JPH0254799A - Power supply device in plating bath - Google Patents
Power supply device in plating bathInfo
- Publication number
- JPH0254799A JPH0254799A JP20574288A JP20574288A JPH0254799A JP H0254799 A JPH0254799 A JP H0254799A JP 20574288 A JP20574288 A JP 20574288A JP 20574288 A JP20574288 A JP 20574288A JP H0254799 A JPH0254799 A JP H0254799A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- anode
- plating
- current
- stop processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 40
- 238000007654 immersion Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、被処理物をメッキ処理槽内で間欠的に移送し
ながら、各停止処理位置で、被処理物に陰極付与し、該
被処理物に対向して配置した陽極により、被処理物にメ
ッキ処理を施すメッキ処理槽において、その給電装置の
改良に関するものである。Detailed Description of the Invention <Industrial Application Field> The present invention provides a method for applying a cathode to the workpiece at each stop processing position while intermittently transporting the workpiece in a plating tank. The present invention relates to an improvement in a power supply device for a plating tank in which a workpiece is plated by an anode placed opposite the workpiece.
〈従来技術〉
長時間のメッキ処理が必要な被処理物にあっては、メッ
キ処理槽内に、複数の停止処理位置を設定し、各停止処
理位置を間欠的に順送りさせて、該必要処理時間を満た
すようにされる。<Prior art> For objects that require long-term plating processing, a plurality of stop processing positions are set in the plating processing tank, and each stop processing position is intermittently sequentially advanced to perform the required processing. Made to fill the time.
このようなメッキ処理槽に備えられる給電装置において
、従来は、メッキ処理槽内の各停止処理位置の両側に十
電位の電圧を印加された陽極を浸漬配置するとともに、
移送路に沿って差し渡したー電位の電圧を印加された陰
極側給電バーに被処理物と電気的に接続する集電子を接
触させながら、間欠的に停止処理位置に移送させ、メッ
キ処理を施す構成になるものである。Conventionally, in a power supply device installed in such a plating tank, anodes to which a voltage of ten potentials is applied are placed immersed on both sides of each stop processing position in the plating tank, and
While the current collector electrically connected to the workpiece is brought into contact with the cathode-side power supply bar to which a voltage of -potential is applied along the transport path, the workpiece is intermittently transported to the stop processing position to perform plating processing. It is a composition.
〈発明が解決しようとする課題〉
上記従来構成にあっては、通常陽極と陰極は、夫々すべ
て電気的に共通とし、単一の整流器により給電するよう
にしていたため、大きさや形の異なる被処理物を混在さ
せた場合に、または被処理物の量が異なる場合に均一な
厚さのメッキを形成することができなかった。<Problems to be Solved by the Invention> In the conventional configuration described above, normally the anode and cathode are electrically common and are supplied with power by a single rectifier. When materials are mixed or when the amount of materials to be treated is different, it is not possible to form plating with a uniform thickness.
この解決策として、陰極側給電バーを共通とし、各停止
処理位置の両側に配置された陽極を夫々電気的に独立さ
せて、個々の整流器により給電するようにし、夫々被処
理物に対応して、電流設定をすることが考えられた。As a solution to this problem, the cathode side power supply bar is made common, and the anodes placed on both sides of each stop processing position are electrically independent and are supplied with power by individual rectifiers. , it was considered to set the current.
しかしながら、このような手段では、陰極が共通である
が故に、特定の被処理物に対応すべき陽極の電流が、隣
接する被処理物にも分散することになり、個々の陽極電
流を高精度に制御してみても、陰極側から見れば、高精
度の電流設定とはなり得す、その目的を達し得ないもの
である。However, in such a method, since the cathode is common, the anode current that should correspond to a specific workpiece is also dispersed to adjacent workpieces, and individual anode currents cannot be adjusted with high precision. Even if you try to control the current, from the cathode side, you cannot achieve the purpose of setting the current with high precision.
本発明は、上述の各従来欠点を除去することを目的とす
るものである。The present invention aims to eliminate each of the above-mentioned conventional drawbacks.
〈課題を解決するための手段〉
本発明は、
メッキ処理槽内で、被処理物が間欠送りされる移送路の
各停止処理位置毎に浸漬配置された陽極と、
移送路に沿って差し渡され、かつ各停止処理位置間に絶
縁区画部が設けられて、各停止処理位置に対応する複数
の部分給電域が電気的に独立して形成されてなる陰極側
給電バーと、
被処理物を吊持するハンガーに固定されて、被処理物と
電気的に接続すると共に、被処理物の浸漬移動に伴って
、陰極側給電バーに摺擦する集電子と、
各停止処理位置の陽極一部分給電域対に個別に結線され
、被処理物の移動に伴って、当該被処理物に対応する電
流値を各陽極一部分給電域対に順次設定する電流制御装
置と
を備えたことを特徴とするメッキ処理槽における給電装
置である。<Means for Solving the Problems> The present invention comprises: an anode immersed at each stop processing position of a transfer path through which a workpiece is intermittently fed in a plating tank; a cathode-side power supply bar in which a plurality of partial power supply areas corresponding to each stop-processing position are electrically independently formed by providing an insulating section between each stop-processing position; A current collector that is fixed to a hanger and electrically connected to the object to be processed, and that rubs against the cathode side power supply bar as the object moves through the immersion; and a partial power supply to the anode at each stop processing position. Plating characterized by comprising: a current control device which is individually connected to each anode partial power supply region pair and sequentially sets a current value corresponding to the object to be processed in each anode partial power supply region pair as the object to be processed moves; This is a power supply device in the processing tank.
く作用〉
各停止ト処理位置で、陽極と、部分給電域に接続された
被処理物（陰極）とが、夫々一対となり電流制御装置に
より独立して電気的に制御される。Function> At each stop processing position, the anode and the object to be processed (cathode) connected to the partial power supply area form a pair and are electrically controlled independently by the current control device.
このため、被処理物の寸法、形状、量、所要のメッキ厚
等に対応して、電′圧設定をすることができる。Therefore, the voltage can be set according to the size, shape, amount, required plating thickness, etc. of the object to be processed.
ここにおいて、制御されるのは１個々の陰極電流であり
、隣接する陽極から電流が流入することがあってもメッ
キの結果には影響を与えないものである。Here, only one individual cathode current is controlled, and even if current flows from an adjacent anode, it does not affect the plating result.
〈実施例〉 第１図は、メッキ処理槽ｌの平面図であって。<Example> FIG. 1 is a plan view of a plating tank 1. FIG.
被処理物Ｗの送り方向に長く、その内部の被処理物Ｗの
移送路には１図中四箇所の停止処理位置２８〜２ｄが配
設される。そして、第２図に示す様に、メッキ処理槽１
上には、該メッキ処理槽１の側方に設けられた機枠３に
保持されたキャリア（図示せず）により昇降可能、かつ
送り方向移動可能にハンガー４が支持され、該ハンガー
４の先端を各停止処理位置２ａ〜２ｄ上に差し渡し、そ
の端部に被処理物Ｗを吊持している。また、前記ハンガ
ー４のメッキ処理槽１の側傍には、集電子６が設けられ
、陰極側の給電バー８に上方から接触している。さらに
また、メッキ処理槽１内にあって、各停止処理位置２ａ
〜２ｄの両側には、夫／／陽極７．７が対向して浸漬さ
れている。It is long in the feeding direction of the workpiece W, and four stop processing positions 28 to 2d in FIG. Then, as shown in Fig. 2, the plating treatment tank 1
A hanger 4 is supported on the top so that it can be raised and lowered by a carrier (not shown) held by a machine frame 3 provided on the side of the plating tank 1, and can be moved in the feeding direction. is extended over each of the stop processing positions 2a to 2d, and the workpiece W is suspended from the end thereof. Further, a current collector 6 is provided near the side of the plating tank 1 of the hanger 4, and is in contact with the power supply bar 8 on the cathode side from above. Furthermore, each stop processing position 2a is located within the plating processing tank 1.
On both sides of ~2d, husband//anodes 7.7 are immersed facing each other.
前記給電バー８は、メッキ処理槽１の移送路に沿って差
し渡されていると共に、各停止処理位置２ａ〜２ｄ間の
中間位置には第３図に示す様に、絶縁区画部９が配設さ
れている。この絶縁区画部９の幅は、集電子６の幅より
も狭くし、移動中の集電子６が、絶縁区画部９を通過す
るときは、必ず左右いずれかの部分給電域１０．１０に
接触する様にする。The power supply bar 8 is extended along the transfer path of the plating tank 1, and an insulating section 9 is arranged at an intermediate position between each stop processing position 2a to 2d, as shown in FIG. It is set up. The width of this insulating section 9 is made narrower than the width of the current collector 6, and when the moving current collector 6 passes through the insulating section 9, it always comes into contact with either the left or right partial power feeding area 10.10. do as you like.
この各停止処理位置２８〜２ｄにあって、給電バー８の
部分給電域１０と、陽極７．７は、夫々個別に、電流制
御装置１３に備えられた停止処理位置２ａ〜２ｄに対応
する整流器１４ａ〜１４ｄに接続され、各停止処理位置
２８〜２ｄへの電解電流の調整を別個に施し得る様にし
ている。そして、゛この電流値は、当該停止処理位置２
ａ〜２ｄに到来する被処理物Ｗに対応して夫々別個に設
定される。At each of the stop processing positions 28 to 2d, the partial power supply area 10 of the power supply bar 8 and the anode 7.7 are connected to the rectifiers corresponding to the stop processing positions 2a to 2d provided in the current control device 13, respectively. 14a to 14d, so that the electrolytic current to each stop processing position 28 to 2d can be adjusted separately. Then, ``This current value is the corresponding stop processing position 2.
They are set separately corresponding to the objects W to be processed that arrive at points a to 2d.
前記構成の給電装置にあって、その電流制御を第３図に
従って説明する。Current control in the power supply device having the above configuration will be explained with reference to FIG.
各停止処理位置２８〜２ｄには、ハンガー４に吊持され
た被処理物Ｗが浸漬して、所要時間停止する。この停止
時間は、メッキ処理ライン上の各処理工程における最短
処理時間に合わせて設定される。そして、各被処理物Ｗ
はメッキ処理槽ｌ内で、停止処理位置２ａ〜２ｄに停止
すると、第３図イに示すように、各集電子６が停止処理
位置２８〜２ｄの各部分給電域１０に接触し、電流制御
装置１３により、当該被処理物Ｗに対応した所定の電圧
が部分給電域１０と、陽極７．７に印加され、メッキ処
理液内で所定電解電流が流れてメッキ処理が施される。The workpiece W suspended by the hanger 4 is immersed in each stop processing position 28 to 2d and stopped for a required time. This stop time is set according to the shortest processing time in each processing step on the plating processing line. And each workpiece W
When stopped at the stop processing positions 2a to 2d in the plating tank L, each current collector 6 comes into contact with each partial power supply area 10 at the stop processing positions 28 to 2d, as shown in FIG. The device 13 applies a predetermined voltage corresponding to the object W to be processed to the partial power supply area 10 and the anode 7.7, and a predetermined electrolytic current flows in the plating solution to perform plating.
この電流制御装置１３の被処理物Ｗに対応する電流設定
は、シーケンス制御のほか、中央制御装置ＣＰＵ等を用
いて容易に実現し得るものである。The current setting of the current control device 13 corresponding to the workpiece W can be easily realized by using a central control device CPU or the like in addition to sequence control.
所定停止時間が経過すると、各被処理物Ｗはメッキ処理
液に浸漬したままメッキ処理槽ｌ内を一斉に進行する。After the predetermined stopping time has elapsed, the objects W to be processed all move through the plating tank 1 while being immersed in the plating solution.
そしてこれに伴い、集電子６は給電バー８と接触状態を
維持しなから摺擦移動し、第３図口に示すように絶縁区
画部９を通過する。As a result, the current collector 6 slides while maintaining contact with the power supply bar 8, and passes through the insulating section 9 as shown in the opening in FIG.
ところで、各部分給電域１０には、夫々各被処理物Ｗに
対応した所定の電解電流を流すような電圧が、電流制御
装置１３により制御印加される。By the way, a voltage that causes a predetermined electrolytic current corresponding to each workpiece W to flow is controlled and applied to each partial power supply area 10 by a current control device 13.
このため、隣接する部分給電域１０．１０の電位は夫々
異なる。従って、集電子６の移動に際しても、その電位
を維持しておくと、電位差によりスパークを生じたり、
移動中に過剰なメッキ処理が施されたりする。Therefore, the potentials of adjacent partial feed regions 10.10 are different. Therefore, even when the current collector 6 moves, if the potential is maintained, sparks may occur due to the potential difference,
Excessive plating may occur during transportation.
一方、この移動中に給電を停止すると、メッキ処理が施
されないから、時間の浪費となる上、バイポーラ現象を
生じて、メッキの剥離又は二重メッキを生じてしまう。On the other hand, if the power supply is stopped during this movement, the plating process is not performed, which wastes time and also causes a bipolar phenomenon, resulting in peeling of the plating or double plating.
そこで、これらの課題を解決するために、集電子６の移
動中には、各停止処理位置２ａ〜２ｄに供給される最小
電流以下の電流を、電流制御装置１３の各整流器１４ａ
−１４ｄから、各陽極７゜７及び部分給電域１０間に供
給する。これにより、スパーク等を生ずることがなく、
移動中にも適正なメッキ処理が施されることとなる。Therefore, in order to solve these problems, while the current collector 6 is moving, the current less than the minimum current supplied to each stop processing position 2a to 2d is controlled by each rectifier 14a of the current control device 13.
-14d between each anode 7.7 and the partial feed area 10. This prevents sparks, etc.
Appropriate plating treatment will be performed even during transportation.
また、上述のように、集電子６の幅は、絶縁区画部９の
幅よりも広くし、絶縁区画部９を通過する時は、必ずそ
の左右の部分給電域１０．１０のいずれかに接触する様
にしており、その移動中に、絶縁区画部９により給電が
中断されることはないので、バイポーラ現象を生じない
。Further, as described above, the width of the current collector 6 is made wider than the width of the insulating section 9, and when passing through the insulating section 9, it is sure to contact either of the left and right partial power feeding areas 10.10. Since the power supply is not interrupted by the insulating section 9 during the movement, no bipolar phenomenon occurs.
そして、各被処理物Ｗが第３図ハに示すように、停止処
理位置２８〜２ｄ位置に到来すると、再び、電流制御装
置１３により電流値を切換えて、各被処理物Ｗに最適な
電流を各陽極７．７及び部分給電域１０間に供給する。Then, when each workpiece W reaches the stop processing position 28 to 2d as shown in FIG. is supplied between each anode 7.7 and the partial feed area 10.
従って、各被処理物Ｗは、対応する電解電流を、どの停
止処理位置２ａ〜２ｄでも、供給され得ることとなる。Therefore, each workpiece W can be supplied with the corresponding electrolytic current at any of the stop processing positions 2a to 2d.
そして、かかるメッキ処理を、呂停止処理位置２ａ〜２
ｄ毎に施されることにより、所要のメッキ処理時間が充
足されて、所定メッキ厚となる。Then, the plating process is performed at the stop process positions 2a to 2.
By performing plating every d, the required plating processing time is sufficient and a predetermined plating thickness is achieved.
〈発明の効果〉
本発明は、−上述の様に、メッキ処理槽ｌ内の各停止処
理位置２ａ〜２ｄに陽極７．７を配置すると共に、集電
子６が摺擦するメッキ処理槽１の被処理物Ｗの移送路に
沿って差し渡された給電バー８に絶縁区画部９を設けて
、停止処理位置２１１〜２ｄに対応して部分給電域１０
を区画し、各陽極７．７及び部分給電域１０を一対とし
て、電流制御装置１３で別途に制御し得る様にしたから
、イ）被処理物Ｗは、最適電解電流を、いずれの停止処
理位置２８〜２ｄでも供給され得ることとなる。<Effects of the Invention> As described above, the present invention has the following advantages: - As described above, the anode 7.7 is arranged at each stop processing position 2a to 2d in the plating tank 1, and the plating tank 1 is provided with an anode 7. An insulating section 9 is provided on the power supply bar 8 extending along the transfer path of the workpiece W, and a partial power supply area 10 is provided corresponding to the stop processing positions 211 to 2d.
Since each anode 7.7 and the partial power supply area 10 are divided into pairs and can be separately controlled by the current control device 13, a) the workpiece W can control the optimum electrolytic current at any stop treatment. It can also be supplied at positions 28-2d.
口）従って、大きさ、形状の異なる被処理物を任意の量
、ランダムに投入しても、夫々所望の処理が施される。Therefore, even if an arbitrary amount of objects to be treated having different sizes and shapes are thrown in at random, the desired treatment can be performed on each object.
ハ）隣接する部分給電域１０間で電位が異なっても、各
部分給電域１０を移送中に電流制御することにより、電
位差による問題を容易に解消できる。従って、被処理物
Ｗの移送中にも、スパーク等を発生せず、給電が継続さ
れることから、バイポーラ現象を生ずることもなく、処
理時間の損失も最小に抑えることができる。c) Even if the potentials differ between adjacent partial power supply areas 10, problems caused by potential differences can be easily resolved by controlling the current during transfer of each partial power supply area 10. Therefore, even while the object to be processed W is being transferred, no sparks are generated and the power supply is continued, so that no bipolar phenomenon occurs and the loss of processing time can be minimized.
等の優れた効果がある。It has excellent effects such as
添付図面は本発明の一実施例を示し、第１図はモ面図、
第２図は縦断側面図、第３図は給電バー８に対する集電
子６の摺擦を示す作動説明図である。
ｌ・−・メッキ処理槽
２ａ〜２ｄ・・−停止処理位置
６・・・集電子
７．７・・・陽極
８・・−給電バー
９・・・絶縁区画部
１０−・一部分給電域
１３・・・電流制御装置
第３日
冥２０The accompanying drawings show an embodiment of the present invention, and FIG. 1 is a top view;
FIG. 2 is a longitudinal side view, and FIG. 3 is an operation explanatory diagram showing the sliding of the current collector 6 against the power supply bar 8. l...Plating tanks 2a to 2d...-Stop processing position 6...Collector 7.7...Anode 8...-Power supply bar 9...Insulation section 10--Partial power supply area 13- ...Current control device 3rd day 20th day
Claims (1)
各停止処理位置毎に浸漬配置された陽極と、 移送路に沿って差し渡され、かつ各停止処理位置間に絶
縁区画部が設けられて、各停止処理位置に対応する複数
の部分給電域が電気的に独立して形成されてなる陰極側
給電バーと、 被処理物を吊持するハンガーに固定されて、被処理物と
電気的に接続すると共に、被処理物の浸漬移動に伴って
、陰極側給電バーに摺擦する集電子と、 各停止処理位置の陽極一部分給電域対に個別に結線され
、被処理物の移動に伴って、当該被処理物に対応する電
流値を各陽極一部分給電域対に順次設定する電流制御装
置と を備えたことを特徴とするメッキ処理槽における給電装
置。[Scope of Claims] An anode immersed at each stop processing position of a transfer path through which the workpiece is intermittently fed in a plating processing tank; A cathode-side power supply bar is provided with an insulating section in between, and a plurality of electrically independent partial power supply areas corresponding to each stop processing position are formed, and the bar is fixed to a hanger that suspends the object to be processed. The current collector is electrically connected to the object to be processed, and is individually connected to a current collector that rubs against the cathode side power supply bar as the object to be processed moves through the immersion, and to a pair of anode partial power supply areas at each stop processing position. 1. A power supply device for a plating tank, comprising: a current control device that sequentially sets a current value corresponding to the object to be processed in each anode partial power supply region pair as the object to be processed moves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63205742A JP2539671B2 (en) | 1988-08-19 | 1988-08-19 | Power supply device in plating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63205742A JP2539671B2 (en) | 1988-08-19 | 1988-08-19 | Power supply device in plating tank |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254799A true JPH0254799A (en) | 1990-02-23 |
| JP2539671B2 JP2539671B2 (en) | 1996-10-02 |
Family
ID=16511909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63205742A Expired - Fee Related JP2539671B2 (en) | 1988-08-19 | 1988-08-19 | Power supply device in plating tank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2539671B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013091821A (en) * | 2011-10-24 | 2013-05-16 | Kyocer Slc Technologies Corp | Plating apparatus |
| KR102206395B1 (en) * | 2020-06-30 | 2021-01-25 | (주)네오피엠씨 | Plating apparatus having individual partition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS551998A (en) * | 1978-06-19 | 1980-01-09 | Manuf Metarirujiku Dou Torunu | Coating aluminium and its preparation |
| JPS60135599A (en) * | 1983-12-22 | 1985-07-18 | Nippon Light Metal Co Ltd | Surface treatment of metal |
| JPS6270180U (en) * | 1985-10-21 | 1987-05-02 |
-
1988
- 1988-08-19 JP JP63205742A patent/JP2539671B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS551998A (en) * | 1978-06-19 | 1980-01-09 | Manuf Metarirujiku Dou Torunu | Coating aluminium and its preparation |
| JPS60135599A (en) * | 1983-12-22 | 1985-07-18 | Nippon Light Metal Co Ltd | Surface treatment of metal |
| JPS6270180U (en) * | 1985-10-21 | 1987-05-02 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013091821A (en) * | 2011-10-24 | 2013-05-16 | Kyocer Slc Technologies Corp | Plating apparatus |
| KR102206395B1 (en) * | 2020-06-30 | 2021-01-25 | (주)네오피엠씨 | Plating apparatus having individual partition |
| TWI769643B (en) * | 2020-06-30 | 2022-07-01 | 南韓商耐奧匹艾姆西股份有限公司 | A plating apparatus having individual partitions |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2539671B2 (en) | 1996-10-02 |
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| LAPS | Cancellation because of no payment of annual fees |