CN205398763U - Water flat line is insoluble anode titanium net device for copper facing - Google Patents

Water flat line is insoluble anode titanium net device for copper facing Download PDF

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Publication number
CN205398763U
CN205398763U CN201620185709.8U CN201620185709U CN205398763U CN 205398763 U CN205398763 U CN 205398763U CN 201620185709 U CN201620185709 U CN 201620185709U CN 205398763 U CN205398763 U CN 205398763U
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CN
China
Prior art keywords
titanium net
anode titanium
insoluble anode
copper facing
insoluble
Prior art date
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Expired - Fee Related
Application number
CN201620185709.8U
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Chinese (zh)
Inventor
曾宪兰
谢信韦
黄金
张奇飞
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SUZHOU JIDAO ELECTRODE TECHNOLOGY Co Ltd
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SUZHOU JIDAO ELECTRODE TECHNOLOGY Co Ltd
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Priority to CN201620185709.8U priority Critical patent/CN205398763U/en
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Publication of CN205398763U publication Critical patent/CN205398763U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a water flat line is insoluble anode titanium net device for copper facing includes insoluble anode titanium net and electroplating negative plate, wherein, insoluble anode titanium net comprises a plurality of positive pole titanium network element, and a plurality of positive pole titanium network element are in accord and set up synthetic rectangular plate shaped jointly wholly, and are adjacent the width in the formation clearance between the positive pole titanium network element equals. Compare traditional water flat line is insoluble anode titanium net device for copper facing, the utility model discloses originally, a plurality of positive pole titanium network element are cut apart into according to certain proportional relation to monoblock titanium anode to guarantee that insoluble anode titanium net current distribution in the electroplating process is even, be favorable to negative plate plating layer evenly distributed.

Description

A kind of horizontal line copper facing insoluble anode titanium net device
Technical field
This utility model belongs to wiring board techniques field, is specifically related to a kind of horizontal line copper facing insoluble anode titanium net device.
Background technology
Ni-Ti anode is coated on titanio material by precious metal iridium salt and forms through high temperature sintering, it is widely used in the hydrometallurgy industries such as plating, electrolysis, so far having the history of 40 years the sixth of the twelve Earthly Branches, relative to traditional platinized electrode for alkaline copper plating technique, Ni-Ti anode has the advantage that plating uncle's electrode is incomparable:
As electric current high efficiency is high, there is excellent antibacterial corrosive nature;Electrode life is long;Higher electric current density can be born;Catalysis activity is high, and Ni-Ti anode is a kind of low overpotential for oxygen evolution (the relative mereurous sulfate of 1.385V) electrode, is easier to analysis oxygen in Oxygen anodic evolution district, and therefore during electrolysis, groove pressure is relatively low, and more saves electric energy;Pollution-free, anodic coating is the ceramic oxide of precious metal iridium, and this oxide is the oxide of a kind of quite stable, is practically insoluble in any soda acid;Cost performance is high, maintain the service life that platinized electrode (thick coating 3.5) is same, the price of Ni-Ti anode is about the 80% of platinized electrode, and Ni-Ti anode is to have better electrochemical stability in basic plating copper electrolyte, has electrolysis activity and the durability of excellence.
But, the anode titanium net of traditional horizontal line plating insoluble Ni-Ti anode is " one to one " form, namely the insoluble anode titanium net that in electroplating process, one piece of PCB substrate is corresponding a piece big, but this kind is combined with a greatest problem to be existed: in electroplating process, titanium net zone line is intensive due to electric lines of force, corresponding position institute copper facing thickness is more than institute's copper facing position, titanium net both sides, ultimately result in overall electroplating quality to decline, as shown in Figure 1, in electroplating process, the electric lines of force of B point is the most intensive, and electroplating thickness herein is also last.Therefore, how to develop one copper facing uniformity good horizontal line copper facing insoluble anode titanium net device in copper facing process and become problem demanding prompt solution.
Utility model content
In view of the defect that above-mentioned prior art exists, the purpose of this utility model is to provide a kind of anti-horizontal line copper facing insoluble anode titanium net device, the problems such as solution minus plate copper facing is uneven.For realizing aforementioned utility model purpose, the technical solution adopted in the utility model includes:
A kind of horizontal line copper facing insoluble anode titanium net device includes insoluble anode titanium net and electroplating cathode plate, wherein, described insoluble anode titanium net is made up of some anode titanium net units, some anode titanium net units agree with mutually and are combined into rectangular plate-like entirety, and the width forming gap between adjacent described anode titanium net unit is equal.
Further, every piece of described anode titanium net unit is erose planar panel structure to this utility model, and after energising, the electric lines of force between every piece of described anode titanium net unit and described electroplating cathode plate is uniformly distributed.
Further, the electric current density on every piece of described anode titanium net unit is suitable for this utility model.
Further, the electric lines of force trend after being energized between electroplating cathode plate described in every piece of described anode titanium net unit is consistent for this utility model.
Further, the width in described gap is 0.5 times~1.5 times of insoluble anode titanium net thickness to this utility model.
This utility model further, described anode titanium net unit edge offers identification groove.
By such scheme, this utility model at least has the advantage that compares conventional flat line copper facing insoluble anode titanium net device, script monoblock Ni-Ti anode is divided into some anode titanium net units according to certain proportionate relationship by this utility model, to ensure insoluble anode titanium net homogeneous current distribution in electroplating process, minus plate electrodeposited coating is conducive to be uniformly distributed.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be practiced according to the content of description, below with preferred embodiment of the present utility model and coordinate accompanying drawing describe in detail as after.
Accompanying drawing explanation
Fig. 1 is prior art anode titanium web frame schematic diagram;
Fig. 2 is the structural representation of this utility model a kind of horizontal line copper facing insoluble anode titanium net device;
Fig. 3 is the top view of this utility model a kind of horizontal line copper facing insoluble anode titanium net device.
In figure, the implication of each accompanying drawing labelling is as follows.
1 insoluble anode titanium net 2 electroplating cathode plate
3 electric lines of force 4 anode titanium net units
5 gap 6 grooves
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is carried out clear, complete description, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments, it is not limited to scope of the present utility model.Based on embodiment of the present utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
Referring to Fig. 2, this utility model one horizontal line copper facing insoluble anode titanium net device, including insoluble anode titanium net 1 and electroplating cathode plate 2, when described insoluble anode titanium net 1 and electroplating cathode plate 2 are energized, distribution between the two has virtual electric lines of force 3, and wherein, described insoluble anode titanium net 1 is made up of some anode titanium net units 4, some anode titanium net unit 4 phases are agreed with and are combined into rectangular plate-like entirety, and the width forming gap 5 between adjacent described anode titanium net unit 4 is equal.
As a kind of preferred embodiment, as shown in Figure 3, according to current distributions, it is divided into A1, A2, A3, four pieces of described anode titanium net units 4 not of uniform size for A4, the electric current of every piece of anode titanium net unit 4 can independently control, and in use can finely tune every block of anode titanium net unit 4 electric current, to reach the electroplating effect of optimum.Preferably, every piece of described anode titanium net unit 4 is erose planar panel structure, and after energising, the electric lines of force 3 between every piece of described anode titanium net unit 4 and described electroplating cathode plate 2 is uniformly distributed, and electric lines of force 3 is evenly distributed and is conducive to electroplating thickness to be evenly distributed.
Should be noted that, it is calculate the electric current density on every piece of described anode titanium net unit 4 by the requirement that tradition Ni-Ti anode entire plate is divided into some anode titanium net units 4, makes the electric current density on every piece of described anode titanium net unit 4 of segmentation of anode titanium net unit 4 suitable.Preferably, the electric lines of force 3 after being energized between electroplating cathode plate 2 described in every piece of described anode titanium net unit 4 moves towards consistent.The width in described gap 5 is 0.5 times~1.5 times of insoluble anode titanium net 1 thickness, does not affect electroplating effect under this scope.Further, described anode titanium net unit 4 edge offers identification groove 6, facilitate some variform anode titanium net units 4 to be quickly assembled into overall block structure.
Therefore, compare conventional flat line copper facing insoluble anode titanium net device, script monoblock Ni-Ti anode is divided into some anode titanium net units 4 according to certain proportionate relationship by this utility model, to ensure insoluble anode titanium net 1 homogeneous current distribution in electroplating process, electroplating cathode plate 2 electrodeposited coating is conducive to be uniformly distributed.This utility model still has numerous embodiments, all employing equivalents or equivalent transformation and all technical schemes of being formed, all falls within protection domain of the present utility model.

Claims (6)

1. a horizontal line copper facing insoluble anode titanium net device, it is characterized in that: include insoluble anode titanium net (1) and electroplating cathode plate (2), wherein, described insoluble anode titanium net (1) is made up of some anode titanium net units (4), some anode titanium net units (4) are agreed with mutually and are combined into rectangular plate-like entirety, and the width in the formation gap (5) between adjacent described anode titanium net unit (4) is equal.
2. a kind of horizontal line copper facing insoluble anode titanium net device according to claim 1, it is characterized in that: every piece of described anode titanium net unit (4) is erose planar panel structure, after energising, the electric lines of force (3) between every piece of described anode titanium net unit (4) and described electroplating cathode plate (2) is uniformly distributed.
3. a kind of horizontal line copper facing insoluble anode titanium net device according to claim 2, it is characterised in that: the electric current density on every piece of described anode titanium net unit (4) is suitable.
4. a kind of horizontal line copper facing insoluble anode titanium net device according to claim 2, it is characterised in that: between every piece of described electroplating cathode plate (2) of described anode titanium net unit (4), electric lines of force (3) trend after energising is consistent.
5. a kind of horizontal line copper facing insoluble anode titanium net device according to claim 1, it is characterised in that: the width of described gap (5) is 0.5 times~1.5 times of insoluble anode titanium net (1) thickness.
6. a kind of horizontal line copper facing insoluble anode titanium net device according to claim 1, it is characterised in that: described anode titanium net unit (4) edge offers identification groove (6).
CN201620185709.8U 2016-03-11 2016-03-11 Water flat line is insoluble anode titanium net device for copper facing Expired - Fee Related CN205398763U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620185709.8U CN205398763U (en) 2016-03-11 2016-03-11 Water flat line is insoluble anode titanium net device for copper facing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620185709.8U CN205398763U (en) 2016-03-11 2016-03-11 Water flat line is insoluble anode titanium net device for copper facing

Publications (1)

Publication Number Publication Date
CN205398763U true CN205398763U (en) 2016-07-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111058080A (en) * 2019-12-31 2020-04-24 西安泰金工业电化学技术有限公司 Double-layer titanium mesh anode for horizontal electroplating of PCB

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111058080A (en) * 2019-12-31 2020-04-24 西安泰金工业电化学技术有限公司 Double-layer titanium mesh anode for horizontal electroplating of PCB
CN111058080B (en) * 2019-12-31 2023-10-24 西安泰金新能科技股份有限公司 Double-layer titanium mesh anode for horizontal electroplating of PCB

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160727

Termination date: 20180311

CF01 Termination of patent right due to non-payment of annual fee