CN106917134A - The electroplanting device and method of Fe Ni systems alloying metal paper tinsel - Google Patents
The electroplanting device and method of Fe Ni systems alloying metal paper tinsel Download PDFInfo
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- CN106917134A CN106917134A CN201611208394.5A CN201611208394A CN106917134A CN 106917134 A CN106917134 A CN 106917134A CN 201611208394 A CN201611208394 A CN 201611208394A CN 106917134 A CN106917134 A CN 106917134A
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- conductive rollers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0642—Anodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0685—Spraying of electrolyte
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
Abstract
The present invention relates to a kind of electroplanting device electroplated on the surface of Fe Ni alloying metal paper tinsels, including：Electrolytic cell, including electrolyte；First conductive rollers and the second conductive rollers, outside the electrolytic cell, and as negative electrode；Dip roll, positioned at the electrolyte bath, is incorporated into electrolyte bath, and it is discharged by the second conductive rollers afterwards in being impregnated into electrolyte by the metal foil supplied by the first conductive rollers；A pair of first anode, the both sides of the metal foil mobile route being arranged between first conductive rollers and the dip roll；A pair of second plates, the both sides of the metal foil mobile route being arranged between the dip roll and the second conductive rollers；And electroplating bath, make first conductive rollers conductive with the first anode by connection and make second conductive rollers conductive with the second plate.
Description
Technical field
Quality characteristic excellent electronic device panel (panel), fine metal are being applicable as the present invention relates to a kind of
Mask (FMM：Fine Metal Mask), form feature on the Fe-Ni systems alloying metal paper tinsel of sealing material or grafting material after locate
Manage the electro-plating method and device of layer.
Background technology
Metal foil is developed to multiple use and is used in extensively in family/industry.For example, aluminium foil (Aluminum
Foil family or cooking food) are widely used in, stainless steel foil (Stainless Steel Foil) is mainly used as interior trim for building
Material or outer exterior material.
Also, electrolytic copper foil (Electrolytic Copper Foil) is widely used in printing loop substrate (PCB：
Printed Circuit Board) circuit, computer, personal palm PC (PDA), e-book, mobile phone etc. are widely used in recently
Small sized product.
The metal foil of specific use is also produced, wherein Fe-Ni systems alloying metal paper tinsel is because of thermal coefficient of expansion (Coefficient
Of Thermal Expansion, CTE) it is low and can act as Organic Light Emitting Diode (OLED, Organic Light
Emitting Diodes) with substrate, sealing material and FMM materials etc., also as the collector or electronic device of secondary cell
Substrate etc. and receive much concern.
It is well known that the method for manufacturing this Fe-Ni systems alloying metal paper tinsel has rolling (Rolling) method and electroforming
(Electro-Forming) method.Wherein, electrocasting is to relative with the cylindrical cathode roller of the rotation being arranged in electrolytic cell
A pair of anodes of circular shape around gap, supply electrolyte come conductive by feed flow nozzle, make Fe-Ni systems alloy electricity heavy
Product arrives the surface of the cathode roll, the method that metal foil is manufactured by winding.
The advantage of the Fe-Ni systems alloying metal paper tinsel manufactured by this electrocasting is that average crystal grain size is fine and mechanical
Physical property is excellent, it is also possible to use relatively low manufacturing expense and causes low cost of manufacture.
Although in addition, have can be manufactured into that flexible and super is thin by the Fe-Ni systems alloying metals paper tinsel that electrocasting is manufactured
Advantage, if but cannot effectively prevent (ensure rust-preventing characteristic) Fe-Ni systems alloying metal paper tinsel surface and inside inevitably to contain
Moisture or transport and storage in occur get rusty (red embroidery), then can cause to be difficult to the element longevity that suitable material or shortening are produced
The problem of life.
To solve this problem, the various antirust paint-on techniques for paper tinsel surface are employed.Wherein, also it is proposed that crossing
The outside of Fe-Ni alloy/C forms cathode copper (Cu) coating layer and to form the radiating circuit layer formed by electrolysis invar anti-corrosion to improve
(Korean Patent Publication No.s 2011-0053805) such as the technologies of property and heat dispersion.
As another example, chemical bond and it is not accompanied by by the Fe-Ni systems alloying metal paper tinsel that electrocasting is manufactured, between atom
Diffusion process between atom, therefore residual stress is very big, according to different situations, it is also possible to which showing for shape inequality occurs
As.Therefore, typically, will be through the technique by post weld heat treatment elimination residual stress, in this PWHT procedures after manufacture
The problem of surface discolouration and surface oxidisation can be produced.
As an example for solving this problem, in order in the heat treatment process for preventing the Fe-Ni alloy/C metal foil
Surface discolouration is produced, it is proposed that forming the scheme of metal barrier in surface metallization.
The metal barrier can effectively prevent the oxygen under 300 DEG C of atmospheric atmospheres of high temperature above infiltration and
Fe in Fe-Ni metal foils is diffused to the surface, so as to be favorably improved the heat resistance and rust-preventing characteristic of Fe-Ni systems alloying metal paper tinsel.
The content of the invention
(1) technical problem to be solved
The metal barrier can be formed by electroless plating method, electrolysis or vacuum vapour deposition, be used the present invention relates to one kind
Electrolysis (galvanoplastic) forms the device of heat resistance metal barrier or the coating of another functional metal in Fe-Ni metal foils.
The present invention provides a kind of device, when manufacture be applicable as quality characteristic excellent electronic device panel (panel),
Fine metal mask (FMM：Fine Metal Mask), the Fe-Ni systems alloying metal paper tinsel of sealing material or grafting material when, in order to
Make metal foil that there is specific function and in the case of processing surface with metal, electroplated on Fe-Ni systems alloying metal paper tinsel surface
Device.
The technical problem to be solved in the present invention is not limited to the above, and the additional technical problem of the present invention is recorded in whole
In individual description, those skilled in the art are understanding additional technology by specification of the invention
Do not exist hell and high water in problem.
(2) technical scheme
It is of the invention as the electroplanting device electroplated on the surface of Fe-Ni alloy/C metal foil, including：Electrolytic cell, bag
Include electrolyte；First conductive rollers and the second conductive rollers, outside the electrolytic cell, and as negative electrode；Dip roll, positioned at described
Electrolyte bath, is incorporated into electrolyte bath, and it is impregnated into electrolyte by the metal foil supplied by the first conductive rollers
Discharged by the second conductive rollers afterwards；A pair of first anode, are arranged at the metal foil between first conductive rollers and the dip roll
The both sides of mobile route；A pair of second plates, are arranged at the metal foil movement road between the dip roll and second conductive rollers
The both sides in footpath；And electroplating bath, conduction between first conductive rollers and the first anode is made by connection, and make described second
It is conductive between conductive rollers and the second plate.
The electroplating bath can possess more than 2, and an electroplating bath and electroplating bath adjacent thereto share a conductive rollers.
The shared conductive rollers can abut electroplating bath with the anode bridge of one upper channel of electroplating bath of formation and formation
The anode bridge electrical connection of lower channel.
The place position being initially separated after metal foil is contacted with first conductive rollers, can possess for the metal
Spray the shower nozzle of electroplating solution in the two sides of paper tinsel.
The position that at least one of first conductive rollers and the second conductive rollers conductive rollers are contacted in beginning with metal foil
On can possess buffer roll.
The present invention provides a kind of electro-plating method electroplated on the surface of Fe-Ni alloy/C metal foil, the electro-plating method
Using electroplanting device, the electroplanting device includes：Electrolytic cell, including electrolyte；First conductive rollers and the second conductive rollers, positioned at institute
State outside electrolytic cell, and as negative electrode；Dip roll, positioned at the electrolyte bath, the metal that will be supplied by the first conductive rollers
Paper tinsel is incorporated into electrolyte bath, and it is discharged by the second conductive rollers afterwards in being impregnated into electrolyte；A pair of first anode, are set
The both sides of the metal foil mobile route between first conductive rollers and the dip roll；And a pair of second plates, it is arranged at
The both sides of the metal foil mobile route between the dip roll and second conductive rollers, electrically connect the first anode with described the
One conductive rollers, electrical connection second plate and the second conductive rollers, and apply electric current.
Additionally, it is preferred that the place position spray electroplating solution being initially separated after being contacted with first conductive rollers to metal foil,
The electroplating solution is preferably sprayed on the two sides of metal foil.
And then, preferably start and at least one of first conductive rollers and second conductive rollers in the metal foil
The position of conductive rollers contact, makes the metal foil be close to conductive rollers by buffer roll.
(3) beneficial effect
According to the present invention so that ratio resistance is big and being difficult to the Fe-Ni systems alloying metal paper tinsel of conduction has fixed voltage difference,
So as to perform uniform metal coating, the Fe-Ni metal foils of high-quality are manufactured.
And then, functional-coated layer can be formed uniformly in the Fe-Ni metal foils of high-quality, improve the resistance to of metal foil
Hot, thermal diffusivity etc., therefore preferably it is used as Organic Light Emitting Diode (OLED：Organic Light Emitting
Diodes) with the material of FMM, sealing material, the substrate of electronic device etc..
Brief description of the drawings
Fig. 1 is the figure of the cross-section structure of the electroplanting device for diagrammatically showing to include general electroplating bath.
Fig. 2 is the chart that the brushing plating voltage change based on material and anode-cathode distance is determined when showing to apply same current.
Fig. 3 is the conduction of the one embodiment of the invention for diagrammatically showing to be applicable to ratio resistance Fe-Ni alloy/C paper tinsel high
The figure of structure.
Fig. 4 is the figure of the electroplating bath for possessing solution shower nozzle for diagrammatically showing one embodiment of the invention.
Fig. 5 is the figure of the electroplating bath for possessing buffer roll for diagrammatically showing one embodiment of the invention.
Specific embodiment
The present invention is used as to being applicable as the excellent electronic device panel of quality characteristic, fine metal mask (FMM：
Fine Metal Mask), the Fe-Ni systems alloying metal paper tinsel of sealing material or grafting material assign functional scheme, there is provided it is a kind of
In the method that Fe-Ni alloy/C metal foil surface carries out metal plating.
Further illustrate with reference to the accompanying drawings.
Fig. 1 is can to physical properties such as the heat resistance in order to ensure Fe-Ni alloy/C metal foil, corrosion resistance and etchings
Realize an example of the electroplating bath of the equipment for after-treatment of the Fe-Ni alloy/C metal foil on two sides and/or deviation electroplating processes, drying etc.
Son.
The Fe-Ni alloy/C metal foil with about 20 μ m thicks is connected to such as the post processing electroplating bath in Fig. 1 and applies suitable
During electric current (Current) more than degree, be able to confirm that with brushing plating voltage rise and in conductive rollers (Conductor
Roll there is short circuit (Shot) phenomenons such as electric arc (Arc) in).
As an example, 110A or so is applied to each anode bridge of electroplating bath (Anode bridge), i.e., in view of Fe-
The width and length of Ni metal foils and apply equivalent to about 2A/dm2The electric current of left and right, so as to observe the change of now brushing plating voltage
And the results are shown in table 1.
【Table 1】
Knowable to upper table 1, when the anode bridge of a and d is controlled by the conductive rollers of the No.1C/R shown in Fig. 1, each electric bridge
There is larger difference between brushing plating voltage.Similarly, when the electric bridge of b and c is controlled, also have between the brushing plating voltage of each electric bridge
Larger difference.
And then, when No.1C/R controls all electric bridges of a to d, although have between a and b electric bridges and between c and d electric bridges similar
Brushing plating voltage, but brushing plating voltage between a and d electric bridges and between b and c electric bridges has larger difference.
This phenomenon is cannot again to carry out the conductive state of high current, it is impossible to each anode bridge is controlled in identical electrolytic cell
Electric current, and when applying electric current, with the increase (increase of resistance) of voltage, very thin Fe-Ni alloy/C metal foil can generate heat, produce
Raw flue gas, appearance heat wrinkle etc..
Therefore, analysis electrolytic processing apparatus and material are to vertical-type electrolytic cell (" V " type Vertical as shown in Figure 1
The influence of the electric conductivity of the Fe-Ni alloy/C metal foil in Cell), as a result, compared to other materials, institute is Fe- using material
The ratio resistance of Ni alloying metal paper tinsels is very high, and this resistance value present material thickness is thinner, conductive channel (pass) is got over
It is long, the trend that resistance value is dramatically increased when conductive.
That is, in general plated conductive method, as illustrated in fig. 1, the No.1 conductive rollers on conductive path
(Conductor Roll, C/R) connection is from rectifier negative electrode out to a the and b anode bridges of lower channel (down pass)
C the and d anode bridges of (anode bridge, anode) and upper channel (up pass) are conductive.
In this conductive rollers position, because electric channel (pass) length of the c and d electric bridges on from conductive rollers to upper channel becomes
Long, impedance (Impedance) also correspondingly increases.Therefore, for the Fe-Ni alloy/C on conductive channel circuit (pass line)
Metal foil, the anode in upper channel (up pass) direction is that the brushing plating voltage of c and d electric bridges will be above lower channel (down pass) side
To anode be a and b electric bridges brushing plating voltage.
Therefore, the thick carbon steel material of more than about 200 μm of the very thin Cu paper tinsel low compared to ratio resistance or thickness, bright in ratio resistance
When being electroplated in aobvious less than 100 μm high of the thin Fe-Ni alloy/C metal foil surface of super, resistance increases with the increase of electric current
Plus, cause brushing plating voltage (plating voltage) to steeply rise.
Above-mentioned phenomenon can be confirmed by Fig. 2.Fig. 2 is shown as applying same current (Lab., 14A/dm2, 26A) when according to
The chart of the change of the brushing plating voltage that material and anode-cathode distance carry out conductive test and obtain.That is, according to Fig. 2, die opening is observed
From it is identical when brushing plating voltage, compared to the paper tinsel and the Cu paper tinsels of 35 μ m thicks of the STS materials of 75 μ m thicks, very thin Fe-Ni paper tinsels
Brushing plating voltage is of a relatively high.
And then, the paper tinsel of the STS materials of 75 μ m thicks and the Cu paper tinsels of 35 μ m thicks are almost not based on the brush plating of anode-cathode distance
Voltage differences, thickness be the thin Fe-Ni paper tinsels of 13 μm of super present brushing plating voltage with the increase of anode-cathode distance increased trend.
Therefore, as indicated above, in the material that the ratio resistances such as such as Fe-Ni alloy/C are big, especially enter in very thin material surface
During row plating, resistance increases as the distance between conductive rollers and the negative electrode bridge for being connected to conductive rollers is elongated, so as to cause voltage
Difference increase, cannot finally improve electric current.
As described above, when the Fe-Ni alloy/C metal foil high to ratio resistance is electroplated, the factor of influence is produced on electric conductivity
It is the voltage differences based on conductive rollers with the distance of paper tinsel, so as to understand final by the distance between (-) source of supply and (+) source of supply
Left and right voltage change.
It is therefore preferred that it is as described above when the surface of ratio resistance Fe-Ni alloy/C metal foil high is electroplated, make
Interval of the conductive rollers (C/R) and between anode bridge minimizes.
It is therefore preferred that when the ratio resistances such as such as Fe-Ni very thin material surface high is electroplated, in order that conductive rollers
(C/R) interval with anode bridge minimizes, as shown in figure 3, on the basis of the moving direction of Fe-Ni alloy/C metal foil, lower channel
The anode bridge (anode) of a and b of (down pass) constitutes the circuit being connected with No.1C/R (negative electrode) as comparative electrode simultaneously
Be connected to rectifier and conductive, the anode bridge (anode) of the c and d of upper channel (up pass) constituted as comparative electrode with
The circuit of No.2C/R (negative electrode) connections is simultaneously connected to rectifier and conductive.
With this conductive structure by connecting the power supply of rectifier to connect the circuit between each anode bridge and conductive rollers,
So as to make conductive rollers be minimized with the interval of anode bridge, further, it is possible to equably maintain the pole between upper channel and lower channel
Between be spaced, make based on each electric bridge voltage difference minimize.
Can possess more than two electroplating baths as needed.Now, an electroplating bath and the electroplating bath being adjacent
The conductive rollers of adjacent position can be shared.For example, the second conductive rollers of the first electroplating bath can play the first conduction of the second electroplating bath
The effect of roller, accordingly, the second conductive rollers of first electroplating bath are connected to the anode bridge of the upper channel to form the first electroplating bath,
And then it is connected to the anode bridge of the lower channel to form the second electroplating bath.
Electroplated in addition, rising to brushing plating voltage as described above (plating voltage) and material high must be compared
When, behind the C/R of electroplating bath (Plating Cell), i.e., as shown in figure 4, the place portion being initially separated after being contacted with conductive rollers
Position is preferably provided for being sprayed to the two sides of Fe-Ni alloy/C metal foil the shower nozzle (Shower Nozzle) of electroplating solution.
By the shower nozzle, electroplate liquid is sprayed onto the metal foil behind conductive rollers such that it is able to absorb because of brushing plating voltage high
And the heat for distributing, the generation of flue gas caused by the heating in metal foil is prevented from, and the generation of heat wrinkle can also be suppressed.
And then, because very thin Fe-Ni alloy/C metal foil is the material of poorly conductive, it is preferred that by improving
The contact between very thin metal foil and conductive rollers is stated to prevent the short-circuit generation caused by the raising of electric conductivity.When brush plating electricity
Buckling is high and when making contact of the conductive rollers with paper tinsel uneven, can deepen to cause the trend of short circuit because of short circuit.
It is therefore preferred that as shown in figure 5, in order to improve the very thin metal foil and conductive rollers (C/R, Conductor
Roll the contact between), the position for starting to contact with C/R in the metal foil sets buffer roll (Snubber Roll), makes gold
Category paper tinsel is adjacent to better with C/R.Hereby it is possible to induce conductive rollers to be contacted with the stabilization of metal foil, thus, it is possible to prevent from connecing
Touchdown point is short-circuited (electric arc), moreover it is possible to reduce brushing plating voltage (plating voltage).
Claims (10)
1. a kind of electroplanting device, its as the electroplanting device electroplated on the surface of Fe-Ni alloy/C metal foil, including：
Electrolytic cell, including electrolyte；
First conductive rollers and the second conductive rollers, outside the electrolytic cell, and as negative electrode；
Dip roll, positioned at the electrolyte bath, electrolyte bath is incorporated into by the metal foil supplied by the first conductive rollers, and
It is set to be discharged by the second conductive rollers afterwards in being impregnated into electrolyte；
A pair of first anode, the both sides of the metal foil mobile route being arranged between first conductive rollers and the dip roll；
A pair of second plates, the both sides of the metal foil mobile route being arranged between the dip roll and second conductive rollers；With
And
Electroplating bath, made between first conductive rollers and the first anode by connection it is conductive, and make second conductive rollers with
It is conductive between the second plate.
2. electroplanting device according to claim 1,
The first anode-cathode distance between first conductive rollers and the first negative electrode and the second pole between the second conductive rollers and the second negative electrode
Between distance it is identical.
3. electroplanting device according to claim 1 and 2,
Possess 2 the above electroplating baths, an electroplating bath and electroplating bath adjacent thereto share a conductive rollers.
4. electroplanting device according to claim 3,
The anode bridge of one upper channel of electroplating bath of the shared conductive rollers and formation and the lower channel of the adjacent electroplating bath of formation
Anode bridge electrical connection.
5. electroplanting device according to claim 1 and 2,
The place position being initially separated after metal foil is contacted with first conductive rollers, possesses for the two of the metal foil
Spray the shower nozzle of electroplating solution in face.
6. electroplanting device according to claim 1 and 2,
The position that at least one of first conductive rollers and second conductive rollers conductive rollers are contacted in beginning with metal foil
On possess buffer roll.
7. a kind of electro-plating method, used as the electro-plating method electroplated on the surface of Fe-Ni alloy/C metal foil, it is filled using plating
Put, the electroplanting device includes：
Electrolytic cell, including electrolyte；
First conductive rollers and the second conductive rollers, outside the electrolytic cell, and as negative electrode；
Dip roll, positioned at the electrolyte bath, electrolyte bath is incorporated into by the metal foil supplied by the first conductive rollers, and
It is set to be discharged by the second conductive rollers afterwards in being impregnated into electrolyte；
A pair of first anode, the both sides of the metal foil mobile route being arranged between first conductive rollers and the dip roll；With
And
A pair of second plates, the both sides of the metal foil mobile route being arranged between the dip roll and second conductive rollers,
The first anode and first conductive rollers are electrically connected, second plate and the second conductive rollers is electrically connected, and apply electric current.
8. electro-plating method according to claim 7, it is characterised in that
The place position spray electroplating solution being initially separated after being contacted with first conductive rollers to metal foil.
9. electro-plating method according to claim 8, it is characterised in that
The electroplating solution is sprayed on the two sides of metal foil.
10. electro-plating method according to claim 7, it is characterised in that
Start what is contacted with least one of first conductive rollers and second conductive rollers conductive rollers in the metal foil
Position, makes the metal foil be close to conductive rollers by buffer roll.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150185890A KR101746993B1 (en) | 2015-12-24 | 2015-12-24 | Method and apparatus for electroplating fe-ni alloy metal foil |
| KR10-2015-0185890 | 2015-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106917134A true CN106917134A (en) | 2017-07-04 |
Family
ID=59217776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611208394.5A Pending CN106917134A (en) | 2015-12-24 | 2016-12-23 | The electroplanting device and method of Fe Ni systems alloying metal paper tinsel |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101746993B1 (en) |
| CN (1) | CN106917134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
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| CN2495660Y (en) * | 2000-10-30 | 2002-06-19 | 沈京沙 | Electroforming cell for continuous prodn. of foamed nickel |
| CN1763257A (en) * | 2005-08-30 | 2006-04-26 | 江阴长发耐指纹钢板有限公司 | Surface treatment method for environment-friendly chromium-free zirconium-containing electro-galvanized fingerprint resistant steel sheet |
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| CN201826030U (en) * | 2010-09-30 | 2011-05-11 | 深圳市信诺泰创业投资企业(普通合伙) | Continuous electroplating device for films |
| CN202193865U (en) * | 2011-08-23 | 2012-04-18 | 灵宝华鑫铜箔有限责任公司 | Anti-oxidation tank of crude foil engine |
| CN105088298A (en) * | 2014-05-20 | 2015-11-25 | 宝山钢铁股份有限公司 | Composite electroplating bath for electroplating of cold rolling thin strip steel surface and electroplating section of composite electroplating bath |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
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| KR101746993B1 (en) | 2017-06-14 |
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