KR101756690B1

KR101756690B1 - Anodizing method for imparting the current performance

Info

Publication number: KR101756690B1
Application number: KR1020150033567A
Authority: KR
Inventors: 김영기
Original assignee: (주) 거성테크놀로지; 김영기
Priority date: 2015-03-11
Filing date: 2015-03-11
Publication date: 2017-07-12
Also published as: KR20160110702A

Abstract

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a plating method capable of providing electroplating performance to a plating layer in order to induce static electricity generated on a surface thereof, And an anodizing method for imparting electrification performance.
The present invention provides a method for removing contaminants on a surface of a substrate, comprising the steps of: The pretreated object is impregnated with an electrolytic bath in which a plating solution is stored and maintained at a temperature of 20 ° C to 25 ° C and a plating is performed for 50 to 70 minutes by applying a voltage of 15V to 20V to form a plating layer on the surface of the object Wow; Subjecting the plated object to impregnation in a sealing bath containing a sealing liquid for 25 minutes to 35 minutes to improve the corrosion resistance of the plating layer; Washing the object subjected to the steps with washing water; And drying the washed object after the sealing step is performed.

Description

Anodizing method for imparting the current performance < RTI ID = 0.0 >

The present invention relates to an anodizing method for imparting electrification performance.

More particularly, the present invention relates to an electroplating process for forming an electroplating layer on a surface of a substrate, comprising the steps of: The present invention also relates to an anodizing method for imparting an electric current carrying performance so as to ensure an electrical conductivity.

Anodizing is applied to a wide range of fields such as semiconductor equipment, building materials (chassis), telecommunication equipment, optical equipment, ornaments, automobile parts, etc. Recently, Be in the spotlight.

Such anodizing forms a film of aluminum oxide on the surface of aluminum. When the aluminum component is used as an anode in an electrolytic solution and energized, the aluminum surface is oxidized by oxygen generated in the anode to form a film of aluminum oxide, . Particularly, there are various electrolytes used in the anodizing work, but in Korea, boric acid, boric acid, sulfamic acid and the like are used by using sulfuric acid as a fishery.

Korean Patent Application No. 2008-0102585 (method and system for treating metal anodizing, hereinafter referred to as original invention) discloses a process for performing the above-described anodizing operation.

The anodizing process of the present invention comprises the steps of: (a) immersing a plurality of plating objects on a hanging table supported by a plurality of anode plates and contacting a cathode line partitioned by an insulating block in a predetermined section, ; (b) a positive electrode plate which is in contact with the positive electrode line and which supports the positive electrode line, and a negative electrode plate which is in contact with a negative electrode line which is located at a certain distance from the positive electrode line and which supports the negative electrode line, Performing an anodizing process; (c) driving the motor in the power control panel to rotate a chain coupled with the driving sprocket and the driven sprocket via a speed reducer and a power transmitting member, and a cradle contacting the anode line positioned at a certain distance from the chain, Rotating the transport block; (d) sucking and discharging the gas generated in the electrolytic solution during the anodizing through a duct equipped with the suction fan; And (e) separating the anodized object from the electrolytic bath ".

The anodizing treatment process is a general plating process in which the surface of the object to be plated is plated so that the surface of the object to be plated has insulation performance. Recently, plating for semiconductor processing or testing equipment has been known A request has occurred.

This is to prevent static electricity generated on the surface of the plating layer from being conducted outside the work section by making the electroplating performance of the plated layer of the semiconductor processing parts or test equipments to be defective due to static electricity during processing or testing of the semiconductor. However, by the general anodizing operation as in the above-described inventions, a problem that the electrification performance is hardly achieved in the plating layer is exposed.

For reference, semiconductor fabrication parts and test equipment makers require a surface resistance value of 0.8 or less while maintaining normal plating characteristics after plating, and such surface resistance value is not obtained in general anodizing process.

The present invention has been made to solve the above problems.

Accordingly, it is an object of the present invention to provide an electroplating apparatus capable of providing electroplating performance to a plating layer in order to induce static electricity generated on a surface thereof, And an object of the present invention is to provide an anodizing method for imparting a current carrying performance.

In order to achieve the above object, the present invention performs the following process.

The present invention provides a method for removing contaminants on a surface of a substrate, comprising the steps of: The pretreated object is impregnated with an electrolytic bath in which a plating solution is stored and maintained at a temperature of 20 ° C to 25 ° C and a plating is performed for 50 to 70 minutes by applying a voltage of 15V to 20V to form a plating layer on the surface of the object Wow; Subjecting the plated object to impregnation in a sealing bath containing a sealing liquid for 25 minutes to 35 minutes to improve the corrosion resistance of the plating layer; Washing the object subjected to the steps with washing water; And drying the washed object after the sealing step is performed.

Here, in the step of forming the plating layer, the conductive metal powder sintered in the form of fine particles is added to the electrolytic solution to perform plating.

At this time, the conductive metal powder is added in an amount of 0.5% by weight to 2% by weight based on 100% by weight of the total electrolyte solution.

Further, in the step of forming the plating layer, an agitator provided in the electrolytic bath may be provided, or a vibration generating unit may be provided outside the electrolytic bath so that the electrolytic solution to which the conductive metal powder is added is stirred or vibrated to be plated.

Industrial Applicability As described above, the present invention has an effect of preventing defective processing or defective test caused by static electricity by being applied to parts of a semiconductor processing equipment or a test equipment by a work process in which a plating layer is provided with an electrification performance. In addition, the present invention has an excellent plating property in a state in which the plating layer is provided with the electrification performance, so that it is possible to produce a high-quality product.

1 is a flowchart of an anodizing method according to the present invention.
2 is a process diagram of an anodizing process according to the present invention.

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a flow chart of an anodizing method according to the present invention, and FIG. 2 is a process diagram of an anodizing process according to the present invention. The apparatus for carrying out the anodizing process shown in this embodiment includes a conveyor for conveying a work section to which an object to be plated (hereinafter referred to as an object to be plated) is caught and an elevator mechanism such as a cylinder for impregnating an object into a plating liquid, The present invention is not limited thereto.

In order to carry out the anodizing process according to the present invention, a pretreatment step (S1), a plating step (S2), a water washing step (S3), a sealing step (S4), a drying step S5.

In the pretreatment step S1, as a process for removing surface contaminants of the object 1, degreasing, etching, and washing processes are performed to remove pollutants such as oil and dust or to chemically separate harmful components do.

In the plating step S2, the preprocessed object 1 is impregnated into the electrolytic bath 2 in which the plating liquid is stored, a voltage of a constant power source is supplied, and electroplating is performed for a predetermined time to form a plating layer on the surface of the object 1. [ Respectively. The electrolytic bath 2 is applied as a constant temperature tank in which the plating solution can maintain a temperature of 20 ° C to 25 ° C. The voltage supplied to the plating solution is 15V to 20V, and the plating is performed for 50 to 70 minutes .

If the temperature of the plating solution is less than 20 캜, the surface resistance of the plating layer will be high, and the desired electrification performance will not be expected. If the temperature of the plating solution is 25 캜 or more, the surface resistance value will be low. And the degree of curing of the plated layer).

If the voltage supplied to the plating solution is less than 15 V, the surface resistance of the plating layer is lowered while the plating characteristics are poor. When the voltage is 20 V or higher, the desired plating characteristics are maintained for the plating characteristics, do.

Meanwhile, since the plating operation time is related to the productivity, it is necessary to perform the operation for more than 50 minutes in consideration of the temperature condition and the voltage supply condition described above, so that the normal plating property and the desired surface resistance value can be obtained, If it exceeds 70 minutes, productivity is deteriorated due to excessive time delay.

With the added technique, it is possible to add a conductive metal powder such as nickel, copper, gold, silver, etc., which are sintered in the form of fine particles, to the electrolytic solution in order to expect more excellent electrification performance.

At this time, the conductive metal powder is added in an amount of 0.5 wt% to 2 wt% based on 100 wt% of the entire plating solution, and when the conductive metal powder is less than 0.5 wt%, the desired electrification performance is difficult to expect, The desired plating characteristics due to the addition of excessive metal material can not be obtained.

When the conductive metal powder is added to the plating solution, the agitator 3 provided in the electrolytic bath 2 may be installed or the vibration generating unit 4 may be provided outside the electrolytic bath 2. This is to stir or vibrate the plating solution to which the conductive metal powder is added during the plating process so that the conductive metal powder is more uniformly dispersed in the plating layer to have more excellent electrification property and plating property.

In the plating step S2, the object 1 to be plated is impregnated with the sealing tank 5 in which the sealing liquid is stored for 25 minutes to 35 minutes to improve the corrosion resistance of the plating layer. If the sealing time is less than 25 minutes, the oxidation period of the plating layer is shortened. If the sealing time is more than 35 minutes, excellent plating characteristics are obtained but the consumption of the sealing liquid and the productivity are decreased.

The water washing step S3 is a step of washing the surface of the object 1 to which the work of each step has been performed in the pre-processing step S1, the plating step S2, the sealing step S4 and the drying step S5 It is a process for. The drying step S5 is for drying and curing the plating layer of the object 1 which has completed the sealing process. The drying step S5 may be performed by selecting room temperature drying, hot air drying, NIR drying or the like depending on the characteristics of the plating product.

Table 1 below compares the normal anodizing treatment conditions of aluminum white hard and the anodizing treatment conditions of the present invention.

AL White Hard (Normal operation) AL white hard (surface resistance work) Boiling temperature Minus 10 degrees Boiling temperature Video 22 degrees volt 23 volts volt 18 volts working time 30 minutes working time 60 minutes Sealing time 10 minutes Sealing time 30 minutes

As a result of measuring the surface resistances of the surfaces of the respective plating layers after performing the plating process of the above-described embodiment under the same conditions as in Table 1, the surface resistivity of 0.92 was obtained for the unit power supply in the general work, In the work, a surface resistance of 0.67 was obtained for the supply of unit power.

Particularly, the anodizing plating layer formed by these two operations has similar characteristics in terms of thickness, hardness, heat resistance, corrosion resistance, and the like in the range of approximately 1%, and only plating by the anodizing treatment according to this embodiment In the fabrication of semiconductor processing parts and test equipment, after plating, the surface resistance value of 0.8 or less was obtained while maintaining normal plating characteristics.

1: object
2: electrolytic bath
3: The bridge
4: Vibration generating unit
5: Sealing tank

Claims

A pretreatment step for removing surface contaminants of the object 1;
The pretreated object 1 is impregnated in an electrolytic bath 2 which is kept at a temperature of 20 ° C to 25 ° C and is plated for 50 to 70 minutes by supplying a voltage of 15 V to 20 V, ), A conductive metal powder sintered in the form of fine particles is added to the plating liquid to perform plating, and the conductive metal powder is added in an amount of 0.5 to 2 wt% based on 100 wt% of the plating liquid as a whole Forming a plating layer on the plating layer to induce static electricity generated on the surface of the plating layer;
Subjecting the coated object 1 to impregnation in a sealing tank 5 containing a sealing liquid for 25 minutes to 35 minutes to improve the corrosion resistance of the plating layer;
Washing the object (1) subjected to each step with washing water;
Drying the washed object (1) after the sealing step is performed;
Wherein the anodizing treatment is carried out by using the anodizing treatment.

delete

The method according to claim 1,
The step of forming the plating layer may be performed by providing an agitator 3 provided in the electrolytic bath 2 or by providing a vibration generating unit 4 on the outside of the electrolytic bath 2 to stir or vibrate the plating liquid to which the conductive metal powder is added, And an electric field is applied to the anodizing process.