CN114649211A - Surface coating process of lead frame - Google Patents
Surface coating process of lead frame Download PDFInfo
- Publication number
- CN114649211A CN114649211A CN202011500584.0A CN202011500584A CN114649211A CN 114649211 A CN114649211 A CN 114649211A CN 202011500584 A CN202011500584 A CN 202011500584A CN 114649211 A CN114649211 A CN 114649211A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- workpiece
- coating process
- surface coating
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims abstract description 12
- 239000011241 protective layer Substances 0.000 claims abstract description 10
- 238000007781 pre-processing Methods 0.000 claims abstract description 7
- 150000002500 ions Chemical class 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 6
- -1 excited molecules Chemical class 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 3
- 239000003344 environmental pollutant Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 231100000719 pollutant Toxicity 0.000 claims description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 229920001529 polyepoxysuccinic acid Polymers 0.000 description 2
- ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of coating, and particularly discloses a surface coating process of a lead frame, which comprises the following steps: s1, preprocessing; s2, ion cleaning; s3, electroplating; and S4, preparing a protective layer. The surface coating process of the lead frame provided by the invention can improve the activity of the surface of a workpiece by utilizing ion cleaning, can enhance the subsequent coating effect, can improve the bonding strength of a coating and the workpiece, is matched with electroplating treatment to improve the stability of a formed film, is not easy to fall off, further enhances the corrosion resistance, prolongs the service life of the lead frame, and can play a role in protecting the coating by being matched with a protective layer.
Description
Technical Field
The invention relates to the technical field of film coating, in particular to a surface film coating process of a lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
In order to guarantee the service life and the use effect of electronic products, the quality of a lead frame needs to be guaranteed, so that the surface of the lead frame needs to be subjected to film coating treatment, the strength of the material is improved, the toughness is improved, and the service life of the lead frame is guaranteed.
Disclosure of Invention
The invention mainly aims to provide a surface coating process of a lead frame, which can effectively solve the problems in the prior art.
A surface coating process of a lead frame comprises the following steps:
s1, preprocessing;
s2, ion cleaning;
s3, electroplating treatment;
and S4, preparing a protective layer.
The preprocessing in step S1 includes:
1) polishing the formed lead frame to remove burrs on the surface;
2) putting the polished lead frame workpiece into pretreatment liquid, carrying out ultrasonic treatment for 4-6 min, and removing floating dust and grease;
wherein: the pretreatment solution is prepared from polyepoxy succinic acid sodium, sodium gluconate and fatty alcohol-polyoxyethylene ether sodium sulfate according to the weight ratio of 1: 1-2.5: 3-5.
In the step S2, the ion cleaning enables a large amount of active particles such as ions, excited molecules, radicals and the like in the plasma to act on the surface of the solid sample, which not only can remove pollutants and impurities on the surface, but also enables the plasma to act on the surface of the solid, so as to break the original chemical bonds on the surface of the solid, and the radicals in the plasma and the bonds form a network cross-linking structure, thereby improving the surface activity of the material.
The specific operation mode of the electroplating treatment in the step S3 is as follows: putting the lead frame workpiece subjected to ion cleaning into an electrolyte, using the lead frame workpiece as a positive electrode, using a stainless steel plate as a negative electrode, performing electroplating treatment for 8-10 min, and forming a uniform, compact and well-combined metal or alloy deposition layer on the surface of the workpiece by electrolysis, wherein the deposition thickness is 2-5 microns.
In the step S3, the voltage is 320-380V, the current is 15-25A, and the frequency is 400-600 Hz in the electroplating process.
The specific operation mode of preparing the protective layer in the step S4 is as follows: after washing and drying the electroplated lead frame workpiece, uniformly coating the poly (trifluoropropylmethylsiloxane) on the surface of the workpiece, carrying out curing reaction for 2-3 h at room temperature, and carrying out heat treatment for 1-2 h at 100-120 ℃ to obtain a surface protection layer, wherein the thickness of the protection layer is 1-3 mu m.
The surface coating process of the lead frame provided by the invention can improve the activity of the surface of a workpiece by utilizing ion cleaning, can enhance the subsequent coating effect, can improve the bonding strength of a coating and the workpiece, improves the stability of film formation, is not easy to fall off, further enhances the corrosion resistance, prolongs the service life of the lead frame, and can play a role in protecting the coating by matching with a protective layer.
Drawings
Fig. 1 is a process flow diagram of a surface coating process of a lead frame according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1, a surface coating process for a lead frame specifically comprises the following steps:
s1, preprocessing;
s2, ion cleaning;
s3, electroplating;
and S4, preparing a protective layer.
The preprocessing in step S1 includes:
1) polishing the formed lead frame to remove burrs on the surface;
2) putting the polished lead frame workpiece into pretreatment liquid, carrying out ultrasonic treatment for 4-6 min, and removing floating dust and grease;
wherein: the pretreatment solution is prepared from polyepoxy succinic acid sodium, sodium gluconate and fatty alcohol-polyoxyethylene ether sodium sulfate according to the weight ratio of 1: 1-2.5: 3-5.
The polishing process can be carried out by adopting fixed polishing equipment or a handheld polishing machine.
In the step S2, the ion cleaning enables a large amount of active particles such as ions, excited molecules, radicals and the like in the plasma to act on the surface of the solid sample, which not only can remove pollutants and impurities on the surface, but also enables the plasma to act on the surface of the solid, so as to break the original chemical bonds on the surface of the solid, and the radicals in the plasma and the bonds form a network cross-linking structure, thereby improving the surface activity of the material.
The specific operation mode of the electroplating treatment in the step S3 is as follows: putting the lead frame workpiece subjected to ion cleaning into an electrolyte, using the lead frame workpiece as a positive electrode, using a stainless steel plate as a negative electrode, performing electroplating treatment for 8-10 min, and forming a uniform, compact and well-combined metal or alloy deposition layer on the surface of the workpiece by electrolysis, wherein the deposition thickness is 2-5 microns.
In the step S3, the voltage is 320-380V, the current is 15-25A, and the frequency is 400-600 Hz.
The specific operation mode for preparing the protective layer in the step S4 is as follows: after washing and drying the electroplated lead frame workpiece, uniformly coating the poly (trifluoropropylmethylsiloxane) on the surface of the workpiece, carrying out curing reaction for 2-3 h at room temperature, and carrying out heat treatment for 1-2 h at 100-120 ℃ to obtain a surface protection layer, wherein the thickness of the protection layer is 1-3 mu m.
The surface coating process of the lead frame, provided by the invention, has the advantages that the surface of the workpiece is pretreated firstly, the subsequent coating effect and the coating quality can be ensured, the activity of the surface of the workpiece can be improved by matching with ion cleaning, the subsequent coating effect can be enhanced, the bonding strength of the coating and the workpiece can be improved, the film forming stability is improved, the film is not easy to fall off, the corrosion resistance is further enhanced, the service life of the lead frame is prolonged, in addition, the coating can be protected by matching with a protective layer, meanwhile, the production cost is greatly reduced, the process flow is simplified, the processing efficiency is improved, the labor intensity of workers is reduced, the prepared protective film has stable performance, and is hard in texture and stable in chemical performance and cannot be denatured under high-temperature environment and ultraviolet irradiation.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A surface coating process of a lead frame is characterized in that: the specific process comprises the following steps:
s1, preprocessing;
s2, ion cleaning;
s3, electroplating;
and S4, preparing a protective layer.
2. The surface coating process of the lead frame according to claim 1, wherein: the preprocessing in step S1 includes:
1) polishing the formed lead frame to remove burrs on the surface;
2) putting the polished lead frame workpiece into pretreatment liquid, carrying out ultrasonic treatment for 4-6 min, and removing floating dust and grease;
wherein: the pretreatment solution is prepared from sodium polyepoxysuccinate, sodium gluconate and fatty alcohol-polyoxyethylene ether sodium sulfate according to the weight ratio of 1: 1-2.5: 3-5.
3. The surface coating process of the lead frame according to claim 1, wherein: in the step S2, the ion cleaning enables a large amount of active particles such as ions, excited molecules, radicals and the like in the plasma to act on the surface of the solid sample, which not only can remove pollutants and impurities on the surface, but also enables the plasma to act on the surface of the solid, so as to break the original chemical bonds on the surface of the solid, and the radicals in the plasma and the bonds form a network cross-linking structure, thereby improving the surface activity of the material.
4. The surface coating process of the lead frame according to claim 1, wherein: the specific operation mode of the electroplating treatment in the step S3 is as follows: putting the lead frame workpiece subjected to ion cleaning into an electrolyte, using the lead frame workpiece as a positive electrode, using a stainless steel plate as a negative electrode, performing electroplating treatment for 8-10 min, and forming a uniform, compact and well-combined metal or alloy deposition layer on the surface of the workpiece by electrolysis, wherein the deposition thickness is 2-5 microns.
5. The surface coating process of the lead frame according to claim 1, wherein: in the step S3, the voltage is 320-380V, the current is 15-25A, and the frequency is 400-600 Hz in the electroplating process.
6. The surface coating process of the lead frame according to claim 1, wherein:
the specific operation mode for preparing the protective layer in the step S4 is as follows: after washing and drying the electroplated lead frame workpiece, uniformly coating the poly (trifluoropropylmethylsiloxane) on the surface of the workpiece, carrying out curing reaction for 2-3 h at room temperature, and carrying out heat treatment for 1-2 h at 100-120 ℃ to obtain a surface protection layer, wherein the thickness of the protection layer is 1-3 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011500584.0A CN114649211A (en) | 2020-12-17 | 2020-12-17 | Surface coating process of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011500584.0A CN114649211A (en) | 2020-12-17 | 2020-12-17 | Surface coating process of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114649211A true CN114649211A (en) | 2022-06-21 |
Family
ID=81991277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011500584.0A Pending CN114649211A (en) | 2020-12-17 | 2020-12-17 | Surface coating process of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114649211A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115976465A (en) * | 2022-12-27 | 2023-04-18 | 天津美泰真空技术有限公司 | Surface coating process of chip carrier |
-
2020
- 2020-12-17 CN CN202011500584.0A patent/CN114649211A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115976465A (en) * | 2022-12-27 | 2023-04-18 | 天津美泰真空技术有限公司 | Surface coating process of chip carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103173840A (en) | Method for producing grinding electroplated diamond wheel | |
| CN103276435B (en) | Micro-nano processing method for aluminum/aluminum alloy surface and aluminum/ aluminum alloy structure | |
| TW201247065A (en) | A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate | |
| CN110172717B (en) | Copper plating method for ceramic substrate | |
| CN108866590A (en) | A kind of nonmagnetic welding wire and its manufacturing process | |
| CN1230575C (en) | Continuous nickel plating process for stainless steel wire | |
| CN114649211A (en) | Surface coating process of lead frame | |
| CN107254694A (en) | A kind of tin plating electrolyte and the efficient tin plating technique based on the tin plating electrolyte | |
| JP5613125B2 (en) | Method for producing aluminum anodic oxide film having high withstand voltage and excellent productivity | |
| CN109016196A (en) | A kind of electroplating diamond wire saw | |
| CN103993344A (en) | Method for manufacturing electroplating diamond grinding wheel | |
| CN105386100A (en) | Method for electroplating copper and sliver on iron-nickel alloy frame | |
| CN104087985A (en) | Copper coating method of metal part | |
| CN106086968A (en) | A kind of electroplating technology of IGBT molybdenio plate surface-coated noble metal | |
| CN113604846A (en) | Surface treatment process for integrated circuit lead frame | |
| CN103498157A (en) | Method for preparing silvered layer on 4J34 fe-ni-co ceramic sealing alloy | |
| CN110468400A (en) | A kind of aluminum alloy surface environmental protection passivating method | |
| KR102204664B1 (en) | Nano passivation treatment method of reel-to-reel metal plate and processed products, and metal plate and processed products manufactured accordingly | |
| CN113843462B (en) | Method for improving wire cutting efficiency of semiconductor electric discharge machine by using electroless plating process | |
| CN110582166B (en) | Ceramic plate processing method combining DBC and DPC and ceramic substrate | |
| KR101756690B1 (en) | Anodizing method for imparting the current performance | |
| CN113285003B (en) | Method for manufacturing LED support and LED support | |
| KR100481950B1 (en) | An electrode wire production method for a graphite coating discharge processing | |
| CN105463544A (en) | Electroplating method for iron-made frame | |
| KR100460699B1 (en) | An electrode production method for a coating wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |