201022481 六、發明說明： 【發明所屬之技術領域】 本發明係關於遮蔽板及電解電鍍裝置。 【先前技術】 印刷電路板（Printed Circuit Board ; PCB)，係基於電 子零件相互間之電配線的電路設計而在絕緣基板上形成導 體的印刷配線板。通常，印刷電路板，係在酚樹脂絕緣板 • 或環氧樹脂絕緣板等的表面上，對應配線圖案來構成必要 的銅箔電路’使得可在其上面密集地裝載1C、電容器、電 阻等各種電子零件的絕緣平板。為了在絕緣板上形成銅箔 電路’需要反覆進行數次的電解電鍍。此時，基板内的電 鍍厚度’被要求形成均勻。 參照第1圖，係顯示根據習知技術用以在印刷電路板上 進行電鍍所使用的電解電鍍槽的刳面。通過歧管4,將電鍍 液供應至電鍍槽1内，於是陽極2(正極）與被電鍍物也就是 • 基板3(負極（陰極））會被浸入電鍍液中，若在兩電極間通 電，則使所供應的金屬離子因為電場而從陽極2移動至基 板3 〇 為了使電鍍厚度均勻，首先，必須使在被電鍍物也就是 基板的表面周圍之電鍍金屬的離子濃度，維持在一定水準 以上。 其次，必須維持電流密度均勻。若電流密度變高，則電 鍍速度加快，對應於基板位置，會形成不同的電鍍厚度。 電鍍槽内的電力線，雖然在基板中心部份，於垂直或平行 3 201022481 於基板與陽極2的方向上，其密度幾乎均勻但是在美 周圍部份，係因為邊緣效應（edge effect)而有電力線二= 的傾向。因此，與基板中心部份a . „ , Α 、 I抝相比，在基板邊緣部份之 電鑛的成長速度比較快’結果會右太其纪田 不f有在基板周圍部份的電 厚度較厚這樣的問題。 ^ 為了使電流密度均勻，如第i圖所示，雖然有在陽極2 與基板3之間設置用於遮蔽基板的邊緣部份之遮蔽板5，以 妨礙朝向基板周圍部份的電鍍的方法，但是，此方法會妨 ® 礙電鍍液的流動而在遮蔽物所遮蔽的部分A造成電鍍液的 停滯’並使得維持電鍍液的一定濃度變得困難。 【發明内容】 [發明所欲解決之問題] 為了解決此習知技術的問題點，本發明之目的在於提供可 使電鑛液的流動順暢且使電流密度均勻之遮蔽板及使用此 遮蔽板之電解電鍍裝置。 [解決問題之技術手段] 若依照本發明之一實施型態，提供一種遮蔽板，其特徵 在於包含：在電解電鍍時’遮斷電力線的一板狀物；及被 形成在板狀物上的複數個蜂巢狀（honeyc〇mb)的孔。此時， 可使用其中央形成有開口部分之框狀的四角形板材來作為 該板狀物。 若依照本發明之另一實施型態，提供一種電解電鍍裝 置’係用於電鍍基板的電解電鍍裝置，其包含：一用於收 201022481 谷電鑛液之電錢槽；一用於將電鍍液供應至電鍍槽中之歧 管，一被配置在電鍍槽中之陽極；一位於與陽極相對的位 置，並用於固定基板之陰極；一電連接至陽極與陰極之電 源部分；以及一形成有複數個蜂巢狀的孔之遮蔽板，其存 在"於陰極與陽極之間，並用來使電流密度均勻。 可使用其中央形成有開口部分之框狀的四角形板材來 作為該遮蔽板。歧管係由陽極朝向基板喷射電鍍液，也可 使用網目狀（mesh)之物來作為陽極，特別是陽極也可以是 在網目狀的籃籠（basket)中收容有金屬球的形狀。 [功效] 若依照本發明的實施型態，可使用多孔性蜂巢結構來製 造遮蔽板，以獲得可使電流密度均勻化之遮蔽效果，且提 高電解液的流動效率。 再者，上述發明的概要，並非列舉本發明的全部的必要 特徵者。此外，該些特徵群的子組合亦可作為發明。 【實施方式】 本發明可施加各種修改而具有各種實施例，故本申請案 僅將特定實施例以圖式舉例並詳細說明。但是，此不代表 本發明受限於該等特定實施例，應理解本發明亦涵蓋包含 有本發明的思想與技術範圍之所有的變化、均等物及替代 物。於說明本發明之時，若判斷對於習知技術的具體說明 反而會造成本發明的主旨不明的場合，則省略該處之詳細 201022481 說明。 限定本:：ί所使用的用語’僅用於說明特定的實施例而非 發明者。單數的表示’只要在文中沒有明罐的表示， '’、了包含複數的表示。請理解’於本申請中，「 η!」等用語’係指定在說明書上所記載的特徵、數 階奴、動作、構成要素、零件或該等之 構成要素、零件或該等之組合的存在或追加的可能性。 以下’將參照附圖詳細地說明依據本發明之遮蔽板及電 ==置的較佳實施例。於說明本發明之時，對於相同 的構成要素’標上相同的圖式符號，以省略對此的 S復說明。 第2圖係顯示依據本發明之一實施型態的遮蔽板之一 實施例的平面圖，顯示用於遮斷電力線的-板狀物53及形 成在該板狀物53上之複數個蜂巢構造的六角形孔 通常因為在基板的邊緣部份會被進行較多的電鎮，所以 板狀物53的形狀，係如第2圃裕- 第2圖所不，以僅遮蔽基板的邊緣 部：為㈣’係於中央形成有大開口部分之框狀的形狀。 但是，依據場合，亦有Α邊链丨v AL k Α 有在邊緣料的部分形成高電流密度 的情況’在此種場合下，只要使用_種板狀物即可，該板 狀物的形狀可遮蔽會形成高電流密度的部分。 為了確保上述電液的油叙祕 , 夜的流動性，本發明的遮蔽板50， 係在板狀物53上形成有藉怒棚 取男複數個/、角形的孔而成的蜂巢狀。 因為即使在板狀物53上形成孔55，仍有遮斷電力線的效 6 201022481 果’所以與沒有使用遮蔽板50的場合相比，被遮蔽板5〇 所遮蔽的部分’其電流密度降低。 又，因為電锻液可通過孔55，所以可解決習知技術的 問題點也就是電鍍液體停滯的問題。特別是，若孔55的形 狀為蜂巢構造的六角形’則具有使流體流動均勻的效果。 此係因為電鍵液通過蜂巢構造時’流速的降低被最小化， 且在通過方向以外的方向’藉由空間的限制而可減少亂 流，所以通過蜂巢狀後的電鍍液的流動會成為均勻。因此， _ 蜂巢構造的孔55，比一般的孔更具有將電鍍液的濃度維持 一定的效果。 電鍵液通過蜂巢構造的孔55的方向的厚度，亦即板狀 物53的厚度，雖然越厚越具有減少亂流的效果，但是由於 會減少流速，所以孔55的尺寸、數量及板狀物53的厚度， 只要因應需要而改變即可。例如，若分散電流密度係比較 重要的場合’則減少孔55的數量及尺寸，若確保電鑛液的 流動性係比較重要的場合，則可增加孔5 5的尺寸。 第3圖係顯示依據本發明之另一實施型態的電解電錄 裝置之一實施例的斜視圖，顯示電鍍槽1〇、陽極2〇、陰極 30、基板35、歧管40、遮蔽板50以及電源部分6〇。 電鍍槽10 ’係收容有電鍍液的水槽，並收容陽極2〇以 及陰極30。 陰極30 ’係連接至電鍍對象物也就是基板35，被配置 於與陽極20相對的位置。於基板35的要被電鍍的部分， 形成金屬層，該金屬層與陰極3〇電連接。 201022481 陽極20 ’係位於與基板35(已連接於陰極3〇)相對的位 置’由要電鍍在基板35上的金屬物質所構成。一旦電流流 動’則構成陽極20的金屬離子被分離至電鍍液中並形成電 %特別疋，如第3圖所示，若陽極2 0係網目構造則有助 於電鍍液的流動，且可增加電鍍液與陽極2〇的接觸面積並 提高電鍵的效率。 電源部分60電連接至陽極20及陰極30，藉由來自電 源σ卩分60的電流之流動，可將陽極2〇的金屬電鍵在已連 ❿接於陰極30上之基板35的表面。 歧管40，係將電鑛液供應至電鍵槽中的裝置，雖然以 往是被配置在電鍍槽的下部，但是如第3圖所示，可藉由 配置在側面並從陽極2〇朝向基板喷射電鍍液，以提高電鍍 效率並將電鍍液體的濃度維持一定。使用從陽極2〇朝向基 板，亦即朝向陰極30方向喷射之歧管4〇的場合，係在陽 極20形成可使電鍍液通過的開口部分，特別是以網目型態 為佳。 ❹ 遮蔽板50，係存在介於基板35與陽極20之間，如上 述般，係形成有複數個蜂巢狀的孔55〇從陰極3〇來看時， 遮蔽板50係被配置成可遮蔽基板35上的要被形成厚電鍍 層的部分’來遮斷電力線，藉此來防止特定部份的電流密 度形成過高。通常，因為在基板35的邊緣部份所形成的電 流密度較高，所以如第3圖所示，為了遮蔽基板扣的邊緣 部伤，也可形成四角形的框狀。關於遮蔽板5〇，如上所述， 省略詳細說明。 201022481 第4圖係顯示依據本發明之另一實施型態的電解電鑛 裝置之另-實施例的斜視圖，顯示電鑛槽1〇、陽極託、藍 籠26、金屬球27、陰極30、基板35、歧管4〇以及遮蔽板 50 〇 本實施例的陽極25,與上述實施例的陽極2〇的形狀相 異；本實施例的陽極25，係在網目狀的籃籠26中收容由電 鍍金屬所形成的金屬球27,而藉由更換金屬球27便可持續 使用陽極25。因為藍籠26係網目構造，與上述相同具有良 #好的電鐘液的流動性。籃籠26的形狀係不受限於第4圖所 示的柱狀，也可形成平板狀等而作多種的變化❶ 電源部分60,可連接至各個陽極25，但是為了圖式方 便，僅以連接至一個電極25來圖示。 如上述，利用將遮蔽板50製作為多孔性的蜂巢構造， 可得到電流密度均勻的遮蔽效果，且提高電鍍液的流動效 率β _ 以上，雖然已使用本發明的實施型態來進行說明，但是 本發明的技術範圍並不受限於上述實施型態所記載的範 圍。相關業者顯然可對上述實施型態施加多種變化或改 良即使疋此種已施加有變化或改良的型態亦可包含在本 發明的技術範圍中一事，根據申請專利範圍的記載，可明 .確得知。 申請專利範圍、說明書及圖式中所示的裝置以及方法中 的動作、順序、階段與製程等的各處理的實行順序，只要 沒有明示「之前」及「先進行」等，並且沒有將先前的處 201022481 理的輸出’使用於後面的處理中的情況’料以任意的順 序來實現。關於申請專利範圍、說明書及圖式中的動作流 程’雖然為了方便而以「首先」及「其次」等來進行說明， 但是並不代表必須以此順序來實施。 【圖式簡單說明】 第1圖係顯示依據習知技術之電解電疲裝置的圖。 第2圖係顯示依據本發明之一實施型態的遮蔽板之一 ® 實施例的平面圖。 第3圖係顯示依據本發明之另一實施型態的電解電鍍 裝置之一實施例的斜視圖。 第4圖係顯示依據本發明之另一實施型態的電解電鍍 裝置之另一實施例的斜視圖。 27 金屬球 30 陰極 35 _基板 40 歧管 50 遮蔽板 53 板狀物 55 蜂巢構造的孔 60 電源部分 A 部分 【主要元件符號說明 1 電鍍槽 2陽極 3 基板（陰極） 4 歧管 - 5 遮蔽板 10電鍍槽 20 陽極 25陽極 26籃籠201022481 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a shielding plate and an electrolytic plating apparatus. [Prior Art] A printed circuit board (PCB) is a printed wiring board in which a conductor is formed on an insulating substrate based on a circuit design of electrical wiring between electronic components. In general, a printed circuit board is formed on a surface of a phenol resin insulating board or an epoxy resin insulating board, and a necessary copper foil circuit is formed corresponding to a wiring pattern so that various types of capacitors, capacitors, resistors, and the like can be densely loaded thereon. Insulating plate for electronic parts. In order to form a copper foil circuit on an insulating plate, it is necessary to perform electrolytic plating several times. At this time, the plating thickness ' in the substrate is required to be uniform. Referring to Fig. 1, there is shown a face of an electrolytic plating bath used for electroplating on a printed circuit board according to the prior art. The plating solution is supplied to the plating bath 1 through the manifold 4, so that the anode 2 (positive electrode) and the object to be plated, that is, the substrate 3 (negative electrode (cathode)), are immersed in the plating solution, and if the electrodes are energized, Then, the supplied metal ions are moved from the anode 2 to the substrate 3 due to the electric field. In order to make the plating thickness uniform, first, it is necessary to maintain the ion concentration of the plating metal around the surface of the object to be plated, that is, the substrate, above a certain level. . Second, it is necessary to maintain a uniform current density. If the current density becomes higher, the plating speed is increased, and different plating thicknesses are formed corresponding to the substrate position. The power line in the plating bath, although in the center of the substrate, in the direction of the substrate and the anode 2 in the vertical or parallel 3 201022481, the density is almost uniform but in the surrounding part, there is a power line due to the edge effect. The tendency of two =. Therefore, compared with the central portion of the substrate a. „ , Α , I , , the growth rate of the electric ore at the edge of the substrate is relatively fast 'the result will be right too, the field is not the thickness of the part around the substrate Thicker such problem. ^ In order to make the current density uniform, as shown in Fig. i, there is a shielding plate 5 for shielding the edge portion of the substrate between the anode 2 and the substrate 3 to hinder the peripheral portion of the substrate. The method of plating, however, this method may hinder the flow of the plating solution and cause the stagnation of the plating solution in the portion A shielded by the shield and make it difficult to maintain a certain concentration of the plating solution. DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION In order to solve the problems of the prior art, it is an object of the present invention to provide a shielding plate which can smooth the flow of electric mineral liquid and make the current density uniform, and an electrolytic plating apparatus using the same. Means for Solving the Problem] According to an embodiment of the present invention, a shielding plate is provided, comprising: a plate that cuts off a power line during electrolytic plating; and is formed on a plate a plurality of honeycomb-shaped holes in the object. At this time, a square-shaped plate having a frame shape in which an opening portion is formed in the center may be used as the plate. According to another embodiment of the present invention, An electrolytic plating apparatus is provided as an electrolytic plating apparatus for plating a substrate, comprising: a electric money tank for receiving 201022481 valley electric mineral liquid; and a manifold for supplying the plating liquid to the plating tank, An anode disposed in the plating bath; a cathode located opposite the anode and configured to fix the substrate; a power supply portion electrically connected to the anode and the cathode; and a shielding plate formed with a plurality of honeycomb-shaped holes, the presence thereof " between the cathode and the anode, and used to make the current density uniform. A square-shaped plate having a frame portion having an opening portion formed in the center may be used as the shielding plate. The manifold is sprayed with the anode toward the substrate, and may also be used. A mesh object is used as the anode, and in particular, the anode may have a shape in which a metal ball is accommodated in a mesh-shaped basket. [Effect] According to the present invention In an embodiment, the shielding plate can be manufactured using a porous honeycomb structure to obtain a shielding effect that uniformizes the current density, and the flow efficiency of the electrolytic solution is improved. Furthermore, the summary of the above invention does not enumerate all of the present invention. In addition, the sub-combinations of the feature groups can also be used as the invention. [Embodiment] The present invention can be applied with various modifications and various embodiments, and the present application only exemplifies and details the specific embodiments. However, the present invention is not limited to the specific embodiments, and it is understood that the invention also encompasses all variations, equivalents, and alternatives. If it is judged that the specific description of the prior art may cause the gist of the present invention to be unclear, the detailed description of 201022481 will be omitted. The term "definite" is used to describe a particular embodiment and not the inventor. The singular expression 'as long as there is no representation of the can in the text, '', includes a plural number. Please understand that 'in this application, the terms 'η!' are used to specify the characteristics, numerical slaves, actions, constituent elements, parts, or constituents, parts, or combinations of such combinations described in the specification. Or the possibility of appending. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the shielding plate and the electric device according to the present invention will be described in detail with reference to the accompanying drawings. In the description of the present invention, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted. 2 is a plan view showing an embodiment of a shielding plate according to an embodiment of the present invention, showing a plate 53 for interrupting a power line and a plurality of honeycomb structures formed on the plate 53 Since the hexagonal hole is usually subjected to a large number of electric gates at the edge portion of the substrate, the shape of the plate 53 is as shown in the second sheet - the second sheet is not shielded to cover only the edge portion of the substrate: (4) A shape in which a frame having a large opening portion is formed in the center. However, depending on the occasion, there is also a case where the edge chain 丨v AL k Α has a high current density in the portion of the edge material. In this case, the shape of the plate may be used as long as the slab is used. It can mask portions that form high current densities. In order to secure the oil narration of the electro-hydraulic liquid and the fluidity of the night, the shielding plate 50 of the present invention is formed in a honeycomb shape in which a plurality of male or female holes are taken from the shack. Since the hole 55 is formed in the plate member 53, the power line is cut off. Therefore, the current density of the portion shielded by the shield plate 5 is lower than that in the case where the shield plate 50 is not used. Further, since the electric forging liquid can pass through the hole 55, the problem of the prior art can be solved, that is, the problem of stagnant plating liquid. In particular, if the shape of the hole 55 is a hexagonal shape of a honeycomb structure, there is an effect of making the fluid flow uniform. This is because the flow rate of the key fluid is minimized by the honeycomb structure, and the turbulence can be reduced by the space limitation in the direction other than the direction of the passage, so that the flow of the plating solution after the honeycomb is uniform. Therefore, the hole 55 of the honeycomb structure has an effect of maintaining a constant concentration of the plating solution than a normal hole. The thickness of the electric button fluid in the direction of the hole 55 of the honeycomb structure, that is, the thickness of the plate 53 is thicker, and the thicker the effect of reducing the turbulence, the size, the number, and the plate of the hole 55 are reduced because the flow rate is reduced. The thickness of 53 can be changed as needed. For example, if the dispersion current density is important, the number and size of the holes 55 are reduced. If the fluidity of the electric ore is important, the size of the holes 55 can be increased. 3 is a perspective view showing an embodiment of an electrolytic lithography apparatus according to another embodiment of the present invention, showing a plating tank 1 阳极, an anode 2 〇, a cathode 30, a substrate 35, a manifold 40, and a shielding plate 50. And the power section 6〇. The plating tank 10' is a water tank containing a plating solution, and houses an anode 2 and a cathode 30. The cathode 30' is connected to the plating object, that is, the substrate 35, and is disposed at a position opposed to the anode 20. At a portion of the substrate 35 to be plated, a metal layer is formed, which is electrically connected to the cathode 3A. 201022481 The anode 20' is located at a position opposite to the substrate 35 (connected to the cathode 3') by a metal substance to be electroplated on the substrate 35. Once the current flows, the metal ions constituting the anode 20 are separated into the plating solution and form a special % of electricity. As shown in Fig. 3, if the anode 20 is a mesh structure, it contributes to the flow of the plating solution and can be increased. The contact area of the plating solution with the anode 2 turns and increases the efficiency of the key. The power supply portion 60 is electrically connected to the anode 20 and the cathode 30. The metal of the anode 2 turns on the surface of the substrate 35 that has been connected to the cathode 30 by the flow of current from the power source σ 卩 60. The manifold 40 is a device for supplying electric ore liquid into the key groove. Although it has been disposed in the lower portion of the plating tank, as shown in FIG. 3, it can be disposed on the side and sprayed from the anode 2 toward the substrate. A plating solution to increase the plating efficiency and maintain the concentration of the plating liquid constant. In the case where the manifold 4 is sprayed from the anode 2 to the substrate, that is, toward the cathode 30, an opening portion through which the plating solution can pass is formed in the anode 20, particularly in the form of a mesh.遮蔽 The shielding plate 50 is interposed between the substrate 35 and the anode 20. As described above, a plurality of honeycomb-shaped holes 55 are formed. When viewed from the cathode 3, the shielding plate 50 is configured to shield the substrate. A portion of the 35 to be formed into a thick plating layer is used to interrupt the power line, thereby preventing the current density of a specific portion from being excessively formed. In general, since the current density formed at the edge portion of the substrate 35 is high, as shown in Fig. 3, a quadrangular frame shape may be formed in order to shield the edge portion of the substrate buckle. Regarding the shielding plate 5, as described above, the detailed description is omitted. 201022481 FIG. 4 is a perspective view showing another embodiment of an electrolytic ore apparatus according to another embodiment of the present invention, showing an electric ore tank, an anode holder, a blue cage 26, a metal ball 27, a cathode 30, The substrate 35, the manifold 4, and the shielding plate 50 are the same as the anode 2 of the above embodiment, and the anode 25 of the present embodiment is housed in the mesh basket 26 in the mesh. The metal balls 27 formed by the metal plating are used, and the anode 25 can be continuously used by replacing the metal balls 27. Since the blue cage 26 is a mesh structure, it has the same fluidity as the above. The shape of the basket cage 26 is not limited to the columnar shape shown in Fig. 4, and may be formed into a flat plate shape or the like, and various types of variations may be made. The power source portion 60 may be connected to each of the anodes 25, but for convenience of the drawings, only Connected to an electrode 25 for illustration. As described above, by using the honeycomb structure in which the shielding plate 50 is made porous, it is possible to obtain a shielding effect having a uniform current density, and to improve the flow efficiency β _ or more of the plating solution, although the embodiment of the present invention has been used for explanation. The technical scope of the present invention is not limited to the scope described in the above embodiment. It will be apparent to those skilled in the art that various changes or modifications can be made to the above-described embodiments, and even if such a type of change or improvement has been applied, it can be included in the technical scope of the present invention, and it is clear from the description of the scope of the patent application. know. The order of execution of the processes, the sequence, the stage, and the process in the apparatus and method shown in the patent application, the specification, and the drawings is as long as the "before" and "before" are not explicitly stated, and the previous At 201022481, the output 'used in the later processing' is expected to be implemented in any order. The operation flow in the patent application scope, the specification, and the drawings is described as "first" and "second" for convenience, but it does not mean that it must be implemented in this order. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an electrolytic electric fatigue device according to a conventional technique. Figure 2 is a plan view showing an embodiment of a shield plate according to one embodiment of the present invention. Fig. 3 is a perspective view showing an embodiment of an electrolytic plating apparatus according to another embodiment of the present invention. Fig. 4 is a perspective view showing another embodiment of an electrolytic plating apparatus according to another embodiment of the present invention. 27 Metal ball 30 Cathode 35 _Substrate 40 Manifold 50 Masking plate 53 Plate 55 Honeycomb structure hole 60 Power part A part [Main component symbol description 1 Plating tank 2 Anode 3 Substrate (cathode) 4 Manifold - 5 Shading plate 10 plating tank 20 anode 25 anode 26 basket cage