A7五A7 five
、發明説明G B7 ^本發明係有關於一種電鍍處理裴置，更詳細地來說， 係有關於-種電鍍處理裝置，係可將被鑛物浸潰於電鍵液 中而對該被鍍物進行電鍍處理者。 用以在預定對象物的表面上進行形成金屬等薄層之電 錄處理的電錢處理裝置中，有一種是將被鍵物浸潰在電鍵 /夜中來進行電鍍處理者，在第3圖中顯示這種電鍍處理裝 置之以往的例子。如第3圖所示，這種電鑛處理裝置5在充 真％鍍液50之電鑛槽51的底部處設置有用以出電鑛液外的 錢液喷出裝置52’及空氣噴出裝置53,這種裝置以由空 氣喷出衣置53貝出之空氣攪拌由電鍍液喷出裝置52喷出的 電錄液50,㈣物，例如印刷電路板54被浸在魏液5〇中。 $於由空氣喷出裝置53噴出之空氣沿著這印刷電路板^上 升到液面時攪拌電錢液5〇，所以電錢液5〇不偏差地均勾接 觸印刷電路板54,於是因為金屬離子之濃度梯度減少，在 印刷電路板54之表面上進行均一厚度的電鍍。 然而，以印刷電路板54為例，近年來，由於具有微細 配線之高密度、多層或薄型多層者出現，使構造複雜化， 雖然多層的印刷電路板大多是以通孔法來製造，而該通孔 法係以在導體圖案相互間穿孔之孔的内壁上進行電鐘來連 接者’但是這樣的印刷電路板，例如設有非貫通孔，即不 通孔（BVH)55等之凹部或貫通孔等者，必須在這些部位上 進行電鍍。 在這種情況下，如果以上述習用電鍍處理裝置$來處 理，在將要進行電鍍處理的印刷電路板54上，特別是存在 本紙張尺度顧( CNS ) A4規格（210χ^^] M6417 五、發明説明（2 有特別小直彳 1^通料，“_電_ 使電鍍液之交換不完全，所以令 因而 其結果胃，彡行 屬料無法充份地供給。 電贫不魏55之底部上無法進行充份厚度的 電鐘，或者甚至元全無法被電錢的問題。 在這種情形下，這種印刷電路板上會發生因電鑛不良 而產生通電不良的情形。 本發明之目的係解決上述問題，提供即使在被鑛物之 電鍍處理面上存在有非貫通孔之凹部等，也可以在其内部 進行充份厚度之電鍍的電鍍處理裝置。 本發明係一種電鍍處理裝置，其係以以下的方式構成 來解決前述的技術問題。即’本發明係一種電鍍處理裝置， 係可將被鍍物浸潰於電鍍液中而對該被鍍物進行電鑛處理 者’其特徵在於具有可向前述被鍍物之電鍍處理面喷射前 述電鍍液的電鍍液喷射裝置。 經濟部智慧財產局員工消費合作社印製 此外，本發明的電鍍處理裝置中，電鍍物藉一搬送裝 置而被支持在-充填有電鏡液之浸潰槽中，並且_邊接觸 陰電極邊平行於陽電極移動，且前述電鍍槽中配置可對 移動之被鍍物表面喷射電鍍液的電鍍液喷射部。 因為在電鍍液中對被支持之被鍍物的電鍍處理面喷射 電鑛液’本發明的電鍍處理裝置可以對電鍍處理面充份地 電 供給電鍛液。因此可以對電鍍處理面進行充份厚度的 鍍。 非 此外’如果藉由本發明，在前述電鍍處理面上設有 貝通孔的情況下’也可以對非貫通孔的内部充份地供給 電Description of the invention G B7 ^ The present invention relates to an electroplating treatment. More specifically, the present invention relates to an electroplating treatment device, which is capable of immersing a mineral in an electric key liquid to perform the plating on the object to be plated. Electroplater. One type of electronic money processing device for performing a recording process for forming a thin layer of a metal or the like on a surface of a predetermined object is one in which a keyed object is immersed in a key / night to perform electroplating, as shown in FIG. 3 A conventional example of such a plating treatment apparatus is shown. As shown in FIG. 3, the electric ore processing device 5 is provided with a money liquid ejection device 52 'and an air ejection device 53 at the bottom of the electric ore tank 51 filled with the true plating solution 50. This device agitates the electric recording liquid 50 and the objects, such as the printed circuit board 54, immersed in the Wei liquid 50 with the air from the air spraying device 53. The air sprayed by the air ejection device 53 stirs the electric money liquid 50 as it rises to the liquid level along the printed circuit board ^, so the electric money liquid 50 contacts the printed circuit board 54 without deviation, so the metal The ion concentration gradient is reduced, and a uniform thickness plating is performed on the surface of the printed circuit board 54. However, taking printed circuit board 54 as an example, in recent years, the appearance of high-density, multi-layer or thin multi-layers with fine wiring has complicated the structure. Although multi-layer printed circuit boards are mostly manufactured by the through-hole method, the The through-hole method is connected by an electric clock on the inner walls of holes that are perforated between conductor patterns. However, such printed circuit boards are provided with, for example, non-through holes, that is, recesses or through holes such as non-through holes (BVH) 55 Etc., plating must be performed on these parts. In this case, if the conventional electroplating treatment device $ is used for processing, on the printed circuit board 54 to be electroplated, in particular, there is a paper size specification (CNS) A4 specification (210χ ^^) M6417 V. Invention Explanation (2 There are special small straight 1 彳 materials, "_ 电 _ makes the exchange of the electroplating solution incomplete, so that the result is that the stomach can not be fully supplied. The electricity is poor on the bottom of the Wei 55 The problem is that an electric clock with a sufficient thickness cannot be made, or even Yuan Quan cannot be charged with electricity. In this case, such a printed circuit board may have a poor electrical conduction due to a defective electric mine. The object of the present invention is to In order to solve the above-mentioned problems, a plating processing device capable of performing plating with a sufficient thickness inside even if a non-through-hole recessed portion or the like is present on a mineral-plated processing surface is provided. The present invention relates to a plating processing device which is based on The following method is configured to solve the aforementioned technical problem. That is, the present invention is a plating treatment device, which is a person who can immerse an object to be plated in a plating solution and perform an electro-mineral treatment on the object to be plated. It is characterized by having a plating solution spraying device capable of spraying the plating solution onto the plating treatment surface of the object to be plated. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, in the plating processing device of the present invention, the plating material is borrowed and transported. It is supported in an immersion tank filled with electron microscopy liquid, and moves parallel to the positive electrode while contacting the negative electrode, and the plating bath is provided with a plating solution spraying section that can spray a plating solution on the surface of the moving object. Because the electroplating solution is sprayed on the electroplated surface of the supported plated object in the electroplating solution, the electroplating treatment device of the present invention can fully supply the electric forging fluid to the electroplated surface. Therefore, the electroplated surface can be charged. It is also possible to fully supply electricity to the interior of the non-through hole if the 'through hole is provided in the aforementioned plating treatment surface by the present invention'.
-5- 546417 A7 ________B7 五、發明説明（3 ) 鐘液’如此也可對非貫通孔之内部進行充份厚度的電錢。 月ij述被鍍物可以是印刷電路板，此時，印刷電路板的 電鑛處理面及在此電鍍處理面上設置的非貫通孔内可進行 充份厚的電鍍。 由以上說明可知’藉由本發明的電鑛處理裝置，因為 向被鍍物之電鍍處理面喷射電鍍液，所以在有如習知般形 成於被鍍物中之凹部等的情形下，可消除此凹部電鍍液滯 留而難以供給金屬離子的情形。即，由於即使對具有凹凸 之電鍍處理面也可以不產生滯留地供給電鍍液，所以可對 於電鍍處理面均一地進行充份厚度的電鍍。 再者，即使是在電鍍處理面上設有貫通孔，由於在此 貫通孔内部可以充份地供給不滯留的電鍍液，所以可以在 貫通孔内部進行充份厚度之電鍍。 特別地，即使是以具有凸部或貫通孔之印刷電路板做 為被鍍物時，也可以對印刷電路板全體進行充份厚度的電 鍍，消除通電不良的現象。 第1圖是顯示本發明之電鍍處理裝置的平面圖。 經濟部智慧財產局員工消費合作社印製 弟2圖是弟1圖之a_a的截面圖。 第3圖是顯示習知電鍍處理裝置之一例的載面圖。 以下’依據圖示之發明的實施態樣詳細說明本發明的 電鍍處理裝置。 第1圖及第2圖中所示之電鍍處理裝置丨係一種在電鍍 槽ίο内充填有電鍍液15’在此電鍍液15中進行浸潰被鍍物 的處理者’本發明的實施態樣說明有關適用於推送型電鑛-5- 546417 A7 ________B7 V. Description of the invention (3) Bell liquid ’This way, it is also possible to make a sufficient thickness of electricity inside the non-through hole. The article to be plated may be a printed circuit board. In this case, the electroplated surface of the printed circuit board and non-through holes provided in the electroplated surface can be fully plated. From the above description, it can be understood that, with the electro-mineral processing apparatus of the present invention, the plating solution is sprayed onto the plating surface of the object to be plated. Therefore, in the case where there is a concave portion or the like conventionally formed in the plated object, the concave portion can be eliminated A case where the plating solution stays and it is difficult to supply metal ions. That is, since the plating solution can be supplied without causing stagnation even on the electroplated surface having irregularities, it is possible to uniformly plate the electroplated surface with a sufficient thickness. Furthermore, even if a through-hole is provided on the plating treatment surface, since the plating solution can be sufficiently supplied inside the through-hole, it is possible to perform plating with a sufficient thickness inside the through-hole. In particular, even when a printed circuit board having a convex portion or a through hole is used as an object to be plated, the entire printed circuit board can be plated with a sufficient thickness to eliminate the phenomenon of poor current flow. Fig. 1 is a plan view showing an electroplating treatment apparatus according to the present invention. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 is a cross-sectional view of Figure 1_a of Figure 1. FIG. 3 is a front view showing an example of a conventional plating treatment apparatus. Hereinafter, the plating processing apparatus of the present invention will be described in detail based on the embodiment of the invention shown in the drawings. The plating treatment apparatus shown in FIG. 1 and FIG. 2 is an embodiment of the present invention in which a plating bath 15 is filled with a plating bath 15 ′, and the plating bath 15 is impregnated with the object to be plated. Description about suitable for push-type power mine
546417 A7 B7 五、發明説明（4 處理裝置的情形。 如圖所示，這種電鍍處理裝置丨具有在立方體狀電鍍 槽10内的長軸方向上呈一列地配置的多數陽電極丨丨，及平 行該陽電極11設置的陰電極。陽電極丨丨係以，例如在適宜 直徑的圓筒内插入多數個銅製的球體來構成。又，陰電極 12係以金屬的板材形成。 此外，被鍍物係多層的印刷電路板13，該印刷電路板 13係固定在電鐘槽内可沿長軸方向移動地設置的搬送裝置 14上，且以與陰電極12接觸的狀態平行於陽電極地移動。 該搬送裝置14具有可相對陰電極12自由移動地卡止的卡止 部16，為了懸掛印刷電路板13而設置在卡止部16上的吊鈎 17 ’以及推動卡止部16且只搬送預定距離的推動構件丨8。 另一方面，在前述電鍍槽中充填有預定深度的電鍍液 15 〇 經濟部智慧財產局員工消費合作社印製 另外，該電鍍處理裝置1具有對被支持在電鍍液15中 之印刷電路板13的電鍍處理面20全面地喷射電鍍液15的電 鍍液喷射部21，該電鍍液喷射部21為圓筒形，且個別地配 置在左右兩側各側呈一列地設置的前述陽電極11及其相鄰 陽電極11之間。 此外，此電鍍液喷射部21，如第2圖所示，係用比印 刷電路板13之高度更大的管來構成，其外周面上的多數喷 出口 22係呈一縱列地設置。此喷出口 22面向印刷電路板13 的電鍍處理面20。 又，電鍍液喷射部2 1係連接到，如泵等電鍍液供給裝 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） -7- 546417 A7 B7 五、發明説明（5 置（圖未示）上，因在電鍍液喷射部21内供給加壓電鍍液， 故會由喷出口 22向電鍍槽1〇内喷射。再者，第1圖中的標 號24係指電鍍液吐出裝置。 如此構成的電鍍處理裝置係在對電解液，即含有金屬 離子之電解質溶液通入電流後，於印刷電路板13之表面上 析出預定金屬來進行電鍍處理的裝置。在本裝置的這種電 鑛處理中’因為由電鍍液喷射部21的喷出口 22對印刷電路 板13的電鏡處理面2〇持續地喷射電鍍液15，即使電錢處理 面20設置的是非貫通孔，即不通孔（Bvh)23等，電錢液15 也能充份地供應到不通孔23内。因此，可以在不通孔23内 周面及底面處進行充分厚度的電鍍。 再者，雖然此實施的形態係已說明了適用於本發明 推送型電鑛處理裝置的情形，然而本發明可適用於，伸 限於，如載送型電鍍處理裝置等各種電鍍處理裝置。 元件標號對照表 之 不 (請先閱讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 1·.·電鍍處理裝置 10…電鍍槽 11.··陽電極 12…陰電極 13…印刷電路板 14…搬送裝置 15…電鍍液 16…卡止部 17…吊鈎 18···推動構件 2 0…電鑛處理面 21…電鐘液τ射部 22···喷出口 24…電鑛液吐出裝置 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X297公釐） -8-546417 A7 B7 V. Description of the invention (4) Processing device. As shown in the figure, this plating processing device 丨 has a plurality of anode electrodes arranged in a row in the direction of the long axis in the cube-shaped plating tank 10 丨, and A cathode electrode provided in parallel with the anode electrode 11. The anode electrode is constituted by, for example, inserting a plurality of copper spheres into a cylinder of a suitable diameter. The cathode electrode 12 is formed of a metal plate. In addition, it is plated. The multilayer printed circuit board 13 is fixed on a transfer device 14 which is movably disposed in a major axis direction in an electric clock slot, and moves in parallel with the anode electrode in a state of being in contact with the cathode electrode 12 The transfer device 14 includes a locking portion 16 that can be locked to move freely with respect to the female electrode 12, a hook 17 ′ provided on the locking portion 16 to suspend the printed circuit board 13, and the locking portion 16 is pushed to carry only A pushing member of a predetermined distance 丨 8. On the other hand, the aforementioned plating tank is filled with a plating solution of a predetermined depth 150. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A plating solution spraying section 21 for spraying the plating solution 15 on the plating processing surface 20 of the printed circuit board 13 supported in the plating solution 15 is provided. Between the aforementioned anode electrodes 11 and their adjacent anode electrodes 11 are arranged in a row on each side. In addition, as shown in FIG. 2, the plating solution spraying section 21 is formed with a larger height than the printed circuit board 13. It is constituted by a tube, and most of the ejection ports 22 on its outer peripheral surface are arranged in a line. This ejection port 22 faces the plating treatment surface 20 of the printed circuit board 13. Furthermore, the plating solution ejection portion 21 is connected to, for example, a pump The size of paper used for the plating solution supply is applicable to the Chinese National Standard (CNS) A4 specification (21〇 > < 297 mm) -7- 546417 A7 B7 V. Description of the invention (5 sets (not shown), because The plating solution spraying section 21 supplies pressurized plating solution, and is sprayed into the plating tank 10 from the discharge port 22. Furthermore, reference numeral 24 in the first figure refers to a plating solution discharge device. The plating processing device configured as described above is In the electrolyte, that is, the electrolyte solution containing metal ions A device that deposits a predetermined metal on the surface of the printed circuit board 13 and performs an electroplating treatment after the current is applied. In this electro-mineral processing of the device, the electron microscope of the printed circuit board 13 is caused by the ejection port 22 of the plating solution ejection section 21 The plating surface 15 is continuously sprayed on the processing surface 20, and even if the electric money processing surface 20 is provided with a non-through hole, that is, a non-through hole (Bvh) 23, etc., the electric liquid 15 can be fully supplied into the non-through hole 23. Therefore, Electroplating with sufficient thickness can be performed on the inner peripheral surface and the bottom surface of the non-through hole 23. Furthermore, although the morphology of this implementation has been described as being applicable to the push-type electric ore processing device of the present invention, the present invention is applicable to It is limited to various plating processing apparatuses, such as a carrier-type plating processing apparatus. The comparison of the component labeling table (please read the precautions on the back before filling out this page), 11 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1. ··· Plating treatment device 10 ... Plating tank 11. ·· Positive electrode 12… Female electrode 13 ... Printed circuit board 14 ... Transport device 15 ... Plating solution 16 ... Locking portion 17 ... Hook 18 ... Pushing member 2 0 ... Electric mine treatment surface 21 ... Electric clock liquid τ emitting portion 22 ... Spray Outlet 24 ... Electric mineral liquid discharge device The paper size is applicable to China National Standard (CNS) A4 specification (21 × 297 mm) -8-