CN113956808A - Copper foil adhesive tape for enhancing signals and manufacturing method thereof - Google Patents
Copper foil adhesive tape for enhancing signals and manufacturing method thereof Download PDFInfo
- Publication number
- CN113956808A CN113956808A CN202111174669.9A CN202111174669A CN113956808A CN 113956808 A CN113956808 A CN 113956808A CN 202111174669 A CN202111174669 A CN 202111174669A CN 113956808 A CN113956808 A CN 113956808A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- conductive adhesive
- coated
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Abstract
The invention discloses a copper foil tape for enhancing signals and a manufacturing method thereof, relates to the field of copper foil tapes, and comprises a second metal layer. The invention has excellent oxidation resistance and corrosion resistance, no color change in appearance after 8H continuous spraying in neutral salt spray test, excellent conductivity, extremely low grounding resistance, and lower than 5m omega/inch of vertical resistance in vertical resistance test2The conductive particles (including nickel powder, gold powder, silver powder, nickel-coated graphite powder, silver-coated copper powder and the like) can be selected and used as polymer-coated polymer microspheres with metal coatings (the polymer microspheres with the metal coatings comprise gold-coated polymer microspheres, silver-coated polymer microspheres, copper-coated polymer microspheres and nickel-coated polymer microspheres), wherein the polymer-coated polymer microspheres with the metal coatings can realize anisotropic conductivity and have excellent conductivityThe adhesive has the advantages of initial adhesion, peeling force, permanent adhesion, good heat conduction and heat dissipation performance, heat conductivity coefficient of 400W/m x k, excellent shielding efficiency, and 0-10 GHz range exceeding 100 dB.
Description
Technical Field
The invention relates to the field of copper foil tapes, in particular to a copper foil tape for enhancing signals and a manufacturing method thereof.
Background
The copper foil tape is a metal tape and is mainly applied to the fields of electromagnetic shielding and heat conduction and heat dissipation, the copper foil has excellent electrical conductivity and heat conductivity, but is easy to oxidize, and after gold plating, the overall effects of oxidation resistance, salt mist resistance and stability are enhanced, so that the copper foil tape is widely applied to mobile phones, notebook computers and other digital products.
The arrival of 5G brings opportunities and challenges, and the update of communication technology has more stringent requirements on signal processing: the antenna plays an important role in the process of filtering invalid electromagnetic waves and enhancing valid signals, and the existing antenna has weak signal receiving and transmitting capacity and cannot meet the requirements of communication technology on signal processing.
Disclosure of Invention
Based on this, the present invention aims to provide a copper foil tape for signal enhancement and a method for manufacturing the same, so as to solve the problems of 5G coming and the challenges brought by the chance, and the update of the communication technology has more stringent requirements for signal processing: the antenna plays an important role in the process of filtering invalid electromagnetic waves and enhancing valid signals, and the existing antenna has weak signal receiving and transmitting capacity and cannot meet the technical problem of the requirement of communication technology on signal processing.
In order to achieve the purpose, the invention provides the following technical scheme: the copper foil adhesive tape for enhancing signals comprises a second metal layer, wherein a first metal layer is arranged at the bottom end of the second metal layer, a copper foil layer is connected to the bottom end of the first metal layer, a conductive adhesive layer is arranged at the bottom end of the copper foil layer, and a release layer is connected to the bottom end of the conductive adhesive layer.
Preferably, the method comprises the following steps:
the method comprises the following steps: adopting a copper foil layer as a base material, and carrying out plating treatment on the top surface of the copper foil layer to form a first metal layer and a second metal layer;
step two: after the plating layer is finished, coating a special conductive adhesive on the bottom surface of the copper foil layer;
step three: drying the conductive adhesive to form a conductive adhesive layer;
step four: sticking the bottom surface of the conductive adhesive layer and the release surface of the release layer;
step five: curing at room temperature to 40 ℃, inspecting, cutting, rolling and storing.
Preferably, in the step one, the top surface of the copper foil layer is plated, the primary plating layer is plated in an electroplating mode, the plating layer is one of zinc, nickel and chromium, the secondary plating layer is plated in a vacuum mode, and the plating layer is gold, and the method includes the following steps:
s1: performing primary electroplating, namely washing the copper foil layer of the substrate with water, after washing, ensuring that the surface of the copper foil layer does not contain impurities, pickling the copper foil layer to remove oxides, activating the substrate, keeping the pickling concentration at 5%, and keeping the pickling time until the acid liquor is turbid;
s2: acid degreasing is carried out, oxides on the copper surface are removed, an acid degreasing agent is used, the concentration of the degreasing agent is 10%, the degreasing time is 6min, secondary pickling is carried out after degreasing, the base material is activated, the concentration is 5%, and the pickling time is 3 min;
s3: electroplating;
s4: the secondary coating adopts a magnetron sputtering coating method in vacuum coating, inert gas is filled in vacuum, high-voltage vacuum current is heated between the substrate and the number target material, electrons generated by glow discharge excite the inert gas to generate plasma, and the plasma bombs out atoms of the metal target material to be deposited on the substrate to finish coating;
s5: and after the film coating is finished, drying the film by adopting low-temperature air.
Preferably, step two: after the coating is finished, coating a special conductive adhesive on the bottom surface of the copper foil layer to form a conductive adhesive layer, wherein the conductive adhesive layer comprises a resin adhesive and conductive particles, the resin adhesive can adopt thermoplastic resin or thermosetting resin, the thermoplastic resin is polyacrylic resin or polymethacrylic resin, the thermosetting resin is mainly epoxy resin, and the conductive particles are one or more of nickel powder, gold powder, silver powder, nickel-coated graphite powder, silver-coated copper powder, polymer-coated gold-plated polymer microspheres, polymer-coated silver-plated polymer microspheres, polymer-coated copper-plated polymer microspheres and polymer-coated nickel-plated polymer microspheres.
6. Preferably, the preparation method of the conductive adhesive layer comprises the following steps:
s1: the common conductive adhesive layer comprises that after a nickel layer with the thickness of 0.6 mu m is electroplated on the other surface, a gold layer with the thickness of 20nm is vacuum-plated, a copper surface protective film is torn off, and raw materials of thermoplastic resin, conductive particles, a curing agent and a solvent are proportioned, wherein the proportion of the thermoplastic resin, the conductive particles, the curing agent and the solvent is 50:10:1: 75;
s2: sequentially adding resin, a solvent, conductive particles and a curing agent into a planetary stirrer for stirring, wherein the stirring time is 30-40min, the stirring speed is 800 r/min, and the stirring temperature is controlled at 20-33 ℃;
s3: after stirring, taking out the slurry, filtering, and standing at room temperature for defoaming;
s4: coating the bottom end of the copper foil layer by adopting a scraper or a micro-concave coating mode;
s5: the anisotropic conductive adhesive layer comprises a copper surface protective film which is torn off after a zinc layer with the thickness of 30nm is electroplated on the other surface of the anisotropic conductive adhesive layer, and raw materials of thermosetting resin, conductive particles, a curing agent and a solvent are proportioned, wherein the proportion of the thermosetting resin, the conductive particles, the curing agent and the solvent is 40:10:1: 5;
s6: sequentially adding resin, solvent, conductive particles and curing agent into a planetary stirrer for stirring, wherein the stirring time is 30-40min, the stirring speed is 1000 r/min, and the stirring temperature is controlled at 20-33 ℃;
s7: after stirring, taking out the slurry, filtering, and standing at room temperature for defoaming;
s8: and the coating is coated at the bottom end of the copper foil layer in a slit mode.
Preferably, in the process of attaching the bottom surface of the conductive adhesive layer by using the release surface of the release layer, the release layer is one of a silicon-based release film and release paper.
Preferably, the thickness of the copper foil layer is 4-35 μm, the thickness of the first metal layer is 0.5-5 μm, the thickness of the second metal layer is 10-100 nm, the thickness of the conductive adhesive layer is 5-60 μm, and the use thicknesses of the second metal layer, the first metal layer, the copper foil layer, the conductive adhesive layer and the release layer are 10-100 μm.
Compared with the prior art, the invention has the beneficial effects that:
1. the device has excellent oxidation resistance and corrosion resistance through the second metal layer, the first metal layer, the copper foil layer, the conductive adhesive layer and the release layer, the neutral salt spray test shows no color change after continuously spraying for 8H, the device has excellent conductive performance and extremely small grounding resistance, the vertical resistance test is lower than 5m omega/inch 2, the conductive particles (including nickel powder, gold powder, silver powder, nickel-coated graphite powder, silver-coated copper powder and the like) can be selected as metal-coated polymer microspheres (including gold-coated polymer microspheres, silver-coated polymer microspheres, copper-coated polymer microspheres and nickel-coated polymer microspheres), the metal-coated polymer microspheres can realize anisotropic conductivity, the device also has excellent initial adhesion, stripping force and holding adhesion, the heat conduction and heat dissipation performance is good, the heat conduction coefficient can reach 400W/m k, and the device has excellent shielding efficiency, the range of 0-10 GHz exceeds 100 dB.
Drawings
FIG. 1 is a schematic view of a conventional bonding structure of a conductive adhesive layer according to the present invention;
FIG. 2 is a schematic diagram of a connection structure of an ACF conductive adhesive layer according to the present invention;
FIG. 3 is a flow chart of the present invention.
In the figure: 1. a second metal layer; 2. a first metal layer; 3. a copper foil layer; 4. a conductive adhesive layer; 5. and a release layer.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following describes an embodiment of the present invention based on its overall structure.
Example 1
A copper foil adhesive tape for enhancing signals and a manufacturing method thereof comprise a second metal layer 1, wherein a first metal layer 2 is arranged at the bottom end of the second metal layer 1, a copper foil layer 3 is connected to the bottom end of the first metal layer 2, a conductive adhesive layer 4 is arranged at the bottom end of the copper foil layer 3, and a release layer 5 is connected to the bottom end of the conductive adhesive layer 4.
The method comprises the following steps:
the method comprises the following steps: adopting a copper foil layer 3 as a base material, and carrying out plating treatment on the top surface of the copper foil layer 3 to form a first metal layer 2 and a second metal layer 1;
step two: after the plating layer is finished, coating a special conductive adhesive for adhering the conductive adhesive layer 4 on the bottom surface of the copper foil layer 3;
step three: coating the bottom surface of the copper foil layer 3 to form a conductive adhesive layer 4;
step four: the bottom surface of the conductive adhesive layer 4 is bonded with the release layer 5 by a release film adhesive;
step five: and (5) drying by cold air, and inspecting, cutting, rolling and storing the product.
In this embodiment, a high-quality electrolytic copper foil of 6 μm is selected, a protective film is coated on one surface of the electrolytic copper foil, a nickel layer of 0.8 μm is plated on the other surface of the electrolytic copper foil, a gold layer of 40nm in thickness is vacuum-plated, the protective film is removed, polyacrylic resin is mechanically stirred, screened conductive particles are added, a curing agent is weighed according to a certain proportion, ethyl acetate or toluene is used for dilution, glue is uniformly mixed and then coated on the non-plating surface of the gold-plated copper foil, and the non-plating surface is bonded with a release film to prepare a copper foil adhesive tape with a grounded reinforcing signal, which is a copper foil adhesive tape with a common conductive adhesive layer, please refer to fig. 1.
Example 2
A copper foil adhesive tape for enhancing signals and a manufacturing method thereof comprise a second metal layer 1, wherein a first metal layer 2 is arranged at the bottom end of the second metal layer 1, a copper foil layer 3 is connected to the bottom end of the first metal layer 2, a conductive adhesive layer 4 is arranged at the bottom end of the copper foil layer 3, and a release layer 5 is connected to the bottom end of the conductive adhesive layer 4.
The method comprises the following steps:
the method comprises the following steps: adopting a copper foil layer 3 as a base material, and carrying out plating treatment on the top surface of the copper foil layer 3 to form a first metal layer 2 and a second metal layer 1;
step two: after the plating layer is finished, coating a special conductive adhesive for adhering the conductive adhesive layer 4 on the bottom surface of the copper foil layer 3;
step three: coating the bottom surface of the copper foil layer 3 to form a conductive adhesive layer 4;
step four: the bottom surface of the conductive adhesive layer 4 is bonded with the release layer 5 by a release film adhesive;
step five: and (5) drying by cold air, and inspecting, cutting, rolling and storing the product.
In this embodiment, a high-quality electrolytic copper foil of 8 μm is selected, a protective film is coated on one surface of the electrolytic copper foil, a zinc layer of 0.8 μm is electroplated on the other surface of the electrolytic copper foil, a gold layer with a thickness of 20nm is vacuum-plated, the protective film is removed, polyacrylic resin is mechanically stirred, the screened gold-coated polymer microspheres are added, a curing agent is weighed according to a certain proportion, cyclohexanone or butanone is used for dilution, glue is uniformly mixed and then coated on the non-plating surface of the gold-plated copper foil, and the non-plating surface is bonded with a release film to prepare a copper foil adhesive tape with an enhanced signal capable of being grounded, which is an anisotropic conductive adhesive layer (ACF) copper foil adhesive tape, please refer to fig. 2.
Although embodiments of the present invention have been shown and described, it is intended that the present invention should not be limited thereto, that the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples, and that modifications, substitutions, variations or the like, which are not inventive and may be made by those skilled in the art without departing from the principle and spirit of the present invention and without departing from the scope of the claims.
Claims (7)
1. A copper foil tape for signal enhancement comprising a second metal layer (1), characterized in that: the bottom of second metal level (1) is provided with first metal level (2), and the bottom of first metal level (2) is connected with copper foil layer (3), the bottom of copper foil layer (3) is provided with conductive adhesive layer (4), and the bottom of conductive adhesive layer (4) is connected with from type layer (5).
2. A copper foil tape for signal enhancement and a method of making the same according to claim 1, comprising:
the method comprises the following steps: adopting a copper foil layer (3) as a base material, and carrying out plating treatment on the top surface of the copper foil layer (3) to form a first metal layer (2) and a second metal layer (1);
step two: after the plating layer is finished, coating a special conductive adhesive on the bottom surface of the copper foil layer (3) to form a conductive adhesive layer (4);
step three: coating a film on the bottom surface of the copper foil layer (3) to form a conductive adhesive layer (4);
step four: the bottom surface of the conductive adhesive layer (4) is attached to the release surface of the release layer (5);
step five: curing at room temperature to 40 ℃, inspecting, cutting, rolling and storing.
3. A copper foil tape for signal enhancement and a method of manufacturing the same according to claim 2, wherein: in the step one, the top surface of the copper foil layer (3) is plated, the primary plating layer adopts an electroplating mode, the plating layer is one of zinc, nickel and chromium, the secondary plating layer adopts a vacuum plating mode, and the plating layer is gold, and the method comprises the following steps:
s1: primary electroplating, namely washing the copper foil layer (3) of the substrate by water, after washing, ensuring that the surface of the copper foil layer (3) does not contain impurities, pickling the copper foil layer to remove oxides and activate the substrate, wherein the pickling concentration is kept at 5%, and the pickling time is that the acid liquor is turbid;
s2: acid degreasing is carried out, oxides on the copper surface are removed, an acid degreasing agent is used, the concentration of the degreasing agent is 10%, the degreasing time is 6min, secondary pickling is carried out after degreasing, the base material is activated, the concentration is 5%, and the pickling time is 3 min;
s3: electroplating;
s4: the secondary coating adopts a magnetron sputtering coating method in vacuum coating, inert gas is filled in vacuum, high-voltage vacuum current is heated between the substrate and the number target material, electrons generated by glow discharge excite the inert gas to generate plasma, and the plasma bombs out atoms of the metal target material to be deposited on the substrate to finish coating;
s5: and after the film coating is finished, drying the film by adopting low-temperature air.
4. A copper foil tape for signal enhancement and a method of manufacturing the same according to claim 2, wherein: the second step is as follows: after the coating is finished, a special conductive adhesive is coated on the bottom surface of the copper foil layer (3) to form a conductive adhesive layer (4), wherein the conductive adhesive layer (4) comprises a resin adhesive and conductive particles, the resin adhesive can adopt thermoplastic resin or thermosetting resin, the thermoplastic resin is polyacrylic resin or polymethacrylic resin, the thermosetting resin is mainly epoxy resin, and the conductive particles are one or more of nickel powder, gold powder, silver powder, nickel-coated graphite powder, silver-coated copper powder, polymer-coated gold-plated polymer microspheres, polymer-coated silver-plated polymer microspheres, polymer-coated copper-plated polymer microspheres and polymer-coated nickel-plated polymer microspheres.
5. A copper foil tape for signal enhancement and a method of making the same according to claim 4 wherein: the preparation method of the conductive adhesive layer (4) comprises the following steps of:
s1: the common conductive adhesive layer comprises that after a nickel layer with the thickness of 0.6 mu m is electroplated on the other surface, a gold layer with the thickness of 20nm is vacuum-plated, a copper surface protective film is torn off, and raw materials of thermoplastic resin, conductive particles, a curing agent and a solvent are proportioned, wherein the proportion of the thermoplastic resin, the conductive particles, the curing agent and the solvent is 50:10:1: 75;
s2: sequentially adding resin, a solvent, conductive particles and a curing agent into a planetary stirrer for stirring, wherein the stirring time is 30-40min, the stirring speed is 800 r/min, and the stirring temperature is controlled at 20-33 ℃;
s3: after stirring, taking out the slurry, filtering, and standing at room temperature for defoaming;
s4: coating the bottom end of the copper foil layer (3) by adopting a scraper or a micro-concave coating mode;
s5: the anisotropic conductive adhesive layer comprises a copper surface protective film which is torn off after a zinc layer with the thickness of 30nm is electroplated on the other surface of the anisotropic conductive adhesive layer, and raw materials of thermosetting resin, conductive particles, a curing agent and a solvent are proportioned, wherein the proportion of the thermosetting resin, the conductive particles, the curing agent and the solvent is 40:10:1: 5;
s6: sequentially adding resin, solvent, conductive particles and curing agent into a planetary stirrer for stirring, wherein the stirring time is 30-40min, the stirring speed is 1000 r/min, and the stirring temperature is controlled at 20-33 ℃;
s7: after stirring, taking out the raw materials, filtering, and standing at room temperature for defoaming;
s8: is coated at the bottom end of the copper foil layer (3) by adopting a slit mode.
6. A copper foil tape for signal enhancement and a method of manufacturing the same according to claim 2, wherein: the fourth step is that: and in the process of attaching the bottom surface of the conductive adhesive layer (4) by using the release surface of the release layer (5), the release layer (5) is one of a silicon-based release film and release paper.
7. A copper foil tape for signal enhancement and a method of manufacturing the same according to claim 2, wherein: the thickness of the copper foil layer (3) is 4-35 mu m, the thickness of the first metal layer (2) is 0.5-5 mu m, the thickness of the second metal layer (1) is 10-100 nm, the thickness of the conductive adhesive layer (4) is 5-60 mu m, and the use thicknesses of the second metal layer (1), the first metal layer (2), the copper foil layer (3), the conductive adhesive layer (4) and the release layer (5) are 10-100 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111174669.9A CN113956808A (en) | 2021-10-09 | 2021-10-09 | Copper foil adhesive tape for enhancing signals and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111174669.9A CN113956808A (en) | 2021-10-09 | 2021-10-09 | Copper foil adhesive tape for enhancing signals and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113956808A true CN113956808A (en) | 2022-01-21 |
Family
ID=79463149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111174669.9A Withdrawn CN113956808A (en) | 2021-10-09 | 2021-10-09 | Copper foil adhesive tape for enhancing signals and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113956808A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114855156A (en) * | 2022-05-09 | 2022-08-05 | 如皋市凯源电器设备有限公司 | Preparation process of corrosion-resistant conductive strip |
-
2021
- 2021-10-09 CN CN202111174669.9A patent/CN113956808A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114855156A (en) * | 2022-05-09 | 2022-08-05 | 如皋市凯源电器设备有限公司 | Preparation process of corrosion-resistant conductive strip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11272646B2 (en) | Electromagnetic interference (EMI) shielding film, circuit board, and preparation method for EMI shielding film | |
| JP2019083205A (en) | Shield film, shielded printed wiring board, and method for manufacturing shield film | |
| US10881039B1 (en) | Electromagnetic interference shielding film, circuit board, and preparation method for electromagnetic interference shielding film | |
| WO2013188997A1 (en) | Ultrathin shielding film of high shielding effectiveness and manufacturing method therefor | |
| CN108323143B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| KR20130106283A (en) | An electromagnetic shielding adhesive tape | |
| WO2019144564A1 (en) | Electromagnetic wave shielding film, manufacturing method therefore, and use thereof | |
| JP2015206119A (en) | surface-treated copper foil | |
| CN112853408A (en) | Preparation method of ultrathin carrier-attached copper foil easy to peel and pure in interface | |
| CN113956808A (en) | Copper foil adhesive tape for enhancing signals and manufacturing method thereof | |
| JP2011153372A (en) | Metal multilayer laminated electrical insulator, and method for producing the same | |
| CN207885103U (en) | A kind of electromagnetic shielding film | |
| CN112111233A (en) | Thermosetting conductive shielding adhesive film and preparation method thereof | |
| CN111154228B (en) | Preparation method of electromagnetic wave shielding film | |
| CN110149790B (en) | Graphene electromagnetic shielding film and preparation method thereof | |
| CN116891694A (en) | Copper foil adhesive tape and manufacturing method thereof | |
| KR102502018B1 (en) | Surface treatment copper foil and copper clad laminate | |
| JPH04212498A (en) | Conductive adhesive member, preparation of the same, and conductive component/electronic equipment using the same | |
| CN104091796A (en) | Electronic chip shielding layer structure | |
| CN113930180A (en) | Copper foil adhesive tape for enhancing signals | |
| CN116716055A (en) | Copper foil adhesive tape | |
| CN1306387A (en) | Method for generating electromagnetic wave interference shielding membrane | |
| CN110783015A (en) | Conductive adhesive film, circuit board and preparation method of conductive adhesive film | |
| CN109890187A (en) | FPC electromagnetic shielding film and preparation method thereof | |
| CN209627808U (en) | Free ground film and wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220121 |
|
| WW01 | Invention patent application withdrawn after publication |