KR101746993B1 - Method and apparatus for electroplating fe-ni alloy metal foil - Google Patents

Abstract

The present invention relates to an electroplating apparatus for electroplating a surface of an Fe-Ni alloy metal foil, which comprises an electrolytic bath containing an electrolytic solution, first and second energized rolls provided outside the electrolytic bath and provided as a cathode, Wherein the metal foil is disposed on the first energizing roll and guided to the inside of the electrolytic bath through the first energizing roll to be dipped in the electrolytic solution and discharged through the second energizing roll, And a pair of second anodes disposed on both sides of a nitrogen foil movement path between the dipping roll and the second energizing roll, the first energizing roll and the first anode are energized, And a plating cell connected to the second energizing roll and the second anode so as to be energized.

Description

METHOD AND APPARATUS FOR ELECTROPLATING FE-NI ALLOY METAL FOIL FIELD OF THE INVENTION [0001]

The present invention relates to an electroplating method and apparatus for forming a functional post-treatment layer on an Fe-Ni alloy metal foil that can be used as an electronic device panel, an FMM (Fine Metal Mask), an encapsulant or a bonding material having excellent quality characteristics .

Metal foils have been developed for various applications and are widely used in the home / industry. For example, aluminum foil is widely used for domestic and cooking purposes, and stainless steel foil is mainly used as a building interior material or exterior material.

Electrolytic copper foil is widely used as a circuit of a printed circuit board (PCB), and recently it is widely used mainly in small-sized products such as a notebook computer, a personal digital assistant (PDA), an E-book, have.

Among them, Fe-Ni alloy metal foil has a low coefficient of thermal expansion (CTE) and is used as a substrate and sealing material for organic light emitting diodes (OLED), FMM Or the like, and is receiving the spotlight by the current collector of the secondary battery or the substrate of the electronic device.

Rolling method and electroforming method are widely known as methods for producing such Fe-Ni alloy metal foil. Among them, the electrolytic solution is supplied with electrolytic solution through a liquid supply nozzle in a gap surrounded by a pair of circular arc-shaped positive electrodes opposed to a rotating cylindrical negative electrode drum provided in an electrolytic bath, Ni alloy is electrodeposited and rolled to form a metal foil.

The Fe-Ni-based alloy metal foil manufactured by the electroforming method has an advantage that the average grain size is small and the mechanical properties are excellent. Further, the Fe-Ni alloy metal foil is advantageous in that it can be manufactured even at a low manufacturing cost and thus its manufacturing cost is low.

On the other hand, the Fe-Ni-based alloy metal foil manufactured by the electroplating method has the advantage of being able to be produced as a flexible and ultra-thin foil, while the moisture and transportation and inevitably contained in the surface and inside of the Fe- If rusting (red rust) generated during storage is not effectively prevented (ensuring rust resistance), application of the material is difficult or the life of the manufactured device shortens.

Various rust-preventive coating techniques for foil surfaces have been applied to solve these problems. And a technique of forming an electrolytic copper (Cu) plating layer on the outer surface of the Fe-Ni alloy to form a heat dissipation circuit layer formed by electrolytic ingot to improve the corrosion resistance and heat dissipation performance (Korean Patent Laid-Open Publication No. 2011-0053805 ).

As another example, the Fe-Ni-based alloy metal foil manufactured by the electroplating method has a large residual stress because the atoms are chemically bonded and the diffusion process between the atoms is not accompanied, I have possession. Therefore, in general, a post-heat treatment is performed to remove the residual stress after the manufacturing process. In such a post-heat treatment process, surface discoloration occurs and surface rust is generated.

In order to solve this problem, a method of forming a metal barrier layer by coating a metal on the surface of the Fe-Ni alloy metal foil in order to prevent discoloration of the surface during the heat treatment process has been proposed.

The metal barrier layer can effectively prevent the penetration of oxygen and the diffusion of Fe into the surface of the Fe-Ni metal foil in an atmospheric air atmosphere at a temperature of 300 ° C or higher, thereby improving the heat resistance and rust resistance of the Fe-Ni alloy metal foil .

The metal barrier layer may be formed by an electroless plating method, an electrolytic plating method, or a vacuum deposition method. The present invention is applicable to an apparatus for forming a heat resistant metal barrier layer or another functional metal coating on an Fe-Ni metal foil by an electrolytic plating method .

The present invention relates to an Fe-Ni alloy metal foil which can be used as an electronic device panel having excellent quality characteristics, an FMM (Fine Metal Mask), an encapsulant or a bonding material, It is intended to provide an apparatus for electroplating an Fe-Ni alloy metal foil surface when treating the surface.

The object of the present invention is not limited to the above description. Additional objects and advantages of the invention will be set forth in part in the description which follows, and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

The present invention relates to an electroplating apparatus for electroplating a surface of a Fe-Ni alloy metal foil, comprising: an electrolytic bath containing an electrolytic solution; first and second energizing rolls provided outside the electrolytic bath and provided as a cathode; Diffling rolls for guiding the metal foil supplied through the first energizing rolls to the inside of the electrolytic bath to be dipped in the electrolytic solution and then discharged through the second energizing rolls are disposed on both sides of the metal foil moving path between the first energizing roll and the diphling roll And a pair of second anodes disposed on both sides of the nitrogen foil movement path between the dipping roll and the second energizing roll, the first energizing roll and the first anode are energized, and the second energizing roll And a plating cell connected to energize the energizing roll and the second anode.

At least two plating cells may be provided. In this case, one plating cell and a plating cell adjacent thereto may share one conduction roll.

The shared energizing roll may be electrically connected to an anode bridge forming an up-path of one plating cell and an anode bridge forming a down-path of a plating cell adjacent to the anode bridge.

And a shower nozzle for spraying an electroplating solution on both sides of the metal foil at a point where the metal foil starts to be separated from the first energizing roll after being contacted.

At least one of the energizing rolls of the first and second energizing rolls may have a snubber roll at a position where it starts to contact the metal foil.

The present invention provides an electroplating method for electroplating a surface of a Fe-Ni alloy metal foil, comprising: an electrolytic bath containing an electrolytic solution; First and second energizing rolls located outside the electrolytic cell and provided as cathodes; A dipping roll which is positioned inside the electrolytic bath and guides the metal foil supplied through the first energizing roll to the inside of the electrolytic bath to be dipped in the electrolytic solution and then discharged through the second energizing roll; A pair of first anodes disposed on both sides of the metal foil movement path between the first energizing roll and the diphling roll; And a pair of second anodes disposed on both sides of a nitrogen foil movement path between the dipping roll and the second energizing roll, wherein the first anode and the first energizing roll are electrically connected to each other, And an electric current is applied by electrically connecting the second anode and the second energizing roll.

It is preferable that the electroplating solution is sprayed to a point where the metal foil starts to be separated from the first energizing roll, and it is more preferable that the electroplating solution is sprayed on both sides of the metal foil.

Furthermore, it is preferable that the metal foil is brought into close contact with the energizing roll by a snubber roll at a position where the metal foil starts to contact the energizing roll of at least one of the first and second energizing rolls.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to make the voltage difference constant for an Fe-Ni alloy metal foil having a large resistivity and difficult to conduct current, to perform uniform metal coating, and to produce a high quality Fe-Ni metal foil .

Further, the functional coating layer can be uniformly formed on the high-quality Fe-Ni metal foil, and heat resistance and heat dissipation property can be improved in the metal foil. Therefore, FMM for OLED (Organic Light Emitting Diodes) As a material for a substrate, an electronic device, or the like.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view showing a cross-sectional structure of an electroplating apparatus including a general electroplating cell. FIG.
FIG. 2 is a graph showing changes in plating voltage according to the distance between the material and the electrode when the same current is applied.
3 is a schematic view of a current-carrying structure according to an embodiment of the present invention applicable to a Fe-Ni alloy foil having a high resistivity.
4 is a schematic view of a plating cell having a solution shower nozzle according to an embodiment of the present invention.
FIG. 5 is a schematic view of a plating cell having a snubber roll according to an embodiment of the present invention. Referring to FIG.

The present invention relates to an Fe-Ni alloy metal foil surface, which is a method for imparting functionality to an Fe-Ni alloy metal foil that can be used as an electronic device panel, an FMM (Fine Metal Mask), a sealing material, The present invention provides a method of electroplating a metal on a substrate.

Hereinafter, a more detailed description will be given with reference to the drawings.

Fig. 1 is a graph showing the relationship between the electrical properties of the Fe-Ni alloy metal foil and the post-treatment equipment of the Fe-Ni alloy metal foil, which can realize double- and / or divergence electroplating treatment, drying and the like for securing properties such as heat resistance, corrosion resistance, This is an example of a plating bath.

When an Fe-Ni alloy metal foil having a thickness of about 20 탆 is connected to a post-treatment electroplating bath as shown in Fig. 1 and a current higher than a proper level is applied, the arc voltage Arc) is generated in a short time period.

For example, when a current corresponding to about 2A / dm 2 is applied to an electrodeposition vessel at a level of 110 A per anode bridge, that is, considering the width and length of the Fe-Ni metal foil, , And the results are shown in Table 1. < tb >< TABLE >

Cell Rectifier Input (110A) Plating Voltage per Bridge Bridge control a b c d a + d 9.0 X X 12.7 b + c X 9.1 12.6 X a + b + c + d 14.1 14.3 21.3 21.4

As can be seen from Table 1 above, It can be seen that when the anode bridge of a and d is controlled by the energized roll of 1 C / R, there is a large difference between the plating voltages of the respective bridges. Similarly, it can be seen that the plating voltage at each bridge shows a large difference even when the bridge of b and c is controlled.

Further, all the bridges a to d are denoted by No. 1 C / R control shows a similar plating voltage between a and b bridges and between c and d bridges, but there is a large difference in plating voltage between a and d bridges and between b and c bridges.

This phenomenon is such that it is impossible to conduct current to a high current any longer and it is not possible to control the current for each anode bridge in the same electrolytic cell, And a fume was generated and heat wrinkles were observed.

As a result of analyzing the influence of the electrolytic treatment equipment and the material on the conductivity of the Fe-Ni alloy metal foil in the bar vertical type electrolytic cell ("V" type vertical cell) shown in FIG. 1, The resistivity of the alloy metal foil was much higher than that of the other materials. The resistivity of the alloy metal foil showed a tendency to increase significantly when the thickness of the material was thinner, and when the current passing pass was longer.

That is, in a general electroplating electrification method, as shown in Fig. 1, a negative electrode from a rectifier is connected to a No. 1 energizing roll (C / R) on the energizing path to generate a down- The anode bridge and the up pass c and d anode bridges are energized.

In such a position of the energized roll, since the electric path length from the energizing roll to the c and d bridges on the up-path is long, the impedance is increased accordingly. Therefore, in the Fe-Ni alloy metal foil on the energizing pass line, the c and d bridges, which are the anodes in the up pass direction, are higher than the a and b bridges, which are the anodes in the down pass direction, .

Therefore, when electroplating is carried out on the surface of a super-thin Fe-Ni alloy metal foil having a specific resistivity of 100 μm or less as compared with an ultra-thin Cu foil having a low resistivity or a thick carbon steel having a thickness of about 200 μm or more, And the plating voltage is rapidly increased.

This can be confirmed from FIG. 2 is a graph showing changes in the plating voltage as a result of the energization test according to the distance between the workpiece and the electrode when the same current (Lab., 14 A / dm 2, 26 A) is applied. In other words, according to FIG. 2, when the plating voltage at the same inter-electrode distance is examined, the ultra-thin Fe-Ni foil has a relatively high plating voltage compared to the foil of the STS material of 75 μm thickness and the Cu foil of 35 μm thickness Respectively.

Further, it can be seen that the foil of the STS material having a thickness of 75 탆 and the Cu foil having the thickness of 35 탆 have almost no difference in plating voltage according to the inter-electrode distance, but the Fe-Ni foil having a thickness of 13 탆, The plating voltage was increased.

Therefore, as described above, as the distance between the current-carrying roll and the cathode bridge connected to the current-carrying roll is increased, the voltage difference becomes larger due to the increase of resistance as a material having a high resistivity such as Fe-Ni alloy, And eventually can not increase the current.

The factors affecting the electrical conductivity of the Fe-Ni alloy metal foil having a high resistivity as described above are caused by the voltage difference depending on the distance between the energizing roll and the foil. As a result, the (-) source and the (+ It is understood that the distance between the voltage and the voltage changes the voltage change.

Therefore, when electroplating the surface of the Fe-Ni alloy metal foil having a high specific resistance as described above, it is preferable to minimize the distance between the energizing roll (C / R) and the anode bridge.

In order to minimize the gap between the energizing roll (C / R) and the anode bridge in electroplating the surface of the ultra-thick material having a high resistivity such as Fe-Ni, the Fe-Ni alloy metal foil The anode bridge (anode) of a and b of the down pass constitutes an electric circuit connected to the No. 1 C / R (cathode) as a counter electrode and connected and connected to the rectifier, it is preferable that the anode bridge (anode) of c and d in the up pass constitutes an electric circuit connected to the No. 2 C / R (cathode) as a counter electrode and connected to the rectifier.

By providing the energizing structure in which the power source of the rectifier is connected so that the electric circuit between each anode bridge and the energizing roll is connected as described above, the interval between the energizing roll and the anode bridge can be minimized and the gap between the up and down passes can be uniform So that the voltage difference according to each bridge can be minimized.

Two or more such plating cells may be provided as necessary. At this time, one plating cell and plating cells adjacent thereto can share the conductive rolls adjacent to each other. For example, the second energizing roll of the first plating cell can serve as a first energizing roll of the second plating cell, whereby the second energizing roll of the first plating cell is capable of functioning as the up- And connected to the anode bridge constituting the path and further to the anode bridge constituting the down path of the second plating cell.

On the other hand, in the case of electroplating a material having a high plating voltage as described above, the material is electrostatically deposited after the C / R of the plating cell, that is, as shown in FIG. 4, It is preferable to provide a shower nozzle for spraying the electroplating solution on both sides of the Fe-Ni alloy metal foil at the starting point.

It is possible to absorb heat dissipation due to the high plating voltage by spraying the electroplating liquid on the metal foil immediately after the energizing roll through the shower nozzle, thereby preventing occurrence of fumes due to heat generation in the metal foil and suppressing the generation of heat wrinkles can do.

Furthermore, it is preferable that the ultra-thin Fe-Ni alloy metal foil is a material having poor electrical conductivity, and that the contact between the metal foil of the ultra-thin foil and the conductive roll is improved, When the plating voltage becomes high, when the contact between the conductive roll and the foil is not uniform, a short circuit due to an electrical short circuit tends to occur.

As shown in FIG. 5, in order to increase the contact property between the metal foil of the ultra thin foil and the conductive roll (C / R, Conductor Roll), a Snubber Roll is preferably provided so that the metal foil can more closely adhere to the C / R. As a result, it is possible to induce stable contact between the conductive roll and the metal foil, thereby preventing the occurrence of short-circuiting at the contact point and, at the same time, lowering the plating voltage.

Claims (10)

An electroplating apparatus for electroplating a surface of an Fe-Ni alloy metal foil having a thickness of 13 to 100 mu m,
An electrolytic bath containing an electrolytic solution;
First and second energizing rolls located outside the electrolytic cell and provided as cathodes;
A dipping roll which is positioned inside the electrolytic bath and guides the metal foil supplied through the first energizing roll to the inside of the electrolytic bath to be dipped in the electrolytic solution and then discharged through the second energizing roll;
A pair of first anodes disposed on both sides of the metal foil movement path between the first energizing roll and the diphling roll; And
A pair of second anodes disposed on both sides of the nitrogen foil movement path between the diphling roll and the second energizing roll,
And a plating cell connected between the first energizing roll and the first anode and energized by the second energizing roll and the second anode,
And a shower nozzle for spraying an electroplating solution on both sides of the metal foil at a point where the metal foil starts to be separated from the first energizing roll after being contacted.
The electroplating apparatus according to claim 1, wherein the first inter-electrode distance between the first energizing roll and the first negative electrode is the same as the second inter-electrode distance between the second energizing roll and the second negative electrode.
The electroplating apparatus according to claim 1 or 2, wherein two or more plating cells are provided, and one plating cell and adjacent plating cells share one energizing roll.
4. The electroplating apparatus according to claim 3, wherein the shared energizing roll is electrically connected to the anode bridge forming the down path of the plating cell adjacent to the anode bridge forming the up path of one plating cell.
delete 3. The electroplating apparatus according to claim 1 or 2, wherein the energizing roll of at least one of the first and second energizing rolls has a snubber roll at a position where it starts to contact the metal foil.
An electroplating method for electroplating a surface of an Fe-Ni alloy metal foil having a thickness of 13 to 100 mu m,
An electrolytic bath containing an electrolytic solution; First and second energizing rolls located outside the electrolytic cell and provided as cathodes; A dipping roll which is positioned inside the electrolytic bath and guides the metal foil supplied through the first energizing roll to the inside of the electrolytic bath to be dipped in the electrolytic solution and then discharged through the second energizing roll; A pair of first anodes disposed on both sides of the metal foil movement path between the first energizing roll and the diphling roll; And a pair of second anodes disposed on both sides of the nitrogen foil movement path between the dippingroll and the second energizing roll,
The first anode and the first energization roll are electrically connected, the second anode and the second energization roll are electrically connected to each other to apply a current, and the metal foil is contacted with the first energization roll, Wherein an electroplating solution is sprayed on both sides of the metal foil at a point where the metal foil is exposed.
delete delete 8. The electric motor according to claim 7, characterized in that the metal foil is brought into close contact with the energizing roll by a snubber roll at a position where the metal foil starts to contact the energizing roll of at least one of the first and second energizing rolls Plating method.

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