CN218321695U - Electroplating device and electroplating system - Google Patents
Electroplating device and electroplating system Download PDFInfo
- Publication number
- CN218321695U CN218321695U CN202221816287.1U CN202221816287U CN218321695U CN 218321695 U CN218321695 U CN 218321695U CN 202221816287 U CN202221816287 U CN 202221816287U CN 218321695 U CN218321695 U CN 218321695U
- Authority
- CN
- China
- Prior art keywords
- conductive
- electroplating
- conductive tool
- base
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The embodiment of the utility model provides an electroplating device and electroplating system relates to electroplating technical field, include: the device comprises a rectifier power supply, a first conductive tool and a second conductive tool; the first conductive tool and the second conductive tool are connected in series to the negative electrode of the rectifier power supply, and the first conductive tool and the second conductive tool are connected in parallel. The first conductive tool is used for being electrically connected with the first surface of the part to be plated, and the second conductive tool is used for being electrically connected with the second surface of the part to be plated; an adjustable resistor is connected in series between the first conductive tool and the negative electrode of the rectifier power supply and/or between the second conductive tool and the negative electrode of the rectifier power supply. Through setting up adjustable resistance, can realize the differentiation adjustment to the electric current on first electrically conductive frock and/or the electrically conductive frock of second, under the circumstances that only uses a rectifier power, also can satisfy the differentiation of waiting to plate a first surface and second surface and electroplate the demand, saved cost of manufacture and subsequent maintenance cost.
Description
Technical Field
The utility model relates to an electroplate technical field, especially relate to an electroplate device and electroplating system.
Background
Electroplating is a process of depositing metal or alloy on the surface of an article to be plated by means of electrolysis to form a uniform, compact and well-bonded metal layer, and can play a role in preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
In the prior art, when the front and back surfaces of a piece to be plated are simultaneously plated, due to the differentiated design of the front and back surfaces of the piece to be plated, the areas and heights of the plating layers on the front and back surfaces of the piece to be plated are also different. In order to realize differential electroplating on the front and back surfaces of the workpiece to be plated, two rectifier power supplies are generally arranged, and currents with different intensities are respectively introduced into the front and back surfaces of the workpiece to be plated.
By adopting the electroplating scheme in the prior art, the required rectifier power supply quantity and power lines are more, the structure is complex, and the manufacturing cost and the subsequent maintenance cost are greatly increased.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electroplating device and electroplating system to solve prior art's electroplating scheme, required rectifier power quantity and power cord are more and the structure is complicated, lead to cost of manufacture and subsequent maintenance cost greatly increased's problem.
In order to solve the above problem, the utility model discloses a realize like this:
in a first aspect, an embodiment of the present invention provides an electroplating apparatus, including: the device comprises a rectifier power supply, a first conductive tool and a second conductive tool;
the first conductive tool and the second conductive tool are connected in series with the negative electrode of the rectifier power supply, and the first conductive tool and the second conductive tool are connected in parallel;
the first conductive tool is used for being electrically connected with a first surface of a piece to be plated, the second conductive tool is used for being electrically connected with a second surface of the piece to be plated, and the first surface and the second surface are two opposite surfaces of the piece to be plated;
and an adjustable resistor is connected in series between the first conductive tool and the negative electrode of the rectifier power supply and/or between the second conductive tool and the negative electrode of the rectifier power supply.
Optionally, the electroplating device further comprises an electroplating chamber and an anode;
under the working condition: electroplating liquid is filled in the electroplating cavity;
the first surface, the first conductive tool and the anode form a first electroplating loop, and the second surface, the second conductive tool and the anode form a second electroplating loop;
the anode is connected in series with the anode of the rectifier power supply.
Optionally, the anode comprises a first anode plate and a second anode plate;
the first surface, the first conductive tool and the first anode plate form the first electroplating loop, and the second surface, the second conductive tool and the second anode plate form the second electroplating loop;
the first anode plate and the second anode plate are arranged in parallel.
Optionally, an insulating layer is disposed on an outer surface of the adjustable resistor.
Optionally, the resistance value of the adjustable resistor is adjusted in a range of 0 to 10 Ω.
Optionally, the first conductive tool includes a first base and a first conductive probe disposed on the first base;
the second conductive tool comprises a second base and a second conductive probe arranged on the second base;
the first base and the second base are respectively connected with the negative pole of the rectifier power supply in series;
when the first base and the second base are at a first relative position, a gap for loading and unloading the piece to be plated is formed between the first conductive probe and the second conductive probe;
when the first base and the second base are at a second relative position, the first conductive probe is electrically connected with the first surface, and the second conductive probe is electrically connected with the second surface.
Optionally, at least part of the outer surface of the first conductive tool and at least part of the outer surface of the second conductive tool are both provided with an insulating layer.
Optionally, the first conductive tool further includes: a conductive connection member;
the conductive connector includes opposing first and second ends;
the first end is clamped with the negative electrode of the rectifier power supply, and the second end is fixedly connected with the first base.
Optionally, the adjustable resistor is disposed on the first base and is fixedly connected to the first base.
In a second aspect, an embodiment of the present invention provides an electroplating system, including the above electroplating apparatus.
In an embodiment of the present invention, an electroplating apparatus includes: the device comprises a rectifier power supply, a first conductive tool and a second conductive tool; the first conductive tool and the second conductive tool are connected in series to the negative electrode of the rectifier power supply, and the first conductive tool and the second conductive tool are connected in parallel. The first conductive tool is used for being electrically connected with the first surface of the part to be plated, and the second conductive tool is used for being electrically connected with the second surface of the part to be plated; an adjustable resistor is connected in series between the first conductive tool and the negative electrode of the rectifier power supply and/or between the second conductive tool and the negative electrode of the rectifier power supply. Through setting up adjustable resistance, can realize the differentiation adjustment to the electric current on first electrically conductive frock and/or the electrically conductive frock of second, under the circumstances that only uses a rectifier power, also can satisfy the differentiation of waiting to plate a first surface and second surface and electroplate the demand, saved cost of manufacture and subsequent maintenance cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 shows one of the schematic structural diagrams of a solar cell electroplating apparatus according to an embodiment of the present invention;
fig. 2 shows a second schematic structural view of a solar cell electroplating apparatus according to an embodiment of the present invention.
Description of reference numerals:
10-an anode; 20-a first conductive tool; 30-a second conductive tool; 40-positive pole of rectifier power supply; 50-negative pole of rectifier power supply; 60-a part to be plated; 70-adjustable resistance; 80-conductive connectors; 101-a first anode plate; 102-a second anode plate; 201-a first base; 202-a first electrically conductive probe; 301-a second base; 302-second conductive probe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 to 2, an embodiment of the present invention provides an electroplating apparatus, including: the rectifier power supply, the first conductive tool 20 and the second conductive tool 30; the first conductive tool 20 and the second conductive tool 30 are connected in series with a negative electrode 50 of the rectifier power supply, and the first conductive tool 20 and the second conductive tool 30 are connected in parallel; the first conductive tool 20 is used for being electrically connected with a first surface of a to-be-plated part 60, and the second conductive tool 30 is used for being electrically connected with a second surface of the to-be-plated part 60; an adjustable resistor 70 is connected in series between the cathodes 50 of the rectifier power supply and/or between the second conductive tool 30 and the cathode 50 of the rectifier power supply of the first conductive tool 20.
Specifically, as shown in fig. 1 to 2, the rectifier power supply includes a positive electrode and a negative electrode, the first conductive tool 20 and the second conductive tool 30 are connected in series to the negative electrode 50 of the rectifier power supply, and the first conductive tool 20 and the second conductive tool 30 may be connected in series to the negative electrode 50 of the rectifier power supply through a flexible wire or may be connected in series to the negative electrode 50 of the rectifier power supply through a rigid conductive member. The first conductive tool 20 and the second conductive tool 30 are made of conductive materials, and the first conductive tool 20 and the second conductive tool 30 are connected in parallel, that is, two branch currents are divided by a negative electrode 50 of a rectifier power supply and respectively pass through the first conductive tool 20 and the second conductive tool 30. In the electroplating process, the part 60 to be plated is clamped between the first conductive tool 20 and the second conductive tool 30, the part 60 to be plated comprises a first surface and a second surface, the first surface and the second surface are two opposite surfaces of the part to be plated, the first surface and the second surface are both provided with electrode contacts, the first surface of the part 60 to be plated is opposite to the first conductive tool 20, and the second surface of the part 60 to be plated is opposite to the second conductive tool 30. In a working state, the first conductive tool 20 is electrically connected with the electrode contact on the first surface of the member to be plated 60, and the second conductive tool 30 is electrically connected with the electrode contact on the second surface of the member to be plated 60. The rectifier power supply, the electroplating solution, the anode 10, the first conductive tool 20, the second conductive tool 30 and the to-be-plated part 60 form a complete electroplating loop together, and metal cations in the electroplating solution are deposited on the first surface and the second surface of the to-be-plated part 60 to form electrodes.
In view of the design principle of the to-be-plated part 60, the area and height of the first surface electrode of the to-be-plated part 60 are not consistent with the area and height of the second surface electrode, and if electrodes with different areas and heights are deposited on the first surface and the second surface of the to-be-plated part 60 at the same time, currents with different intensities need to be applied to the first surface and the second surface of the to-be-plated part 60, that is, currents with different intensities need to be applied to the first conductive tool 20 and the second conductive tool 30. Therefore, an adjustable resistor 70 is connected in series between the first conductive tool 20 and/or the second conductive tool 30 and the negative electrode 50 of the rectifier power supply. The adjustable resistor 70 may be a carbon film adjustable resistor, a force-sensitive adjustable resistor, a light-sensitive adjustable resistor, a wire-wound adjustable resistor, a pressure-sensitive adjustable resistor, a humidity-sensitive adjustable resistor, a metal film adjustable resistor, a gas-sensitive adjustable resistor, a composite film adjustable resistor, a metal glass uranium adjustable resistor, or the like.
The adjustable resistor 70 may be connected in series only between the first conductive fixture 20 and the negative electrode 50 of the rectifier power supply, and the current intensity on the first conductive fixture 20 is controlled by adjusting the resistance of the adjustable resistor 70, so as to change the current intensity on the first surface of the to-be-plated part 60. The adjustable resistor 70 may also be connected in series only between the second conductive tool 30 and the negative electrode 50 of the rectifier power supply, and the current intensity on the second conductive tool 30 is controlled by adjusting the resistance value of the adjustable resistor 70, so as to change the current intensity on the second surface of the to-be-plated part 60. Adjustable resistors 70 can also be connected in series between the first conductive tool 20 and the second conductive tool 30 and the negative electrode 50 of the rectifier power supply, so that a larger adjustment range can be obtained under the condition that the input current of the rectifier power supply is constant.
In an embodiment of the present invention, an electroplating apparatus includes: the rectifier power supply, the first conductive tool 20 and the second conductive tool 30; the first conductive tool 20 and the second conductive tool 30 are connected in series with a negative electrode 50 of a rectifier power supply, and the first conductive tool 20 and the second conductive tool 30 are connected in parallel. The first conductive tool 20 is used for being electrically connected with the first surface of the piece to be plated 60, and the second conductive tool 30 is used for being electrically connected with the second surface of the piece to be plated 60; an adjustable resistor 70 is connected in series between the first conductive tool 20 and/or the second conductive tool 30 and the negative electrode 50 of the rectifier power supply. Through setting up adjustable resistance 70, can realize the differentiation adjustment to the electric current on the electrically conductive frock 20 of first electrically conductive frock and/or the electrically conductive frock 30 of second, under the condition that only uses a rectifier power, also can satisfy the differentiation electroplating demand of waiting to plate a 60 first surface and second surface, saved cost of manufacture and subsequent maintenance cost.
Optionally, referring to fig. 1 to 2, the electroplating apparatus further includes an electroplating chamber, an anode 10; under the working condition: electroplating liquid is filled in the electroplating cavity; the first surface, the first conductive tool 20 and the anode 10 form a first electroplating loop, and the second surface, the second conductive tool 30 and the anode 10 form a second electroplating loop; the anode 10 is connected in series with the positive pole 40 of the rectifier power supply.
Specifically, as shown in fig. 1 to 2, the plating chamber is used to provide a plating generation site, and the plating chamber may be a closed type or a semi-closed type plating chamber. The electroplating cavity is filled with electroplating liquid, and the electroplating liquid comprises water-soluble metal salt and a buffering agent. In the electroplating process, one or more of copper powder, nickel powder, copper oxide powder, copper salt, tin salt or nickel salt can be added into the electroplating bath to maintain the concentration stability of the electroplating bath and ensure the continuity of the electroplating process.
The anode 10 is connected in series with the anode 40 of the rectifier power supply, the material of the anode 10 can be copper, nickel, etc., and metal cations can be precipitated in the electroplating process to supplement the metal cations in the electroplating solution. The number of anodes 10 can be set according to the actual requirements of the electroplating.
In a working state, the anode 10, the first conductive tool 20, the second conductive tool 30 and the to-be-plated part 60 are at least partially in the electroplating solution. The current of the rectifier power supply starts from the positive electrode and reaches the anode 10, metal cations are separated out from the anode 10, ion exchange is realized through electroplating solution, the metal cations are deposited and attached on the first surface or the second surface of the part to be plated 60, and the current returns to the negative electrode 50 of the rectifier power supply through the first conductive tool 20 or the second conductive tool 30, so that the conduction of an electroplating loop is realized. In the process, the total number of the electroplating loops is two, the first surface, the first conductive tool 20 and the anode 10 form a first electroplating loop, and the first electroplating loop is used for forming a plating layer on the first surface of the piece to be plated 60; the second surface, the second conductive tool 30 and the anode 10 form a second electroplating loop, and the second electroplating loop is used for forming a plating layer on the second surface of the piece to be plated 60.
By serially connecting the adjustable resistor 70 between the first conductive tool 20 and/or the second conductive tool 30 and the cathode 50 of the rectifier power supply, the current on the first electroplating loop and/or the second electroplating loop can be adjusted in a differentiated mode, the requirement for the differential electroplating of the first surface and the second surface of the piece to be plated 60 can be met under the condition that only one rectifier power supply is used, and the manufacturing cost and the subsequent maintenance cost are saved.
Alternatively, as shown with reference to fig. 1-2, the anode comprises a first anode plate 101 and a second anode plate 102; the first surface, the first conductive tool 20 and the first anode plate 101 form the first electroplating loop, and the second surface, the second conductive tool 30 and the second anode plate 102 form the second electroplating loop; the first anode plate 101 is disposed in parallel with the second anode plate 102.
Specifically, as shown in fig. 1 to 2, the anode 10 includes a first anode plate 101 and a second anode plate 102, the first anode plate 101 and the second anode plate 102 are respectively connected in series with the positive electrode 40 of the rectifier power supply, and the first anode plate 101 and the second anode plate 102 are connected in parallel. The first anode plate 101 and the second anode plate 102 can be respectively positioned at two sides of the piece to be plated 60, the first anode plate 101 is arranged opposite to the first base 201, the second anode plate 102 is arranged opposite to the second base 301, and the first anode plate 101 and the second anode plate 102 are parallel to each other, so that the consistency of the concentration of electroplating liquid at two sides of the piece to be plated 60 is improved, and the electroplating quality is favorably improved.
The structure of the first anode plate 101 and the second anode plate 102 may include: one or more of a planar structure, a net-shaped structure, a linear structure and a point structure. Preferably, the anode plate with a net-shaped structure or a dot matrix structure can be selected, and compared with the anode plate with a planar structure or the anode plate with a net-shaped structure or a dot matrix structure, the anode plate with a net-shaped structure or a dot matrix structure has better fluidity of electroplating solution and improved electroplating uniformity.
In a working state, the first anode plate 101, the second anode plate 102, the first conductive tool 20, the second conductive tool 30 and the to-be-plated part 60 are at least partially in the electroplating solution. The first surface, the first conductive tool 20 and the first anode plate 101 form a first electroplating loop, and the first electroplating loop is used for forming a coating on the first surface of the piece to be plated 60; the second surface, the second conductive tool 30 and the second anode plate 102 form a second electroplating loop, and the second electroplating loop is used for forming a plating layer on the second surface of the to-be-plated piece 60.
Optionally, the outer surface of the adjustable resistor 70 is provided with an insulating layer.
Specifically, in the electroplating process, the adjustable resistor 70 inevitably contacts the electroplating solution, and in order to prevent the adjustable resistor 70 from being corroded and plated, an insulating layer is arranged on the outer surface of the adjustable resistor 70, covers the adjustable resistor 70, prevents the electroplating solution and water vapor from invading into the adjustable resistor 70, and improves the durability of the adjustable resistor 70. The insulating layer can be made of teflon, rubber and other materials, and can also be formed on the outer surface of the adjustable resistor 70 by spraying insulating paint.
Optionally, the resistance value of the adjustable resistor 70 is adjusted in a range of 0 to 10 Ω.
Particularly, the resistance control range of adjustable resistor 70 can be selected according to the output current of the rectifier power supply and the current size that the product needs to be input, in the embodiment of the present invention, the resistance control range of adjustable resistor 70 is 0-10 Ω. When the adjustable resistors 70 are connected in series between the first conductive tool 20 and the second conductive tool 30 and the negative electrode 50 of the rectifier power supply, the adjustable resistors 70 corresponding to the resistance value adjusting ranges can be selected according to the difference between the first surface and the second surface of the workpiece 60 to be plated, and the resistance value adjusting ranges of the adjustable resistors 70 connected in series on the first conductive tool 20 and the second conductive tool 30 can be the same or different.
Optionally, referring to fig. 1 to fig. 2, the first conductive tool 20 includes a first base 201 and a first conductive probe 202 disposed on the first base 201; the second conductive tool 30 comprises a second base 301 and a second conductive probe 302 arranged on the second base 301; the first base 201 and the second base 301 are connected in series with the negative electrode 50 of the rectifier power supply respectively; when the first base 201 and the second base 301 are at a first relative position, a gap for loading and unloading the workpiece 60 is formed between the first conductive probe 202 and the second conductive probe 302; when the first base 201 and the second base 301 are in the second relative position, the first conductive probe 202 is electrically connected to the first surface, and the second conductive probe 302 is electrically connected to the second surface.
Specifically, as shown in fig. 1 to fig. 2, the first conductive tool 20 and the second conductive tool 30 are used for conducting a circuit between the negative electrode 50 of the rectifier power supply and an electrode contact of the to-be-plated part 60, and simultaneously, play a role in clamping and fixing the to-be-plated part 60. The first conductive tool 20 includes a first base 201 and a first conductive probe 202 disposed on the first base 201, and the first base 201 and the first conductive probe 202 are made of a conductive material. The first base 201 is used for bearing the first conductive probe 202, the first base 201 can be plate-shaped or column-shaped, and the first conductive probe 202 and the first base 201 can be assembled by welding, clamping, bolt connection and the like. Similarly, the second conductive tool 30 includes a second base 301 and a second conductive probe 302 disposed on the second base 301, and the second base 301 and the second conductive probe 302 are made of conductive materials. The second base 301 is used for carrying a second conductive probe 302, the second base 301 may also be plate-shaped or column-shaped, and the second conductive probe 302 and the second base 301 may be assembled by welding, clamping, bolting, and the like. The first conductive probe 202 and the second conductive probe 302 have small volumes, and can ensure the alignment precision when contacting with the electrode contacts on the first surface and the second surface of the workpiece 60. The arrangement positions and the number of the first conductive probes 202 and the second conductive probes 302 can be selected according to the distribution positions and the number of the electrode contacts on the first surface and the second surface of the workpiece 60, which is not limited by the embodiment of the present invention.
The first base 201 and the second base 301 have a first relative position and a second relative position therebetween. When the first base 201 and the second base 301 are in the first relative position, a gap for loading and unloading the workpiece 60 is formed between the first conductive probe 202 and the second conductive probe 302, and the workpiece 60 can be loaded and unloaded normally. When the first base 201 and the second base 301 are located at the second relative position, a clamping space is formed between the first base 201 and the second base 301, so that the workpiece 60 can be clamped and fixed. At this time, the first conductive probe 202 is electrically connected to the electrode contact of the first surface of the workpiece 60, and the second conductive probe 302 is electrically connected to the electrode contact of the second surface of the workpiece 60.
The embodiment of the utility model provides an in, the electroplating scheme is applicable in the scene of hanging plating, for example first base 201 and second base 301 hang and establish on the electroplating chamber, wait to plate 60 and be fixed between first base 201 and second base 301 by the centre gripping, wait to plate 60 and vertically place, utilize devices such as arms with first base 201, second base 301 and wait to plate that 60 removes to electroplating intracavity realization electroplating. The electroplating scheme can also be applied to a horizontal electroplating scene, wherein the piece to be electroplated 60 is horizontally placed and clamped and fixed between the first base 201 and the second base 301, and the first base 201 and the second base 301 horizontally transmit the piece to be electroplated 60 to the electroplating cavity.
The first base 201 and the second base 301 are switched between the first relative position and the second relative position, so that the workpiece 60 can be mounted, dismounted, clamped and fixed. The first base 201 and the second base 301 may be switched between the first relative position and the second relative position manually, or the switching of the positions of the first base 201 and the second base 301 may be controlled by a driving mechanism, which may be a motor, an air cylinder, or the like. A rotating shaft and a torsion spring may also be disposed between the first base 201 and the second base 301, the first base 201 and the second base 301 are hinged through the rotating shaft, and the first base 201 and the second base 301 are switched between the first relative position and the second relative position in a rotating manner by using the driving force of the torsion spring.
Optionally, an insulating layer is disposed on at least a portion of the outer surface of the first conductive tool 20 and at least a portion of the outer surface of the second conductive tool 30.
Specifically, in the electroplating process, the first conductive tool 20 and the second conductive tool 30 inevitably contact the electroplating solution, in order to prevent corrosion and plating-up phenomena of the first conductive tool 20 and the second conductive tool 30, an insulating layer is disposed on at least part of the outer surface of the first conductive tool 20 and at least part of the outer surface of the second conductive tool 30, the insulating layer at least partially covers the first conductive tool 20 and the second conductive tool 30, and only the ends of the first conductive probe 202 and the second conductive probe 302 are exposed, so as to ensure the stability of the electrical connection between the first conductive probe 202 and the electrode contact 302. Through setting up isolated insulation layer, can reduce the phenomenon that first electrically conductive frock 20 and the electrically conductive frock 30 of second corrodes, go up to plate, promote the durability. The insulating layer can be made of teflon, rubber and other materials, and can also be formed on the outer surfaces of the first conductive tool 20 and the second conductive tool 30 in a mode of spraying insulating paint.
Optionally, referring to fig. 1 to 2, the first conductive tool 20 further includes: a conductive connection member 80; the conductive connection 80 includes opposite first and second ends; the first end with the negative pole 50 joint of rectifier power, the second end with first base 201 fixed connection.
Specifically, as shown in fig. 1 to 2, in the embodiment of the present invention, the electroplating may be performed by a rack plating method. A support rod is arranged on the cathode 50 of the rectifier power supply, and the first base 201 is hung on the support rod, and particularly can be hung on the support rod through the conductive connecting piece 80. The conductive connector 80 includes a first end and a second end opposite to each other, and the first end may be provided with a hook, a chuck, etc. to be engaged with the support rod of the negative electrode 50 of the rectifier power supply. The second end is fixedly connected with the first base 201, and the assembly can be realized by adopting modes such as welding, riveting and the like. The second base 301 may be connected to the first base 201 through a hinge or the like. Through setting up electrically conductive connecting piece 80, first base 201 and second base 301 can realize the installation fast and dismantle, are convenient for wash and change the assembly line.
Optionally, referring to fig. 1 to fig. 2, the adjustable resistor 70 is disposed on the first base 201 and is fixedly connected to the first base 201.
Specifically, as shown in fig. 2, the first base 201 is hung on the support rod of the negative electrode 50 of the rectifier power supply through the conductive connecting member 80, and has good load-bearing capacity and stability. Therefore, the adjustable resistor 70 is disposed on the first base 201 and fixed by bonding or welding, so that the stability of mounting the adjustable resistor 70 can be improved.
As shown in fig. 1, the adjustable resistor 70 may also be disposed between the second conductive tool 30 and the negative electrode 50 of the rectifier power supply, and a reinforcing member may be disposed between the second conductive tool 30 and the negative electrode 50 of the rectifier power supply to improve the stability of the installation of the adjustable resistor 70.
The embodiment of the utility model also provides an electroplating system, including foretell electroplating device.
In the embodiment of the present invention, the electroplating system adopts the above electroplating device, and the electroplating device comprises: the device comprises a rectifier power supply, a first conductive tool 20 and a second conductive tool 30; the first conductive tool 20 and the second conductive tool 30 are connected in series with the negative electrode 50 of the rectifier power supply, and the first conductive tool 20 and the second conductive tool 30 are connected in parallel. The first conductive tool 20 is used for being electrically connected with a first surface of the piece to be plated 60, and the second conductive tool 30 is used for being electrically connected with a second surface of the piece to be plated 60; an adjustable resistor 70 is connected in series between the first conductive tool 20 and/or the second conductive tool 30 and the negative electrode 50 of the rectifier power supply. Through setting up adjustable resistance 70, can realize the differentiation adjustment to the electric current on the electrically conductive frock 20 of first electrically conductive frock and/or the electrically conductive frock 30 of second, under the condition that only uses a rectifier power, also can satisfy the differentiation electroplating demand of waiting to plate a 60 first surface and second surface, saved cost of manufacture and subsequent maintenance cost.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one of 8230, and" comprising 8230does not exclude the presence of additional like elements in a process, method, article, or apparatus comprising the element.
The above description is for illustrative purposes only and is not intended to be limiting, and the present invention is not limited to the above embodiments, and many modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.
Claims (10)
1. An electroplating apparatus, comprising: the device comprises a rectifier power supply, a first conductive tool and a second conductive tool;
the first conductive tool and the second conductive tool are connected in series with the negative electrode of the rectifier power supply, and the first conductive tool and the second conductive tool are connected in parallel;
the first conductive tool is used for being electrically connected with a first surface of a piece to be plated, the second conductive tool is used for being electrically connected with a second surface of the piece to be plated, and the first surface and the second surface are two opposite surfaces of the piece to be plated;
and an adjustable resistor is connected in series between the first conductive tool and the negative electrode of the rectifier power supply and/or between the second conductive tool and the negative electrode of the rectifier power supply.
2. The electroplating apparatus of claim 1, further comprising an electroplating chamber, an anode;
under the working condition: electroplating liquid is filled in the electroplating cavity;
the first surface, the first conductive tool and the anode form a first electroplating loop, and the second surface, the second conductive tool and the anode form a second electroplating loop;
the anode is connected in series with the anode of the rectifier power supply.
3. The electroplating apparatus of claim 2, wherein the anode comprises a first anode plate and a second anode plate;
the first surface, the first conductive tool and the first anode plate form the first electroplating loop, and the second surface, the second conductive tool and the second anode plate form the second electroplating loop;
the first anode plate and the second anode plate are arranged in parallel.
4. The electroplating apparatus according to claim 1, wherein the outer surface of the adjustable resistor is provided with an insulating layer.
5. The plating apparatus as recited in claim 1, wherein the adjustable resistor has a resistance value adjusted in a range of 0 to 10 Ω.
6. The electroplating device according to claim 1, wherein the first conductive tool comprises a first base and a first conductive probe arranged on the first base;
the second conductive tool comprises a second base and a second conductive probe arranged on the second base;
the first base and the second base are respectively connected with the negative pole of the rectifier power supply in series;
when the first base and the second base are at a first relative position, a gap for loading and unloading the piece to be plated is formed between the first conductive probe and the second conductive probe;
when the first base and the second base are at a second relative position, the first conductive probe is electrically connected with the first surface, and the second conductive probe is electrically connected with the second surface.
7. The electroplating apparatus according to claim 1, wherein an insulating layer is disposed on at least part of the outer surface of the first conductive tool and at least part of the outer surface of the second conductive tool.
8. The plating apparatus as recited in claim 6, wherein the first conductive tool further comprises: a conductive connection member;
the conductive connector includes opposing first and second ends;
the first end with the negative pole joint of rectifier power, the second end with first base fixed connection.
9. The electroplating apparatus as claimed in claim 6, wherein the adjustable resistor is disposed on the first base and is fixedly connected to the first base.
10. An electroplating system, comprising: the plating apparatus as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221816287.1U CN218321695U (en) | 2022-07-14 | 2022-07-14 | Electroplating device and electroplating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221816287.1U CN218321695U (en) | 2022-07-14 | 2022-07-14 | Electroplating device and electroplating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218321695U true CN218321695U (en) | 2023-01-17 |
Family
ID=84870088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221816287.1U Active CN218321695U (en) | 2022-07-14 | 2022-07-14 | Electroplating device and electroplating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218321695U (en) |
-
2022
- 2022-07-14 CN CN202221816287.1U patent/CN218321695U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7060391B2 (en) | Current collector structure and methods to improve the performance of a lead-acid battery | |
| CN100378252C (en) | Partial plating method and its apparatus | |
| JPS58161785A (en) | Electrode clad with lead or lead alloy and manufacture | |
| CN108140845A (en) | Metal porous body, fuel cell and the method for manufacturing metal porous body | |
| Ghaemi et al. | New advances on bipolar rechargeable alkaline manganese dioxide–zinc batteries | |
| CN218321695U (en) | Electroplating device and electroplating system | |
| CN111501081A (en) | Jig for rack plating and tin plating process | |
| CN115787046B (en) | Roller type film electroplating equipment | |
| CN111118586A (en) | Electroplating fixture and electroplating device | |
| CN210314518U (en) | Plastic part electroplating pre-dipping device | |
| CN215251264U (en) | Anodic oxidation hanger | |
| CN202284230U (en) | Plating bath | |
| CN201990752U (en) | Anode for improving electroplating uniformity | |
| CN213295553U (en) | Transfer device, matching structure and electroplating system | |
| CN108796591A (en) | Electrode structural body | |
| CN2062738U (en) | Electroplate hanger | |
| CN111235613A (en) | Auxiliary anode for electroplating and auxiliary anode device for electroplating | |
| CN208183087U (en) | A kind of titanium painting ruthenium net anode plate of insoluble anode method electrolytic preparation high pure metal | |
| CN211284613U (en) | Polishing hanger | |
| CN215404616U (en) | Electroplating tool for sliding rail with I-shaped structure | |
| CN217127578U (en) | Electroplating carrier and electroplating system | |
| CN218372603U (en) | Insoluble material anode plate | |
| CN220413581U (en) | Large-plane aluminum plate electroplating device | |
| CN212293819U (en) | Jig for rack plating | |
| CN219430167U (en) | Integrated electroplating flower basket clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |