200427399 玖、發明說明： 【發明所屬之技術領域】 發明背景 本發明係與例如通訊、光纖和電腦設備與其等之 類似物的電子設備之屏蔽元件有關。為了將該等設備的 元件以及與其連接的元件，由可能干擾其等之運作的電 磁場加以遮蔽，該屏蔽元件係有必需的。 【先前技術】 習知技藝中，這種型式的屏蔽元件係藉著將金屬薄 片切割與彎曲成所需的覆蓋式外形而形成。除此之外， 屏蔽元件已經藉著塑膠由射出模製並接著鍍上金屬以 提供必需屏蔽作用來形成。 本發明係藉由提供一更經濟之製造此種類型元件 的方法之這些習知技藝的改良。 【發明内容】 發明摘要 因此，本發明係為一種用於製造一屏蔽元件的方 法，該屏蔽元件係藉著在一以壓力或真空塑成屏蔽元件 的形狀所形成之薄片進行催化與電鍍作用，而提供用於 電子設備之EMI (電磁干擾）屏蔽作用。 該方法包含已知在製造程序期間蝕刻該作為屏蔽 元件之部件的步驟，但是該由聚合物薄片所形成之部件 係在一顯微層級下將其表面粗链化，以使得一金屬層可 5 200427399 以附著於其上。該經蝕刻表面然後被以一催化溶液催 化，以使其可以被無電極電鍍作用電鍍。 無電極電鍍作用係被用來將第一金屬層沈積在該 部件的表面上的。該第一金屬層可以是包括有銅、鎳、 鈷、銀、金或錫之任何導電性金屬，並使得該部件成為 導電性的，因而其可以在接下來的電解電鍍步驟中用來 作為陰極。 最後，電解電鍍作用係被用來將第二金屬層沈積 在該部件的表面之第一金屬層上。第二金屬層可以是包 括有鎳、錫、銅、鋅或鉻之任何的電解金屬。 本發明將現在將在下述中被更詳細地描述。 【實施方式】 較佳具體例的詳細描述 依據本發明的方法所製造的屏蔽元件在電子工業 中具有許多不同的用途，其中其等通常用於EMI屏 蔽。同樣地，其等具有許多不同的形狀和結構，以使其 等可以進行在特別的應用中所需要的屏蔽功能。舉例來 說，一屏蔽元件可以作為在一電子設備中之電路板上的 一個晶片之外蓋，或者其可以是在例如一個人電腦的電 子設備裡的一整個元件之外蓋或外殼。除此之外，該屏 蔽元件可以是一連接至一電子設備的一部份之纜線的 密封殼。簡而言之，本發明並不限於一屏蔽元件或的這 些特定的變化例。 6 200427399 依據本發明，該屏蔽元件係由 或真空模製，並非如習知技藝所建=合物材料而被壓力 射出成型的。該微薄片形式之聚人之加工私序一般為 式，其包括冑TEFLON® (聚四氟为材料可以是任何樣 烯、但；％其係較佳地為AB S (内冑) &酉日或聚丙 聚物）、HIPS (高衝擊性聚苯乙知-丁二烯-苯乙稀共 歸）或PC-ABS (聚碳 酸酯 ABS)，其等係較佳地易於 、進行標準的催化和電 鍍程序。適當的 ABS塑膠係可％ J 取自 Elkhart，200427399 (1) Description of the invention: [Technical field to which the invention belongs] BACKGROUND OF THE INVENTION The present invention relates to shielding elements of electronic equipment such as telecommunications, optical fibers, and computer equipment and the like. This shielding element is necessary in order to shield the components of these devices and the components connected to them from electromagnetic fields that may interfere with their operation. [Prior Art] In the conventional art, this type of shielding element is formed by cutting and bending a metal sheet into a desired covering shape. In addition to this, the shielding element has been formed by injection molding from plastic and then plated with metal to provide the necessary shielding. The present invention is an improvement on these conventional techniques by providing a more economical method of manufacturing this type of element. SUMMARY OF THE INVENTION Therefore, the present invention is a method for manufacturing a shielding element, which is catalyzed and electroplated by a sheet formed by forming a shape of the shielding element under pressure or vacuum. Provides EMI (electromagnetic interference) shielding for electronic equipment. The method includes the steps known to etch the part as a shielding element during the manufacturing process, but the part formed from the polymer sheet is roughened on its surface at a micro level to make a metal layer 200427399 to attach to it. The etched surface is then catalyzed with a catalytic solution so that it can be plated by electroless plating. Electroless plating is used to deposit a first metal layer on the surface of the component. The first metal layer may be any conductive metal including copper, nickel, cobalt, silver, gold, or tin, and makes the part conductive, so it can be used as a cathode in the subsequent electrolytic plating step. . Finally, electrolytic plating is used to deposit a second metal layer on the first metal layer on the surface of the part. The second metal layer may be any electrolytic metal including nickel, tin, copper, zinc, or chromium. The invention will now be described in more detail in the following. [Embodiment] Detailed description of preferred specific examples The shielding elements manufactured according to the method of the present invention have many different uses in the electronics industry, and among them, they are generally used for EMI shielding. As such, they have many different shapes and structures so that they can perform the shielding function required in a particular application. For example, a shielding element may be used as a chip cover on a circuit board in an electronic device, or it may be a whole element cover or housing in an electronic device such as a personal computer. In addition, the shielding element may be a hermetically sealed case of a cable connected to a part of an electronic device. In short, the invention is not limited to a specific example of a shielding element or these. 6 200427399 According to the present invention, the shielding element is made of or vacuum-molded, and is not pressure-molded as a composite material built by conventional techniques. The processing sequence of the polymer in the form of microsheets is generally formula, which includes 胄 TEFLON® (the material of PTFE can be any kind of olefin, but; it is preferably AB S (internal 胄) & 酉Japan or polypropylene polymer), HIPS (high impact polystyrene-butadiene-styrene co-homing) or PC-ABS (polycarbonate ABS), which are preferably easy to perform standard catalysis And plating procedures. Proper ABS plastics can be taken from Elkhart,
Indiana， USA 的 Bayer 公司卢/f 止 1 生產的 Lustran 752， 其係為厚度為17密耳（0017#· ^ 升1 7吋；0.43毫米）之高衝擊 1±冋光澤f生、黑色的ABS塑膠薄片。LUSTRAN⑧係 為Bayer公司所擁有的註冊商標（美國註冊號第 720，161 號）。 為了將屏蔽元件形成一所需之三度空間幾何形 狀’該聚合物材料薄片係被切割成一可以配合所使用的 裝置（也就是，一壓力或真空模製裝置）之尺寸。該薄 片係被略為加熱，以使其可被軟化並輕易地變形，併且 女置於在該成形裝置之模具兩個鑄模之間。該模具然後 被關閉’而壓力或真空係被用來使得該聚合物薄片會與 模具的形狀一致。藉此所獲得的”部件”在自模具上移 除時會維持其之形狀。可以瞭解的是該”部件，，將會具 有成形部分（其最終將會成為所製造的屏蔽元件）與 非成形部分（此係為該薄片未在該模製裝置中變形的 200427399 區域）。後者的部分在電鍍程序結束的時候可能會自 需的屏蔽元件切除。 在該製造方法中之接下來的步驟係清潔該將被電 又的σ卩件以移除任何的油、脂或在形成期間可能需要之 其他污染物。舉例來說，該部件可藉由將其在室溫下浸 ，包於卜丙醇（丙醇）三十秒，然後以流動的DI (去離 子）水沖洗，以移除在浸泡之後殘留在該部件上的任何 ’酉精薄膜。更概略來說，例如酒精之任何 的溶劑，都可被用於清洗步驟中。 八 ^ 該製造方法會進行一蝕刻步驟，在其中部件的表面 會在一顯微層級下被粗糙化，以將其整備以進行催化與 錢作用。一鉻酸/硫酸餘刻溶液可被用於此一目的。 此種溶液可藉由將3 80克的鉻酸溶解於足以產生 具有體積為83 0亳升的溶液之DI水而製備。然後， 添加170毫升的濃硫酸而得到1升的體積。 當該破部件被浸泡大約七分鐘時，所產生的溶液係 被加熱到7 〇 °c，並機械地攪拌。該部件然後被移出並 在流動的DI水中沖洗，直到在其之表面不再具有鉻。Lustran 752, manufactured by Bayer, Inc. of Indiana, USA. It is a high-impact, high-impact, black ABS with a thickness of 17 mils (0017 # · ^ 1 17 inches; 0.43 mm), black. Plastic sheet. LUSTRAN⑧ is a registered trademark owned by Bayer Corporation (US Registration No. 720, 161). In order to form the shielding element into a desired three-dimensional spatial geometry, the polymer material sheet is cut to a size that can be used with the device used (i.e., a pressure or vacuum molding device). The sheet is slightly heated so that it can be softened and easily deformed, and the woman is placed between the two molds of the mold of the forming apparatus. The mold is then closed 'and a pressure or vacuum system is used to make the polymer sheet conform to the shape of the mold. The "part" thus obtained will maintain its shape when removed from the mold. What can be understood is that the "part" will have a shaped part (which will eventually become the manufactured shielding element) and an unformed part (this is the 200427399 area where the sheet is not deformed in the molding device). The latter Some of the shielding elements may be removed at the end of the plating process. The next step in the manufacturing method is to clean the sigma that will be recharged to remove any oil, grease or during formation Other contaminants that may be required. For example, the part can be immersed in room temperature for 30 seconds by immersion in propanol (propanol), and then rinsed with flowing DI (deionized) water to Any thin film remaining on the part after immersion is removed. More generally, any solvent such as alcohol can be used in the cleaning step. The manufacturing method performs an etching step. The surface of the part will be roughened under a micro level to prepare it for catalysis and money. A chromic acid / sulfuric acid solution can be used for this purpose. Such a solution can be prepared by applying 3 80 g Chromic acid was prepared by dissolving in DI water sufficient to produce a solution with a volume of 8300 liters. Then, 170 ml of concentrated sulfuric acid was added to obtain a volume of 1 liter. When the broken part was soaked for about seven minutes, the produced The solution was heated to 70 ° C and mechanically stirred. The part was then removed and rinsed in flowing DI water until it no longer had chromium on its surface.
在下一個步驟中，即，該催化步驟，該部件之該經 <虫刻的表面係被催化以使其可被無電極電鑛作用所電 鍍。一商業上可取得的催化劑可被用於此一目的中。舉 例來5兒’可以使用取自於Marlboro， Massachusetts 5 USA 的 Shipley 公司之 Shipley Cataposit 44。 CATAPOSIT® 係為 Philadelphia，Pennsylvania，USA 200427399 的 Rohm and Haas公司所擁有的註冊商標（美國註冊 號第 1，〇31，891 號）。 一用於本製造方法中之催化溶液，係藉著以充份的 DI水稀釋 50毫升的 Shipley Cataposit 44，以產生 3 0 0毫升的體積。當該被部件被浸泡一分鐘時，所產生 的溶液係被加熱到 4 0 °C 並機械地授拌。該部件然後被 移出並依序在三個容器 DI水中浸泡，該部件係被留置 於第三容器中直到進行該製造方法的下一步驟。In the next step, that is, the catalytic step, the < insect-etched surface system of the part is catalyzed so that it can be electroplated by an electroless electroless process. A commercially available catalyst can be used for this purpose. For example, 5 'can use Shipley Cataposit 44 from Shipley Company of Marlboro, Massachusetts 5 USA. CATAPOSIT® is a registered trademark owned by Rohm and Haas Corporation of Philadelphia, Pennsylvania, USA 200427399 (U.S. Registration No. 1, 031, 891). A catalytic solution used in this manufacturing method was produced by diluting 50 ml of Shipley Cataposit 44 with sufficient DI water to produce a volume of 300 ml. When the part is soaked for one minute, the resulting solution is heated to 40 ° C and mechanically mixed. The part is then removed and immersed in three containers of DI water sequentially, and the part is left in a third container until the next step of the manufacturing method is performed.
Shipley Cataposit 44係使用一錫和la的混合物來 作為催化劑。運用把、金、銀或舶的其他催化劑也可在 實際上被用於本發明中。 下一個步驟係為一無電極電鍍步驟。一商業上可取 得的無電極電鍍溶液可被用於此一目的中。舉例來說， 可以使用取自於 Waterbury， Connecticut， USA 的 MacDermid 公司之 MacDermid Ultra Dep 1000 無電極 銅電解溶液。為了要進行無電極電鍍步驟，可以製備適 田數量的MacDermid Ultra Dep 1 000無電極銅電解溶 液’將其加熱到50°C，並機械地攪拌同時預備的催化 材料係被進行電鍍1 5到2〇分鐘以將該溶液活化。該 預備的材料然後被移除，而該將被電鑛的部件然後被 /又在仍然正被機械地攪拌的溶液中，並電鍍大約七分 4里。該部件然後被移除並在流動的DI水下沖洗。 9 200427399 或者，無電極電鍍步驟可以在不背離本發明的範圍 下’用以鎳、姑、銀、金或錫為基礎無電極電鑛溶液來 進行。 本發明的製造方法的最後一個步驟係為一電解電 鑛步驟。一商業上可取得的電解電鍍溶液可被用於此一 目的中。舉例來說，可以使用也是取自於Waterbury，Shipley Cataposit 44 uses a mixture of tin and la as a catalyst. Other catalysts, such as gold, silver, or silver, can also be practically used in the present invention. The next step is an electrodeless plating step. A commercially available electrodeless plating solution can be used for this purpose. For example, a MacDermid Ultra Dep 1000 electrodeless copper electrolytic solution from MacDermid Corporation of Waterbury, Connecticut, USA can be used. In order to perform the electrodeless plating step, a suitable amount of MacDermid Ultra Dep 1 000 electrodeless copper electrolytic solution can be prepared 'heated to 50 ° C and mechanically stirred while the prepared catalytic material is electroplated 1 5 to 2 0 minutes to activate the solution. The prepared material is then removed, and the parts to be mined are then / are in the solution still being mechanically stirred and electroplated for about seven minutes and four miles. The part was then removed and rinsed under flowing DI water. 9 200427399 Alternatively, the electrodeless plating step can be performed with a nickel-, nickel-, silver-, gold-, or tin-based electrodeless ore solution without departing from the scope of the present invention. The last step of the manufacturing method of the present invention is an electrolytic ore step. A commercially available electrolytic plating solution can be used for this purpose. For example, you can also use Waterbury,
Connecticut ’ USA 的 MacDermid 公司之 MacDermidConnecticut ’MacDermid of MacDermid
Barrett SN (胺磺酸鎳電解溶液）。為了要進行無電極電 鐘步驟’可以製備適當數量的MacDermid Barrett SN 溶液，將其加熱到50°C，並調整至4·〇的pH值。一 個‘準的赫爾電池鎳陽極然後被安裝在被機械地攪拌 之該電解電鑛溶液中。 該部件是然後以2.0安培電鍍大約2分鐘，旋轉 180 ，再以2·0安培電鍍大約另外的2分鐘。該部 件^後n溶液中移除，在流動# di纟下沖洗；並在 8〇°C下乾燥30分鐘。 雖然錄因為其之耐钱性而係最普遍地用於電鍍作 用中’該電解電鍍步驟可以任擇地用來在部件施上加一Barrett SN (nickel sulfamate electrolytic solution). To perform the electrodeless clock step ', an appropriate amount of MacDermid Barrett SN solution can be prepared, heated to 50 ° C, and adjusted to a pH of 4.0. A ‘quasi-Hull ’s nickel anode is then installed in the electrolytic power ore solution which is mechanically stirred. The part was then plated at 2.0 amps for approximately 2 minutes, rotated 180 degrees, and plated at 2.0 amps for approximately another 2 minutes. The part was removed from the solution, rinsed under flow #di 纟; and dried at 80 ° C for 30 minutes. Although it is most commonly used in electroplating because of its durability, the electrolytic plating step can optionally be used to add one to the component.
層錫_ #或鉻。所有的這些金屬都可用於提供EMI 屏蔽作用。 一針對上述内容所進行的修改對於習於此藝者而 °將曰疋顯而易知的’但是其不會將本發明修改至超 過隨附的申請專利範圍之範圍。 10 200427399Layer tin_ # or chromium. All of these metals can be used to provide EMI shielding. A modification to the above will be obvious to those skilled in the art, but it will not modify the invention beyond the scope of the accompanying patent application. 10 200427399