CN114855156A - Preparation process of corrosion-resistant conductive strip - Google Patents
Preparation process of corrosion-resistant conductive strip Download PDFInfo
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- CN114855156A CN114855156A CN202210496192.4A CN202210496192A CN114855156A CN 114855156 A CN114855156 A CN 114855156A CN 202210496192 A CN202210496192 A CN 202210496192A CN 114855156 A CN114855156 A CN 114855156A
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- copper foil
- passivation
- agent
- organic compounds
- sodium
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- 238000005260 corrosion Methods 0.000 title claims abstract description 21
- 230000007797 corrosion Effects 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000011889 copper foil Substances 0.000 claims abstract description 63
- 238000002161 passivation Methods 0.000 claims abstract description 40
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 36
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 18
- 239000008139 complexing agent Substances 0.000 claims abstract description 18
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 18
- KIEOKOFEPABQKJ-UHFFFAOYSA-N sodium dichromate Chemical compound [Na+].[Na+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KIEOKOFEPABQKJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 235000010288 sodium nitrite Nutrition 0.000 claims abstract description 18
- 238000005096 rolling process Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000000137 annealing Methods 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 239000013078 crystal Substances 0.000 claims abstract description 8
- 239000011241 protective layer Substances 0.000 claims abstract description 8
- 239000013077 target material Substances 0.000 claims abstract description 8
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 5
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 27
- 238000005406 washing Methods 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000011550 stock solution Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 15
- 229910021641 deionized water Inorganic materials 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 12
- 238000005237 degreasing agent Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000013543 active substance Substances 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000013527 degreasing agent Substances 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 150000002484 inorganic compounds Chemical class 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 9
- 239000007800 oxidant agent Substances 0.000 claims description 9
- 238000004321 preservation Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229940125782 compound 2 Drugs 0.000 claims description 3
- 229940126214 compound 3 Drugs 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 claims description 3
- 239000000446 fuel Substances 0.000 claims description 3
- 238000005098 hot rolling Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000002244 precipitate Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000007888 film coating Substances 0.000 abstract description 2
- 238000009501 film coating Methods 0.000 abstract description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention discloses a preparation process of a corrosion-resistant conductive strip, which comprises the following preparation steps: s1: repeatedly rolling; s2: annealing; s3: cleaning and purifying; s4: preparing a passivation solution; s5: passivating; s6: pulse coating; s7: the conductive copper foil is passivated by using novel passivation solution prepared from sodium nitrite, triethanolamine, sodium bichromate, sodium carbonate, a defoaming agent and a complexing agent, so that a first layer of corrosion-resistant and oxidation-resistant protective layer can be obtained, then a mixed crystal prepared from nickel powder, aluminum powder and silver ion solution is used as a target material, the conductive strip is subjected to film coating deposition treatment by a pulse laser deposition method, a deposited metal corrosion-resistant film is stably attached to the surface of the conductive strip, and a second layer of firmer and more durable corrosion-resistant and oxidation-resistant protective layer is obtained.
Description
Technical Field
The invention relates to the field of preparation of metal conducting strips, in particular to a preparation process of a corrosion-resistant conducting strip.
Background
Today, with rapid development of high technology, electronic products are being updated day by day, and the requirements for materials of electronic products are higher and higher, so as to make life of people safer, metal conductive bars with outstanding conductive performance and low cost are required.
The conductive strip is a conductive device mainly used for non-horizontal direction live motion and medium and low voltage circuit breakers and the like, the conductive strip is made of a metal substrate (copper or aluminum) and a silica gel insulating protective layer, a main conductive part is made of a metal material with high conductivity, and the copper and the aluminum have small resistivity and high conductivity, so the conductive strip is always considered to be the best material for manufacturing the conductive strip.
In practical use, due to different applied environments, the oxidation resistance and the corrosion resistance of the conductive strip have to be considered, and the existing methods for improving the oxidation resistance and the corrosion resistance of the conductive strip generally adopt an electrolysis or passivation method to improve the performance, and although the method can ensure that the conductive strip is not oxidized and corroded in a short time, the passivated conductive strip still has no lasting corrosion resistance with the increase of the service time, so that a preparation process of the corrosion-resistant conductive strip is required to be provided.
Disclosure of Invention
The present invention is directed to a process for manufacturing a corrosion-resistant conductive strip, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a preparation process of a corrosion-resistant conductive strip, wherein a basic original sheet is a high-precision copper strip, the thickness of the high-precision copper strip is less than 200 microns, and the preparation process comprises the following preparation steps:
s1: repeatedly rolling, namely feeding the high-precision copper strip into a rolling machine, conveying the high-precision copper strip into gaps of a plurality of rotating rollers in the rolling machine by a conveying mechanism, heating the rotating rollers to a specified temperature, repeatedly hot rolling, and obtaining a 50-120 micron copper foil after rolling;
s2: annealing, namely putting the rolled copper foil into an annealing furnace, heating the copper foil by using liquid and gas fuel, vacuumizing the annealing furnace to avoid the oxidation phenomenon of the copper foil exposed in the air, stopping heating for heat preservation when the surface of the copper foil reaches a specified temperature, and controlling the heat preservation time to be 1-1.5h so as to completely transform the microstructure of the copper foil, and slowly reducing the temperature in the furnace after heat preservation to enable the internal structure of the copper foil to reach a balanced state so as to obtain good process performance;
s3: cleaning and purifying, namely putting the annealed copper foil into a cleaning barrel, adding trichloroethylene, stirring, washing for 20 minutes, filtering, adding ethanol, repeatedly washing, filtering again after washing, adding 1mol/L citric acid solution after filtering, stirring, washing for 20 minutes, washing and filtering with ethanol again, removing waste liquid, and drying in vacuum;
s4: preparing a passivation solution: the formula of the passivation stock solution comprises: deionized water, 1-1.5% of sodium nitrite, 2-3% of triethanolamine, 1-1.5% of sodium bichromate, 1.5-3% of sodium carbonate, 3% of defoaming agent and 6-8% of complexing agent; the treatment stock solution formula comprises: 7 to 10 percent of active agent and 9.5 to 11 percent of degreasing agent;
preparing a passivation stock solution: after the sodium nitrite, the triethanolamine, the sodium bichromate, the sodium carbonate, the defoaming agent and the complexing agent are measured according to the formula, added into deionized water in sequence, stirred and dissolved by a stirrer and uniformly mixed;
s5: passivating: putting a copper foil into an active agent, increasing the reaction activity of the surface of the copper foil by the active agent, and facilitating quick film formation, wherein the treatment time is controlled to be 20-25 minutes, after the treatment, putting the copper foil into prepared passivation stock solution, standing for 10-15 minutes, after the passivation is completed, washing the passivated copper foil by using a degreasing agent, cleaning oil stains on the surface of the passivated copper foil, finally washing the copper foil by using an ultrasonic cleaner, standing for 5-10 minutes after the washing, sending the copper foil into a dryer, and controlling the drying temperature to be 80-100 ℃;
s6: pulse coating: selecting platinum powder and nickel powder according to a proper amount, putting the two metal powders into a silver ion solution, stirring and mixing, extracting the prepared metal mixed solution after mixing, preparing metal mixed crystals by adopting a cooling crystallization method, taking metal mixed crystals as a target material of pulse laser deposition equipment, taking passivated metal copper foil as a substrate, bombarding the target material by utilizing a laser beam, depositing the bombarded substances on the substrate to form a precipitate on the substrate, and standing for 30 minutes for forming;
s7: and cutting, namely feeding the coated copper foil into a copper foil cutting machine, cutting the copper foil by the cutting machine according to the required length, and adding a silica gel insulating protective layer to obtain the copper conductive strip.
Preferably, the formula proportion 1 of the passivation stock solution is as follows:
| raw materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1% | / |
| Triethanolamine | Organic compounds | 2% | / |
| Sodium bichromate | Oxidizing agent | 1.5% | / |
| Sodium carbonate | Inorganic compound | 1.5% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 6% | / |
| Deionized water | Pure water | Make up to 100% |
Preferably, the formula ratio 2 of the passivation stock solution is as follows:
| raw materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1.5% | / |
| Triethanolamine | Organic compounds | 2.5% | / |
| Sodium bichromate | Oxidizing agent | 1% | / |
| Sodium carbonate | Inorganic compound | 2% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 7% | / |
| Deionized water | Pure water | Make up to 100% |
Preferably, the formula ratio 3 of the passivation stock solution is as follows:
| starting materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1.25% | / |
| Triethanolamine | Organic compounds | 3% | / |
| Sodium bichromate | Oxidizing agent | 1.5% | / |
| Sodium carbonate | Inorganic compound | 3% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 8% | / |
| Deionized water | Pure water | Make up to 100% |
Preferably, in the passivation treatment, the copper foil needs to be heated to 70 ℃ when entering the passivation stock solution, so that a better passivation effect can be obtained conveniently.
Preferably, the degreasing agent used in the passivation treatment can be any one of a neutral or weakly alkaline degreasing agent.
Preferably, the conductive strip obtained after cutting in S7 may be provided with a plurality of heat dissipation holes through a punching device, and a metal heat conduction sheet is mounted in the heat dissipation holes.
The invention has the technical effects and advantages that: a process for preparing anticorrosion conducting strip includes such steps as passivating the conducting copper foil by the passivating liquid prepared from sodium nitrite, triethanolamine, sodium bichromate, sodium carbonate, defoaming agent and complexing agent to obtain the first anticorrosion and antioxidizing protecting layer, depositing the conducting strip by pulse laser deposition method, and attaching the anticorrosion film to the surface of conducting strip to obtain the second anticorrosion and antioxidizing protecting layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a preparation process of a corrosion-resistant conductive strip, wherein a basic original sheet adopts a high-precision copper strip, the thickness of the high-precision copper strip is less than 200 micrometers, and the preparation process comprises the following preparation steps:
s1: repeatedly rolling, namely feeding the high-precision copper strip into a rolling machine, conveying the high-precision copper strip into gaps of a plurality of rotating rollers in the rolling machine by a conveying mechanism, heating the rotating rollers to a specified temperature, repeatedly hot rolling, and obtaining a 50-120 micron copper foil after rolling;
s2: annealing, namely putting the rolled copper foil into an annealing furnace, heating the copper foil by using liquid and gas fuel, vacuumizing the annealing furnace to avoid the oxidation phenomenon of the copper foil exposed in the air, stopping heating for heat preservation when the surface of the copper foil reaches a specified temperature, and controlling the heat preservation time to be 1-1.5h so as to completely transform the microstructure of the copper foil, and slowly reducing the temperature in the furnace after heat preservation to enable the internal structure of the copper foil to reach a balanced state so as to obtain good process performance;
s3: cleaning and purifying, namely putting the annealed copper foil into a cleaning barrel, adding trichloroethylene, stirring, washing for 20 minutes, filtering, adding ethanol, repeatedly washing, filtering again after washing, adding 1mol/L citric acid solution after filtering, stirring, washing for 20 minutes, washing and filtering with ethanol again, removing waste liquid, and drying in vacuum;
s4: preparing a passivation solution: the formula of the passivation stock solution comprises: deionized water, 1-1.5% of sodium nitrite, 2-3% of triethanolamine, 1-1.5% of sodium bichromate, 1.5-3% of sodium carbonate, 3% of defoaming agent and 6-8% of complexing agent; the treatment stock solution formula comprises: 7 to 10 percent of active agent and 9.5 to 11 percent of degreasing agent;
preparing a passivation stock solution: after the sodium nitrite, the triethanolamine, the sodium bichromate, the sodium carbonate, the defoaming agent and the complexing agent are measured according to the formula, added into deionized water in sequence, stirred and dissolved by a stirrer and uniformly mixed;
s5: passivating: putting a copper foil into an active agent, increasing the reaction activity of the surface of the copper foil by the active agent, and facilitating quick film formation, wherein the treatment time is controlled to be 20-25 minutes, after the treatment, putting the copper foil into prepared passivation stock solution, standing for 10-15 minutes, after the passivation is completed, washing the passivated copper foil by using a degreasing agent, cleaning oil stains on the surface of the passivated copper foil, finally washing the copper foil by using an ultrasonic cleaner, standing for 5-10 minutes after the washing, sending the copper foil into a dryer, and controlling the drying temperature to be 80-100 ℃;
s6: pulse coating: selecting platinum powder and nickel powder according to a proper amount, putting the two metal powders into a silver ion solution, stirring and mixing, extracting the prepared metal mixed solution after mixing, preparing metal mixed crystals by adopting a cooling crystallization method, taking metal mixed crystals as a target material of pulse laser deposition equipment, taking passivated metal copper foil as a substrate, bombarding the target material by utilizing a laser beam, depositing the bombarded substances on the substrate to form a precipitate on the substrate, and standing for 30 minutes for forming;
s7: and cutting, namely feeding the coated copper foil into a copper foil cutting machine, cutting the copper foil by the cutting machine according to the required length, and adding a silica gel insulating protective layer to obtain the copper conductive strip.
In the first embodiment, the formula proportion 1 of the passivation stock solution is as follows:
| raw materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1% | / |
| Triethanolamine | Organic compounds | 2% | / |
| Sodium bichromate | Oxidizing agent | 1.5% | / |
| Sodium carbonate | Inorganic compound | 1.5% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 6% | / |
| Deionized water | Pure water | Make up to 100% |
In the second embodiment, the formula ratio 2 of the passivation stock solution is as follows:
| raw materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1.5% | / |
| Triethanolamine | Organic compounds | 2.5% | / |
| Sodium bichromate | Oxidizing agent | 1% | / |
| Sodium carbonate | Inorganic compound | 2% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 7% | / |
| Deionized water | Pure water | Make up to 100% |
In the third embodiment, the formula ratio 3 of the passivation stock solution is as follows:
| raw materials | Variety of raw material | Specific gravity of | Parts by weight (kg) |
| Sodium nitrite | Inorganic salt | 1.25% | / |
| Triethanolamine | Organic compounds | 3% | / |
| Sodium bichromate | Oxidizing agent | 1.5% | / |
| Sodium carbonate | Inorganic compound | 3% | / |
| Defoaming agent | Organic compounds | 3% | / |
| Complexing agents | Organic compounds | 8% | / |
| Deionized water | Pure water | Make up to 100% |
In the passivation treatment, the copper foil needs to be heated to 70 ℃ when entering the passivation stock solution, so that a better passivation effect can be obtained conveniently, the oil removing agent used in the passivation treatment can be any one of neutral or alkalescent oil removing agents, the conducting strip obtained after the S7 is cut can be provided with a plurality of heat dissipation holes through punching equipment, and metal heat conducting fins are installed in the heat dissipation holes.
In conclusion, the preparation process of the corrosion-resistant conductive strip, provided by the invention, is characterized in that the conductive copper foil is passivated by using a novel passivation solution prepared from sodium nitrite, triethanolamine, sodium bichromate, sodium carbonate, a defoaming agent and a complexing agent, can obtain a first layer of anti-corrosion and anti-oxidation protective layer, then takes mixed crystal prepared by nickel powder, aluminum powder and silver ion solution as a target material, the conducting bar is subjected to film coating deposition treatment by a pulse laser deposition method, the corrosion resistance of the three metals is superior to that of copper, the deposited metal corrosion-resistant film is stably attached to the surface of the conducting bar, and a second firm and durable corrosion-resistant anti-oxidation protective layer is obtained.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
The standard parts used by the invention can be purchased from the market, and the special-shaped parts can be customized according to the description of the specification.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A preparation process of a corrosion-resistant conductive strip is characterized in that a basic original sheet is a high-precision copper strip, the thickness of the high-precision copper strip is less than 200 micrometers, and the preparation process comprises the following preparation steps:
s1: repeatedly rolling, namely feeding the high-precision copper strip into a rolling machine, conveying the high-precision copper strip into gaps of a plurality of rotating rollers in the rolling machine by a conveying mechanism, heating the rotating rollers to a specified temperature, repeatedly hot rolling, and obtaining a 50-120 micron copper foil after rolling;
s2: annealing, namely putting the rolled copper foil into an annealing furnace, heating the copper foil by using liquid and gas fuel, vacuumizing the annealing furnace to avoid the oxidation phenomenon of the copper foil exposed in the air, stopping heating for heat preservation when the surface of the copper foil reaches a specified temperature, and controlling the heat preservation time to be 1-1.5h so as to completely transform the microstructure of the copper foil, and slowly reducing the temperature in the furnace after heat preservation to enable the internal structure of the copper foil to reach a balanced state so as to obtain good process performance;
s3: cleaning and purifying, namely putting the annealed copper foil into a cleaning barrel, adding trichloroethylene, stirring, washing for 20 minutes, filtering, adding ethanol, repeatedly washing, filtering again after washing, adding 1mol/L citric acid solution after filtering, stirring, washing for 20 minutes, washing and filtering with ethanol again, removing waste liquid, and drying in vacuum;
s4: preparing a passivation solution: the formula of the passivation stock solution comprises: deionized water, 1-1.5% of sodium nitrite, 2-3% of triethanolamine, 1-1.5% of sodium bichromate, 1.5-3% of sodium carbonate, 3% of defoaming agent and 6-8% of complexing agent; the treatment stock solution formula comprises: 7 to 10 percent of active agent and 9.5 to 11 percent of degreasing agent;
preparing a passivation stock solution: after the sodium nitrite, the triethanolamine, the sodium bichromate, the sodium carbonate, the defoaming agent and the complexing agent are measured according to the formula, added into deionized water in sequence, stirred and dissolved by a stirrer and uniformly mixed;
s5: passivating: putting a copper foil into an active agent, increasing the reaction activity of the surface of the copper foil by the active agent, and facilitating quick film formation, wherein the treatment time is controlled to be 20-25 minutes, after the treatment, putting the copper foil into prepared passivation stock solution, standing for 10-15 minutes, after the passivation is completed, washing the passivated copper foil by using a degreasing agent, cleaning oil stains on the surface of the passivated copper foil, finally washing the copper foil by using an ultrasonic cleaner, standing for 5-10 minutes after the washing, sending the copper foil into a dryer, and controlling the drying temperature to be 80-100 ℃;
s6: pulse coating: selecting platinum powder and nickel powder according to a proper amount, putting the two metal powders into a silver ion solution, stirring and mixing, extracting the prepared metal mixed solution after mixing, preparing metal mixed crystals by adopting a cooling crystallization method, taking metal mixed crystals as a target material of pulse laser deposition equipment, taking passivated metal copper foil as a substrate, bombarding the target material by utilizing a laser beam, depositing the bombarded substances on the substrate to form a precipitate on the substrate, and standing for 30 minutes for forming;
s7: and cutting, namely feeding the coated copper foil into a copper foil cutting machine, cutting the copper foil by the cutting machine according to the required length, and adding a silica gel insulating protective layer to obtain the copper conductive strip.
2. The process according to claim 1, wherein the passivation solution is prepared according to the following formula ratio 1:
。
3. The process according to claim 1, wherein the passivation solution is prepared according to the formula ratio 2:
。
4. The process according to claim 1, wherein the passivation solution is prepared according to the formula ratio 3:
。
5. The process for preparing a corrosion-resistant conductive strip according to claim 1, wherein during the passivation treatment, the copper foil is heated to 70 ℃ when entering the passivation solution, so as to obtain a better passivation effect.
6. The process of claim 1, wherein the degreasing agent used in the passivation process is selected from any one of neutral or weakly alkaline degreasing agents.
7. The process of claim 1, wherein the conductive strip obtained by cutting in S7 is perforated with a plurality of heat dissipation holes by a punching device, and a metal heat conduction sheet is mounted in the heat dissipation holes.
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