KR102206395B9 - Plating apparatus having individual partition - Google Patents

Plating apparatus having individual partition

Info

Publication number
KR102206395B9
KR102206395B9 KR1020200080189A KR20200080189A KR102206395B9 KR 102206395 B9 KR102206395 B9 KR 102206395B9 KR 1020200080189 A KR1020200080189 A KR 1020200080189A KR 20200080189 A KR20200080189 A KR 20200080189A KR 102206395 B9 KR102206395 B9 KR 102206395B9
Authority
KR
South Korea
Prior art keywords
plating apparatus
individual partition
partition
individual
plating
Prior art date
Application number
KR1020200080189A
Other languages
Korean (ko)
Other versions
KR102206395B1 (en
Inventor
배민수
Original Assignee
(주)네오피엠씨
배민수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)네오피엠씨, 배민수 filed Critical (주)네오피엠씨
Priority to KR1020200080189A priority Critical patent/KR102206395B1/en
Priority to TW109146732A priority patent/TWI769643B/en
Priority to CN202011613416.2A priority patent/CN113943968A/en
Application granted granted Critical
Publication of KR102206395B1 publication Critical patent/KR102206395B1/en
Publication of KR102206395B9 publication Critical patent/KR102206395B9/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020200080189A 2020-06-30 2020-06-30 Plating apparatus having individual partition KR102206395B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200080189A KR102206395B1 (en) 2020-06-30 2020-06-30 Plating apparatus having individual partition
TW109146732A TWI769643B (en) 2020-06-30 2020-12-29 A plating apparatus having individual partitions
CN202011613416.2A CN113943968A (en) 2020-06-30 2020-12-30 Electroplating apparatus with individual partitions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200080189A KR102206395B1 (en) 2020-06-30 2020-06-30 Plating apparatus having individual partition

Publications (2)

Publication Number Publication Date
KR102206395B1 KR102206395B1 (en) 2021-01-25
KR102206395B9 true KR102206395B9 (en) 2022-04-11

Family

ID=74237948

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200080189A KR102206395B1 (en) 2020-06-30 2020-06-30 Plating apparatus having individual partition

Country Status (3)

Country Link
KR (1) KR102206395B1 (en)
CN (1) CN113943968A (en)
TW (1) TWI769643B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539671B2 (en) * 1988-08-19 1996-10-02 株式会社中央製作所 Power supply device in plating tank
JP3523555B2 (en) * 2000-02-28 2004-04-26 古河電気工業株式会社 Plating equipment
JP2006037134A (en) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd Current control method for continuous plating device of carrier system
KR20090049957A (en) * 2007-11-14 2009-05-19 삼성전기주식회사 Plating apparatus
JP5795514B2 (en) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 Continuous plating equipment
KR101300325B1 (en) * 2011-12-21 2013-08-28 삼성전기주식회사 Apparatus for plating substrate and control method thereof
CN204982125U (en) * 2015-08-24 2016-01-20 黄海 Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB
KR101859395B1 (en) 2017-10-18 2018-05-18 (주)네오피엠씨 Substrate plating apparatus

Also Published As

Publication number Publication date
TW202202664A (en) 2022-01-16
CN113943968A (en) 2022-01-18
KR102206395B1 (en) 2021-01-25
TWI769643B (en) 2022-07-01

Similar Documents

Publication Publication Date Title
SG11202001659PA (en) Plating apparatus
EP4119723A4 (en) Clothes-folding apparatus
KR101916350B9 (en) Vertical continuous plating apparatus
GB2594294B (en) Apparatus
SG10201913055SA (en) Peeling apparatus
GB201909538D0 (en) Deposition apparatus
KR102206395B9 (en) Plating apparatus having individual partition
GB202301888D0 (en) Partitions
GB202010930D0 (en) Partitions
GB202010920D0 (en) Breathwork apparatus
GB202004775D0 (en) Apparatus
SG11202004564XA (en) Enhanced nickel plating process
CA199763S (en) Tray partition
GB2615875B (en) Apparatus
GB2614950B (en) Apparatus
GB2613251B (en) Apparatus
GB2601388B (en) Apparatus
GB2589823B (en) Modular conduit-connector apparatus
GB202210418D0 (en) Towel time
GB202112578D0 (en) Refilling apparatus
GB202109686D0 (en) Refilling apparatus
GB202109693D0 (en) Refilling apparatus
GB202215819D0 (en) Apparatus
GB202116352D0 (en) Apparatus
GB202112073D0 (en) Apparatus

Legal Events

Date Code Title Description
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]