 .

That is, the jig transfer device 40 transfers the jig 50 arranged at the end point of the continuous plating line 10 to the first individual area 23 of the step-by-step plating line 20 , and at the same time the jig 50 is arranged in the first individual area 23 . The gripper 50 is moved to the second individual area 24 .

Also, since the first individual regions 23 and the second individual regions 24 are provided with the respective second anodes 22 , the control unit 30 adjusts the current value applied to the respective second anodes 22 so that the electric current of the step-by-step electroplating production line 20 is completed. The final plating thicknesses of the substrates 51 are equal to each other.

In addition, in the step-by-step electroplating production line 20 , each of the individual regions 23 and 24 where the individual substrates 51 are arranged is provided with an individual partition 25 .

When plating substrates 51 in individual regions of the step-by-step electroplating production line 20 , the individual partitions 25 can minimize the influence of adjacent substrates 51 on electroplating, that is, the influence of ions and electric fields.

The individual partitions 25 are disposed on the step-by-step electroplating production line 20 along a direction intersecting at right angles to the transfer direction of the substrate 51 .

The individual regions are formed between two individual partitions 25 spaced apart in the direction of movement of the jig 50 , which are provided with a substrate 51 and the second anode 22 .

In addition, the individual partitions 25 are formed with through holes 26 for transferring the substrate 51 in one direction.

Therefore, when the jig 50 is transferred, the substrate 51 held by the jig 50 passes through the through holes 26 formed in the individual partitions 25 and is easily moved to an adjacent individual area.

Furthermore, the continuous electroplating production line 10 is provided with a first guide rail 17 of conductive material for transferring the jig 50 , and the step-by-step electroplating production line 20 is provided with a second guide rail 27 for transferring the jig 50 .

The second guide rail 27 is composed of the following components: a plurality of conductive rail fittings 29 , which are composed of conductor materials and are arranged at intervals; and insulating rail fittings 28 , which are arranged between the conductive rail fittings 29 .

The conductive rail fittings 29 are arranged in the individual areas, and are electrically connected to the clamps 50 stopped in the individual areas.

The control unit 30 controls the current value applied to each of the second anodes 22 arranged in the individual regions, respectively, and controls the current in the entire section of the continuous electroplating line 10 and the step-by-step electroplating line 20 so as to pass through the second anodes 22. The final combined current value applied to the individual clamps 50 by one anode 12 and the second anode 22 is within a preset constant value.

And, in the first anode 12 disposed in the continuous electroplating production line 10, as shown in FIG. The upper part and part of the lower part are arranged in the second anode 22 of the step-by-step electroplating production line 20, and are respectively provided with a blocking plate 52, and the blocking plate 52 covers part of the upper part, part of the lower part, Part left and part right.

In the continuous electroplating production line 10, since the substrate 51 continues to move in the lateral direction, the blocking plates 52 for covering part of the left side and part of the right side of one side of the first anode 12 cannot be provided, but the step-by-step In the electroplating production line 20, since the electroplating is completed in a state where the substrate 51 is stopped, a resist plate 52 that can cover part of the left side and part of the right side of one surface of the second anode 22 can be provided.

As described above, in the second anode 22, not only the upper and lower parts, but also the left and right sides are provided with the blocking plates 52, so that when electroplating is performed, the edge portion of the substrate 51 can be prevented from accumulating current, resulting in the thickness of the electroplating layer. become uneven.

That is, in the step-by-step electroplating production line 20 according to the present invention, blocking plates 52 may be provided on the upper, lower, left and right sides of the second anode 22, which can prevent current from concentrating on the entire edge portion of the substrate 51, causing the edge portion of the substrate 51 If the thickness of the plating layer becomes abnormally thick, the current value applied from the control unit 30 to the second anode 22 can also be adjusted to make the thickness of the plating layer formed on the entire substrate 51 uniform.

The electroplating apparatus with individual partitions according to the present invention is not limited to the above-mentioned embodiments, and various modifications can be implemented within the scope permitted by the technical idea of the present invention.

10: Continuous electroplating production line

11: Electroplating tank

12: The first anode

17: The first rail

20: Step-by-step electroplating production line

21: Electroplating tank

22: Second anode

23: The first individual area

24: Second individual area

25: Individual partitions

26: Through hole

27: Second rail

28: Insulation rail accessories

29: Conductor rail accessories

30: Control Department

40: Fixture transfer device

50: Fixtures

51: Substrate

Claims (3)

An electroplating device with individual partitions, comprising: a continuous electroplating production line, which makes a clamp holding a substrate move continuously at a constant speed along one direction, supplies power to a first anode, and forms an electroplating layer on the substrate; a step An electroplating production line, which is arranged behind the continuous electroplating production line, is provided with a second anode for supplying power to the second anode, and after the continuous electroplating production line performs electroplating, an additional electroplating is formed on the transferred substrate layer; a control section that adjusts the value of the current applied to the first anode and the second anode so that the final plating thickness formed on the substrate remains uniform; the continuous plating line is electroplating is performed in a state of When the individual area of the electroplating production line performs electroplating on the substrate, the influence of the adjacent substrates on the electroplating is minimized through the individual sub-area; the individual area is formed between two separate individual sub-areas, which are configured with a substrate and the second anode, the individual sections are formed with through holes for transferring the substrate, the control section controls the current value applied to the first anode over the entire section of the continuous plating line In the step-by-step electroplating production line, in a state where the jig transferred by the continuous electroplating production line is stopped, the sub-jig adjusts the current value applied to the second anode corresponding to the jig so as to form a current value on the substrate. The final plating thickness is kept uniform, and the control section respectively controls the current value applied to the respective second anodes arranged in the individual regions, and controls the current in the entire section of the continuous plating line and the step-by-step plating line, so that the passing The final total current value of the first anode and the second anode applied to the individual fixtures is within a preset constant value, and the first anode is arranged in the continuous electroplating production line, and is respectively provided with a resist plate, the resist plate covers Part of the upper part and part of the lower part of the side facing the substrate are arranged in the second anode of the step-by-step electroplating production line, respectively provided with a blocking plate, which covers part of the upper part of the side facing the substrate , part lower, part left, and part right. The electroplating apparatus with individual divisions according to claim 1, wherein the control unit calculates an intermediate total value by summing the current values applied to the individual jigs through the first anode in the continuous electroplating production line, and in the continuous electroplating production line The step-by-step electroplating line adjusts and controls the current value applied to the second anode such that a residual current value obtained by subtracting the intermediate total value from the final total current value is applied to individual fixtures. The electroplating device with individual partitions according to claim 1, wherein: the continuous electroplating production line is provided with a first guide rail for transferring the conductive material of the fixture; the step-by-step electroplating production line is provided with a first guide rail for transferring the fixture a second guide rail; the second guide rail is composed of the following components: a plurality of conductive rail fittings, which are composed of conductor materials and are arranged at intervals; an insulating rail fitting, which is arranged between the conductive rail fittings; The conductive rail fittings are arranged in the individual areas, and are electrically connected to the clamps stopped in the individual areas; the control unit respectively controls the current values applied to the second anodes arranged in the individual areas, The current is controlled throughout the section of the continuous plating line and the step-by-step plating line so that the final combined current value applied to the individual fixtures through the first anode and the second anode is within a preset constant value.

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