CN114196920A - Preparation method of copper foil - Google Patents

Preparation method of copper foil Download PDF

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Publication number
CN114196920A
CN114196920A CN202111580022.6A CN202111580022A CN114196920A CN 114196920 A CN114196920 A CN 114196920A CN 202111580022 A CN202111580022 A CN 202111580022A CN 114196920 A CN114196920 A CN 114196920A
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China
Prior art keywords
copper foil
concentration
foil
carrier
copper
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CN202111580022.6A
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Chinese (zh)
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CN114196920B (en
Inventor
李大双
陆冰沪
王同
甘国庆
吴斌
黄超
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Hefei Tongguan Electronic Copper Foil Co ltd
Tongling Nonferrous Copper Crown And Copper Foil Co ltd
Anhui Tongguan Copper Foil Group Co ltd
Original Assignee
Hefei Tongguan Electronic Copper Foil Co ltd
Tongling Nonferrous Copper Crown And Copper Foil Co ltd
Anhui Tongguan Copper Foil Group Co ltd
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Priority to CN202111580022.6A priority Critical patent/CN114196920B/en
Publication of CN114196920A publication Critical patent/CN114196920A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2252/00—Sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

The invention provides an extremely thin strippable composite copper foil and a preparation method thereof, wherein the preparation method comprises the following steps: copper foil is used as a base material in an ionic vapor deposition coating machine, and copper sheets and molybdenum sheets are used as cathode target materials; vapor deposition to form a pretreated foil; taking the pretreated foil as a second base material, taking a nickel sheet and a molybdenum sheet as cathode targets, and forming a metal isolation layer on the pretreated foil through vapor deposition to obtain a carrier copper foil; coating an organic isolating layer on the S surface of the carrier copper foil; electrodepositing an ultra-thin copper foil with the thickness of 1.5-5 mu m on the surface of the carrier copper foil coated with the metal isolation layer and the organic isolation layer, and then sequentially carrying out coarsening, solidification, blackening, galvanizing, passivation surface treatment and silane coupling agent coating processes on the surface of the ultra-thin copper foil to obtain a finished product of the composite copper foil; the direct bonding force between the finished carrier copper foil carrier foil and the ultrathin copper foil is moderate, and the copper and nickel elements are uniformly distributed without any nonuniform distribution phenomenon.

Description

Preparation method of copper foil
Technical Field
The invention belongs to the technical field of electronic copper foil processing methods, particularly relates to an extremely thin peelable carrier copper foil prepared by a physical sputtering method, and further relates to a computer chip packaging material.
Background
The electronic copper foil is used as one of key composition materials of a Copper Clad Laminate (CCL), a Printed Circuit Board (PCB) and a lithium ion battery, and is widely applied to industries such as computers, 5G communication, telecommunication instruments, household appliances, lithium batteries for power, lithium batteries for energy storage and the like. In the age of rapid development of the electronic information industry, the electronic copper foil is considered as a "neural network" for signal and power transmission and communication of electronic products. The quality of the lithium ion battery directly affects the production quality of electronic products, the manufacturing process of the lithium ion battery and the comprehensive performance of the lithium ion battery. With the development of electronic products towards multifunctionalization and high added value, such as light weight, thinness, smallness, shortness, continuous increase of the endurance mileage of new energy automobiles and the like, the quality requirement of the electronic copper foil in the electronic industry has higher standards. A copper foil with superior properties, such as thinness, lower roughness, better conductivity, better signal transmission capability, and less signal loss, is needed to meet market demands. Common copper foils comprise a rolled copper foil and an electrolytic copper foil, in order to meet the novel technical requirements of the market on the copper foil, an ultrathin strippable load copper foil is researched and prepared, and a novel copper foil preparation method, namely a physical vapor deposition sputtering method, is applied.
The electronic copper foil is used as a key material for signal transmission in electronic products, the influence of the surface profile degree on signal transmission loss is very important, and in order to reduce the signal loss and attenuation of a high-frequency circuit in high-speed transmission, the thin high-performance electronic copper foil with lower surface roughness is required to be adopted. The ultrathin strippable load copper foil is prepared by taking a common HTE copper foil as a cathode carrier and electrodepositing an alloy ultrathin copper foil layer of copper, nickel, zinc and the like with the thickness of 3-5 mu m on the surface of the cathode carrier. The load copper foil can be applied to an IC packaging carrier plate. For the novel copper foil, the conventional production method of the electronic copper foil is broken through, and the copper foil is prepared by adopting a novel copper foil production method, namely a physical vapor deposition sputtering method. Compared with the conventional electroplating method for producing the copper foil, the physical vapor deposition sputtering method can avoid the concentration polarization effect and the cathode and anode polarization effect which are faced in the electroplating process, and the problems of complicated equipment and complex process. Meanwhile, the vapor deposition sputtering method has high deposition rate and good process repeatability, is a new technology with wide application prospect, and is environment-friendly and clean.
Disclosure of Invention
The invention provides an extremely thin strippable composite copper foil and a preparation method thereof, wherein the preparation method comprises the following steps:
s1, starting the ion type vapor deposition coating machine, vacuumizing the ion type vapor deposition coating machine by using a sputtering vacuum pump, filling inert gas into the ion type vapor deposition coating machine, and keeping the vacuum of the ion type vapor deposition coating machineDegree of 10-2-10-3Supporting;
THE THE copper foil is used as a base material, and 99.99 percent of copper sheets and 99.99 percent of molybdenum sheets are used as cathode target materials; applying high voltage to the cathode and the anode to form a pretreated foil;
s2, washing and pickling the pretreated foil;
s3, taking the pretreated foil as a second base material, taking 99.99 percent of nickel sheet and 99.99 percent of molybdenum sheet as cathode target materials, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
s4, coating an organic isolating layer on the S surface of the carrier copper foil, wherein the organic isolating layer consists of BTA and MBT;
s5, electrodepositing the extra-thin copper foil with the thickness of 1.5-5 mu m on the surface of the carrier copper foil coated with the metal isolation layer and the organic isolation layer, and then sequentially carrying out coarsening, solidification, blackening, galvanizing, passivation surface treatment and silane coupling agent coating processes on the surface of the extra-thin copper foil to obtain a finished product of the composite copper foil.
Preferably, the inert gas in the step S1 and the step S2 is one or more of inert gases such as argon, neon, xenon, krypton and the like; the inert gas used in the step S1 is the same as the inert gas used in the step S2.
Preferably, in the step S1, the mass ratio of copper to molybdenum is 7-9: 1;
in the vapor deposition process, after a substrate and a target material are ready, high voltage is applied to a cathode and an anode of a sputtering instrument, inert gas is subjected to glow discharge partial ionization under the action of the high voltage to generate inert gas cations, a cathode dark space is formed in the area near the cathode, inert gas ions, neutral atoms, electrons and photons are stored in the cathode dark space, the inert gas cations in the cathode dark space are accelerated under the action of negative high voltage of the cathode, then the target material is bombarded at a very high speed, atoms or molecules splashed from the target material have a fast speed and high energy and immediately fly to the substrate material placed on the anode to be deposited on the surface of the substrate material to form a thin film, and the splashed target atoms have enough energy, so that the thin film can be well attached to the surface of the substrate material.
The copper-nickel alloy is a novel alloy material, and because copper and nickel can be infinitely mutually dissolved, the copper-nickel alloy integrates the characteristics of good corrosion resistance and high oxidation resistance of nickel and the characteristic of strong electric conductivity of copper metal, and meanwhile, the copper-nickel alloy foil has excellent tensile strength and electric conductivity, and has excellent heat conductivity, so that the copper-nickel alloy is an excellent current collector material, but the copper-nickel alloy is easy to have uneven distribution of copper and nickel elements, and the nickel element on the surface of the copper foil can also have the problem of even distribution of the nickel element on the surface of the copper foil. The problem of uniform distribution of copper and nickel can be amplified in the vapor deposition process, and the molybdenum element is introduced in the foil generation process, so that the problem of uniform distribution of the copper and nickel element is improved surprisingly. And because molybdenum, copper and nickel are excellent compatible elements and have strong affinity with each other, the molybdenum alloy has no side effect on the performance of products.
And thirdly, coating a 10-100nm organic isolating layer on the metal isolating layer. The organic isolating layer is composed of a mixture of BTA and MBT, and can enter empty orbitals of copper to form coordinate bonds to form a stripping layer film due to polar groups such as N, O, P, S and unsaturated pi bonds in the organic corrosion inhibitor, so that the organic isolating layer has certain characteristics of heat resistance, easy stripping and the like. The metal ion salt used as the isolation layer material and the organic matter have synergistic effect to achieve better isolation effect.
After the pretreatment of the carrier material HTE copper foil, the next step of the foil generation process of the ultrathin copper foil and the surface treatment process of the copper foil are carried out. Firstly, a foil generating process, namely, taking a pretreated HTE copper foil as a substrate, taking 99.99 percent of copper sheets and 99.99 percent of molybdenum sheets as cathode target materials, vacuumizing a sputtering instrument by a vacuum pump, and then filling one of inert gases such as argon, neon, xenon, krypton and the like into the sputtering instrument. Electrifying the sputtering instrument, and controlling the thickness and the appearance of the thin foil by controlling the size and the electrifying time of the electrified current and the sputtering distance, wherein the thickness of the thin foil is generally controlled to be 1-3 mu m. And then, carrying out surface treatment on the generated thin foil in the same way as electrolytic copper foil to ensure that a finished copper foil with qualified roughness, peeling resistance, tensile strength, elongation, heat resistance, oxidation resistance, electrical property and the like is finally formed.
Performing surface treatment on the generated thin foil, using an initial carrier foil as a base body, using 99.99% of nickel sheets and 99.99% of molybdenum sheets as cathode composite alloy target materials, vacuumizing a sputtering instrument by using a vacuum pump, filling one of inert gases such as argon, neon, xenon and krypton into the sputtering instrument, and keeping the vacuum degree of the sputtering instrument at 10-2-10-4And supporting, then electrifying the sputtering instrument, controlling the thickness of the zinc layer and the chromium oxidation resistant layer on the surface of the pretreated carrier foil matrix by controlling the size and the electrifying time of the electrifying current, the sputtering distance and the size of the target material, and simultaneously controlling the surface form of the copper foil and the size of copper grains to prepare the nodular copper foil with uniform grain size and compact and flat appearance.
Finally, the produced thin foil has high-temperature anti-oxidation capability, and finally the thin foil after galvanizing and anti-oxidation treatment is taken out, and a layer of silane coupling agent is coated on the surface of the thin foil, so that the thin foil and a resin base material have certain binding force, the direct binding force between the finished carrier copper foil carrier foil and the ultrathin copper foil is moderate, and the stripping resistance value can be kept unchanged for 10 min after the high-temperature tin immersion treatment at 288 ℃. And the copper and nickel elements are uniformly distributed without any nonuniform distribution phenomenon.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following examples are carried out to further illustrate the present invention in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A first embodiment of the present invention provides a method for preparing an organic metal layer, which includes the following steps.
Firstly, vacuumizing a sputtering instrument, then filling one or more of inert gases such as argon, neon, xenon, krypton and the like into the sputtering instrument, then respectively taking 99.99% of copper sheets and 99.99% of molybdenum sheets as composite alloy cathode target materials, and carrying out vapor deposition to form a pretreated foil, wherein the ratio of copper to molybdenum is 9: 1.
Washing and pickling the pre-treated foil, taking the pre-treated copper foil as a second base material, taking 99.99 percent of nickel sheets and 99.99 percent of molybdenum sheets as cathode materials, electrifying a sputtering instrument, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
coating a machine isolating layer consisting of BTA and MBT on the S surface of the carrier copper foil, wherein the ratio of the BTA to the MBT is 1: 3, the concentration is 3g/L, and the coating is dried for half a minute.
And (2) carrying out electrodeposition on the carrier copper foil coated with the metal isolation layer and the organic isolation layer to form an ultrathin copper foil with the thickness of 1.5-5 microns on the surface of the organic metal layer, and respectively carrying out subsequent roughening, curing, blackening, galvanizing and antioxidation on the obtained semi-finished product, and coating a silane coupling agent to finally obtain the strippable ultrathin copper foil. In the electrolyte used for electrodeposition, Cu2+The concentration of the sodium salt of the alkane sulfonic acid is 60-90g/L, the concentration of the sulfuric acid is 70-150g/L, the concentration of the collagen with the molecular weight of 2000-3000 is 0.5-1.0g/L, the concentration of the sodium salt of the alkane sulfonic acid is 50-200ppm, the concentration of the polyethylene glycol is 10-50ppm, and the concentration of the sodium citrate is 10-100 ppm; the electro-deposition temperature is 40-45 ℃, and the electro-deposition current density is 1000-2。
In the roughening solution used for roughening, Cu2+The concentration is 10-20g/L, the concentration of sulfuric acid is 70-220g/L, WO4 2-The concentration of (A) is 30-50ppm, and the concentration of chloride ion is controlled at 30 ppm.
In the curing liquid used for curing, Cu2+The concentration is 30-60g/L, the concentration of sulfuric acid is 70-150g/L, and the concentration of chloride ion is 20-60 ppm.
In the blackening solution used for blackening, Ni2+The concentration is 1-30g/L, the cobalt concentration is 10-60ppm, one of boric acid or citric acid, and the pH value is 3.5-10; in the zinc plating bath used for zinc plating, Zn2+The concentration is 4-10g/L, the potassium pyrophosphate is 50-70g/L, and the pH value is 8.5-10; in the passivation solution used for passivating surface treatment, the concentration of chromium is 1-5g/L, and the pH value is10-14; the components used in the process of coating the silane coupling agent are one or more of silanes containing amino, epoxy, vinyl, acyloxy and alkyl functional groups, and the spraying temperature is 20-35 ℃.
The ultrathin strippable foil prepared by the embodiment has a flat and bright surface, the thickness of 3-6 mu m, the roughness Rz of the rough surface of 1.53 mu m and the tensile strength of 37 kfg/mm2The thickness is uniform, and the phenomenon of tearing the belt is avoided. The bonding force between the carrier foil and the ultrathin foil is 0.11 kgf/cm, and the stripping resistance value can be kept unchanged for 10 min after the high-temperature tin immersion treatment at 288 ℃. The copper foil has a compact surrounding structure, and the copper and nickel elements are uniformly distributed.
Example 2
A first embodiment of the present invention provides a method for preparing an organic metal layer, which includes the following steps.
Firstly, vacuumizing a sputtering instrument, then filling one or more of inert gases such as argon, neon, xenon, krypton and the like into the sputtering instrument, then respectively taking 99.99% of copper sheets and 99.99% of molybdenum sheets as composite alloy cathode target materials, and carrying out vapor deposition to form a pretreated foil, wherein the ratio of copper to molybdenum is 8: 1.
Washing and pickling the pre-treated foil, taking the pre-treated copper foil as a second base material, taking 99.99 percent of nickel sheets and 99.99 percent of molybdenum sheets as cathode materials, electrifying a sputtering instrument, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
coating a machine isolating layer consisting of BTA and MBT on the S surface of the carrier copper foil, wherein the ratio of the BTA to the MBT is 1: 3, the concentration is 3g/L, and the coating is dried for half a minute.
And (2) carrying out electrodeposition on the carrier copper foil coated with the metal isolation layer and the organic isolation layer to form an ultrathin copper foil with the thickness of 1.5-5 microns on the surface of the organic metal layer, and respectively carrying out subsequent roughening, curing, blackening, galvanizing and antioxidation on the obtained semi-finished product, and coating a silane coupling agent to finally obtain the strippable ultrathin copper foil. In the electrolyte used for electrodeposition, Cu2+Concentration of (2)60-90g/L, the concentration of sulfuric acid is 70-150g/L, the concentration of collagen with molecular weight of 2000-3000 is 0.5-1.0g/L, the concentration of sodium alkane sulfonate is 50-200ppm, the concentration of polyethylene glycol is 10-50ppm, and the concentration of sodium citrate is 10-100 ppm; the electro-deposition temperature is 40-45 ℃, and the electro-deposition current density is 1000-2。
In the roughening solution used for roughening, Cu2+The concentration is 10-20g/L, the concentration of sulfuric acid is 70-220g/L, WO4 2-The concentration of (A) is 30-50ppm, and the concentration of chloride ion is controlled at 30 ppm.
In the curing liquid used for curing, Cu2+The concentration is 30-60g/L, the concentration of sulfuric acid is 70-150g/L, and the concentration of chloride ion is 20-60 ppm.
In the blackening solution used for blackening, Ni2+The concentration is 1-30g/L, the cobalt concentration is 10-60ppm, one of boric acid or citric acid, and the pH value is 3.5-10; in the zinc plating bath used for zinc plating, Zn2+The concentration is 4-10g/L, the potassium pyrophosphate is 50-70g/L, and the pH value is 8.5-10; in the passivation solution used for passivating the surface, the concentration of chromium is 1-5g/L, and the pH value is 10-14; the components used in the process of coating the silane coupling agent are one or more of silanes containing amino, epoxy, vinyl, acyloxy and alkyl functional groups, and the spraying temperature is 20-35 ℃.
The ultrathin strippable foil prepared by the embodiment has a flat and bright surface, the thickness of 3-6 mu m, the roughness Rz of the rough surface of 1.50um and the tensile strength of 36 kfg/mm2The thickness is uniform, and the phenomenon of tearing the belt is avoided. The bonding force between the carrier foil and the ultrathin foil is 0.13kgf/cm, and the stripping resistance value can be kept unchanged for 10 min after the high-temperature tin immersion treatment at 288 ℃. The copper foil has a compact surrounding structure, and the copper and nickel elements are uniformly distributed.
Example 3
A first embodiment of the present invention provides a method for preparing an organic metal layer, which includes the following steps.
Firstly, vacuumizing a sputtering instrument, then filling one or more of inert gases such as argon, neon, xenon, krypton and the like into the sputtering instrument, then respectively taking 99.99% of copper sheets and 99.99% of molybdenum sheets as composite alloy cathode target materials, and carrying out vapor deposition to form a pretreated foil, wherein the ratio of copper to molybdenum is 7: 1.
Washing and pickling the pre-treated foil, taking the pre-treated copper foil as a second base material, taking 99.99 percent of nickel sheets and 99.99 percent of molybdenum sheets as cathode materials, electrifying a sputtering instrument, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
coating a machine isolating layer consisting of BTA and MBT on the S surface of the carrier copper foil, wherein the ratio of the BTA to the MBT is 1: 3, the concentration is 3g/L, and the coating is dried for half a minute.
And (2) carrying out electrodeposition on the carrier copper foil coated with the metal isolation layer and the organic isolation layer to form an ultrathin copper foil with the thickness of 1.5-5 microns on the surface of the organic metal layer, and respectively carrying out subsequent roughening, curing, blackening, galvanizing and antioxidation on the obtained semi-finished product, and coating a silane coupling agent to finally obtain the strippable ultrathin copper foil. In the electrolyte used for electrodeposition, Cu2+The concentration of the sodium salt of the alkane sulfonic acid is 60-90g/L, the concentration of the sulfuric acid is 70-150g/L, the concentration of the collagen with the molecular weight of 2000-3000 is 0.5-1.0g/L, the concentration of the sodium salt of the alkane sulfonic acid is 50-200ppm, the concentration of the polyethylene glycol is 10-50ppm, and the concentration of the sodium citrate is 10-100 ppm; the electro-deposition temperature is 40-45 ℃, and the electro-deposition current density is 1000-2。
In the roughening solution used for roughening, Cu2+The concentration is 10-20g/L, the concentration of sulfuric acid is 70-220g/L, WO4 2-The concentration of (A) is 30-50ppm, and the concentration of chloride ion is controlled at 30 ppm.
In the curing liquid used for curing, Cu2+The concentration is 30-60g/L, the concentration of sulfuric acid is 70-150g/L, and the concentration of chloride ion is 20-60 ppm.
In the blackening solution used for blackening, Ni2+The concentration is 1-30g/L, the cobalt concentration is 10-60ppm, one of boric acid or citric acid, and the pH value is 3.5-10; in the zinc plating bath used for zinc plating, Zn2+The concentration is 4-10g/L, the potassium pyrophosphate is 50-70g/L, and the pH value is 8.5-10; in the passivation solution used for passivating the surface, the concentration of chromium is 1-5g/L, and the pH value is 10-14; coating compositionThe silane coupling agent coating process uses one or more of silanes containing amino, epoxy, vinyl, acyloxy and alkyl functional groups, and the spraying temperature is 20-35 ℃.
The ultrathin strippable foil prepared by the embodiment has a flat and bright surface, the thickness of 3-6 mu m, the roughness Rz of the rough surface of 1.50um and the tensile strength of 38 kfg/mm2The thickness is uniform, and the phenomenon of tearing the belt is avoided. The bonding force between the carrier foil and the ultrathin foil is 0.16kgf/cm, and the stripping resistance value can be kept unchanged for 10 min after the high-temperature tin immersion treatment at 288 ℃. The copper foil has a compact surrounding structure, and the copper and nickel elements are uniformly distributed.
Comparative example 1
A first embodiment of the present invention provides a method for preparing an organic metal layer, which includes the following steps.
Firstly, vacuumizing a sputtering instrument, then filling one or more of inert gases such as argon, neon, xenon, krypton and the like into the sputtering instrument, and then respectively taking 99.99% of copper sheets as composite alloy cathode target materials to form a pretreated foil through vapor deposition.
Washing and pickling the pre-treated foil, taking the pre-treated copper foil as a second base material, taking 99.99 percent of nickel sheets and 99.99 percent of molybdenum sheets as cathode materials, electrifying a sputtering instrument, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
coating a machine isolating layer consisting of BTA and MBT on the S surface of the carrier copper foil, wherein the ratio of the BTA to the MBT is 1: 3, the concentration is 3g/L, and the coating is dried for half a minute.
And (2) carrying out electrodeposition on the carrier copper foil coated with the metal isolation layer and the organic isolation layer to form an ultrathin copper foil with the thickness of 1.5-5 microns on the surface of the organic metal layer, and respectively carrying out subsequent roughening, curing, blackening, galvanizing and antioxidation on the obtained semi-finished product, and coating a silane coupling agent to finally obtain the strippable ultrathin copper foil. In the electrolyte used for electrodeposition, Cu2+The concentration of (A) is 60-90g/L, the concentration of sulfuric acid is 70-150g/L, and the molecular weight is 20The concentration of the collagen of 00-3000 is 0.5-1.0g/L, the concentration of the alkane sulfonic acid sodium salt is 50-200ppm, the concentration of the polyethylene glycol is 10-50ppm, and the concentration of the sodium citrate is 10-100 ppm; the electro-deposition temperature is 40-45 ℃, and the electro-deposition current density is 1000-2。
In the roughening solution used for roughening, Cu2+The concentration is 10-20g/L, the concentration of sulfuric acid is 70-220g/L, WO4 2-The concentration of (A) is 30-50ppm, and the concentration of chloride ion is controlled at 30 ppm.
In the curing liquid used for curing, Cu2+The concentration is 30-60g/L, the concentration of sulfuric acid is 70-150g/L, and the concentration of chloride ion is 20-60 ppm.
In the blackening solution used for blackening, Ni2+The concentration is 1-30g/L, the cobalt concentration is 10-60ppm, one of boric acid or citric acid, and the pH value is 3.5-10; in the zinc plating bath used for zinc plating, Zn2+The concentration is 4-10g/L, the potassium pyrophosphate is 50-70g/L, and the pH value is 8.5-10; in the passivation solution used for passivating the surface, the concentration of chromium is 1-5g/L, and the pH value is 10-14; the components used in the process of coating the silane coupling agent are one or more of silanes containing amino, epoxy, vinyl, acyloxy and alkyl functional groups, and the spraying temperature is 20-35 ℃.
The ultrathin strippable foil prepared by the embodiment has a flat and bright surface, the thickness of 3-6 mu m, the roughness Rz of the rough surface of 1.57um and the tensile strength of 30 kfg/mm2The thickness is uniform, and the phenomenon of tearing the belt is avoided. The bonding force between the carrier foil and the ultrathin foil is 0.2kgf/cm, and the stripping resistance value can be kept unchanged for 10 min after the high-temperature tin immersion treatment at 288 ℃. The copper foil has compact surrounding structure and uneven distribution of copper and nickel elements.
As can be seen from examples 1 to 3 and comparative examples, the introduction of molybdenum in the foil-forming process can reduce the roughness of the rough surface, improve the tensile strength and make the distribution of copper and nickel uniform. Further improving the performance of the copper foil.
The present invention is not limited to the above-described embodiments, and various modifications made without inventive step from the above-described concept will fall within the scope of the present invention for those skilled in the art.

Claims (8)

1. A preparation method of an extremely thin strippable composite copper foil is characterized by comprising the following steps:
s1, starting the ion type vapor deposition coating machine, vacuumizing the ion type vapor deposition coating machine by using a sputtering vacuum pump, filling inert gas into the ion type vapor deposition coating machine, and keeping the vacuum degree of the ion type vapor deposition coating machine at 10-2-10-3Supporting;
THE THE copper foil is used as a base material, and 99.99 percent of copper sheets and 99.99 percent of molybdenum sheets are used as cathode target materials; applying high voltage to the cathode and the anode to form a pretreated foil;
s2, washing and pickling the pretreated foil;
s3, taking the pretreated foil as a second base material, taking 99.99 percent of nickel sheet and 99.99 percent of molybdenum sheet as cathode target materials, and keeping the vacuum degree at 10-2-10-3Applying high voltage to the cathode and the anode in the inert gas atmosphere to form a metal isolation layer on the pretreated foil to obtain a carrier copper foil;
s4, coating an organic isolating layer on the S surface of the carrier copper foil, wherein the organic isolating layer consists of BTA and MBT;
s5, electrodepositing the extra-thin copper foil with the thickness of 1.5-5 mu m on the surface of the carrier copper foil coated with the metal isolation layer and the organic isolation layer, and then sequentially carrying out coarsening, solidification, blackening, galvanizing, passivation surface treatment and silane coupling agent coating processes on the surface of the extra-thin copper foil to obtain a finished product of the composite copper foil.
2. The method of claim 1, wherein the inert gas in step S1 and step S2 is one or more of argon, neon, xenon, krypton, and the like.
3. The method of claim 2, wherein the inert gas used in the steps S1 and S2 is the same.
4. The preparation method according to claim 1, wherein in the step S1, the mass ratio of copper to molybdenum is 7-9: 1.
5. The method according to claim 1, wherein the roughening solution used for roughening contains Cu2+The concentration is 10-20g/L, the concentration of sulfuric acid is 70-220g/L, WO4 2-The concentration of (A) is 30-50ppm, and the concentration of chloride ion is controlled at 30 ppm.
6. The method according to claim 1, wherein the curing liquid used for curing contains Cu2+The concentration is 30-60g/L, the concentration of sulfuric acid is 70-150g/L, and the concentration of chloride ion is 20-60 ppm.
7. The method according to claim 1, wherein Ni is contained in a blackening solution used for blackening2+The concentration is 1-30g/L, the cobalt concentration is 10-60ppm, one of boric acid or citric acid, and the pH value is 3.5-10; in the zinc plating bath used for zinc plating, Zn2+The concentration is 4-10g/L, the potassium pyrophosphate is 50-70g/L, and the pH value is 8.5-10; in the passivation solution used for passivating the surface, the concentration of chromium is 1-5g/L, and the pH value is 10-14; the components used in the process of coating the silane coupling agent are one or more of silanes containing amino, epoxy, vinyl, acyloxy and alkyl functional groups, and the spraying temperature is 20-35 ℃.
8. A composite copper foil produced by the production method according to any one of claims 1 to 7.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114672855A (en) * 2022-03-29 2022-06-28 电子科技大学 Preparation method of ultrathin copper foil
CN115233262A (en) * 2022-08-01 2022-10-25 九江德福科技股份有限公司 Preparation method of ultra-thin copper foil with carrier
CN116618647A (en) * 2023-07-21 2023-08-22 安徽诺星航空科技有限公司 Molybdenum-copper alloy composite material and preparation process thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260058A (en) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk Carrier-attached very thin copper foil, manufacturing method of carrier-attached very thin copper foil, and wiring board
US20090291319A1 (en) * 2006-05-19 2009-11-26 Mitsui Mining & Smelting Co., Ltd. Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, surface-treated copper foil with carrier sheet and copper-clad laminate using the surface-treated copper foil with carrier sheet
CN101892499A (en) * 2010-07-24 2010-11-24 江西理工大学 Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
US20120196144A1 (en) * 2011-01-31 2012-08-02 Ming Jen Tzou Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
JP2012219368A (en) * 2011-04-14 2012-11-12 Nan Ya Plastics Corp Ultra thin copper foil with very low profile copper foil as carrier and manufacturing method therefor
TW201420360A (en) * 2012-11-16 2014-06-01 Nanya Plastics Corp Copper foil structure having a blackening ultra-thin coil and manufacturing method thereof
CN103857178A (en) * 2012-12-03 2014-06-11 南亚塑胶工业股份有限公司 Copper foil structure with black ultra-thin copper foil and manufacturing method thereof
US20190371750A1 (en) * 2017-01-16 2019-12-05 Iljin Materials Co., Ltd. Carrier-foil-attached ultra-thin copper foil
CN111278644A (en) * 2017-12-27 2020-06-12 三井金属矿业株式会社 Copper foil with carrier
CN112795964A (en) * 2020-12-07 2021-05-14 安徽铜冠铜箔集团股份有限公司 Ultrathin strippable composite copper foil and preparation method thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260058A (en) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk Carrier-attached very thin copper foil, manufacturing method of carrier-attached very thin copper foil, and wiring board
US20090291319A1 (en) * 2006-05-19 2009-11-26 Mitsui Mining & Smelting Co., Ltd. Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, surface-treated copper foil with carrier sheet and copper-clad laminate using the surface-treated copper foil with carrier sheet
CN101892499A (en) * 2010-07-24 2010-11-24 江西理工大学 Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
US20120196144A1 (en) * 2011-01-31 2012-08-02 Ming Jen Tzou Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
JP2012219368A (en) * 2011-04-14 2012-11-12 Nan Ya Plastics Corp Ultra thin copper foil with very low profile copper foil as carrier and manufacturing method therefor
TW201420360A (en) * 2012-11-16 2014-06-01 Nanya Plastics Corp Copper foil structure having a blackening ultra-thin coil and manufacturing method thereof
CN103857178A (en) * 2012-12-03 2014-06-11 南亚塑胶工业股份有限公司 Copper foil structure with black ultra-thin copper foil and manufacturing method thereof
US20190371750A1 (en) * 2017-01-16 2019-12-05 Iljin Materials Co., Ltd. Carrier-foil-attached ultra-thin copper foil
CN111278644A (en) * 2017-12-27 2020-06-12 三井金属矿业株式会社 Copper foil with carrier
CN112795964A (en) * 2020-12-07 2021-05-14 安徽铜冠铜箔集团股份有限公司 Ultrathin strippable composite copper foil and preparation method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114672855A (en) * 2022-03-29 2022-06-28 电子科技大学 Preparation method of ultrathin copper foil
CN114672855B (en) * 2022-03-29 2023-09-26 电子科技大学 Preparation method of ultrathin copper foil
CN115233262A (en) * 2022-08-01 2022-10-25 九江德福科技股份有限公司 Preparation method of ultra-thin copper foil with carrier
CN115233262B (en) * 2022-08-01 2023-12-12 九江德福科技股份有限公司 Preparation method of extra-thin copper foil with carrier
CN116618647A (en) * 2023-07-21 2023-08-22 安徽诺星航空科技有限公司 Molybdenum-copper alloy composite material and preparation process thereof
CN116618647B (en) * 2023-07-21 2023-10-13 安徽诺星航空科技有限公司 Molybdenum-copper alloy composite material and preparation process thereof

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