CN103046105A

CN103046105A - Plating apparatus

Info

Publication number: CN103046105A
Application number: CN2011104377889A
Authority: CN
Inventors: 柳达铉; 韩奉换; 罗钟声; 柳先重; 蔡星秉
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2011-10-13
Filing date: 2011-12-23
Publication date: 2013-04-17
Also published as: KR20130039834A

Abstract

The invention discloses a plating apparatus. The plating apparatus includes a plating groove accommodating plating liquid. A plurality of plating items are disposed in the plating liquid. The plating device also includes a plurality of anodes disposed on one surface or two surfaces oppositely of the plating items; a first shielding plate disposed between the plating item and the anode; and a second shielding board composed of a first part and a second part connected with the first part perpendicularly. The first part is disposed between the first shielding plate and the anode and the second part is disposed opposite to the tail end of the anode. The plating device can make the thickness of the plating layer on the surface of the plating items uniform and can improve the plating reliability and improving the quality of plated products.

Description

Electroplanting device

The cross reference of related application

The application requires right of priority that submit to, that be entitled as the korean patent application No.10-2011-0104441 of " electroplanting device (Plating Apparatus) " on October 13rd, 2011, and the full content of this application is introduced among the application with for referencial use.

Technical field

The present invention relates to a kind of electroplanting device.

Background technology

Plating can be used to protect metallic decoration or surface, and electroplates and to be used in the circuit that comprises electronic component, printed circuit board, semiconducter device and to form etc. various fields.

In plating, in the electro immersion plating liquid that is about to electroplate, and make simultaneously described electro will desired metal ion deposit to the surface of described electro as negative electrode and the metal that is used for galvanic deposit as anode by applying electric current, thereby formation plated film (plated film).

When described electro has conductivity, can directly implement to electroplate as negative electrode with described electro, but when described electro is made by insulating material such as circuit card, form the electroless plating electrolytic coating of the electrode serve as plating by electroless plating dectroless plating (electroless chemical plating) at insulating material, and implement to electroplate with the formation plated film as electrode with described electroless plating electrolytic coating.

Simultaneously, at Korean Patent Registration No.1993-0004073 electroplanting device of the prior art is disclosed.

Usually, with regard to the prior art electroplanting device, when in electro being put into plating tank (plating bath), electroplating, from the scattered metal ion of anode by galvanic deposit to described electro.In this case, current concentration is at the end of described electro, so that the end of described electro is arrived in the galvanic deposit of metal ion concentrated area, the result can not obtain uniform electroplating thickness owing to electroplate deviation.

Further, with regard to regard to the prior art electroplanting device, disposed electroplate liquid spray tube (plating solution ejecting pipe) and air agitator (air agitator) in the plating tank, and the volume of laying the parts of corresponding assembly has occupied very large space with respect to the cumulative volume of described plating tank.

That is, increased the volume of respective regions by the additional assembly of installing.

Form the current path from the anode to the electro in the zone that volume increases, and electroplating current concentrates on current path and adjoin on the electro of laying, cause the plating deviation.

Summary of the invention

The present invention is devoted to provide a kind of electroplanting device of even thickness of the electroplating surface that can make electro.

Further, the present invention is devoted to provide a kind of electroplanting device that can effectively stop at bulky area formation current path.

Preferred implementation according to the present invention provides a kind of electroplanting device, and described electroplanting device comprises: hold the plating tank of electroplate liquid, wherein, a plurality of electros are devoted in the described electroplate liquid; A surface or two a plurality of anodes that the surface is staggered relatively with each described a plurality of electro; The first shielding slab of between described electro and described anode, placing (shielding plate); And by first part and the secondary shielding plate that consists of with described first part second section connected vertically, wherein, described first part places between described the first shielding slab and described anode, and described second section and described anode is terminal staggered relatively.

In this article, described the first shielding slab can separate placement to cover the periphery of described electro with described electro with described anode.

Described the first shielding slab can comprise the opening portion (opening portion) that is used for exposing described electro of formation, and the area of described opening portion can be less than the area of described electro.

Described the first shielding slab can separate placement with the bottom of described plating tank, and described the first shielding slab can separate placement with the input district (input section) of described plating tank.

The part of described the first shielding slab of facing with bottom and the described input district of described plating tank can be opening.

Described secondary shielding plate can be bent to '

' shape.

Described secondary shielding plate can separate placement with described anode with described the first shielding slab.

Described electro can be printed circuit board (PCB).

Described anode can comprise the anode basket (anode basket) of throwing in plated metal, and described plated metal can be selected from the group by copper (Cu), nickel (Ni), tin (Sn), silver (Ag), platinum (Pt), gold (Au), zinc (Zn) and their compositions of mixtures thereof.

Described electroplanting device may further include electroplate liquid source of supply (supplier) and described electroplate liquid source of supply that described electroplate liquid is fed in the described plating tank and can comprise: the delivery pipe with a plurality of holes of the described electroplate liquid of discharging; And the two ends that connect described delivery pipe are to supply the supply pipe of described electroplate liquid.

Described electroplanting device may further include the agitator be used to the injection air of the described electroplate liquid that circulates.

Description of drawings

Fig. 1 has shown the structure skeleton view of the electroplanting device of a preferred embodiment of the invention;

Fig. 2 has shown the structure skeleton view according to the electroplanting device of another kind of preferred implementation of the present invention;

Fig. 3 has shown the sketch of the current concentration degree on the electro of a preferred embodiment of the invention in rendering to electroplanting device; And

Fig. 4 has shown the sketch according to the current concentration degree on the electro of another kind of preferred implementation of the present invention in rendering to electroplanting device.

Embodiment

Description below in conjunction with accompanying drawing will make various characteristics and advantages of the present invention become more apparent.

Employed term and word not should be understood to be confined to the definition on common implication and the dictionary in specification sheets of the present invention and claims, can suitably define the concept that is hinted by term and be construed as based on the contriver, to describe best the principle of his or she the known enforcement best approach of the present invention, these terms are construed as with word has the meaning and the concept relevant with technical scope of the present invention.

Below in conjunction with the detailed description of accompanying drawing above-mentioned and other viewpoint, characteristics and advantages of the present invention become is easier to understand.In this manual, should be noted in the discussion above that in the reference number of the different assemblies that increase in the accompanying drawings, even the assembly of reference shows that in different figure identical reference number represents identical assembly.The term that uses in specification sheets " first ", " second " etc. can be used in describes various assemblies, but described assembly is not limited by above-mentioned term.Described term only is used to distinguish an assembly and another assembly.Further, in description of the invention, the detailed description of relevant well-known functions or configuration is omitted in order to avoid cover purport of the present invention.Further, when determining that the detailed description of knowing the field related to the present invention may be covered spirit of the present invention, this detailed description will be omitted.

In this article, describe preferred implementation of the present invention in detail in connection with accompanying drawing.

Preferred implementation 1

Fig. 1 has shown the structure skeleton view according to the electroplanting device of typical embodiment of the present invention.Fig. 3 has shown the sketch according to the current concentration degree on the electro of typical embodiment of the present invention in rendering to electroplanting device.

Referring to Fig. 1, electroplanting device 100 comprises plating tank 110, anode 120, the first shielding slab 130 and secondary shielding plate 140 according to the preferred embodiment of the present invention.

Hold in the described plating tank 110 and electroplate needed electroplate liquid, and described plating tank 110 can have the size of holding simultaneously a plurality of electros 300.

In a preferred embodiment, described electro 300 can be printed circuit board (PCB), but specifically is not defined in this, and described electro 300 can be board-like electro such as galvanized steel sheet, silicon chip (silicon wafer) etc.

The electroplate liquid source of supply (not showing) of supply electroplate liquid can be provided in the described plating tank 110.Described electroplate liquid source of supply (not showing) can comprise the delivery pipe (not showing) in a plurality of holes with the described electroplate liquid of discharging, and the supply pipe (do not show) of two ends to supply described electroplate liquid that connects described delivery pipe (not having to show).

In this article, stirring described electroplate liquid by delivery pipe (not showing) stops up to prevent described electroplate liquid.

Further, described electroplate liquid can overflow or discharges by the suction unit (suction) that is used for recirculation from described plating tank 110.

Described plating tank 110 may further include the agitator (not showing) that described electroplate liquid circulation is entered into described electroplate liquid by injection air.

In Fig. 1, described electroplate liquid source of supply (not show) and described agitator (not showing) do not show, but described electroplate liquid source of supply (not have demonstration) and described agitator (not having demonstration) can be placed on the optional position of bottom, top and sidepiece of described plating tank.

In this case, the assembly that adds except described electroplate liquid source of supply (do not have show) and described agitator (not have demonstration) also can be placed in the described plating tank, and the volume of placing the zone of described additional assembly may increase.

With described anode 120 and described a plurality of electro 300 staggered relatively with the metal ion that allows from described anode 120, to discharge (loosen) easily by galvanic deposit to described electro 300.

In a preferred embodiment, as shown in Figure 1, it is staggered relatively that described anode 120 has cylinder form and described a plurality of anode 120 and an electro 300, but specifically be not defined in this.

For example, described anode 120 can the rectangular cylinder form of tool and an anode 120 can be staggered relatively with an electro 300.

In a preferred embodiment, described anode 120 can comprise anode basket (not showing) and plated metal is rendered in the described anode basket.

Described anode basket (not showing) can have holey and easily be discharged with the described metal ion that allows to discharge from described plated metal, but specifically is not defined in this.

Further, described plated metal can have spherical, but specifically is not defined in this.

In this article, described plated metal is as can being pure metal or alloy by the metal of galvanic deposit on described electro 300.

In a preferred embodiment, described plated metal can be selected from the group by copper (Cu), nickel (Ni), tin (Sn), silver (Ag), platinum (Pt), gold (Au), zinc (Zn) and their compositions of mixtures, but specifically is not defined in this.

In Fig. 1, described anode 120 is placed on each surface on two surfaces of described electro 300, but specifically be not defined in this, and for the only electroplating surface with described electro 300, described anode 120 can be only with corresponding surperficial staggered relatively.

On rectifier is connected to such as anode 120 as described in the above-mentioned placement and be connected to as on the electro 300 as described in the negative electrode, and when described anode 120 and described electro 300 apply electric current, the plated metal of described anode 120 is by electrolysis, and the metal ion of described plated metal is released in the described electroplate liquid and electronics moves to described negative electrode by rectifier.

The described metal ion that is discharged in the described electroplate liquid moves to described negative electrode, and to combine with described electro 300 lip-deep electronics, the result realizes electroplating.

Described the first shielding slab 130 can be placed between described electro 300 and the described anode 120.

In this case, described the first shielding slab 130 can separate placement with described anode 120 with described electro, covers simultaneously the periphery of a plurality of electros 300.

Namely, as shown in Figure 1, described the first shielding slab 130 can be the rectangle column with hollow space, and described a plurality of electro 300 is placed in the described hollow space, and described anode 120 can be along the peripheral separated placement of described the first shielding slab 130.

Further, in a preferred embodiment, described the first shielding slab 130 can comprise the opening portion 135 that forms for exposing described electro 300 as shown in Figure 1.

In this case, the area of described opening portion 135 can be less than the area of described electro 300, but specifically is not defined in this.

That is, as shown in Figure 1, described the first shielding slab 130 covers the periphery of described electro 300, and can come out by opening portion 135 in the inside of described electro 300.

The reason that so arranges is to correspond to by covering edge and the terminal peripheral portion of described electro 300, prevents that electroplating thickness from increasing because of edge and the end of current concentration at described electro 300.

Further, in a preferred embodiment, can open right zone and the zone of facing with input district described plating tank 110 described the first shielding slab 130 of the bottom faces with described plating tank 110 of described the first shielding slab 130.

Reason is that described electroplate liquid is circulated glibly, and corresponding zone can open or partially open fully.

Further, in a preferred embodiment, described the first shielding slab 130 can be placed to as shown in Figure 1 with the bottom of described plating tank 110 and throw in distinguish from, but specifically be not defined in this.

Described secondary shielding plate 140 can form by the 140a of first part with the described 140a of first part second section 140b connected vertically as shown in Figure 1, but specifically is not defined in this.

In this case, the described 140a of first part of described secondary shielding plate 140 can place between described the first shielding slab 130 and described anode 120, and the described second section 140b of described secondary shielding plate 140 can with the terminal surface of described anode 120 to placing.

That is, referring to Fig. 1, described secondary shielding plate 140 is bent to

Shape, and

' | ' part can between described the first shielding slab 130 and described anode 120, place, and

' _ ' part can with the end (bottom of described anode 120 as shown in Figure 1) of described anode 120 in the face of placing.

For example, although in Fig. 1, do not show, in a preferred embodiment additional assembly as described electroplate liquid source of supply (not have to show) and described agitator (not having demonstration) be placed on the bottom of described plating tank 110, the volume of bottom of placing the described plating tank 110 of described additional assembly can be greater than the volume on described plating tank 110 tops.

That is, the bottom that described additional assembly is installed in described plating tank 110 with between the electro 300 that increases described plating tank 110 inner bottom parts and described input apart from d1, the result, the volume of the bottom of described plating tank 110 increases.

As mentioned above, as shown in Figure 1 when the volume of the bottom of described plating tank 110 increases, the current path that forms to the lower end of described electro 300 from the bottom of described anode 120 increases.When described current path increased, the electric current that concentrates on the lower end of described electro 300 increased, the result, and the electroplating thickness of described corresponding part also increases.

Therefore, in a preferred embodiment, the first shielding slab 130 is provided, and between the additional bottom that is placed on described the first shielding slab 130 and described anode 120 of the secondary shielding plate 140 with shape described above stoping the lower end from the bottom of described anode 120 to described electro 300 to form current path, thereby reduce the electric current A of the lower end that concentrates on as shown in Figure 3 described electro 300.

As mentioned above, concentrate on the electric current of the lower end of electro 300 by reduction, the thickness of electrolytic coating that can prevent from being formed on the lower end of described electro 300 increases, and the result can obtain to have the described electro 300 of uniform electroplating thickness.

Preferred implementation 2

Fig. 2 has shown the structure skeleton view according to the electroplanting device of the typical embodiment of another kind of the present invention.Fig. 4 has shown the sketch of the current concentration degree on the electro of the typical embodiment of another kind according to the present invention in rendering to electroplanting device.

In a preferred embodiment, the assembly identical with preferred implementation 1 will no longer be described and identical reference number will refer to identical parts.

Referring to Fig. 2, electroplanting device 200 comprises such as the plating tank 110 in the preferred implementation 1, anode 120, the first shielding slab 130 and secondary shielding plate 140 according to the preferred embodiment of the present invention.

Although not concrete demonstration in Fig. 2, but in a preferred embodiment, electroplate liquid source of supply (not have to show) and described agitator (not having demonstration) are placed on the bottom of described plating tank 110 but top to additional assembly unlike preferred implementation 1 as described.

For example, as shown in Figure 2, when described additional assembly is placed on the top of described plating tank 110, it is the input district of described electro 300, from the input district of described plating tank 110 to increasing apart from d2 the upper end of described electro 300, as a result, the volume on the top of described plating tank 110 increases.

Along with the volume on the top of described plating tank 110 increases, the current path that forms to the upper end of described electro 300 from the top of described anode 120 as shown in Figure 2 increases, the result, the electric current that concentrates on the upper end of described electro 300 increases, in addition, the electroplating thickness of described corresponding section also increases.

Therefore, in this preferred implementation, the first shielding slab 130 is provided, and between the additional top that is placed on described the first shielding slab 130 and described anode 120 of the secondary shielding plate 140 that has in preferred implementation 1 shape of describing stoping the upper end from the top of described anode 120 to described electro 300 to form current path, thereby reduce the electric current B of the upper end that concentrates on as shown in Figure 4 described electro 300.

As mentioned above, concentrate on the electric current of the upper end of electro 300 by reduction, the thickness of electrolytic coating that can prevent from being formed on the upper end of described electro 300 increases, and the result can obtain to have the described electro 300 of uniform electroplating thickness.

In a preferred embodiment, the structure that described secondary shielding plate 140 is placed on bottom or the top of described plating tank 110 has been described, but specifically be not defined in this, and apparent, because the increase of described plating tank 110 volumes, described secondary shielding plate 140 can optionally be placed on the zone that described current path increases.

For example, by add-on assemble is installed in the both sides of described plating tank 110 (not being top or the bottom at described plating tank 110), the volume of the both sides of described plating tank 110 increases, and therefore, described secondary shielding plate 140 is placed on the corresponding position forms to prevent described current path.

According to preferred implementation of the present invention, by the additional shielding slab that covers the anode that is arranged in the zone with comparatively large vol of installing in plating tank, the current path that prevention can enlarge the zone with comparatively large vol is to prevent that current concentration is on the electro that adjoins mutually with the zone with comparatively large vol.

Further, to prevent current concentration on the electro that adjoins, therefore, form the electrolytic coating with uniform thickness on the surface of described electro by the additional shielding slab that the described anode of covering is installed.

As mentioned above, form the described electrolytic coating with uniform thickness by the surface at described electro, can improve the reliability of plating and can make high-quality plated item.

Although disclose for illustrative purposes preferred implementation of the present invention, but electroplanting device according to the present invention is not limited to this, and those skilled in the art are to be understood that, in not departing from the claims of enclosing in the situation of disclosed scope and spirit of the present invention, various modifications, to replenish and replace all be possible.

Therefore, these modifications, replenish and replace also to be construed as and belong to scope of the present invention.

Claims

1. electroplanting device, described electroplanting device comprises:

The plating tank that holds electroplate liquid, wherein, a plurality of electros are devoted in the described electroplate liquid;

A surface or two a plurality of anodes that the surface is staggered relatively with each described a plurality of electro;

The first shielding slab of between described electro and described anode, placing; And

By first part and the secondary shielding plate that consists of with described first part second section connected vertically, wherein, described first part places between described the first shielding slab and described anode, and described second section and described anode is terminal staggered relatively.

2. electroplanting device according to claim 1, wherein, described the first shielding slab separates placement with described electro with described anode, to cover the periphery of described electro.

3. electroplanting device according to claim 2, wherein, described the first shielding slab is included as the opening portion that exposes described electro and form.

4. electroplanting device according to claim 3, wherein, the area of described opening portion is less than the area of described electro.

5. electroplanting device according to claim 1, wherein, described the first shielding slab separates placement with the bottom of described plating tank.

6. electroplanting device according to claim 1, wherein, the input of described the first shielding slab and described plating tank is distinguished from placement.

7. electroplanting device according to claim 1, wherein, the zone that described the first shielding slab and bottom faces described plating tank are right and with zone that described input district faces be opening.

8. electroplanting device according to claim 1, wherein, described secondary shielding plate be bent to ' ' shape.

9. electroplanting device according to claim 1, wherein, described secondary shielding plate separates placement with described the first shielding slab with described anode.

10. electroplanting device according to claim 1, wherein, described electro is printed circuit board.

11. electroplanting device according to claim 1, wherein, described anode comprises the anode basket of throwing in plated metal.

12. electroplanting device according to claim 11, wherein, described plated metal is selected from the group by Cu, Ni, Sn, Ag, Pt, Au, Zn and their compositions of mixtures.

13. electroplanting device according to claim 1, described electroplanting device further comprise described electroplate liquid is fed to electroplate liquid source of supply in the described plating tank.

14. electroplanting device according to claim 13, wherein, described electroplate liquid source of supply comprises:

Delivery pipe with a plurality of holes of the described electroplate liquid of discharging; And

Connect the two ends of described delivery pipe to supply the supply pipe of described electroplate liquid.

15. electroplanting device according to claim 1, described electroplanting device further comprises the agitator be used to the injection air of the described electroplate liquid that circulates.