CN214612828U

CN214612828U - Device for improving gold plating thickness uniformity

Info

Publication number: CN214612828U
Application number: CN202120558019.3U
Authority: CN
Inventors: 潘宏名; 万小亮; 王景贵
Original assignee: Guangzhou Guanghe Technology Co Ltd
Current assignee: Guangzhou Guanghe Technology Co Ltd
Priority date: 2021-03-18
Filing date: 2021-03-18
Publication date: 2021-11-05
Anticipated expiration: 2031-03-18

Abstract

The utility model relates to an electroplating device technical field especially relates to an improve thick homogeneity of gild gold device, include the plating bath, erect and insert anode plate in the plating bath, the top of plating bath is equipped with anchor clamps, anchor clamps are used for cliping the product of treating the electroplating, the anode plate includes first plate body and second plate body, first plate body is erect and is inserted the plating bath, the second plate body is located the upper end of first plate body and with first plate body mutually independent, just the second plate body is connected with the rectifier, and the device need not to change the electroplating parameter and can improve the thick homogeneity of gild gold.

Description

Device for improving gold plating thickness uniformity

Technical Field

The utility model relates to an electroplating equipment technical field especially relates to a device of thick homogeneity of gild gold is improved.

Background

The gold-plated finger (gold finger) is a pad arranged like a finger and used for being inserted into the card slot and being in contact conduction with the metal spring piece in the card slot, and the gold-plated finger (gold finger) needs to be electroplated for gold plating. The layout design uniformity of the conventional gold finger meets the requirements that the R value of the gold plating thickness is within 6 mu ' and the R value of the gold plating thickness is within 4 mu ' of 30 mu '. However, some current PCB board gold fingers are spaced 2-3cm from the conductive edge of the PCB board. When electroplating, the clamp clamps the conductive edge, and at the moment, the part of the golden finger is positioned above the liquid level of the electroplating bath and the part of the golden finger is close to the conductive edge, so that the exchange capacity among metal ions of the part of the golden finger (the top of the golden finger) is poor, the coating is thin, and the gold-plating overall gold thickness uniformity of the part of the golden finger is poor, and the uniformity R value reaches 10 mu.

Disclosure of Invention

The utility model aims at overcoming the problems of the prior art and providing a device which can improve the gold-plating gold thickness uniformity without changing the electroplating parameters and has the advantage of simple structure.

In order to achieve the above purpose, the utility model adopts the following scheme:

the utility model provides an improve device of gilt gold thickness homogeneity, include the plating bath, erect and insert the anode plate in the plating bath, the top of plating bath is equipped with anchor clamps, anchor clamps are used for cliping the product of treating the electroplating, the anode plate includes first plate body and second plate body, first plate body erects and inserts the plating bath, the second plate body is located the upper end of first plate body and with first plate body is independent each other, just the second plate body is connected with the rectifier.

Furthermore, the anode plates are arranged in two rows, the anode plates in each row are uniformly arranged along the length direction of the electroplating bath, and the plate surfaces of the anode plates between the two rows of the anode plates are opposite and symmetrically arranged.

Further, there are 16 anode plates in each row of anode plates.

Further, the first plate body and the second plate body are both platinum titanium mesh plate bodies.

Further, the second plate body of each anode plate is integrally connected with the second plate body of the adjacent anode plate so as to surround the upper end part of each first plate body.

Further, the 1/3 length in the vertical direction of the first panel is enclosed by the second panel.

Furthermore, the plate surfaces of the two plate bodies are vertically arranged.

Further, the voltage of the rectifier is 5V.

Further, the rectifier is a manual rectifier.

Further, the electroplating bath is provided with 13 clamps.

Compared with the prior art, the utility model has the advantages of as follows:

the second plate body and the rectifier connected with the second plate body are added at the upper end part of the first plate body in the anode plate, so that the power line circulation at two sides of the liquid level top of the electroplating bath can be accelerated in a targeted manner, the electroplating strength at the top of the electroplating bath is increased, and the problem of poor electroplating uniformity at the top of a golden finger to be electroplated is effectively solved; and, the utility model discloses a device need not to change the gilding parameter, can wholly improve golden finger gold thickness even, and easily operation is suitable for large-scale production and uses.

Drawings

The present application will be described in further detail with reference to the following drawings and detailed description.

Fig. 1 is a schematic structural diagram of the device for improving gold plating thickness uniformity of the present invention.

Fig. 2 is another visual structure diagram of the device for improving gold plating thickness uniformity of the present invention.

The figure includes:

an electroplating bath 1; the anode plate 2, the first plate body 21 and the second plate body 22; a clamp 3; a PCB board 4; a rectifier 5; a conductive edge 6; a gold finger 7.

Detailed Description

The present application is further described in conjunction with the following examples.

Example 1

The device for improving gold plating thickness uniformity disclosed in this embodiment, as shown in fig. 1-2, includes a plating tank 1, and an anode plate 2 vertically inserted into the plating tank 1, where the plating tank 1 is a gold steel tank, a clamp 3 is disposed above the plating tank 1, and the clamp 3 is used for clamping a product to be plated, specifically, a PCB 4. The anode plate 2 comprises a first plate body 21 and a second plate body 22, the first plate body 21 is vertically inserted into the electroplating bath 1, the second plate body 22 is positioned at the upper end part of the first plate body 21 and is mutually independent with the first plate body 21, the second plate body 22 is connected with a rectifier 5, and due to the fact that the second plate body 22 is additionally arranged and the rectifier 5 is connected onto the second plate body 22, the circulation of power lines on two sides of the top of the liquid level of the electroplating bath 1 can be enhanced, and therefore the top of a golden finger of a PCB is electroplated uniformly.

In this embodiment, there are a plurality of the anode plates 2, the plurality of anode plates 2 are arranged in two rows, the anode plates 2 in each row are uniformly arranged along the length direction of the electroplating bath 1, and the plate surfaces of the anode plates 2 between the two rows of the anode plates 2 are oppositely and symmetrically arranged, so that the anode plates 2 are uniformly distributed in the electroplating bath 1, and preferably, 16 anode plates 2 are arranged in each row of the anode plates 2.

In this embodiment, the first plate body 21 and the second plate body 22 are both made of platinum titanium mesh, wherein the size of the first plate body 21 is L640mm × W100mm to meet the production requirement.

In this embodiment, the second plate body 22 of each anode plate 2 is integrally connected to the second plate body 22 of the adjacent anode plate 2, and specifically, the integrally connected second plate body 22 has a size of L4m × W100mm, so as to surround the upper end portion of the first plate body 21 of each anode plate 2 and facilitate the rapid installation of the second plate body 22. In use, brackets or mounts may be provided within the plating bath 1 to secure the second plate 22 and thus the second plate.

Preferably, the second board 22 surrounds 1/3 length in the vertical direction of the first board 21, and the board surfaces of the two boards are vertically arranged, so that the material can be saved, and the required electroplating effect can be achieved.

In this embodiment, the voltage of the rectifier 5 is 5V. The rectifier 5 is a manual rectifier 5. The electroplating bath 1 is provided with 13 clamps 3.

Example 2

The difference between this embodiment and embodiment 1 is that the second plate bodies 22 on the respective anode plates 2 are not integrally connected, so that the material saving effect can be achieved, and the other structures of this embodiment are the same as those of embodiment 1, and are not described herein again.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the protection scope of the present application, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. The utility model provides an improve device of gilt gold thickness homogeneity which characterized in that: the electroplating bath structure comprises an electroplating bath and an anode plate vertically inserted into the electroplating bath, wherein a clamp is arranged above the electroplating bath and used for clamping a product to be electroplated, the anode plate comprises a first plate body and a second plate body, the first plate body is vertically inserted into the electroplating bath, the second plate body is positioned at the upper end part of the first plate body and is mutually independent with the first plate body, and the second plate body is connected with a rectifier.

2. The apparatus for improving gold plating thickness uniformity of claim 1, wherein: the anode plates are arranged in two rows, the anode plates in each row are uniformly arranged along the length direction of the electroplating bath, and the plate surfaces of the anode plates between the two rows of the anode plates are opposite and symmetrically arranged.

3. The apparatus for improving gold plating thickness uniformity of claim 2, wherein: there are 16 anode plates in each row of anode plates.

4. The apparatus for improving gold plating thickness uniformity of claim 3, wherein: the first plate body and the second plate body are both platinum titanium mesh plate bodies.

5. The apparatus for improving gold plating thickness uniformity of claim 4, wherein: the second plate body on each anode plate is integrally connected with the second plate body on the adjacent anode plate so as to surround the upper end part of each first plate body.

6. The apparatus for improving gold plating thickness uniformity of claim 5, wherein: the 1/3 length in the vertical direction of the first panel is enclosed by the second panel.

7. The apparatus for improving gold plating thickness uniformity according to any one of claims 1 to 6, wherein: the plate surfaces of the two plate bodies are vertically arranged.

8. The apparatus for improving gold plating thickness uniformity of claim 1, wherein: the voltage of the rectifier is 5V.

9. The apparatus for improving gold plating thickness uniformity of claim 8, wherein: the rectifier is a manual rectifier.

10. The apparatus for improving gold plating thickness uniformity of claim 1, wherein: and the electroplating bath is provided with 13 clamps.