CN108930036A - A kind for the treatment of process after extra thin copper foil preparation - Google Patents
A kind for the treatment of process after extra thin copper foil preparation Download PDFInfo
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- CN108930036A CN108930036A CN201810768903.2A CN201810768903A CN108930036A CN 108930036 A CN108930036 A CN 108930036A CN 201810768903 A CN201810768903 A CN 201810768903A CN 108930036 A CN108930036 A CN 108930036A
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- copper foil
- layer
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- foil
- processing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Abstract
The invention discloses the treatment process after a kind of preparation of extra thin copper foil, it is related to copper foil preparation technical field, treatment process after extra thin copper foil preparation, comprising the following steps: copper foil curing process → copper foil hair side zinc-plated processing → copper foil surface Passivation Treatment → painting silane coupling agent processing → copper foil drying and processing → copper foil slitting treatment；S1, copper foil curing process: depositing one layer of fine and close metallic copper in the warty particulate interspaces of roughened layer, to increase the contact surface of roughened layer Yu hair foil matrix, to reduce the roughness of roughening layer surface.The copper particle of one layer of warty is electroplated in copper foil hair side by the present invention, it not only can increase the surface area of copper foil hair side, mechanical fasteners effect can also be generated with insulating resin baseplate material, after curing process, though roughness has reduction, but the phenomenon that because of the contact area for increasing roughened layer Yu hair foil, the adhesion strength of process layer and dielectric substrate material being caused but to improve, being inherently eliminated process layer and the layering of hair foil.
Description
Technical field
Treatment process the present invention relates to copper foil preparation technical field, after specially a kind of extra thin copper foil preparation.
Background technique
Copper foil is a kind of negative matter electrolysis material, and one layer be deposited on circuit board substrate layer is thin, continuous metal foil,
Its electric conductor as PCB.It is easy to be bonded in insulating layer, receives printing protective layer, forms circuit patterns after corrosion.
Copper foil have low surface oxygen characteristic, can adhere to various different substrate materials, such as metal, insulating materials etc., possess
Wider temperature use scope.Be mainly used in electromagnetic shielding and it is antistatic, copper-foil conducting electricity is placed in substrate surface, in conjunction with Metal Substrate
Material has excellent conduction, and provides the effect of electromagnetic shielding.Can be divided into: self-adhesion copper foil double lead copper foil, singly leads copper foil etc.
.Electron level copper foil (99.7% or more purity, thickness 5um-105um) is one of basic material of electronics industry electronics and information industry
The usage amount of fast development, electron level copper foil is increasing, and product is widely used in industrial calculator, communication apparatus, QA and sets
Standby, lithium-ions battery, commercial television machine, video recorder, CD player, duplicator, phone, air conditioner, automobile electrical sub-portion
Part, game machine etc..Domestic and international market increasingly increases electron level copper foil, the demand of especially high-performance electronic grade copper foil.It is related
Professional institution's prediction, by 2015, China Electronics's grade copper foil domestic demand amount was up to 300,000 tons, and China will become the world and print
The maximum manufacture ground of circuit board and copper foil base, electron level copper foil especially high-performance foil market are good.
Copper foil is critical conductive material in lithium ion battery and printed circuit board.Currently, most copper in the market
Foil is used on lithium ion battery negative material.As lithium ion battery is towards high capacity, slimming, densification, high speed
Change direction to develop, copper foil is also towards with ultra-thin, low profile (copper foil surface roughness is 2 μm or less), high-intensitive, high ductibility
Etc. the high performance direction of high-quality develop, and its performance and copper foil structure and surface treatment are closely related.Currently, advanced copper foil
Production technology and copper foil surface processing technique are all monopolized by the U.S. and Japan.
The process of existing extra thin copper foil preparation mainly has pickling, roughening, solidification, ashing and passivation, spraying silane, drying
Etc. processes.
Postprocessing working procedures-pretreatment
Copper foil is polluted due to being easy in transport and storing process by grease, sweat mark etc., and surface-active is big, is easy in table
Face generates oxide layer, so copper foil must carry out oil removing, pickling processes before roughening treatment.
Pretreated copper foil, if directly pressed with insulating resin substrate, the adhesion strength of copper foil and substrate is not high, holds
It is easy to fall off；In order to increase the cohesive force of copper foil and substrate, it is necessary to carry out roughening curing process to hair side of the copper foil in conjunction with substrate.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides the treatment process after a kind of preparation of extra thin copper foil, pretreatment is solved
Copper foil afterwards, if directly pressed with insulating resin substrate, the adhesion strength of copper foil and substrate is not high, the problem of being easy to fall off.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: the processing work after a kind of preparation of extra thin copper foil
Skill, comprising the following steps: copper foil curing process → copper foil hair side zinc-plated processing → copper foil surface Passivation Treatment → painting is silane coupled
Agent processing → copper foil drying and processing → copper foil slitting treatment；
S1, copper foil curing process: one layer of fine and close metallic copper is deposited, in the warty particulate interspaces of roughened layer to increase roughened layer
With the contact surface of hair foil matrix, it is roughened the roughness of layer surface with reduction；
S2, copper foil hair side zinc-plated processing: copper foil hair side forms one layer of barrier layer, by zinc-plated processing to improve copper foil in nature
Anti-aging capability in air；
S3, copper foil surface Passivation Treatment: the copper foil behind plating barrier layer carries out surface passivation with chromatedsolution, makes copper foil surface shape
Layer based on Cheng Yige makes copper foil will not be because directly contacting due to oxidation stain with air, to improve the heat-resisting of copper foil
Property, to extend the shelf life of copper foil；
S4, it applies silane coupling agent processing: silane is sprayed in anti-oxidation processing rear surface, to improve the anti-oxidant energy under copper foil room temperature
Power, and in high temperature pressing plate, silane can make copper foil and resin base material combine more preferably by coupling, to improve peel strength.
S5, copper foil drying and processing: copper foil is dried at not less than 100 DEG C；
S6, copper foil slitting treatment: for different demands, cutting point is carried out to the quality of finished copper foil, breadth, weight demands
Class, and package.
Preferably, the copper thickness is less than 12 μm.
Preferably, copper foil chromate and zinc solution in the copper foil surface Passivation Treatment of the S3, after plating barrier layer
Carry out surface passivation, the layer for forming copper foil surface based on chromium zinc.
(3) beneficial effect
The present invention provides a kind of extra thin copper foil preparation after treatment process, have it is following the utility model has the advantages that
The present invention copper foil hair side be electroplated one layer of warty copper particle, not only can increase the surface area of copper foil hair side, moreover it is possible to it is exhausted
Edge resin substrate material generates mechanical fasteners and acts on, after curing process, though roughness has reduction, because increasing roughened layer and hair
The contact area of foil causes the adhesion strength of process layer and dielectric substrate material but to improve, has been inherently eliminated process layer
The phenomenon that being layered with hair foil.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
The present invention provides a kind of technical solution:
Embodiment one:
Treatment process after a kind of preparation of extra thin copper foil, comprising the following steps: copper foil curing process → copper foil hair side zinc-plated processing
→ copper foil surface Passivation Treatment → painting silane coupling agent processing → copper foil drying and processing → copper foil slitting treatment；
S1, copper foil curing process: one layer of fine and close metallic copper is deposited, in the warty particulate interspaces of roughened layer to increase roughened layer
With the contact surface of hair foil matrix, to reduce the roughness of roughening layer surface, after microcosmic upper copper foil hair side roughening treatment, foil face is concave-convex
Injustice rises and falls greatly, and copper foil surface is flatter after cured processing, after curing process, though roughness has reduction, because increasing
The contact area of roughened layer and hair foil, causes the adhesion strength of process layer and dielectric substrate material but to improve, fundamentally
The phenomenon that eliminating process layer and the layering of hair foil；
S2, copper foil hair side zinc-plated processing: copper foil hair side forms one layer of barrier layer, by zinc-plated processing to improve copper foil in nature
Anti-aging capability in air, appearance, which seems, after copper foil is zinc-plated has graying feeling, through this ash of storage after a period of time
Color can be converted into brassy, plate the more copper foils of zinc are then more yellow；
S3, copper foil surface Passivation Treatment: the copper foil behind plating barrier layer carries out surface passivation with chromatedsolution, makes copper foil surface shape
Layer based on Cheng Yige makes copper foil will not be because directly contacting due to oxidation stain with air, to improve the heat-resisting of copper foil
Property, to extend the shelf life of copper foil, 3 months shelf lifes can be reached；
S4, it applies silane coupling agent processing: silane is sprayed in anti-oxidation processing rear surface, to improve the anti-oxidant energy under copper foil room temperature
Power, and in high temperature pressing plate, silane can make copper foil and resin base material combine more preferably by coupling, to improve peel strength.
S5, copper foil drying and processing: copper foil is dried at not less than 100 DEG C；
S6, copper foil slitting treatment: for different demands, cutting point is carried out to the quality of finished copper foil, breadth, weight demands
Class, and package.
Embodiment two:
Treatment process after a kind of preparation of extra thin copper foil, comprising the following steps: copper foil curing process → copper foil hair side zinc-plated processing
→ copper foil surface Passivation Treatment → painting silane coupling agent processing → copper foil drying and processing → copper foil slitting treatment；
S1, copper foil curing process: one layer of fine and close metallic copper is deposited, in the warty particulate interspaces of roughened layer to increase roughened layer
With the contact surface of hair foil matrix, to reduce the roughness of roughening layer surface, after microcosmic upper copper foil hair side roughening treatment, foil face is concave-convex
Injustice rises and falls greatly, and copper foil surface is flatter after cured processing, after curing process, though roughness has reduction, because increasing
The contact area of roughened layer and hair foil, causes the adhesion strength of process layer and dielectric substrate material but to improve, fundamentally
The phenomenon that eliminating process layer and the layering of hair foil；
S2, copper foil hair side zinc-plated processing: copper foil hair side forms one layer of barrier layer, by zinc-plated processing to improve copper foil in nature
Anti-aging capability in air, appearance, which seems, after copper foil is zinc-plated has graying feeling, through this ash of storage after a period of time
Color can be converted into brassy, plate the more copper foils of zinc are then more yellow；
S3, copper foil surface Passivation Treatment: the copper foil behind plating barrier layer carries out surface passivation with chromatedsolution, makes copper foil surface shape
Layer based on Cheng Yige makes copper foil will not be because directly contacting due to oxidation stain with air, to improve the heat-resisting of copper foil
Property, to extend the shelf life of copper foil, 3 months shelf lifes can be reached；
S4, it applies silane coupling agent processing: silane is sprayed in anti-oxidation processing rear surface, to improve the anti-oxidant energy under copper foil room temperature
Power, and in high temperature pressing plate, silane can make copper foil and resin base material combine more preferably by coupling, to improve peel strength.
S5, copper foil drying and processing: copper foil is dried at not less than 150 DEG C；
S6, copper foil slitting treatment: for different demands, cutting point is carried out to the quality of finished copper foil, breadth, weight demands
Class, and package.
Embodiment three:
Treatment process after a kind of preparation of extra thin copper foil, comprising the following steps: copper foil curing process → copper foil hair side zinc-plated processing
→ copper foil surface Passivation Treatment → painting silane coupling agent processing → copper foil drying and processing → copper foil slitting treatment；
S1, copper foil curing process: one layer of fine and close metallic copper is deposited, in the warty particulate interspaces of roughened layer to increase roughened layer
With the contact surface of hair foil matrix, to reduce the roughness of roughening layer surface, after microcosmic upper copper foil hair side roughening treatment, foil face is concave-convex
Injustice rises and falls greatly, and copper foil surface is flatter after cured processing, after curing process, though roughness has reduction, because increasing
The contact area of roughened layer and hair foil, causes the adhesion strength of process layer and dielectric substrate material but to improve, fundamentally
The phenomenon that eliminating process layer and the layering of hair foil；
S2, copper foil hair side zinc-plated processing: copper foil hair side forms one layer of barrier layer, by zinc-plated processing to improve copper foil in nature
Anti-aging capability in air, appearance, which seems, after copper foil is zinc-plated has graying feeling, through this ash of storage after a period of time
Color can be converted into brassy, plate the more copper foils of zinc are then more yellow；
S3, copper foil surface Passivation Treatment: the copper foil behind plating barrier layer carries out surface passivation with chromatedsolution, makes copper foil surface shape
Layer based on Cheng Yige makes copper foil will not be because directly contacting due to oxidation stain with air, to improve the heat-resisting of copper foil
Property, to extend the shelf life of copper foil, 3 months shelf lifes can be reached；
S4, it applies silane coupling agent processing: silane is sprayed in anti-oxidation processing rear surface, to improve the anti-oxidant energy under copper foil room temperature
Power, and in high temperature pressing plate, silane can make copper foil and resin base material combine more preferably by coupling, to improve peel strength.
S5, copper foil drying and processing: copper foil is dried at not less than 200 DEG C；
S6, copper foil slitting treatment: for different demands, cutting point is carried out to the quality of finished copper foil, breadth, weight demands
Class, and package.
As a preferred technical solution of the present invention: copper thickness is extra thin copper foil less than 12 μm.
As a preferred technical solution of the present invention: the copper foil in the copper foil surface Passivation Treatment of S3, after plating barrier layer
Surface passivation is carried out with chromate and zinc solution, the layer for forming copper foil surface based on chromium zinc.
In conclusion the treatment process after extra thin copper foil preparation, is electroplated the copper particle of one layer of warty in copper foil hair side, no
It only can increase the surface area of copper foil hair side, moreover it is possible to generate mechanical fasteners with insulating resin baseplate material and act on, after curing process, slightly
Though rugosity has reduction, because increasing the contact area of roughened layer Yu hair foil, lead to the bonding of process layer and dielectric substrate material
The phenomenon that intensity but improves, and has been inherently eliminated process layer and the layering of hair foil.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (3)
1. the treatment process after a kind of extra thin copper foil preparation, it is characterised in that: the following steps are included: copper foil curing process → copper foil
Hair side zinc-plated processing → copper foil surface Passivation Treatment → painting silane coupling agent processing → copper foil drying and processing → copper foil slitting treatment；
S1, copper foil curing process: one layer of fine and close metallic copper is deposited, in the warty particulate interspaces of roughened layer to increase roughened layer
With the contact surface of hair foil matrix, it is roughened the roughness of layer surface with reduction；
S2, copper foil hair side zinc-plated processing: copper foil hair side forms one layer of barrier layer, by zinc-plated processing to improve copper foil in nature
Anti-aging capability in air；
S3, copper foil surface Passivation Treatment: the copper foil behind plating barrier layer carries out surface passivation with chromatedsolution, makes copper foil surface shape
Layer based on Cheng Yige makes copper foil will not be because directly contacting due to oxidation stain with air, to improve the heat-resisting of copper foil
Property, to extend the shelf life of copper foil；
S4, it applies silane coupling agent processing: silane is sprayed in anti-oxidation processing rear surface, to improve the anti-oxidant energy under copper foil room temperature
Power, and in high temperature pressing plate, silane can make copper foil and resin base material combine more preferably by coupling, to improve peel strength.
S5, copper foil drying and processing: copper foil is dried at not less than 100 DEG C；
S6, copper foil slitting treatment: for different demands, cutting point is carried out to the quality of finished copper foil, breadth, weight demands
Class, and package.
2. the treatment process after a kind of extra thin copper foil preparation according to claim 1, it is characterised in that: the copper thickness
Less than 12 μm.
3. the treatment process after a kind of extra thin copper foil preparation according to claim 1, it is characterised in that: the copper foil of the S3
In surface passivating treatment, copper foil chromate and zinc solution after plating barrier layer carry out surface passivation, form copper foil surface
Layer based on chromium zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810768903.2A CN108930036A (en) | 2018-07-13 | 2018-07-13 | A kind for the treatment of process after extra thin copper foil preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810768903.2A CN108930036A (en) | 2018-07-13 | 2018-07-13 | A kind for the treatment of process after extra thin copper foil preparation |
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| CN201810768903.2A Pending CN108930036A (en) | 2018-07-13 | 2018-07-13 | A kind for the treatment of process after extra thin copper foil preparation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571365A (en) * | 2019-07-19 | 2019-12-13 | 厦门大学 | External packing material for lithium ion battery and application thereof |
| CN111364072A (en) * | 2020-04-23 | 2020-07-03 | 广东嘉元科技股份有限公司 | High-ductility electrolytic copper foil and preparation method thereof |
| CN111383986A (en) * | 2018-12-27 | 2020-07-07 | 东京毅力科创株式会社 | Substrate mounting table and substrate processing apparatus |
| CN112537094A (en) * | 2020-11-23 | 2021-03-23 | 上海英众信息科技有限公司 | Machining method for computer mainboard |
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| CN1962944A (en) * | 2006-11-28 | 2007-05-16 | 招远金宝电子有限公司 | Gray surface treatment process for electrolytic copper foil |
| CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
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2018
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962944A (en) * | 2006-11-28 | 2007-05-16 | 招远金宝电子有限公司 | Gray surface treatment process for electrolytic copper foil |
| CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111383986A (en) * | 2018-12-27 | 2020-07-07 | 东京毅力科创株式会社 | Substrate mounting table and substrate processing apparatus |
| CN110571365A (en) * | 2019-07-19 | 2019-12-13 | 厦门大学 | External packing material for lithium ion battery and application thereof |
| CN111364072A (en) * | 2020-04-23 | 2020-07-03 | 广东嘉元科技股份有限公司 | High-ductility electrolytic copper foil and preparation method thereof |
| CN112537094A (en) * | 2020-11-23 | 2021-03-23 | 上海英众信息科技有限公司 | Machining method for computer mainboard |
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Application publication date: 20181204 |