CN112537094A - Machining method for computer mainboard - Google Patents

Machining method for computer mainboard Download PDF

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Publication number
CN112537094A
CN112537094A CN202011320718.0A CN202011320718A CN112537094A CN 112537094 A CN112537094 A CN 112537094A CN 202011320718 A CN202011320718 A CN 202011320718A CN 112537094 A CN112537094 A CN 112537094A
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China
Prior art keywords
mainboard
resin
processing
copper
glass cloth
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CN202011320718.0A
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Chinese (zh)
Inventor
曾祥聪
毕顺军
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Shanghai Yingzhong Information Technology Co ltd
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Shanghai Yingzhong Information Technology Co ltd
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Priority to CN202011320718.0A priority Critical patent/CN112537094A/en
Publication of CN112537094A publication Critical patent/CN112537094A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/042—Punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/045—Slitting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a processing method for a computer mainboard, which comprises a mainboard body, wherein the mainboard body comprises two copper foils and two synthetic resin base layers, the two copper foils are respectively positioned at the top and the bottom of the synthetic resin base layers, the synthetic resin base layers comprise phenolic resin and modified epoxy glass cloth layers, the number of the modified epoxy glass cloth layers is two, the two modified epoxy glass cloth layers are respectively positioned at the top and the bottom of an inner cavity of the phenolic resin, and through holes are formed in the surface of the phenolic resin. According to the invention, through carrying out surface treatment on the copper foil for multiple times, the service life of the copper foil is effectively prolonged, the phenomenon of poor contact of electronic elements in the connection process is avoided, the physical strength of the mainboard is improved, the phenomenon that the use of the mainboard is influenced by bending and breaking in use is avoided, and the installation and connection stability of the copper foil is ensured.

Description

Machining method for computer mainboard
Technical Field
The invention relates to the technical field of computer mainboards, in particular to a processing method for a computer mainboard.
Background
The mainboard, also called motherboard, is installed in the computer mainframe box, is one of the most basic and important components of the computer, plays a very important role in the whole computer system, the manufacturing quality of the mainboard determines the stability of the hardware system, the mainboard has close relationship with the CPU, each time the CPU is greatly upgraded, the mainboard inevitably leads to the replacement of the mainboard, the mainboard is the core of the computer hardware system and is also a printed circuit board with the largest area in the mainframe box, the main function of the mainboard is to transmit various electronic signals, part of the chips are also responsible for primarily processing some peripheral data, each component in the computer mainframe is connected through the mainboard, the control of the computer on the system memory, storage equipment and other I/O equipment must be completed through the mainboard when the computer normally operates, whether the performance of the computer can be fully exerted, whether the hardware function is enough, the compatibility of the hardware depends on the design of the mainboard, the quality of the mainboard determines the overall performance, service life and function expansion capability of a computer to some extent, the mainboard adopts an open structure, the mainboard is mostly provided with 6-15 expansion slots for the insertion of control cards (adapters) of peripheral equipment of a PC, and the corresponding subsystems of the microcomputer can be locally upgraded by replacing the insertion cards, so that manufacturers and users have greater flexibility in configuring machine types.
The computer mainboard is very important in the hardware of the computer as an important component of the computer, the quality of a finished product is difficult to control in the processing method of the computer mainboard in the existing market, the mainboard is easy to break down in the using process, the long-time use of the mainboard is influenced, and the phenomenon of poor contact is easy to occur when an electronic element is connected with the mainboard, so that the computer mainboard is not favorable for long-time use of a user.
Disclosure of Invention
The invention aims to provide a processing method for a computer mainboard, which has the advantage of stable quality and solves the problems that the quality of a finished product is difficult to control, the mainboard is easy to break down in the using process, the long-time use of the mainboard is influenced, and the electronic element is easy to contact badly when being connected with the mainboard, so that the long-time use of a user is not facilitated.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a computer motherboard, includes the mainboard body, the mainboard body is including copper foil and synthetic resin basic unit, the quantity of copper foil is two, two the copper foil is located the top and the bottom position of synthetic resin basic unit respectively, the synthetic resin basic unit is including phenolic resin and modified epoxy glass cloth layer, the quantity on modified epoxy glass cloth layer is two sets of, and is two sets of modified epoxy glass cloth layer is located the top and the bottom of phenolic resin inner chamber respectively, the through hole has been seted up on phenolic resin's surface.
Preferably, the thickness of the phenolic resin is 1.3mm, and the thickness of the modified epoxy glass cloth layer is 0.15 mm.
Preferably, the through hole comprises a separation original mounting hole, a heat dissipation hole, a through hole and a mounting hole, and the diameters of the hole positions are different.
A processing method for a computer mainboard mainly comprises the following processing steps: copper processing, mainboard laminating and punching and cutting.
A. Producing a coarse foil by electrolyzing dissolved copper, wherein the surface of the coarse foil is subjected to curing treatment after production, the curing treatment mainly adopts a reaction kettle to carry out vapor deposition to fill unevenness on the surface of the coarse foil, the copper sheet is subjected to three times of surface treatment after the curing treatment, mainly serves as a zinc-plated barrier layer, the copper sheet plated with the barrier layer is subjected to surface passivation by using a chromate solution, so that a protective film layer taking chromium as a main body is formed on the surface of the copper sheet, silane is sprayed on the surface of the copper sheet after the anti-oxidation treatment, the surface of the copper sheet is dried at high temperature after the silane is sprayed, the copper sheet is subjected to imprinting of a surface printed circuit after the production is finished, and the specific printed circuit is imprinted according to actual use requirements or patterns provided by customers;
B. the processing of mainboard mainly does: mixing and dissolving epoxy resin and a curing agent in acetone or dimethylformamide and ethylene glycol monomethyl ether, stirring to obtain a uniform resin solution, compounding the resin solution with glass fibers after the resin solution is produced, carrying out production compounding by using a glue dipping machine, drying after the compounding is finished, wherein the drying time is not less than forty minutes, and cutting a formed sheet for later use after the drying is finished;
C. the processing of mainboard laminating mainly does: preparing a copper sheet and paper or glass cloth which is impregnated and dried into a lamination, putting the lamination between two stainless steel plates with a demoulding film or a demoulding agent, and putting the lamination and the steel plates into a hydraulic press for pressing, wherein the pressing time is ten minutes, and the pressing temperature is 70-90 ℃;
D. the processing of punching and cutting mainly comprises the following steps: the method comprises the following steps of carrying out surface cutting treatment on a formed plate according to actual use shape requirements or customer requirements, carrying out dust removal operation by adopting dust removal equipment in the cutting process, controlling the temperature to be 40-90 degrees in the cutting process, fixing the plate during punching operation, then punching, and carrying out dust removal operation by adopting the dust removal equipment during punching operation.
Preferably, the resin solution can be used for gum dipping after being cured, the curing time of the resin solution is 6-12 hours, and the next batch of operation can be carried out after the reaction vessel is cleaned and dried after the resin solution is discharged.
Preferably, in the three surface treatments after the crude foil curing treatment, the treatment of the next process can be performed after washing and drying each surface treatment, the washing and drying time is 10min, and the drying temperature is 100-130 ℃.
Preferably, the surface of the main plate needs to be cleaned when glue overflows from the surface in the main plate attaching process, resin adhered to the surface of the main plate can be directly wiped off, and the resin adhered to the surface of the steel plate needs to be cleaned by using a cleaning agent and then is operated.
Preferably, the production of the main boards needs to be packaged and stored, a layer of low-sulfur-content isolation paper is arranged between the two main boards, then the isolation paper is put into a polyethylene plastic bag or wrapped with moistureproof paper, finally a storage box is adopted for storage, and a flexible protective material is placed in an inner cavity of the storage box.
Preferably, the mixing processing of the epoxy resin is carried out in a reaction kettle, a pressurizing and heating mixing process is adopted in the processing process of the epoxy resin, the mixing temperature is 140-180 ℃, the working pressure is 0.5Mpa, nitrogen is filled in the pressurizing process to serve as a protective gas, and the mixing time is 1.5-2.5 h.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, through carrying out surface treatment on the copper foil for multiple times, the service life of the copper foil is effectively prolonged, the phenomenon of poor contact of electronic elements in the connection process is avoided, the physical strength of the mainboard is improved, the phenomenon that the use of the mainboard is influenced by bending and breaking in use is avoided, and the installation and connection stability of the copper foil is ensured.
2. The use strength and the use flexibility of the phenolic resin and the modified epoxy glass cloth layer can be effectively ensured by determining the use thicknesses of the phenolic resin and the modified epoxy glass cloth layer, and the phenomenon that the use is influenced by the breakage of the phenolic resin and the modified epoxy glass cloth layer in the installation and transportation process is avoided;
through the through holes, the use heat dissipation effect of the mainboard can be better, and the installation and fixation of the mainboard and the electrical connection of subsequent electronic elements are facilitated;
through curing treatment of the resin, macromolecules in the resin can be tighter, and the use strength of the main board is improved;
through the drying and washing process, the surface treatment effect of the copper sheet is better, the conductivity of the copper sheet is improved, the service life of the copper sheet is prolonged, and the copper sheet is convenient for a user to use for a long time;
through cleaning, irregular sawtooth edges on the outer side of the main board can be effectively avoided, the appearance effect of the main board is improved, and meanwhile, the cleanness of an inner cavity of production equipment is guaranteed;
by determining the packaging process, the storage and the placement of the finished mainboard products can be safer, the phenomenon that the use of the finished mainboard products is influenced by abrasion in the placement process is avoided, and the service life of the mainboard is guaranteed;
through confirming epoxy's processing mixed technology, can make the curing effect of resin better, promote the cooperation effect of polymer material in the resin, promote the use intensity after the mainboard shaping, avoided appearing overflowing in follow-up course of working and gluing the phenomenon that influences the use, reduced unnecessary cost waste in the production process, then reduced the cleanness in the equipment operation process, alleviateed staff's operation intensity of labour, ensured product quality.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of a synthetic resin substrate according to the present invention.
In the figure: 1. a main board body; 2. copper foil; 3. a synthetic resin base layer; 4. a phenolic resin; 5. a modified epoxy glass cloth layer; 6. a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The main board body 1, the copper foil 2, the synthetic resin base layer 3, the phenolic resin 4, the modified epoxy glass cloth layer 5 and the through hole 6 are all universal standard parts or parts known by those skilled in the art, and the structure and principle of the main board are known by technical manuals or conventional experimental methods.
Referring to fig. 1-2, a computer motherboard includes a motherboard body 1, the motherboard body 1 includes two copper foils 2 and two synthetic resin base layers 3, the two copper foils 2 are respectively located at the top and the bottom of the synthetic resin base layer 3, the synthetic resin base layer 3 includes a phenolic resin 4 and two modified epoxy glass cloth layers 5, the two modified epoxy glass cloth layers 5 are respectively located at the top and the bottom of an inner cavity of the phenolic resin 4, and a through hole 6 is formed on the surface of the phenolic resin 4.
In this embodiment, specifically, the thickness of the phenolic resin 4 is 1.3mm, the thickness of the modified epoxy glass cloth layer 5 is 0.15mm, and the use strength and the use flexibility of the phenolic resin 4 and the modified epoxy glass cloth layer 5 can be effectively ensured by determining the use thicknesses of the phenolic resin 4 and the modified epoxy glass cloth layer 5, so that the phenomenon that the use is affected by breakage during installation and transportation is avoided.
In this embodiment, specifically, through hole 6 is including separation original paper mounting hole, louvre, via hole and mounting hole, and each hole site diameter size inequality, through seting up of through hole 6, can make the use radiating effect of mainboard better, and the installation of the mainboard of being convenient for simultaneously is fixed and follow-up electronic component's electric connection.
A processing method for a computer mainboard mainly comprises the following processing steps: copper processing, mainboard laminating and punching and cutting.
A. Producing a coarse foil by electrolyzing dissolved copper, wherein the surface of the coarse foil is subjected to curing treatment after production, the curing treatment mainly adopts a reaction kettle to carry out vapor deposition to fill unevenness on the surface of the coarse foil, the copper sheet is subjected to three times of surface treatment after the curing treatment, mainly serves as a zinc-plated barrier layer, the copper sheet plated with the barrier layer is subjected to surface passivation by using a chromate solution, so that a protective film layer taking chromium as a main body is formed on the surface of the copper sheet, silane is sprayed on the surface of the copper sheet after the anti-oxidation treatment, the surface of the copper sheet is dried at high temperature after the silane is sprayed, the copper sheet is subjected to imprinting of a surface printed circuit after the production is finished, and the specific printed circuit is imprinted according to actual use requirements or patterns provided by customers;
B. the processing of mainboard mainly does: mixing and dissolving epoxy resin and a curing agent in acetone or dimethylformamide and ethylene glycol monomethyl ether, stirring to obtain a uniform resin solution, compounding the resin solution with glass fibers after the resin solution is produced, carrying out production compounding by using a glue dipping machine, drying after the compounding is finished, wherein the drying time is not less than forty minutes, and cutting a formed sheet for later use after the drying is finished;
C. the processing of mainboard laminating mainly does: preparing a copper sheet and paper or glass cloth which is impregnated and dried into a lamination, putting the lamination between two stainless steel plates with a demoulding film or a demoulding agent, and putting the lamination and the steel plates into a hydraulic press for pressing, wherein the pressing time is ten minutes, and the pressing temperature is 70-90 ℃;
D. the processing of punching and cutting mainly comprises the following steps: the method comprises the following steps of carrying out surface cutting treatment on a formed plate according to actual use shape requirements or customer requirements, carrying out dust removal operation by adopting dust removal equipment in the cutting process, controlling the temperature to be 40-90 degrees in the cutting process, fixing the plate during punching operation, then punching, and carrying out dust removal operation by adopting the dust removal equipment during punching operation.
In this embodiment, specifically, the resin solution can be used for gum dipping after being cured, the curing time of the resin solution is 6 to 12 hours, the reaction vessel can be subjected to next batch operation after being cleaned and dried after the resin solution is discharged, and by curing the resin, the macromolecules in the resin can be more compact, and the service strength of the main board is improved.
In this embodiment, specifically, in the three surface treatments after the crude foil curing treatment, the next process can be performed after each surface treatment is performed with water washing and drying, the water washing and drying time is 10min, and the drying temperature is 100-.
In this embodiment, it is concrete, excessive glue appears on mainboard laminating in-process surface and need carry out surface cleaning, and mainboard surface adhesion resin can directly wipe off, and steel sheet surface adhesion resin need use the sanitizer to wash and carry out the operation again, through cleaning, can effectively avoid the mainboard outside irregular sawtooth edge to appear, has promoted the outward appearance effect of mainboard, has ensured simultaneously that production facility's inner chamber is clean.
In this embodiment, it is concrete, need pack the storage after mainboard production is accomplished, should fill up the one deck low sulphur content barrier paper between two mainboards, then put into the polyethylene plastic bag in or wrap the dampproofing paper, adopt the storage box to save at last, flexible protective material has been placed to the storage box inner chamber, through confirming packaging technology, can make the off-the-shelf storage of mainboard place safelyr, avoid it to appear wearing and tearing in placing the phenomenon that influences the use, ensured the life of mainboard.
In the embodiment, specifically, the mixing processing of the epoxy resin is performed in the reaction kettle, a pressurizing and heating mixing process is adopted in the processing process of the epoxy resin for processing, the mixing temperature is 140-.
According to the invention, through carrying out multiple surface treatments on the copper foil 2, the service life of the copper foil is effectively prolonged, the phenomenon of poor contact of an electronic element in the connection process is avoided, the physical strength of the mainboard is simultaneously improved, the phenomenon that the use of the mainboard is influenced by bending and breaking in the use process is avoided, the mounting and connecting stability of the copper foil 2 is ensured, the problem that the use electrical connection is influenced by the surface oxidation of the copper foil 2 in the use process is avoided, the problem that the quality of a finished product of a processing method of the computer mainboard in the existing market is difficult to control, the mainboard is easy to break down in the use process, the long-time use of the mainboard is influenced, the phenomenon of poor contact of the electronic element connected with the mainboard is easy to occur.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. A computer motherboard, includes mainboard body (1), its characterized in that: mainboard body (1) is including copper foil (2) and synthetic resin basic unit (3), the quantity of copper foil (2) is two, two copper foil (2) are located the top and the bottom position of synthetic resin basic unit (3) respectively, synthetic resin basic unit (3) are including phenolic resin (4) and modified epoxy glass cloth layer (5), the quantity of modified epoxy glass cloth layer (5) is two sets of, and is two sets of modified epoxy glass cloth layer (5) are located the top and the bottom of phenolic resin (4) inner chamber respectively, through hole (6) have been seted up on the surface of phenolic resin (4).
2. A computer motherboard according to claim 1, characterized in that: the thickness of the phenolic resin (4) is 1.3mm, and the thickness of the modified epoxy glass cloth layer (5) is 0.15 mm.
3. A computer motherboard according to claim 1, characterized in that: the through hole (6) comprises a separation original mounting hole, a heat dissipation hole, a through hole and a mounting hole, and the diameters of the hole positions are different.
4. A processing method for a computer mainboard is characterized by comprising the following steps: the processing steps mainly comprise: processing a copper plate, processing a main board, attaching the main board, punching and cutting;
A. producing a coarse foil by electrolyzing dissolved copper, wherein the surface of the coarse foil is subjected to curing treatment after production, the curing treatment mainly adopts a reaction kettle to carry out vapor deposition to fill unevenness on the surface of the coarse foil, the copper sheet is subjected to three times of surface treatment after the curing treatment, mainly serves as a zinc-plated barrier layer, the copper sheet plated with the barrier layer is subjected to surface passivation by using a chromate solution, so that a protective film layer taking chromium as a main body is formed on the surface of the copper sheet, silane is sprayed on the surface of the copper sheet after the anti-oxidation treatment, the surface of the copper sheet is dried at high temperature after the silane is sprayed, the copper sheet is subjected to imprinting of a surface printed circuit after the production is finished, and the specific printed circuit is imprinted according to actual use requirements or patterns provided by customers;
B. the processing of mainboard mainly does: mixing and dissolving epoxy resin and a curing agent in acetone or dimethylformamide and ethylene glycol monomethyl ether, stirring to obtain a uniform resin solution, compounding the resin solution with glass fibers after the resin solution is produced, carrying out production compounding by using a glue dipping machine, drying after the compounding is finished, wherein the drying time is not less than forty minutes, and cutting a formed sheet for later use after the drying is finished;
C. the processing of mainboard laminating mainly does: preparing a copper sheet and paper or glass cloth which is impregnated and dried into a lamination, putting the lamination between two stainless steel plates with a demoulding film or a demoulding agent, and putting the lamination and the steel plates into a hydraulic press for pressing, wherein the pressing time is ten minutes, and the pressing temperature is 70-90 ℃;
D. the processing of punching and cutting mainly comprises the following steps: the method comprises the following steps of carrying out surface cutting treatment on a formed plate according to actual use shape requirements or customer requirements, carrying out dust removal operation by adopting dust removal equipment in the cutting process, controlling the temperature to be 40-90 degrees in the cutting process, fixing the plate during punching operation, then punching, and carrying out dust removal operation by adopting the dust removal equipment during punching operation.
5. The machining method for the computer motherboard according to claim 4, wherein: the resin solution can be used for gum dipping after being cured, the curing time of the resin solution is 6-12 hours, and the next batch of operation can be carried out after the reaction vessel is cleaned and dried after the resin solution is discharged.
6. The machining method for the computer motherboard according to claim 4, wherein: in the three surface treatments after the crude foil curing treatment, the treatment of the next procedure can be carried out after washing and drying after each surface treatment, the washing and drying time is 10min, and the drying temperature is 100-.
7. The machining method for the computer motherboard according to claim 4, wherein: the surface of the main plate needs to be cleaned when glue overflows from the surface in the main plate attaching process, resin adhered to the surface of the main plate can be directly wiped off, and the resin adhered to the surface of the steel plate needs to be cleaned by using a cleaning agent and then is operated.
8. The machining method for the computer motherboard according to claim 4, wherein: the production of the main boards needs to be packaged and stored, a layer of low-sulfur-content isolation paper is arranged between the two main boards, then the isolation paper is put into a polyethylene plastic bag or wrapped with damp-proof paper, finally, a storage box is adopted for storage, and a flexible protective material is placed in an inner cavity of the storage box.
9. The machining method for the computer motherboard according to claim 4, wherein: the mixing processing of the epoxy resin is carried out in a reaction kettle, a pressurizing and heating mixing process is adopted in the processing process of the epoxy resin, the mixing temperature is 140-180 ℃, the working pressure is 0.5Mpa, nitrogen is filled in the pressurizing process to serve as protective gas, and the mixing time is 1.5-2.5 h.
CN202011320718.0A 2020-11-23 2020-11-23 Machining method for computer mainboard Pending CN112537094A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201319694Y (en) * 2008-08-28 2009-09-30 福建新世纪电子材料有限公司 Copper clad laminated board
CN103213356A (en) * 2013-04-12 2013-07-24 江阴市明康绝缘玻纤有限公司 Preparation method of bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate
CN105150662A (en) * 2015-08-06 2015-12-16 忠信(太仓)绝缘材料有限公司 Manufacturing method of epoxy glass-cloth-matrix copper clad laminate
CN205416616U (en) * 2015-12-17 2016-08-03 福建利豪电子科技股份有限公司 Improved generation high peel strength intensity PCB electronic circuit board
CN108930036A (en) * 2018-07-13 2018-12-04 铜陵市华创新材料有限公司 A kind for the treatment of process after extra thin copper foil preparation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201319694Y (en) * 2008-08-28 2009-09-30 福建新世纪电子材料有限公司 Copper clad laminated board
CN103213356A (en) * 2013-04-12 2013-07-24 江阴市明康绝缘玻纤有限公司 Preparation method of bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate
CN105150662A (en) * 2015-08-06 2015-12-16 忠信(太仓)绝缘材料有限公司 Manufacturing method of epoxy glass-cloth-matrix copper clad laminate
CN205416616U (en) * 2015-12-17 2016-08-03 福建利豪电子科技股份有限公司 Improved generation high peel strength intensity PCB electronic circuit board
CN108930036A (en) * 2018-07-13 2018-12-04 铜陵市华创新材料有限公司 A kind for the treatment of process after extra thin copper foil preparation

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