JPH04212498A - Conductive adhesive member, preparation of the same, and conductive component/electronic equipment using the same - Google Patents

Abstract

PURPOSE:To provide a conductive adhesive member possessing proper adhesion and superior characteristics for shielding electromagnetic radiations. CONSTITUTION:Adhesive resin layer 4, each containing conductive particles and possessing an electric conductivity, are superimposed on both sides of a base material 2 by means of the electrodeposition coating technique. This adhesive member cannot be detached from an outer packaging 11 and is capable of shielding electromagnetic radiations produced from an electronic equipment when being adhered to the interior of the packaging.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to conductive adhesive members used for shielding electromagnetic waves generated from optical equipment such as cameras, audio equipment such as compact disc players, displays, computers, word processors, measuring equipment, etc., and the manufacture thereof. It is about the method.

0002

[Prior Art] Conventionally, the exterior covers of electronic devices such as optical devices such as cameras, home appliances, displays, computers, word processors, and measuring devices are used to prevent electromagnetic waves generated from high-frequency oscillation circuits, motors, cathode ray tubes, etc. inside the electronic devices. Shielding properties against electromagnetic waves are required to prevent leakage to the outside. Particularly in recent years, as electronic devices have become smaller and lighter, exterior covers have been made of plastic, and electromagnetic shielding has become an important issue.

Conventional measures for electromagnetic shielding of plastic covers include methods such as zinc spraying using conductive paint, electroless copper plating, vacuum evaporation of Al, and the use of conductive plastic.

Furthermore, in recent years, in order to reduce the weight and cost of plastic exterior covers, a film coated with an adhesive in which metal particles such as Ni are dispersed has been pasted on the inside of the cover as a conductive adhesive member. More efficient methods of shielding electromagnetic waves have been developed.

By the way, such a conductive adhesive member is produced by spray-painting a special adhesive containing metal powder with large particle size onto a metal base material in the form of a foil or a metal-plated plastic film. It is manufactured by coating by dip coating, laminating method, brush coating method, spatula coating method, spin coating method, bar coating method, roll coating method, melt coating method, etc.

However, in the conventional method, the formation of a conductive adhesive layer is difficult by adding relatively large metal particles, for example, a particle size of 1.
Since a material with a diameter of 0 micron or larger is used, it is difficult to form an adhesive layer with uniform conductivity due to the separation phenomenon between the adhesive and the metal.
It has to be thicker than 0 microns, which poses a problem in terms of cost. Furthermore, when the content of metal powder is increased in order to improve conductivity, there is a problem in that adhesive strength decreases.

[0007] Furthermore, in order to prevent the adhesive from separating from the metal particles, it is necessary to constantly stir the adhesive, which poses a problem in terms of adhesive management. Furthermore, in spray painting, it is difficult to make the film thickness uniform, whereas in the case of dip coating, it is necessary to keep conditions such as the pulling speed and adhesive viscosity constant, so it is difficult to make the film thickness uniform. This is difficult and causes fluctuations in the electromagnetic shielding effect.

[0008] Furthermore, when a conductive cover is formed by bonding two conductive casings using this conductive adhesive member,
It is necessary to provide continuity between the casings so that electromagnetic waves do not leak at the adhesive surface between the casings. However, conventional conductive adhesive members cannot satisfy the conflicting characteristics of maintaining adhesive strength and improving conductivity, and conventionally, when cases are bonded using conductive adhesive members, other conductive means such as washers have been used. and using conductor wires,
It is necessary to use damping screws, etc.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a conductive adhesive member having good adhesive properties and excellent electromagnetic shielding properties, and a method for manufacturing the same. The purpose is to provide the following.

[0010] The present invention also provides a conductive cover which is formed by bonding two or more casings and has excellent electromagnetic wave shielding properties and can provide conductivity between the casings at the bonded surface. For other purposes.

[0011]

[Means for Solving the Problems] The conductive adhesive member of the present invention is characterized by having a base material and a conductive adhesive resin layer containing conductive particles formed by an electrodeposition coating method. That is.

[0012] Furthermore, the method for manufacturing the conductive adhesive member of the present invention includes:
A base material is immersed in an electrodeposition paint containing an electrodepositable adhesive resin and conductive particles, and electrodeposition is performed using the base material as one electrode to coat the adhesive resin and conductive particles on the base material. The method is characterized in that an adhesive resin layer having conductivity is formed by depositing particles.

Furthermore, the conductive cover of the present invention is a conductive cover in which at least two or more casings are bonded together at surface points, and the casings are bonded and electrically connected to each other via a conductive adhesive member. The conductive adhesive member is characterized in that it has a base material and an adhesive resin layer containing conductive particles formed by electrodeposition coating on both surfaces of the base material. be.

According to the present invention, the conductive adhesive resin layer is formed by depositing the adhesive resin and conductive particles on the base material by electrodeposition coating, and unlike spray coating, the conductive adhesive resin layer is formed by depositing adhesive resin and conductive particles on the base material. According to the present invention, it is possible to obtain a conductive adhesive member in which the electromagnetic particles are deposited very densely and uniformly, and even if it is a thin film, there is little variation in the electromagnetic shielding effect and the adhesive force can be maintained.

Further, in the conductive member of the present invention, in a conductive member in which at least two or more casings are in contact with each other at a surface point, the casings are bonded and electrically connected to each other via a conductive adhesive member. The conductive adhesive member is characterized in that it has a base material and an adhesive resin layer containing conductive particles formed by electrodeposition coating on at least one surface of the base material. Further, the electronic device of the present invention provides at least one of The present invention is characterized in that two or more casings are provided with a conductive member that is bonded and electrically conductive.

Next, the present invention will be explained in detail.

FIG. 1(A) is a schematic cross-sectional view of an exterior cover 11 of an electronic device which is provided with electromagnetic shielding measures using the conductive adhesive member 1 of the present invention. FIG. 1(B) is an enlarged partial sectional view of the conductive adhesive member 1. FIG.

The present invention relates to a conductive adhesive member used for efficiently shielding electromagnetic noise generated from electronic equipment by pasting it on the inside of an exterior cover 11 of the electronic equipment, as shown in FIG. 1(A). It is something. FIG. 1(B) is an enlarged partial sectional view of the conductive adhesive member 1. In FIG. 1(B), the conductive adhesive member 1 of the present invention has a metal thin film layer 3 such as a metal copper thin film formed on a non-metallic base material 2, and an adhesive resin layer 4 having conductivity thereon. is formed by electrodeposition coating method.

FIG. 2 is a partial sectional view showing another embodiment of the conductive adhesive member 1 of the present invention, in which a conductive adhesive resin layer 4 is coated on both sides of a metal base material 5 by electrodeposition coating. It is something that is formed.

In the present invention, the conductive adhesive resin layer 4 is obtained by depositing a resin and conductive particles that can be electrodeposited on a base material by an electrodeposition coating method, and the conductive resin layer 4 is made by depositing a resin and conductive particles that can be electrodeposited on a base material by an electrodeposition coating method. Because the conductive particles are densely and uniformly contained, it has excellent electromagnetic shielding properties even if it is a thin film, and it has good adhesive strength because there is no need to increase the content of conductive particles unlike spray painting. It also has

In the present invention, the conductive particles deposited together with the adhesive resin in the adhesive resin layer 4 (hereinafter referred to as resin layer 4) may be any particles that can impart conductivity to the electrodeposited film. For example, there are no particular limitations, such as ceramic powder with metal plating on the surface (metalized ceramic powder), natural mica powder with metal plating on the surface (metalized natural mica powder), or a mixture thereof. or average particle size 0.01
- 5 μm ultrafine metal powder, resin powder with metal coating on the surface, etc., or a mixture thereof, as well as one or two selected from metalized ceramic powder and metalized natural mica powder.
A mixture of seed powder and one or two types of powder selected from ultrafine metal powder and metalized resin powder can be used. In particular, when metallized ceramic powder or metallized natural mica is used as the conductive particles, the conductive adhesive member of the present invention is applied to an adherend such as an exterior cover as shown in FIG. 1(A). When attached, the conductive adhesive member can be more firmly adhered to the exterior cover, and accidents such as the conductive adhesive member falling off after electronic equipment is assembled can be effectively prevented.

Furthermore, it is possible to save or shorten the energy and/or time required to crosslink and harden the resin layer 4 in the process of adhering it to an adherend. Although it is not clear why the resin layer 4 containing these metallized ceramic powders, metallized natural mica powders, or mixtures thereof exhibits strong adhesion, the surface of these powders is quickly oxidized. This is thought to be due to the fact that, unlike metal particles, which tend to be damaged, the powder surface is maintained in an active state to some extent due to the interaction between the powder surface and the metal coating, so the active surface becomes a crosslinking point and promotes crosslinking of the adhesive resin.

As for the metallized ceramic powder and the metallized natural mica powder used in the present invention, the surface of the ceramic powder or natural mica powder is coated with Cu, Ni, Ag, A
Those plated with u, Sn, etc. are used. The plating on the surface of these powders is Cu, A, etc. from the viewpoint of shielding properties and cost.
g and Ni can be suitably used, and electroless plating is suitable as a method for forming the powder on the powder surface. The plating thickness on the powder surface is 0.05 to 3 μm, especially 0.15 μm.
When the thickness is ~2 μm, excellent shielding properties and good adhesion during low-temperature curing can be obtained, and when the plating is formed thicker than 3 μm, the surface characteristics become similar to metal particles and the surface becomes extremely active. Therefore, it is likely to be oxidized in the air, reducing the number of crosslinking points, resulting in insufficient crosslinking of the adhesive resin.

[0024] Furthermore, in forming Ni plating on powder, an aqueous suspension of powder is prepared, and then this suspension is When an electroless nickel plating aging solution is added to form nickel plating on the powder surface and Ni plating is applied with a low phosphorus content, e.g. 5% or less, conductivity improves and Cu
It is possible to form a resin layer 4 having shielding properties almost equivalent to that of plating powder.

[0025] The average particle size of ceramic powder and natural mica powder is 0.1 to 5 μm, especially 0.1 to 5 μm, considering the surface area that contributes to surface activity and dispersibility in electrodeposition paint.
．． A range of 15 to 3 μm, more preferably 0.5 to 2 μm is preferable.

The ceramic used in the present invention is a nonmetallic inorganic solid material produced by heat treatment, such as aluminum oxide, titanium nitride, manganese nitride, tungsten nitride, tungsten carbide, lanthanum nitride, and aluminum silicate. , molybdenum disulfide, titanium oxide, silicic acid, etc., and examples of natural mica include phlogovite mica, sericite mica, muscovite mica, etc.

Next, as the conductive particles, as mentioned above, ultrafine metal powder with an average particle size of 0.01 to 5 μm and surface-metalized resin powder with an average particle size of 0.1 to 5 μm are also available. For example, ultrafine metal powders include Ag, Co, Cu, Fe, etc. obtained by thermal plasma evaporation method.
Examples include powders of Mn, Ni, Pd, Sn, Te, etc., with an average particle size of 0.01 to 5 μm, particularly 0.01 to 0.1
μm, more preferably in the range of 0.03 to 0.07 μm. If it is less than 0.01 μm, secondary aggregation occurs and the diameter is less than 5 μm.
If it exceeds m, the particles will settle in the electrodeposition paint, and the dispersibility of the conductive particles in the resin layer will likely become non-uniform.

[0028] Examples of the metallized resin powder of the present invention include fluororesin, polyethylene resin, acrylic resin,
As with ceramics, apply Cu or Ni to a thickness of 0.05 to 3 μm on the surface of resin powder such as polystyrene resin or nylon.
Obtained by forming.

[0029] Also, the average particle size of this resin powder is about 0.1~
The thickness is preferably about 5 μm.

[0030] By incorporating each of the above-mentioned conductive particles singly in an electrodeposited film, it is possible to obtain an electrodeposited member with electromagnetic wave shielding properties and good coating film properties, but metallized ceramic powder or metallized When ultrafine metal powder, metallized resin powder, or a mixture thereof is added to mica powder or a mixture thereof at a weight ratio of 0.2 to 3, the amount of the powder in the electrodeposited film as shown in FIG. The ultrafine metal powder and/or metallized resin powder 92 fills the voids in the metallized ceramic powder and/or metallized natural mica powder 91, increasing the contact area between each powder. As a result, the conductivity of the resin layer 4 is improved, so the shielding properties of the conductive adhesive member are further improved, and the crosslinking density of the resin layer is improved due to the action of the metallized ceramic powder and/or the metallized natural mica powder. Therefore, a conductive adhesive member with good adhesion to adherends can be obtained.

[0031] The content of the conductive particles in the resin layer 4 of the present invention is determined by considering the electromagnetic wave shielding properties of the conductive adhesive member and the adhesion to the adherend. In this case, 5 to 60 wt%, particularly 10 to 50 wt% is preferable. If it exceeds 60 wt%, the adhesion to the adherend will decrease, and if it is less than 5 wt%, the conductivity of the resin layer 4 will be insufficient, resulting in insufficient electromagnetic shielding properties of the conductive adhesive member.

The conductive particles in the resin layer 4 can be identified using an X-ray microanalyzer, and the content can be measured using a thermogravimetric analyzer.

Next, a method for manufacturing the conductive adhesive member of the present invention shown in FIGS. 1(B) and 2 will be explained.

First, the metal thin film 3 is formed on the nonmetallic base material 2 by, for example, electroless plating. As the non-metallic base material, ordinary plastic materials can be used without particular limitation, such as ABS resin, polycarbonate resin, polyacetal resin, polyethylene terephthalate,
Examples include polybutylene terephthalate, polyetherimide, polypropylene, polyphenylene ether, and the like.

[0035] Examples of the metal base material 5 include copper and aluminum, and the thickness of these base materials 2 and 5 is about 15 to 15 mm, since flexibility is required for conductive adhesive members. A film-like resin base material or a foil-like metal base material with a thickness of about 100 μm, particularly 18 to 50 μm, is preferably used.

A thin metal film is formed on the non-metallic substrate after etching and subsequent catalytic treatment, such as palladium treatment, to make it conductive, as is done in commonly known plating methods on plastics.

[0037] The method for forming the metal thin film on the nonmetallic base material is preferably carried out by electroless plating, electrolytic plating, or the like.

Next, the surface of the metal base material or the plated non-metal base material is washed with a solvent or with an alkali such as an aqueous sodium hydroxide solution or an aqueous sodium carbonate solution to activate the surface of the base material. Next, the adhesive resin and conductive particles that can be electrodeposited are immersed in an electrodeposition paint in which they are dissolved and dispersed, and a voltage is applied using the substrate as a cathode if the resin is cationic, or as an anode if it is anionic. is applied to perform electrodeposition, and the adhesive resin and conductive particles are deposited on the substrate. The reason why the resin and the conductive particles are precipitated together at this time is thought to be as follows. In other words, the functional groups bonded to the resin in the paint that can be electrodeposited are ionized, and when a DC voltage is applied between the object to be coated and the counter electrode, the resin is attracted to the object to be coated. and precipitate. In the electrodeposition paint, this resin is adsorbed around the conductive particles, so as the resin moves to the object to be coated, the conductive particles also move, and together with the resin, the resin moves onto the object to be coated. It precipitates out.

In the present invention, the adhesive resin that can be electrodeposited is at least ionized in the solvent of the electrodeposition paint, and at least when the resin layer 4 deposited by electrodeposition is bonded and hardened to the adherend. It is preferable to have an adhesive force of 1 kg/cm or more, and such a resin may be appropriately selected from resins conventionally used for electrodeposition paints. For example, in the case of anionic electrodeposition paints, the adhesive strength required for resin deposition is It is a resin or prepolymer that has or has introduced anionic functional groups such as carboxyl groups in order to impart a negative charge and hydrophilicity, and the resin layer 4 deposited by electrodeposition is bonded to the adherend after crosslinking. In the case of cationic electrodeposition paints, resins that have or have been introduced with cationic functional groups such as amino groups to provide positive charge and hydrophilicity are preferably used. Alternatively, a prepolymer that satisfies the above-mentioned predetermined properties is preferably used. Specifically, acrylic resins and epoxy resins having the above-mentioned anionic functional groups and cationic functional groups,
A material exhibiting a predetermined adhesive strength may be selected from among polyester resins, polyamide resins, acrylic/melanin resins, alkyd resins, or prepolymers thereof.

In addition, in order to improve the properties of the resin layer 4 as an adhesive layer, crosslinking agents such as melamine resins and block polyisocyanates, and tackifiers such as terpene resins, terpene/phenol resins, and coumarons are added to the electrodeposition paint. Resins and/or softeners such as polybutene and polyisoprene may be added. And the crosslinkers, tackifiers and softeners may or may not be electrodepositable. This is because as the adhesive resin that can be electrodeposited is deposited on the base material, components that cannot be electrodeposited can also be deposited as well as the conductive particles.

[0041] Also, in the electrodeposition process, the applied voltage was 5
0 to 200 V, particularly 70 to 170 V is preferred, and the treatment time is preferably 30 to 180 seconds, particularly 120 to 180 seconds.

[0042] The pH of the electrodeposition solution is 8 to 8 in an anionic type.
10, cationic type is 4-7, and bath temperature is 20-30
°C is preferred.

The thickness of the resin layer 4 is preferably 3 to 30 μm, particularly 7 to 20 μm, so that the conductive adhesive member exhibits excellent electromagnetic shielding properties and sufficient adhesive strength.

Furthermore, the electrodeposition coating material of the present invention can be prepared by, for example, mixing the conductive particles and the electrodepositable adhesive resin in a Pall mill for 24 to 35 minutes.
It is dispersed for about an hour and then diluted with demineralized water to adjust the solid content concentration to 7 to 15 wt%, preferably 10 to 15 wt%. Further, if necessary, a pigment or the like can be added to the electrodeposition paint for coloring, and the amount of pigment added for coloring is preferably 1 to 3 wt%.

The proportion of the conductive particles and the electrodepositable adhesive resin in the electrodeposition paint is 1 to 70 parts by weight, especially 1 to 70 parts by weight of the electrodepositable adhesive resin. 10 to 50 parts by weight is preferred. Within this range, sufficient conductive particles can be deposited to provide shielding properties, the conductive particles in the electrodeposition paint will not settle, and the adhesion to the substrate will be improved. The resin layer 4 can also have the flexibility of the resin layer after curing. The conductive particles to be dispersed in the conductive paint include powders to be deposited on the electrodeposited film together with the resin, such as the above-mentioned metallized ceramic powder, metallized natural mica powder, mixtures thereof, and metallized ceramic powder. or metallized natural mica powder, or a mixture thereof, ultrafine metal powder with an average particle size of 0.01 to 5 μm, resin powder with an average particle size of 0.1 to 5 μm whose surface is coated with metal, or a mixture thereof. Powder can be used.

After the electrodeposition is completed, the base material 2 on which the resin layer 4 is formed
, or 5 is washed with water to obtain the conductive adhesive member of the present invention.

The obtained conductive adhesive member is shown in FIG.
The resin layer 4 is bonded by being brought into close contact with an adherend such as an exterior cover as shown in (A) and subjected to heating, light irradiation, etc. to crosslink the resin layer 4 and impart electromagnetic shielding properties to the adherend. .

Further, in the present invention, when a chemically colored film 6 is formed on the surface of a metal base material 5 or a non-metal base material 2 having a metal thin film 3 as shown in FIG. 3, and then electrodeposition is performed. The adhesion of the resin layer 4 to the base material is improved. In particular, as this chemically colored film 6, for example, a chemically colored film obtained by surface treatment of the metal thin film 3 formed on the base material 2 or the base material 5 has good adhesion with the resin layer 4, so This is preferable because the adhesion of No. 4 can be further improved. The reason why this chemically colored film exhibits good adhesion with the resin layer 4 is not clear, but the surface of this chemically colored film has many very fine POURs, and physical adsorption between it and the ED film is not clear. At the same time, chemical adsorption occurs between the functional groups of the polymer and the active surface of the conductive particles in the ED film and the chemically colored film, resulting in extremely excellent adhesion. In addition, in the present invention, chemically colored films obtained by surface treatment of copper, such as copper oxide, cuprous oxide, copper carbonate, copper sulfide, cupric ammonium hydroxide, etc., have excellent adhesion to the resin layer. It is particularly preferably used in terms of the adhesion of the resin layer to the base material, the corrosion resistance of the metal thin film 3 or the base material 5, and the uniformity of the resin layer.

Therefore, in the present invention, it is preferable to use copper as the metal thin film 3, and when a material other than copper is used as the metal base material, it is preferable to apply copper plating around it.

At this time, the metal thin film 3 is used to form a chemically colored film on the electrode and surface for forming the resin layer, and its thickness is 0.01 μm or more and 0.2 μm or less, particularly 0.0 μm or more.
5 to 0.15 μm is preferable.

[0051] If the film thickness exceeds 0.2 μm, it is not preferable because it takes time to form the copper thin film, and the work efficiency decreases as the weight of the conductive adhesive member increases.

Furthermore, when an electrodeposition coating is formed directly on a thin metal copper film, copper dissolves and accumulates in the electrodeposition coating, which adversely affects the physical properties of the coating. By forming layer 4, dissolution of copper is prevented, and the presence of copper ions is not recognized in the electrodeposition paint.

[0053] Also, as a method for forming the above chemically colored film,
For example, copper sulfate + potassium chlorate mixture, copper chloride + copper acetate +
A copper oxide layer can be formed by immersing a base material on which a copper plating layer is formed in an alum mixture or the like. Examples of methods for forming a copper sulfide layer include immersion in a mixture of potassium sulfide and ammonium chloride, a mixture of sodium hyposulfite and lead acetate, and the like. Examples of the method for forming the copper hydroxide layer include a method of immersing it in a mixed solution of copper nitrate + ammonium chloride + acetic acid. Further, as a method for forming a suboxide layer of copper, which is one of the oxide layers, a method of immersing in a mixed solution of copper sulfate and sodium chloride, a mixed solution of copper sulfate and ammonium chloride, etc. can be mentioned.

Furthermore, in the present invention, when the conductive adhesive member is manufactured using the metal base material 5, the resin layer 4 is formed on both sides as shown in FIG. 2, but when only one side is required, the base material 5
One side may be laminated with a resin film or coated with an insulating paint.

Further, the conductive adhesive member 1, which is made up of the metal base material 5 shown in FIG. 2 and the resin layer 4 formed on both surfaces thereof, maintains conductivity between the conductive casings 41 and 42, as shown in FIG. It can be glued together. Therefore, this has conventionally been done in conductive members formed of two or more conductive casings. A conductive member can be obtained simply by using the conductive adhesive member of the present invention at the joint of the housing without using a conductive means between the housings using a washer, a conductive wire, or a damping screw,
For example, a conductive cover or shield case for an electronic device that can be applied to an exterior cover 51 of a laptop computer body shown in FIG. 5, etc. can be made smaller and lighter, and can be manufactured at low cost.

[0056]

EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.

The particle size of the powder was measured using a centrifugal sedimentation type particle size distribution analyzer (
The measurement was carried out using a product named SACP-3 (manufactured by Shimadzu Corporation), and each powder was regarded as a dense sphere with the same particle size.

The conductive particles in the electrodeposited film were identified using an X-ray microanalyzer, and the content was analyzed using a thermogravimetric analyzer (trade name: Thermal Analysis System 7 Series; manufactured by Perkin-Elmer).

[0059] Regarding the adhesive strength, the beer strength test method (
JIS. C6491).

Contact resistance was measured by a four-terminal measurement method using the circuit shown in FIG.

Example 1-1 A polyester film base material 2 having a thickness of 18 μm was coated with a thickness of 0.5 μm.
A base material on which electroless copper plating 3 was applied to a thickness of 2 μm was prepared.

[0062] As the electrodeposition liquid, a polyester resin (product name: FINET
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 60 parts by weight, polyester resin (product name: FINETEX 5)
25; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further 5 parts by weight of a crosslinking agent (trade name: PERMASTAT R-5; manufactured by Dainippon Ink Chemical Co., Ltd.), and a catalyst (trade name: Cat PA)
-20 (manufactured by Dainippon Ink Chemical Co., Ltd.) at a ratio of 2.5 parts by weight, and then 40 weight parts of alumina powder with an average particle size of 1 μm and electroless nickel plating applied to a thickness of 0.2 μm as conductive particles. The mixture was mixed and dispersed in a ball mill for 30 hours, and then diluted to 15% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition was carried out under the conditions of 25° C. and pH 8.5, using the substrate as an anode and a stainless steel plate as a cathode, applying a voltage of 100 V and processing time of 3 minutes to form a resin layer 4 with a thickness of 17 μm on the surface of the substrate 2. . The content of metallized ceramic powder in resin layer 4 was 40% by weight.

After crosslinking the conductive adhesive member 1 thus obtained at 50° C. for 10 minutes in an oven, the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine the electromagnetic shielding property. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard for presence or absence.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 m of hydrochloric acid were added.
After bonding using an ABS resin substrate whose surface was etched by immersing it in a mixed solution of l/l for 2 minutes,
A test piece was prepared by heating it at 0°C for 10 minutes to adhere it, and the adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured, and it was evaluated whether it had an adhesive force of 1 kg/cm or more. .

Example 1-2 After degreasing a 18 μm thick copper foil substrate 5 with an alcohol solvent, it was treated with an alkaline cleaner (trade name: Bacuna No. 19;
Degreasing was further performed for 1 minute using Yuken Chemical Co., Ltd.). Next, after washing with water, wash with 10% sulfuric acid for 30 seconds, and after washing with water,
Furthermore, it was washed with demineralized water and subjected to surface activation treatment.

[0066] As the electrodeposition liquid, a polyester resin (trade name: FINETEX) is used as an adhesive resin that can be electrodeposited.
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 60 parts by weight,
Polyester resin (product name: FINETEX 52
5; Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (
Product name: PERMASTAT R-5; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (product name: Cat PA-
20 (manufactured by Dainippon Ink Chemical Co., Ltd.) at a ratio of 2.5 parts by weight, and then 50 parts by weight of alumina powder with an average particle size of 1 μm and electroless nickel plating applied to a thickness of 0.2 μm as conductive particles. The mixture was mixed and dispersed in a ball mill for 30 hours, and then diluted to 15% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition was carried out under the conditions of 25° C. and pH 8.5, using the substrate as an anode and a stainless steel plate as a cathode, applying an applied voltage of 100 V and processing time of 3 minutes to form an adhesive layer 4 with a film thickness of 18 μm on both sides of the substrate 5. A conductive adhesive member 1 was obtained. The content of metallized ceramic powder in adhesive layer 4 was 45% by weight.

After crosslinking the conductive adhesive member 1 thus obtained at 50° C. for 10 minutes in an oven, the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine the electromagnetic shielding property. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard for presence or absence.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 m of hydrochloric acid were added.
After bonding using an ABS resin substrate whose surface was etched by immersing it in a mixed solution of l/l for 2 minutes,
A test piece was prepared by heating it at 0°C for 10 minutes to adhere it, and the adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured, and it was evaluated whether it had an adhesive force of 1 kg/cm or more. .

Example 1-3 After degreasing an aluminum base material 5 with a thickness of 18 μm with an alcohol solvent, it was treated with a degreasing solution prepared by adding a small amount of an anionic surfactant to an aqueous sodium carbonate solution for 2 minutes, washed with water, and then treated with demineralized water. It was washed with water and subjected to surface activation treatment.

[0070] As the electrodeposition liquid, a polyester resin (trade name: FINETEX) is used as an adhesive resin that can be electrodeposited.
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 70 parts by weight,
Polyester resin (product name: FINETEX 67
5; Dainippon Ink Chemical Co., Ltd.) 30 parts by weight, further crosslinking agent (
Product name: BECKAMINE PM-N; manufactured by Dainippon Ink Chemical Co., Ltd.) 6 parts by weight, catalyst (product name: Cat ES)
-2; manufactured by Dainippon Ink & Chemicals Co., Ltd.) at a ratio of 3 parts by weight, and then 30 weight of alumina powder with an average particle size of 0.3 μm and electroless nickel plating applied to a thickness of 0.2 μm as conductive particles. The mixture was mixed and dispersed in a ball mill for 30 hours, and then diluted to 10% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition was carried out under the conditions of 25° C. and pH 9, using the above substrate as an anode and a stainless steel plate as a cathode, applying a voltage of 120 V and processing time of 3 minutes to form a resin layer 4 with a thickness of 22 μm on both sides of the substrate 5, and conductive bonding. A sex member was obtained. The content of metallized ceramic powder in the resin layer was 25 weight percent. Then, surface activation treatment was performed in the same manner as in Example 1-1. It was bonded to the ABS resin substrate through the resin layer 4 at the bonding surface and cured at room temperature to obtain a test piece.

Using this test piece, the adhesive strength between the resin layer 4 and the ABS resin base material was measured.

Further, this conductive adhesive member was cured alone, and the surface resistance of the resin layer 4 was measured.

Example 1-4 After applying electroless copper plating to both sides of a polyethylene terephthalate film base material 2 with a thickness of 18 μm, the base material was degreased with an alcohol solvent and then treated with an alkaline cleaner (product name: Bacuna).
No. No. 19 (manufactured by Yuken Chemical Co., Ltd.) was used to further degrease for 1 minute. Next, after washing with water, the copper thin film was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to activate the surface of the copper thin film.

[0074] In addition, as an electrodeposition liquid, a polyester resin (product name: FINETEX) is used as an adhesive resin that can be electrodeposited.
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 70 parts by weight,
Polyester resin (product name: FINETEX 52
5; Dainippon Ink Chemical Co., Ltd.) 30 parts by weight, further crosslinking agent (
Product name: PERMASTAT R-5; manufactured by Dainippon Ink Chemical Co., Ltd.) 6 parts by weight, catalyst (product name: Cat PA-
20 (manufactured by Dainippon Ink Chemical Co., Ltd.) at a ratio of 3 parts by weight, and then electroless nickel plating was applied to alumina having an average particle size of 1 μm as conductive particles to a thickness of 0.2 μm.
0 parts by weight were mixed and dispersed in a ball mill for 30 hours, and then diluted to 15% by weight with demineralized water to obtain an electrodeposition solution.

Electrodeposition was carried out under the conditions of 25° C. and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, applying a voltage of 100 V and processing time of 3 minutes to deposit a resin layer 4 with a thickness of 18 μm on both sides of the substrate 2. A conductive adhesive member was obtained. The content of metallized ceramic powder in resin layer 4 was 50% by weight.

[0076] Next, a surface activation treatment was performed in the same manner as in Example 1-1. A test piece was prepared by adhering to the ABS resin substrate via an adhesive layer at the joint surface and heating at 90° C. for 10 minutes to cure, and the adhesive strength was measured in the same manner as in Example 1-1. Further, the surface resistance of the resin layer 4 was measured after heating this conductive adhesive member alone at 90° C. for 10 minutes.

Example 1-5 Example 1-1 was applied to both sides of the base material 2 of a 100 to 250 mesh polyester film having a thickness of about 18 μm.
Electroless copper plating 3 with a thickness of 0.2 μm was applied in the same manner as above. Next, this base material was immersed in a mixed aqueous solution of 5% sodium hydroxide and 1% potassium persulfate and treated at 70° C. for 30 seconds to form a copper oxide film, which was a chemically colored film.

[0078] As the electrodeposition liquid, a polyester resin (trade name: FINETEX) is used as an adhesive resin that can be electrodeposited.
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 60 parts by weight,
Polyester resin (product name: FINETEX 67
5; Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (
Product name: BECKAMINE PM-N; manufactured by Dainippon Ink Chemical Co., Ltd.) 7 parts by weight, catalyst (product name: Cat ES)
-2; manufactured by Dainippon Ink Chemical Co., Ltd.) at a ratio of 3 parts by weight, and then 60 weight of alumina powder with an average particle size of 0.3 μm and electroless nickel plating applied to a thickness of 0.2 μm as conductive particles. The mixture was mixed and dispersed in a ball mill for 30 hours, and then diluted to 10% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition was carried out at 25° C. and pH 9 using the base material as an anode and a stainless steel plate as a cathode, with an applied voltage of 120 V and a treatment time of 3.
A resin layer 4 having a thickness of 23 μm was formed on both sides of the base material to obtain a conductive adhesive member. The content of metallized ceramic powder in resin layer 4 was 50% by weight. Next, Example 1
Surface treatment was performed in the same manner as in -1. It was bonded to the ABS resin base material through an adhesive layer at the joint surface, and after washing with water, it was cured at room temperature to obtain a test piece.

The adhesive strength of this test piece and the surface resistance of the resin layer 4 were measured in the same manner as in Example 1-1.

Comparative Example 1 As a conductive adhesive, 100 parts by weight of an epoxy adhesive (trade name: Cemedine U-121; manufactured by Cemedine Co., Ltd.) with an average particle size of 0.000 was applied to the polyester base material used in Example 1-1. 2
A conductive adhesive layer having a thickness of 10 μm was formed by spraying a mixture of 10 parts by weight of copper particles having a diameter of μm to form a conductive adhesive member.

[0081]Then, the adhesive force was measured in the same manner as in Example 1-1 by bonding it to the surface-treated ABS resin base material used in Example 1-1 and curing the adhesive.

The surface resistance of the conductive adhesive layer after curing was also measured in the same manner as in Example 1-1.

Comparative Example 2 As a conductive adhesive, 100 parts by weight of ethylene adhesive (trade name: Himilan; manufactured by Mitsui Polychemical Co., Ltd.) with an average particle size of 0.5 μm was applied to the polyester material used in Example 1-1.
A conductive adhesive member was obtained by spraying a mixture of 15 parts by weight of copper particles of 100 μm on the bonding surface of the base material to form a conductive adhesive layer with a thickness of 10 μm.

[0084] Then, the adhesive force was measured in the same manner as in Example 1-1 with respect to the product which was bonded to the surface-treated ABS resin base material used in Example 1-1 and the adhesive was cured.

The stated resistance of the conductive adhesive layer after curing was also measured in the same manner as in Example 1-1.

[0086] The above Examples 1-1 to 1-5 and Comparative Example 1,
The adhesive strength and surface resistance of No. 2 are shown in Table 1-1.

[0087]

[Table 1]

From the above results, it can be seen that the conductive adhesive member of the present invention has excellent adhesive strength and excellent electromagnetic shielding effect.

Example 1-6 Exterior cover 51 of the laptop computer body shown in FIG. 5
AB molded as two casings A and A' that constitute
The S resin housing was immersed in a CrO3-H2SO4-H2O-based etching solution for 1 minute, washed with water, and then immersed for 2 minutes at room temperature in a mixed solution of 30 g/l of stannous chloride and 20 ml/l of hydrochloric acid as a sensitizer solution. Then, the surface was etched after washing with water.

Next, after pasting the conductive adhesive member prepared in Example 1-1 on the entire inner surface of A and A' of the housing,
C. for 10 minutes to cure, and then the casings A and A' were bonded together to produce an exterior cover.

A cross section of this exterior cover is shown in FIG. Further, screws and conductive wires were used for conduction between the housings A and A'.

[0092] The electromagnetic shielding properties of the exterior cover obtained in this way were evaluated using the transmission line method (ASTM).
When measured using the ES7.83 method, the average attenuation was 30
Cleared the VCCI regulation value at ~40dB or more.

Example 2-1 A polyester base material 2 having a thickness of 18 μm was prepared by electroless copper plating to a thickness of 0.2 μm.

[0094] In addition, as the electrodeposition liquid, a polyester resin (trade name: FINETEX) is used as an adhesive resin that can be electrodeposited.
ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.) 60 parts by weight, polyester resin (product name: FINETEX 525)
; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further 5 parts by weight of a crosslinking agent (trade name: PERMASTAT R-5; manufactured by Dainippon Ink Chemical Co., Ltd.), and a catalyst (trade name: Cat PA-2)
0; manufactured by Dainippon Ink Chemical Co., Ltd.) at a ratio of 2.5 parts by weight, and then 30 parts by weight of copper fine powder with an average particle size of 0.02 μm as conductive particles and alumina with an average particle size of 1 μm with a thickness of 0.
．． 20 parts by weight of 2 μm electroless nickel plated powder was mixed and dispersed in a ball mill for 30 hours, then mixed with demineralized water.
It was diluted to 5% by weight to prepare an electrodeposition solution.

Electrodeposition was carried out under the conditions of 25° C. and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, applying a voltage of 100 V and processing time of 3 minutes to form a resin layer 4 with a thickness of 16 μm on one side of the substrate. A conductive adhesive member was obtained. The content of the mixed powder of metallized ceramic powder and fine copper powder in resin layer 4 was 47% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
A BS resin substrate was used as the adherend and bonded together, and then heated at 50°C for 10 minutes to make a test piece.The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured.
It was evaluated whether it had an adhesive strength of /cm or more.

Example 2-2 Example 1-1 was applied to both sides of the base material 2 of a 100 to 250 mesh polyester film having a thickness of approximately 18 μm.
Electroless copper plating 3 with a thickness of 0.2 μm was applied in the same manner as above. Next, this base material was immersed in a mixed aqueous solution of 5% sodium hydroxide and 1% potassium persulfate and treated at 70° C. for 30 seconds to form a copper oxide film, which was a chemically colored film.

[0099] As the electrodeposition liquid, 60 parts by weight of polyester resin (product name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (product name: FINTEX 675; manufactured by Dainippon Ink Chemical Co., Ltd.)
40 parts by weight, further crosslinking agent (product name: BECKAMINE
7 parts by weight of PM-N (manufactured by Dainippon Ink Chemical Co., Ltd.) and 3 parts by weight of a catalyst (product name: Cat ES-2 (manufactured by Dainippon Ink Chemical Co., Ltd.), and further added to this adhesive an average particle size of 0. 30 parts by weight of fine nickel powder of .05 μm, average particle size 0
．． Mix 30 parts by weight of 3 μm alumina powder with electroless nickel plating to a thickness of 0.2 μm, and mix it with a ball mill.
After being dispersed for 0 hours, the solution was diluted to 10% by weight with demineralized water to obtain an electrodeposition solution.

[0100] Electrodeposition was carried out at 25°C and pH 9 using the casing as an anode and a stainless steel plate as a cathode, with an applied voltage of 120V.
A resin layer 4 having a thickness of 21 μm was formed on both sides of the material in a treatment time of 3 minutes to obtain a conductive adhesive member. The content of the mixed powder of metallized ceramic powder and fine copper powder in resin layer 4 was 42% by weight.

The conductive adhesive member 1 thus obtained is heated in an oven at 50° C. for 10 minutes to crosslink, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 is measured to determine whether or not it has electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard value.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O-based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
A BS resin substrate was used as the adherend and bonded together, and then heated at 50°C for 10 minutes to make a test piece.The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured.
It was evaluated whether it had an adhesive strength of /cm or more.

Example 2-3 After degreasing a copper foil base material with a thickness of 18 μm with an alcohol solvent, degreasing was further performed for 1 minute using an alkaline cleaner (trade name: Pakuna No. 19; manufactured by Yuken Chemical). . Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

[0104] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
T; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (product name:
Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2.5
30 parts by weight of fine copper powder with an average particle size of 0.02 μm and 1 μm in average particle size with respect to this adhesive.
Alumina was mixed with 20 parts by weight of powder electroless nickel plated to a thickness of 0.2 μm, dispersed in a ball mill for 30 hours, and then diluted to 15% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition was carried out at 25°C and pH 8.5 using the casing as an anode and a stainless steel plate as a cathode, with an applied voltage of 100 V.
A resin layer 4 having a thickness of 17 μm was formed on both sides of the base material in a treatment time of 3 minutes to obtain a conductive adhesive member 1. Regarding the metallization of the resin layer 4, the content of the mixed powder of ceramic powder and fine copper powder is 47
Weight percent.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
A BS resin substrate was used as the adherend and bonded together, and then heated at 50°C for 10 minutes to make a test piece.The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured.
It was evaluated whether it had an adhesive strength of /cm or more.

Example 2-4 After degreasing an aluminum base material with a thickness of 18 μm with an alcohol solvent, it was treated for 2 minutes with a degreasing solution prepared by adding a small amount of anionic surfactant to an aqueous sodium carbonate solution, washed with water, and then washed with demineralized water. Then surface activation treatment was performed.

[0108] As the electrodeposition liquid, 70 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 675; manufactured by Dainippon Ink Chemical Co., Ltd.) 30 parts by weight, further crosslinking agent (trade name: BECKA M
INE PM-N (manufactured by Dainippon Ink Chemical Co., Ltd.) and 3 parts by weight of a catalyst (trade name: Cat ES-2; manufactured by Dainippon Ink Chemical Co., Ltd.) were mixed, and the average particle size was 0.0.
40 parts by weight of nickel fine powder of 5 μm and average particle size of 0.3
10 parts by weight of alumina powder coated with electroless nickel to a thickness of 0.2 μm was mixed with μm-thick alumina, dispersed in a ball mill for 30 hours, and then diluted to 10% by weight with demineralized water to obtain an electrodeposition solution.

[0109] Electrodeposition was carried out under the conditions of 25° C. and pH 9, using the above substrate as an anode and a stainless steel plate as a cathode, and applying a voltage of 120 V.
A conductive adhesive member was obtained by forming a resin layer 4 having a thickness of 22 μm on both sides of the base material in a treatment time of 3 minutes. The content of the mixed powder of metallized ceramic powder and fine nickel powder in resin layer 4 was 37% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

[0111] Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
Using a BS resin substrate as an adherend, the adherend and the resin layer 4 are bonded together so that they are in contact with each other, and then the resin layer 4 is cured and bonded at room temperature to prepare a test piece, and the conductive adhesive member of the present invention is prepared. The adhesion force between the sample and the ABS resin substrate was measured, and it was evaluated whether the adhesive force was 1 kg/cm or more.

Example 2-5 After degreasing a copper foil base material with a thickness of 18 μm with an alcohol solvent, degreasing was further performed for 1 minute using an alkaline cleaner (trade name: Pakuna No. 19; manufactured by Yuken Chemical). . Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

[0113] As the electrodeposition liquid, 70 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 30 parts by weight, further crosslinking agent (trade name: PERMASTA
T R-5; manufactured by Dainippon Ink Chemical Co., Ltd.) 6 parts by weight and catalyst (trade name: Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 3 parts by weight were mixed, and then an average particle size of 0.07
20 parts by weight of fine copper powder (20 parts by weight) and 50 parts by weight of alumina powder (0.2 μm thick electroless nickel plating) with an average particle size of 1 μm were mixed, dispersed in a ball mill for 30 hours, and then mixed with demineralized water to 5% by weight. It was diluted to make an electrodeposition solution.

[0114] Electrodeposition was carried out under the conditions of 25°C and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, and applying a voltage of 1
A conductive adhesive member 1 was obtained by forming resin layers 4 with a thickness of 18 μm on both sides of the base material at 00 V and a treatment time of 3 minutes. The content of the mixed powder of metallized ceramic powder and fine copper powder in resin layer 4 was 25% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 90° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
1 at 90°C after bonding using a BS resin substrate as an adherend.
A test piece was prepared by heating for 0 minutes and bonded, and the adhesion force between the conductive adhesive member of the present invention and an ABS resin substrate was measured.
It was evaluated whether it had an adhesive strength of /cm or more.

The adhesive strength and surface resistance of Examples 2-1 to 2-5 are shown in Table 2-1.

[0118]

[Table 2]

Example 2-6 The conductive adhesive member 1 obtained in Example 2-1 was adhered to the entire inner surface of the resin casings A and A' produced in Example 1-6 for 50 minutes.
After bonding by heating at ℃ for 10 minutes, the casings A and A' were assembled and L. T. An exterior cover for a personal computer was produced (conductivity between the casings was the same as in Example 1-6).

[0120] When the electromagnetic shielding effect of this exterior cover was measured using the transmission line method, it was approximately 80 dB on average in the frequency band of 50 to 1000 MHz.
It showed extremely excellent attenuation.

Example 2-7 Exterior cover 51 of the laptop computer body shown in FIG. 5
The ABS resin casings A and A' formed for the two casings composing the . Using 20ml/l,
It was treated at room temperature for 2 minutes and washed with water. Next, palladium chloride 0.3 g/l and hydrochloric acid 3 ml/l were added as activator liquid.
1 of the mixed solution was used at room temperature for 2 minutes to conductivity. After that, electroless copper plating solution (manufactured by Okuno Pharmaceutical Co., Ltd.) pH
13.0 to a thickness of 0.7μ on the entire surface of the housings A and A'.
A copper plating sample 81 having a thickness of m was formed.

Next, as shown in FIG. 8, these casings A and A' were joined together using the conductive adhesive member 1 obtained in Example 2-3, and heated at 50° C. for 10 minutes to bond them together to form an exterior cover. 5
1 was produced. Also, no other inter-casing conduction means was used.

[0123] The electromagnetic shielding effect of this exterior cover was measured using the transmission line method, and the average was 70 to 80 dB in the band of 50 to 1000 MHz.
Very excellent attenuation was confirmed, and sufficient conduction between the housings A and A' was obtained by the conductive adhesive member 1.

Example 3-1 After applying electroless copper plating to a thickness of 0.2 μm on one side of a polyester film base material 2 having a thickness of 18 μm, the base material 1 was degreased with an alcohol solvent, and then an alkaline cleaner (trade name: Pakuna) was applied. No. 19 (manufactured by Yuken Chemical) was used to further degrease for 1 minute. Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a copper thin film surface activation treatment.

[0125] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
T; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (trade name: Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2
．． The adhesive was mixed with 40 parts by weight of natural mica powder with an average particle size of 1 μm and electroless nickel plated to a thickness of 0.2 μm, and then mixed in a ball mill for 30 hours. After being dispersed, the solution was diluted to 15% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition 25℃, pH 8.5
Under the following conditions, using the substrate 1 as an anode and a stainless steel plate as a cathode, a film thickness of 17 μm was obtained at an applied voltage of 100 V and a treatment time of 3 minutes.
A conductive adhesive member was obtained by forming resin layers 4 on both sides of the base material.

The content of metallized natural mica powder in resin layer 4 was 40% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
1 at 50℃ after bonding using a BS resin substrate as an adherend.
The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured by heating and adhering for 0 minutes to prepare a test piece.
It was evaluated whether it had an adhesive strength of m or more.

Example 3-2 Electroless copper plating was applied to a polyester base material 1 having a thickness of 18 μm to a thickness of 0.2 μm.

[0130] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
5 parts by weight of T R-5 (manufactured by Dainippon Ink Chemical Co., Ltd.) and 2.5 parts by weight of a catalyst (product name: Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.), and further added to this adhesive an average of After mixing 20 parts by weight of copper fine powder with a particle size of 0.02 μm and 30 parts by weight of mica with an average particle size of 1.0 μm and electroless nickel plating to a thickness of 0.1 μm, and dispersing it in a ball mill for 30 hours. It was diluted to 15% by weight with demineralized water to prepare an electrodeposition solution.

[0131] Electrodeposition was carried out under the conditions of 25°C and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, and applying a voltage of 1
A conductive adhesive member 1 was obtained by forming a resin layer 4 having a thickness of 16 μm on one side of the base material at 00 V and a processing time of 3 minutes. The content of the mixed powder of metallized mica powder and copper fine powder in resin layer 4 is 4
It was 7% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

[0133] Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
1 at 50℃ after bonding using a BS resin substrate as an adherend.
A test piece was prepared by heating for 0 minutes and bonded, and the adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured.
It was evaluated whether it had adhesive force of cm or more.

Example 3-3 After degreasing a copper foil base material with a thickness of 18 μm with an alcohol solvent, degreasing was further performed for 1 minute using an alkaline cleaner (trade name: Pakuna No. 19; manufactured by Yuken Chemical). . Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

[0135] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
T; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (product name:
Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2.5
10 parts by weight of a powder made of alumina with an average particle size of 1 μm and electroless nickel plating applied to a thickness of 0.2 μm and an average particle size of 1.0 μm are mixed in proportions of parts by weight.
30 parts by weight of natural mica powder with electroless nickel plating of 0.2 μm were mixed and dispersed in a ball mill for 30 hours, and then diluted to 15% by weight with demineralized water to prepare an electrodeposition solution. Electrodeposition 17 μm thick resin layer 4 was formed on both sides of the base material under conditions of electrodeposition at 25° C. and pH 8.5, using the casing as an anode and a stainless steel plate as a cathode at an applied voltage of 100 V and a processing time of 3 minutes to perform conductive bonding. A sex member 1 was obtained. The content of the mixed powder of the metallized ceramic powder and the metallized natural mica powder in the resin layer 4 was 40% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less as a guideline.

[0137] Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
1 at 50℃ after bonding using a BS resin substrate as an adherend.
The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured by heating it for 0 minutes to bond it to make a test piece.
It was evaluated whether it had adhesive force of cm or more.

Example 3-4 Electroless copper plating was applied to one side of a polyethylene terephthalate base material 2 having a thickness of 18 μm to a thickness of 0.2 μm. Next, this base material was degreased with an alcohol solvent, and then treated with an alkaline cleaner (
Product name: Pakuna No. No. 19 (manufactured by Yuken Chemical Co., Ltd.) was used to further degrease for 1 minute. Next, after washing with water, the surface was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

Next, the sample was immersed in a mixed aqueous solution of 5% sodium hydroxide and 1% potassium persulfate at 70° C. for 30 seconds to form a copper oxide sample as the chemically colored sample 6.

[0140] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
T; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (product name:
Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2.5
30 parts by weight of fine copper powder with an average particle size of 0.02 μm and 1 μm in average particle size with respect to this adhesive.
10 parts by weight of a powder made by electroless nickel plating to a thickness of 0.2 μm and 10 parts by weight of a powder made by applying electroless nickel plating to natural mica with an average particle size of 1.0 μm to a ball mill. After being dispersed for 30 hours, the solution was diluted to 15% by weight with demineralized water to obtain an electrodeposition solution. Electrodeposition at 25℃, p
Under the conditions of H8.5, using the casing as an anode and a stainless steel plate as a cathode, a film thickness of 1 was obtained at an applied voltage of 100 V and a processing time of 3 minutes.
A conductive adhesive member 1 was obtained by forming a resin layer 4 of 8 μm on one side of the base material. The content of the metallized ceramic powder, metallized mica powder, and copper fine powder in the resin layer 4 was 47% by weight.

[0141] The conductive adhesive member 1 thus obtained was heated in an oven at 50°C for 10 minutes to crosslink it, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine the presence or absence of electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less.

[0142] Furthermore, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution for 1 minute, and after washing with water, 30 g/l of stannous chloride and 20 ml of hydrochloric acid were added.
A whose surface was etched by immersing it in a mixed solution of /l for 2 minutes
1 at 50℃ after bonding using a BS resin substrate as an adherend.
The adhesive force between the conductive adhesive member of the present invention and the ABS resin substrate was measured by heating and adhering for 0 minutes to prepare a test piece.
It was evaluated whether it had an adhesive strength of m or more.

Example 3-5 Electroless copper plating was applied to a 18 μm thick polyester base material to a thickness of 0.2 μm.

Next, the sample was immersed in a mixed aqueous solution of 5% sodium hydroxide and 1% potassium persulfate at 70° C. for 30 seconds to form a copper oxide sample as the chemically colored sample 6.

[0145] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
5 parts by weight of T R-5 (manufactured by Dainippon Ink Chemical Co., Ltd.) and 2.5 parts by weight of a catalyst (product name: Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.), and further added to this adhesive an average of 10 parts by weight of fine copper powder with a particle size of 0.02 μm, average particle size of 1
10 parts by weight of powder made of μm alumina with electroless nickel plating applied to a thickness of 0.2 μm, and 5 parts by weight of natural mica with an average particle size of 1.0 m applied electroless nickel plating to a thickness of 0.1 μm. 5 parts by weight of powder of electroless copper plating to a thickness of 0.05 μm was mixed on the surface of nylon particles with an average particle diameter of 0.5 μm, dispersed in a ball mill for 30 hours, and then diluted to 15 weight percent with demineralized water. It was used as an electrodeposition liquid.

[0146] Electrodeposition was carried out under the conditions of 25°C and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, and applying an applied voltage of 1.
A conductive adhesive member 1 was obtained by forming a resin layer 4 having a thickness of 17 μm on one side of the base material at 00 V and a processing time of 3 minutes.

[0147] The content of the mixed powder in this resin layer 4 is 30
It was wt%.

The conductive adhesive member 1 thus obtained was heated in an oven at 50° C. for 10 minutes to crosslink, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard value.

[0149] Further, the conductive adhesive member of this example before crosslinking was immersed in a CrO3-H2SO4-H2O based etching solution.
After soaking for 1 minute and washing with water, 30g/l of stannous chloride and 20g/l of hydrochloric acid.
After bonding an ABS resin substrate whose surface was etched by immersing it in a mixed solution of ml/l for 2 minutes,
A test piece was prepared by heating at 50°C for 10 minutes to bond.
The adhesive strength between the conductive adhesive member of the present invention and the ABS resin substrate was measured, and it was evaluated whether the adhesive strength was 1 Kg/cm or more.

The adhesive strength and surface resistance values of Examples 3-1 to 3-5 are shown in Table 3-1.

[0151]

[Table 3]

Example 3-6 In Example 2-6, Example 3 was used as the conductive adhesive member 1.
An exterior cover 51 for a laptop computer main body was produced in the same manner as in Example 2-6 except that the conductive adhesive member No.-4 was used. The transmission line method (ASTM ES7.8) was used to evaluate the electromagnetic shielding effect of this exterior cover.
When measured using method 3), an extremely excellent attenuation amount of about 80 dB on average was shown in the band of 50 to 1000 MHz.

Example 4-1 After degreasing a copper foil base material with a thickness of 18 μm with an alcohol solvent, degreasing was further performed for 1 minute using an alkaline cleaner (trade name: Pakuna No. 19; manufactured by Yuken Chemical). . Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

[0154] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
T; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (product name:
Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2.5
50 parts by weight of fine copper powder with an average particle size of 0.02 μm as conductive particles were mixed in the proportions of parts by weight, and after being dispersed in a ball mill for 30 hours, the mixture was diluted to 5% by weight with demineralized water to obtain an electrodeposition solution. . Electrodeposition was carried out under the conditions of 25° C. and pH 8.5, using the substrate as an anode and a stainless steel plate as a cathode, applying a voltage of 100 V and processing time of 3 minutes to form a resin layer 4 with a thickness of 18 μm on both sides of the substrate. Thus, a conductive adhesive member 1 was obtained.

[0155] The content of fine copper powder in resin layer 4 was 15% by weight.

The conductive adhesive member 1 thus obtained was heated in an oven at 140° C. for 20 minutes to crosslink, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard value.

[0157] Also, the copper substrate was degreased with an alcohol solvent, further degreased for 1 minute using an alkaline cleaner (product name: Panac No. 19; manufactured by Yuken Chemical Co., Ltd.), and then washed with 10% sulfuric acid for 30 seconds. After washing with water, the surface was further washed with demineralized water for surface activation treatment.

Example 4-1 Using this copper substrate as an adherend
After being brought into close contact with the conductive adhesive material obtained in
The resin layer 4 was crosslinked and bonded by heating for a minute to prepare a test piece. Next, the adhesive force between the conductive adhesive member and the copper base material of this test piece was measured, and it was evaluated whether the sample had an adhesive force of 1 kg/cm or more.

Example 4-2 After degreasing a copper substrate 5 with a thickness of 18 μm using an alcohol solvent, degreasing was further performed for 1 minute using an alkaline cleaner (trade name: Pakuna No. 19; manufactured by Yuken Chemical). Next, after washing with water, it was washed with 10% sulfuric acid for 30 seconds, and then with demineralized water to perform a surface activation treatment.

Next, the copper hydroxide film was treated in a mixed solution of copper nitrate, ammonium chloride and acetic acid at 70° C. for 30 seconds to form a chemically colored copper hydroxide film on the surface of the copper thin film.

[0161] As the electrodeposition liquid, 60 parts by weight of polyester resin (trade name: FINETEX ES-525; manufactured by Dainippon Ink Chemical Co., Ltd.), polyester resin (trade name: FINETEX 525; manufactured by Dainippon Ink Chemical Co., Ltd.) 40 parts by weight, further crosslinking agent (trade name: PERMASTA
TR-5; manufactured by Dainippon Ink Chemical Co., Ltd.) 5 parts by weight, catalyst (trade name: Cat PA-20; manufactured by Dainippon Ink Chemical Co., Ltd.) 2.5 parts by weight, and further as conductive particles on average 50 parts by weight of fine copper powder having a particle size of 0.07 μm were mixed and dispersed in a ball mill for 30 hours, and then diluted to 5% by weight with demineralized water to obtain an electrodeposition solution.

[0162] Electrodeposition was carried out under the conditions of 25°C and pH 8.5, using the above substrate as an anode and a stainless steel plate as a cathode, and applying an applied voltage of 1.
A resin layer 4 having a thickness of 17 μm was formed on the copper hydroxide coated surface of the base material at 00V for 3 minutes to obtain a conductive adhesive member 1.

[0163] The content of copper fine powder in the resin layer 4 is 47wt.
%Met.

The conductive adhesive member 1 thus obtained was heated in an oven at 140° C. for 20 minutes to crosslink, and then the surface resistivity of the resin layer 4 of the conductive adhesive member 1 was measured to determine whether or not it had electromagnetic shielding properties. It was evaluated whether the resin layer 4 had a conductivity of 0.5Ω/□ or less, which is a standard value.

[0165] Also, the copper substrate was degreased with an alcohol solvent, further degreased for 1 minute using an alkaline cleaner (product name: Panac No. 19; manufactured by Yuken Chemical Co., Ltd.), and then washed with 10% sulfuric acid for 30 seconds. After washing with water, the surface was further washed with demineralized water for surface activation treatment.

Example 4-1 Using this copper substrate as an adherend
After being brought into close contact with the conductive adhesive material obtained in
The resin layer 4 was crosslinked and bonded by heating for a minute to prepare a test piece. Next, the adhesive force between the conductive adhesive member and the copper base material of this test piece was measured, and it was evaluated whether the sample had an adhesive force of 1 kg/cm or more.

Comparative Example 3 As a conductive adhesive, 100 parts by weight of an epoxy adhesive (trade name: Rixipo; manufactured by Showa Kobunshi Co., Ltd.) with an average particle size of 0.02 μm was applied to the base material used in Example 4-1. 1 nickel particle
Using a mixture of 0 parts by weight, a conductive adhesive layer having a thickness of 10 μm was formed by spraying onto the bonding surface of the base material to obtain a conductive adhesive member.

[0168] After the conductive adhesive layer of this conductive adhesive member was cured, the surface resistance was measured.

[0169] Next, this conductive adhesive member was prepared in Example 4-1.
A test piece was prepared by closely adhering to the adherend used in , curing, and bonding. The adhesive force between the conductive adhesive member and the adherend of this test piece was measured.

[0170] The adhesive strength and surface resistance values of Examples 4-1, 4-2 and Comparative Example 3 are shown in Table 4-1.

[0171]

[Table 4]

[0172]

As explained above, according to the present invention, it is possible to obtain a conductive adhesive member having excellent adhesive properties and uniform and good electromagnetic shielding properties.

[0173] Furthermore, according to the present invention, in a conductive cover formed by joining two or more casings, the casings are firmly adhered at the joint, and conduction between the casings is prevented at the joint. A desired conductive cover can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of an exterior cover of an electronic device to which a conductive adhesive member of the present invention is adhered. (A) A partial sectional view of the exterior cover. (B) An enlarged sectional view of the conductive adhesive member.

FIG. 2 is a sectional view showing another embodiment of the conductive adhesive member of the present invention.

FIG. 3 is a sectional view showing still another embodiment of the conductive adhesive member of the present invention. (A) Non-metallic base material (B) Metallic base material

FIG. 4 is a partial cross-sectional view of a conductive member bonded with the conductive adhesive member of the present invention.

FIG. 5 is a perspective view of a laptop computer equipped with the conductive member of the present invention.

FIG. 6 is a circuit diagram used for measuring surface resistance.

FIG. 7 is a sectional view of the laptop main body of FIG. 5.

FIG. 8 is a sectional view showing another embodiment of the laptop computer main body of FIG. 5;

FIG. 9 is a schematic cross-sectional view of the conductive adhesive member of the present invention.

[Explanation of symbols]

1 Conductive adhesive member 2 Non-metal base material 3 Metal thin film layer 4 Adhesive resin layer 5 Metal base material 6 Chemically colored film 11 Exterior covers 41, 42 Conductive housing 51 Laptop computer exterior cover 91 Metallized ceramic powder and/or metallized natural mica powder

Claims (24)

[Claims] 1. A conductive adhesive member comprising a base material and an adhesive resin layer containing conductive particles and having conductivity, which is formed by an electrodeposition coating method. 2. The conductive adhesive member according to claim 1, wherein the base material is a non-metallic base material, and has a metal thin film on at least one surface of the base material. 3. The conductive adhesive member according to claim 2, further comprising a chemically colored coating on the surface of the metal thin film on the side not in contact with the base material. 4. The conductive adhesive member according to claim 1, wherein the base material is a metal base material. 5. The conductive adhesive member according to claim 4, wherein at least one surface of the metal base material has a chemically colored coating. 6. The conductive adhesive member according to claim 1, wherein the conductive particles are one or two selected from metalized ceramic powder and metalized natural mica powder. 7. Claim 1, wherein the conductive particles are one or two selected from metallized resin powder and ultrafine metal powder.
conductive adhesive member. 8. The conductive particles include one or two powders selected from metalized ceramic powder and metalized natural mica powder, and one selected from metalized resin powder and ultrafine metal powder. The conductive adhesive member according to claim 1, which is a mixture of a seed or two types of powder. 9. The adhesive is applied to the substrate by immersing the substrate in an electrodeposition paint containing an electrodepositable adhesive resin and conductive particles, and performing electrodeposition using the substrate as one electrode. 1. A method for producing a conductive adhesive member, the method comprising depositing a conductive resin and conductive particles to form a conductive adhesive resin layer. 10. The method for producing a conductive adhesive member according to claim 10, wherein the conductive particles are one or two kinds of powder selected from metalized ceramic powder and metalized natural mica powder. 11. The method for producing a conductive adhesive member according to claim 1, wherein the conductive particles are one or two selected from metallized resin powder and ultrafine metal powder. 12. The conductive particles include one or two powders selected from metallized ceramic powder and metallized natural mica powder, and one selected from metallized resin powder and ultrafine metal powder. The method for producing a conductive adhesive member according to claim 9, wherein the conductive adhesive member is a mixture of a seed or two types of powder. 13. The method of manufacturing a conductive adhesive member according to claim 9, wherein the base material is a non-metallic base material, and the metal coating is applied to at least one surface of the base material, and then electrodeposition is performed. Claim 14: Electrodeposition is performed after forming a chemically colored film on the surface of the metal film that does not contact the base material.
3. Method for manufacturing a conductive adhesive member. 15. The method of producing a conductive adhesive member according to claim 14, wherein the metal coating is a copper coating, and electrodeposition is performed after forming a copper oxide coating, which is a chemically colored coating, by surface treatment of the copper thin film. Method. Claim 9: The base material is a metal base material.
A method for manufacturing a conductive adhesive member. 17. The method for manufacturing a conductive adhesive member according to claim 16, wherein electrodeposition is performed after forming a chemically colored film on at least one surface of the base material. 18. The production of a conductive adhesive member according to claim 17, wherein the base material is a copper base material, and the electrodeposition is performed after forming a copper oxide film, which is a chemically colored film, by surface treatment of the copper base material. Method. 19. In a conductive member in which at least two or more casings are in contact with each other at a surface point, the casings are bonded and electrically connected to each other via a conductive adhesive member, and the conductive adhesive member A conductive member comprising a base material and an adhesive resin layer containing conductive particles formed by an electrodeposition coating method on at least one surface of the base material. Claim 20: Claim 19 wherein the base material is a metal base material.
conductive member. 21. The conductive member according to claim 20, further comprising a chemically colored layer on at least one surface of the metal base material. 22. The conductive member according to claim 19, wherein the conductive member is an exterior cover. 23. The conductive member according to claim 19, wherein the conductive member is a shield case. 24. At least two or more conductive adhesive members having a base material and an adhesive resin layer containing conductive particles formed by electrodeposition coating on at least one surface of the base material. An electronic device characterized in that a casing thereof is provided with a conductive member that is bonded and made conductive.