CN111256057A

CN111256057A - Lamp belt

Info

Publication number: CN111256057A
Application number: CN202010072670.XA
Authority: CN
Inventors: 郑瑛
Original assignee: Chongqing Huiku Technology Co ltd
Current assignee: Chongqing Huiku Technology Co ltd
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-06-09

Abstract

The embodiment of the invention provides a lamp strip, which can be divided into a plurality of bending limiting areas and a plurality of bending guide areas along the length direction, wherein the bending limiting areas and the bending guide areas are alternately arranged, in the bending limiting areas, the coverage rate of a circuit layer on a flexible substrate is greater than that of the circuit layer in the bending guide areas, and an inverted LED chip is arranged on the circuit layer in the bending limiting areas. Because the coverage rate of the circuit layer in the bending limiting area to the flexible substrate is greater than the coverage rate of the circuit layer in the bending guiding area to the flexible substrate, therefore, the rigidity of the bending limiting area is stronger than that of the bending guiding area, in the process of bending the lamp strip, the bending limiting area is more difficult to bend than the bending guiding area, the flip LED chip in the bending limiting area can be effectively protected, the influence of the stress in the bending process of the lamp strip on the flip LED chip in the bending limiting area is reduced, and the reliability of the electrical connection between the flip LED chip and the circuit layer in the bending limiting area is improved.

Description

Lamp belt

Technical Field

The invention relates to the field of LEDs, in particular to a lamp belt.

Background

The LED strip is a strip-shaped LED product formed by assembling LEDs on a Flexible Printed Circuit (FPC), and has the advantages of long service life, energy saving and environmental protection, and thus has been increasingly widely used in the field of lighting. In the process of transporting and selling the LED lamp strip, in order to save occupied space, the LED lamp strip is usually bent into a coil; when using the LED strip, people may fix the LED strip on a wall or furniture, but the general situation is that the LED strip installation surface may not be completely flat, and the LED strip is bent along with the shape of the installation surface such as the wall or the furniture surface. The LED chips in the LED lamp strip can be damaged and lose efficacy due to stress caused by bending in the bending process, so that the lighting effect of the LED lamp strip is influenced.

Disclosure of Invention

The lamp belt provided by the embodiment of the invention mainly solves the technical problems that: the problem of current lamp area damage because buckle easily, the quality is not high is solved.

In order to solve the technical problem, an embodiment of the present invention provides a light strip, including an FPC, a plurality of flip LED chips, and a packaging adhesive layer covering a light emitting surface of the flip LED chips, where the FPC includes a flexible substrate and a circuit layer disposed on a surface of the flexible substrate; the lamp band is divided into a plurality of bending limiting areas and a plurality of bending guiding areas along the length direction, and the bending limiting areas and the bending guiding areas are arranged alternately; in the bending limiting area, the coverage rate of the circuit layer to the flexible substrate is greater than that of the circuit layer in the bending guide area; the flip LED chip is arranged on the circuit layer in the bending limiting area, the electrode of the flip LED chip is electrically connected with the circuit layer, and at least one flip LED chip is arranged in one bending limiting area.

Optionally, the bending limiting area is a rectangle, the length of one side of the rectangle is equal to the width of the light strip, and the length of the other side of the rectangle is larger than the size of the flip-chip LED chip in the length direction of the light strip and smaller than the distance between two adjacent flip-chip LED chips.

Optionally, a flip LED chip and a resistor are simultaneously disposed in at least one bending limiting region on the light strip.

Optionally, a reinforcing member is further included in the lamp strip, and the reinforcing member is only located in the bending limiting region.

Optionally, the arrangement mode of the reinforcing part comprises at least one of the following modes:

the reinforcing piece is a back auxiliary circuit arranged on the back of the flexible substrate, the back of the flexible substrate is the other surface opposite to the surface where the circuit layer is arranged, and at least one part of the back auxiliary circuit is electrically connected with the circuit layer;

the reinforcing piece is an insulating substrate arranged on the back of the flexible substrate;

the reinforcing piece is transparent adhesive tape covering the light emitting surface of the flip LED chip.

Optionally, the circuit layer located in the bending limiting region includes a placing unit arranged along the length direction of the lamp strip, the placing unit is composed of an upper placing block and a lower placing block arranged along the width direction of the lamp strip, each flip-chip LED chip corresponds to one placing unit uniquely, the flip-chip LED chips are located on the placing unit, one of the first electrode and the second electrode of each flip-chip LED chip is electrically connected with the upper placing block of the placing unit, and the other flip-chip LED chip is electrically connected with the lower placing block of the placing unit; the circuit layer further comprises an interval connecting wire which is arranged in the bending guide area and used for being electrically connected with the placing units in the two bending limiting areas, and the line width size of the interval connecting wire is smaller than the sizes of the upper placing block and the lower placing block in the width direction of the lamp strip.

Optionally, the circuit layer further includes a region interconnection line for electrically connecting the two placement units in one bending limiting region, and a line width dimension of the region interconnection line is smaller than dimensions of the upper and lower placement blocks in the width direction of the light strip.

Optionally, each flip LED chip in the light strip corresponds to each placement unit one by one, and a first electrode of each flip LED chip is electrically connected to an upper placement block of the corresponding placement unit, and a second electrode is electrically connected to a lower placement block of the corresponding placement unit; the upper placing block in the Nth placing unit on the lamp strip is electrically connected with the lower placing block in the (N-1) th placing unit, the lower placing block in the Nth placing unit on the lamp strip is electrically connected with the upper placing block in the (N + 1) th placing unit, and N is larger than or equal to 2.

Optionally, the lamp strip is a double-sided lamp strip, and the size and the setting position of the placing unit on one side of the flexible substrate are matched with those of the placing unit on the other side of the flexible substrate.

Optionally, the bending limiting region and the bending guiding region can be divided into an edge portion and a middle portion along the width direction of the light strip, wherein the position of the middle portion in the width direction of the light strip corresponds to the position of the flip-chip LED chip in the width direction of the light strip, and the size of the middle portion in the width direction of the light strip is larger than that of the flip-chip LED chip in the width direction of the light strip; the coverage rate of the flexible substrate by the circuit layer in the middle part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the middle part of the bending guide area; and/or the coverage rate of the flexible substrate by the circuit layer in the edge part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the edge part of the bending guide area.

Optionally, the edge portions are an upper edge portion and a lower edge portion, and the upper edge portion and the lower edge portion are respectively located on two opposite sides of the middle portion; the coverage rate of the flexible substrate by the circuit layer in the edge part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the edge part of the bending guiding area; and/or the coverage rate of the flexible substrate by the circuit layer in the lower edge part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the lower edge part of the bending guiding area.

The invention has the beneficial effects that:

the lamp strip provided by the embodiment of the invention comprises an FPC (flexible printed circuit), a plurality of flip LED chips and a packaging adhesive layer covering the light emitting surfaces of the flip LED chips, wherein the FPC comprises a flexible substrate and a circuit layer arranged on the surface of the flexible substrate. The lamp strip can be divided into a plurality of bending limiting areas and a plurality of bending guiding areas along the length direction, the bending limiting areas and the bending guiding areas are arranged alternately, and in the bending limiting areas, the coverage rate of the circuit layer on the flexible substrate is greater than that of the circuit layer on the flexible substrate in the bending guiding areas. The flip LED chip is arranged on the circuit layer in the bending limiting area, the electrode of the flip LED chip is electrically connected with the circuit layer, and at least one flip LED chip is arranged in one bending limiting area. Because the coverage rate of the circuit layer in the bending limiting area to the flexible substrate is greater than the coverage rate of the circuit layer in the bending guide area to the flexible substrate, the rigidity of the bending limiting area is stronger than that of the bending guide area, and the bending limiting area is more difficult to bend than the bending guide area in the bending process of the lamp strip. In addition, because the flip LED chip is arranged on the circuit layer in the bending limiting area in the embodiment of the invention, the flip LED chip in the bending limiting area can be effectively protected by utilizing the rigidity difference between the bending limiting area and the bending guide area, the influence of stress on the flip LED chip in the bending limiting area in the bending process of the lamp strip is reduced, the reliability of the electrical connection between the flip LED chip and the circuit layer in the bending limiting area is improved, the quality of the lamp strip is enhanced, and the service life of the lamp strip is prolonged.

Additional features and corresponding advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a front view of a first light strip provided in a first embodiment of the present invention;

fig. 2 is a schematic structural view of the light strip in fig. 1;

fig. 3 is a schematic structural diagram of a second light strip provided in the first embodiment of the present invention;

FIG. 4 is a schematic view of an alternative placement unit provided in one embodiment of the present invention;

FIG. 5a is a schematic view of an alternative placement unit provided in the first embodiment of the present invention;

FIG. 5b is a schematic view of another alternative placement unit provided in the first embodiment of the present invention;

fig. 6a is a schematic structural diagram of a third light strip provided in the first embodiment of the present invention;

fig. 6b is a schematic structural diagram of a fourth light strip provided in the first embodiment of the present invention;

fig. 7 is a schematic structural view of a light strip provided in a second embodiment of the present invention;

fig. 8 is a front view of another light strip provided in the second embodiment of the present invention;

fig. 9 is a front view of a light strip provided in the third embodiment of the present invention;

fig. 10 is a schematic structural diagram of the light strip in fig. 9.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

in order to solve the problem that the LED chip in the existing lamp strip is easily failed by bending the lamp strip, thereby resulting in the lamp strip not high in quality, the present embodiment provides a lamp strip, please refer to the front view of the lamp strip provided by the present embodiment shown in fig. 1:

the light strip 10 includes an FPC11, a plurality of flip LED chips 12, and an encapsulation adhesive layer 13 covering a light emitting surface of the flip LED chips 12. Please further refer to the schematic structural diagram of the light strip 10 shown in fig. 2: the FPC11 includes a flexible substrate 111 and a wiring layer 112 provided on a surface of the flexible substrate 111. Each flip LED chip 12 in the light strip 10 is disposed on the wiring layer 112, and the electrodes of the flip LED chips 12 are electrically connected to the wiring layer 112.

In this embodiment, the light strip 10 may be divided into a plurality of bending limiting regions 101 and a plurality of bending guiding regions 102 along the length direction thereof, and the bending limiting regions 101 and the bending guiding regions 102 are alternately arranged. Each flip-chip LED chip 12 is disposed on the circuit layer 112 in the bending limiting region 101, and at least one flip-chip LED chip 12 is disposed in one bending limiting region 101.

It should be understood that, depending on the arrangement of the components on the light strip 10, the arrangement of the circuit layer 112 on the surface of the flexible substrate 111 is not exactly the same, and in the present embodiment, the coverage rate of the flexible substrate 111 by the circuit layer 112 in the bending limiting region 101 is greater than the coverage rate of the flexible substrate 111 by the circuit layer 112 in the bending guiding region 102. Since the circuit layer 112 is a conductive metal layer, for example, a copper layer in general, the greater the coverage of the flexible substrate 111 by the circuit layer 112, the stronger the rigidity, strength, and the like, and the more rigid an object is, the less likely it is to be bent. Therefore, in the present embodiment, since the coverage rate of the flexible substrate 111 by the circuit layer 112 in the bending limiting region 101 is greater than the coverage rate of the flexible substrate 111 by the circuit layer 112 in the bending guiding region 102, the rigidity of the bending limiting region 101 is greater than that of the bending guiding region 102, and when the light strip 10 is bent by an external force, the bending position is more likely to appear in the bending guiding region. In other words, the bending-limited region 101 is a region of the lamp strip with limited bending, and the bending-guiding region 102 is a region where bending is easy to occur, so that the probability of the bending-occurring bending-limited region 101 can be reduced by "guiding" the difference in rigidity between the bending-limited region 101 and the bending-guiding region 102, and the bending position can be "guided" to the bending-guiding region 102 as much as possible.

Therefore, set up each flip-chip LED chip 12 in the restriction area 101 of buckling in this embodiment, can effectively avoid the lamp area 10 to buckle the position and appear in flip-chip LED chip 12 place to reduce flip-chip LED chip 12 and buckle the probability that the in-process became invalid at lamp area 10, maintain the quality of lamp area 10.

It is understood that only one flip-chip LED chip 12 may be included in one bend-limiting region 101, so that each flip-chip LED chip 12 is protected by a separate bend-limiting region 101. In some examples of the present embodiment, the bending limiting region 101 is a rectangle, and a length of one side of the rectangle is equal to a width of the light strip 10, and a length of the other side of the rectangle is greater than a dimension of the flip LED chips in a length direction of the light strip 10 and is smaller than a distance between two adjacent flip LED chips, for example, please continue to refer to fig. 2: in the structural schematic diagram of the light strip 10 shown in fig. 2, the dimension of the bending limiting regions 101 in the width direction of the light strip 10 is equal to the width of the light strip 10, and the dimension of the bending limiting regions 101 in the length direction of the light strip 10 is greater than the dimension of the flip LED chips 12 in the length direction of the light strip, but is smaller than the distance between two adjacent flip LED chips 12, so that a certain distance exists between the boundaries of two adjacent bending limiting regions 101, and the region between the two bending limiting regions 101 is the bending guiding region 102.

In other examples, at least two flip-chip LED chips may be included in one bend limiting region 101 at the same time. For example, in fig. 3, a strip cutting unit may be included in one bending limiting region 101. In the actual use process of the lamp strip 10, a user can cut an original long lamp strip 10 according to the requirement of the user on the required length of the lamp strip, so as to avoid the influence of cutting on the electrical performance of elements in the lamp strip 10, the user should avoid cutting off a series circuit in the lamp strip 10, and preferably, an integral number of parallel branches can be cut, wherein one end of each parallel branch is connected with the positive power line in the circuit layer 112, and the other end of each parallel branch is connected with the negative power line in the circuit layer 112. Therefore, in this embodiment, a so-called "strip cutting unit" is actually a parallel branch having one end connected to the positive power line in the circuit layer 112 and the other end connected to the negative power line in the circuit layer 112.

It should be understood that the electrical components in the light strip, in addition to the flip-chip LED chip, also include a resistor. In some examples, the resistor is located in the bending guide region, and since the resistor in the light strip is usually disposed by means of a patch, the connection between the resistor and the circuit layer 112 is reliable, and therefore, the resistor may not be disposed in the bending limiting region for protection. However, in some other examples, the resistor may be located in the bending limiting region 101, and therefore, in these examples, the flip-chip LED chip 12 and the resistor may be included in at least one bending limiting region of one light strip 10.

For convenience of description, the coverage of the circuit layer 112 to the flexible substrate 111 is referred to as "circuit layer coverage" hereinafter, and it will be understood by those skilled in the art that the circuit layer coverage of a region is actually the ratio of the area of the circuit layer in the region to the total area of the region. The following describes an implementation of the higher coverage of the circuit layer in the bend limiting zone 101 than in the bend guiding zone 102:

in an example of the present embodiment, the circuit layer 112 includes a placing unit disposed in the bending limiting region 101, see fig. 2: the placing units 20 are mainly used for placing the flip LED chips 12 and realizing electrical connection of the flip LED chips 12, and are disposed in the bending limiting region 101 along the length direction of the light strip, that is, the placing units 20 on the light strip 10 are arranged in a row along the length direction of the light strip 10. The specific structure of the placing unit 20 is shown in fig. 4: the placement unit 20 is composed of two placement blocks, an upper placement block 21 and a lower placement block 22, which are disposed along the width direction of the light strip 10. The upper placing block 21 and the lower placing block 22 are electrically isolated, and two electrodes (a first electrode and a second electrode) of the flip LED chip 12 are electrically connected to the two placing blocks of the placing unit 20, respectively.

In fig. 4, the specifications of the upper placing block 21 and the lower placing block 22 of the placing unit 20 are completely the same, but in other examples of the present embodiment, the shapes and/or sizes of the two placing blocks of the placing unit 20 may not be the same. For example, in the placement unit 50a shown in fig. 5a, the area of the upper placement block 51a is significantly larger than the area of the lower placement block 52 a. In addition, the shape of the placement block may be circular, parallelogram, polygonal, or even irregular, in addition to the rectangular shape shown in fig. 4. For example, in fig. 5b, the upper and lower placing blocks in the placing unit 50b are both elliptical.

In the present embodiment, the circuit layer 112 further includes a segment connecting line 40 disposed in the bending guiding region 102 for electrically connecting the placing units 20 in the two bending limiting regions, please refer to fig. 2. It should be understood that the inter-region connection line 40 may be "line" since the inter-region connection line 40 is only for electrically connecting the placement units 20 in two adjacent bending limitation areas 101, i.e., the line width of the inter-region connection line 40 is not required in practical cases. In this embodiment, the line width of the interval connecting line 40 is smaller than the dimension of the placement block in the width direction of the light strip 10. It will be appreciated that the so-called "line width" of the interval connecting lines 40 is actually the width dimension of the interval connecting lines perpendicular to the direction of current flow therein, and therefore the "width" direction of the interval connecting lines 40 is not the same as the width direction of the light strip 10.

Because the line width of the interval connecting line 40 is less than the sizes of the upper placing block 21 and the lower placing block 22 in the width direction of the lamp strip 10, when the lamp strip is bent in the length direction, the interval connecting line 40 is more easily bent in the bending guide area 102 instead of the bending limiting area where the placing unit 20 is located, and the effect that the rigidity of the bending limiting area 101 is greater than that of the bending guide area 102 is achieved through the arrangement of the placing unit 20 and the interval connecting line 40.

In some examples of the present embodiment, at least two placing units 20 are simultaneously included in one bending limiting region 101, please continue to refer to fig. 3. In this case, electrical connection is required between the placement units in the same bend limiting region, and therefore, in these examples, the connection lines of the wiring layer 112 include the intra-region connection lines 41. In some examples of the present embodiment, one strip cutting unit is disposed in at least two bending limiting regions at the same time, and at least two placing units are included in one bending limiting region 101 at the same time, in these examples, the connecting lines will include both the inter-region connecting lines 41 and the intra-region connecting lines 41. In the light strip 10, the adjacent placing units 20 are usually electrically connected, and the connection across the placing units 20 is usually not occurred, so the intra-area connecting wire 41 mainly realizes the electrical connection between the adjacent placing units 20 in one bending limitation area 101.

It should be understood that, since the intra-area connection line 41 is located in the bending limitation area 101, the wider the intra-area connection line 41 is, the higher the line layer coverage of the bending limitation area 101 is, and thus, the larger the line width dimension of the intra-area connection line 41 is, the better theoretically. Therefore, in the present embodiment, the line width of the interconnection line 41 may be greater than the dimension of the placement block in the width direction of the light strip 10, or equal to the dimension of the placement block in the width direction of the light strip 10. However, in some examples of the present embodiment, it is required that the line width of the interconnection line 41 in the region is also smaller than the dimension of the placement block in the width direction of the light strip. Since if the line width of the interconnection line 41 in the region is greater than or equal to the dimension of the placement block in the width direction of the light strip, if the bending occurs in the bending-limited region, the bending position is likely to occur at the position of the placement block, that is, at the position of the flip LED chip 12, thereby affecting the reliability of the electrical connection between the flip LED chip 12 and the upper and lower placement blocks 21 and 22. Especially, when the size of the placing block in the width direction of the lamp strip is smaller than the line width of the connecting line in the region, once the bending is generated in the bending limiting region, the bending position is most likely to be generated at the place where the placing block is located, and thus, the lamp strip 10 is very easy to be damaged in the bending process.

It is to be understood that the interval connecting lines 40 and the intra-area connecting lines 41 are arranged along the length direction of the light strip 10, because two placing units 20 arranged along the length direction of the light strip 10 need to be connected, and therefore, in some examples of the present embodiment, at least a portion of each of the interval connecting lines 40 and the intra-area connecting lines 41 is parallel to the length direction of the light strip 10.

In an example, the section connecting lines 40 are parallel to the length direction of the lamp strip, in this case, assuming that the connection ends of the section connecting lines 40 and the two placing units are a and b, respectively, the positions of the connection end a and the connection end b in the width direction of the lamp strip 10 are the same, which means that the last placing unit (hereinafter referred to as "last placing unit") in the previous bending limiting area and the first placing unit (hereinafter referred to as "first placing unit") in the subsequent bending limiting area can only be the upper placing block connecting upper placing block and/or the lower placing block connecting lower placing block. In some other examples of this embodiment, the interval connection lines 40 may be partially disposed parallel to the length direction of the light strip, and partially disposed parallel to the width direction of the light strip. For example, in some examples of the present embodiment, the inter-region connection line may electrically connect the lower placement block of the last placement unit in the previous bending limitation region and the upper placement block of the first placement unit in the subsequent bending limitation region. Alternatively, the electrical connection between the upper placement block of the last placement unit in the previous bending limitation area and the lower placement block of the first placement unit in the subsequent bending limitation area can also be realized.

In some examples, the interconnection lines 41 are parallel to the length direction of the light strip, in this case, assuming that the connection ends of the interconnection lines 41 and the two placement units are c and d, respectively, the connection ends c and the connection ends d are located at the same positions along the width direction of the light strip 10, which means that the previous placement unit and the next placement unit can only be upper placement blocks connecting upper placement blocks and/or lower placement blocks connecting lower placement blocks. In other examples of the present embodiment, a portion of the intra-area connection lines 41 may be disposed parallel to the length direction of the light strip, and another portion may be disposed parallel to the width direction of the light strip. For example, in some examples of the present embodiment, the intra-area connection line 41 may realize electrical connection between a lower placement block of a previous placement unit and an upper placement block of a subsequent placement unit. Alternatively, the electrical connection between the upper placement block of the former placement unit and the lower placement block of the latter placement unit may be realized.

In some examples of the present embodiment, the electrode arrangement orientation of each flip-chip LED chip 12 in the light strip 10 may not be exactly the same, e.g., a portion of the flip-chip LED chips have the first electrode on top and the second electrode on bottom, but another portion of the flip-chip LED chips have the first electrode on bottom and the second electrode on top. When manufacturing such a light strip, the flip LED chip 12 needs to be placed according to the structure of the circuit layer 112 on the FPC11 and the required series-parallel relationship between the components when disposing the flip LED chip 12. However, in other examples of the present embodiment, during the process of designing and preparing the FPC 12, the circuit layer 112 is disposed according to the required serial-parallel relationship between the components, so when the flip LED chips 12 are disposed, all the flip LED chips 12 can be directly disposed according to the uniform electrode disposing direction, for example, all the flip LED chips 12 have the first electrode on the top and the second electrode on the bottom.

In some examples of the present embodiment, the relationship between all the flip LED chips 12 and the placing units 20 in the light strip 10 is one-to-one, and the upper placing block in the nth placing unit is electrically connected to the lower placing block in the N-1 th placing unit, and the lower placing block in the nth placing unit is electrically connected to the upper placing block in the N +1 th placing unit, where N is greater than or equal to 2. It should be appreciated that in these examples, there is a series relationship between the flip LED chip on the nth placement unit and the flip LED chip on the N +1 th placement unit. In some of the strips 10 provided in this embodiment, all the flip-chip LED chips in the same strip cutting unit are connected in series, as shown in fig. 6 a. It is needless to say that in a strip shear unit in which the flip LED chips 12 are in series relationship, a resistor 60 should be included in series with the flip LED chips 12.

Continuing with the assumption that all of the flip-chip LED chips 12 in the light strip 10 have the first electrode on top and the second electrode on bottom, in some examples of this embodiment, all of the flip-chip LED chips 12 in the light strip 10 may be divided into at least two groups, and the number of flip-chip LED chips in at least one of the chip groups is greater than or equal to 2. The chip groups are connected in series, but all the flip LED chips in the same chip group are connected in parallel. In these examples, the upper placement blocks 21 corresponding to the placement units 20 in the same chipset are electrically connected to each other, and the lower placement blocks 22 corresponding to the placement units 20 in the same chipset are also electrically connected to each other. In addition, in these examples, at least some of the adjacent chip sets are connected in series through resistors 60, which is shown in fig. 6 b.

Alternatively, in some examples, the resistor in the light strip 10 may be disposed on the placement unit 20, and one end of the resistor is electrically connected to the upper placement block 21, and the other end is electrically connected to the lower placement block 22 as shown in fig. 6 a. In these examples, the placing unit 20 in the light strip 10 can not only protect the flip-chip LED chip 12 from being bent, but also protect the resistor from being damaged during the bending of the light strip 10. However, in other examples, considering that the resistor is disposed on the FPC11 by means of a patch, and thus the electrical connection with the wiring layer 112 on the FPC11 is more reliable than that of the flip LED chip 12, in these examples, the resistor may not be protected by the placing unit 20, and thus the resistor is disposed not on the placing unit 20 but between two adjacent placing units 20, as shown in fig. 6 b.

In some examples of this embodiment, the light strip 10 may be a double-sided light strip, that is, the circuit layer 112 and the flip-chip LED chip 12 are disposed on both the upper surface and the lower surface of the flexible substrate 111, and in order to avoid collision of the bending limiting regions on both sides, it may be ensured that the placing unit 20 on one surface of the flexible substrate 111 matches with the placing unit 20 on the other surface in size and arrangement position, so that it may be ensured that the bending limiting regions 101 on both surfaces of the light strip 10 are completely the same, and the bending guiding regions 102 are also completely the same.

The lamp area that this embodiment provided, utilize the circuit layer to the cover of flexible substrate, form the relatively great restriction area of buckling of rigidity and the relatively less guide area of buckling of rigidity on FPC, and the restriction area of buckling and the guide area alternate arrangement of buckling, can guarantee like this that the lamp area receives external force and have to take place when buckling, the position of buckling can appear in the guide area of buckling as far as possible, and thus, through setting up flip LED chip in the bigger restriction area of buckling of rigidity, just can realize the protection to flip LED chip, avoid the problem that flip LED chip became invalid at the in-process that the lamp area buckles, compare in current lamp area, the lamp area that this embodiment provided has more excellent quality.

Example two:

the present embodiment will be described with reference to the following examples on the basis of the first embodiment:

the light strip may be divided into the bending limiting regions and the bending guiding regions arranged alternately in the length direction, and the light strip may also be divided into at least two regions in the width direction, and in some examples of the present embodiment, as shown in fig. 7, the light strip 70 may be divided into the edge portion and the middle portion 700b in the width direction thereof, in other words, both the bending limiting regions and the bending guiding regions may be divided into the edge portion and the middle portion in the width direction of the light strip 70. The position of the middle portion 700b in the width direction of the light strip 70 corresponds to the position of the flip-chip LED chip 72 in the width direction of the light strip, and the dimension of the middle portion 700b in the width direction of the light strip is larger than the dimension of the flip-chip LED chip 72 in the width direction of the light strip. Briefly, each flip-chip LED chip 72 on the light strip 70 is located in the middle portion 700b, and specifically, each flip-chip LED chip 72 is located in the middle portion within the bending limitation region.

In some examples of this embodiment, when there is no difference in coverage of the flexible substrate by the wiring layer in the edge portion of the bend limiting region and the bend guiding region, the coverage of the flexible substrate by the wiring layer in the middle portion of the bend limiting region is greater than the coverage of the flexible substrate by the wiring layer in the middle portion of the bend guiding region. In some other examples of the present embodiment, when the coverage rate of the flexible substrate by the circuit layer in the middle portion of the bending limiting region is the same as that of the circuit layer in the middle portion of the bending guiding region, the coverage rate of the flexible substrate by the circuit layer in the edge portion of the bending limiting region is greater than that of the flexible substrate by the circuit layer in the edge portion of the bending guiding region. Even in some examples of the present embodiment, the coverage rate of the flexible substrate by the circuit layer in the middle portion of the bending limiting region is greater than the coverage rate of the flexible substrate by the circuit layer in the middle portion of the bending guiding region, and the coverage rate of the flexible substrate by the circuit layer in the edge portion of the bending limiting region is greater than the coverage rate of the flexible substrate by the circuit layer in the edge portion of the bending guiding region.

It is understood that the edge portion can be divided into an upper edge portion 700a and a lower edge portion 700c, and the upper edge portion 700a and the lower edge portion 700c are respectively located at two opposite sides of the middle portion 700 b. Wherein the upper edge portion 700a is closer to the upper placement block and the lower edge portion 700c is closer to the lower placement block. Optionally, the coverage rate of the flexible substrate by the circuit layer in the upper edge part 700a of the bending limiting area is greater than the coverage rate of the flexible substrate by the circuit layer in the upper edge part 700a of the bending guiding area; alternatively, the coverage of the flexible substrate by the circuit layer in the lower edge portion 700c of the bending limiting region is greater than the coverage of the flexible substrate by the circuit layer in the lower edge portion 700c of the bending guiding region. In some examples of this embodiment, when the coverage of the flexible substrate by one of the upper edge portion 700a and the lower edge portion 700c of the bend limiting region is greater than the coverage of the flexible substrate by the other of the upper edge portion 700a and the lower edge portion 700c of the bend limiting region, the coverage of the flexible substrate by the other of the upper edge portion 700a and the lower edge portion 700c of the bend limiting region is equal to the coverage of the flexible substrate by the inner layer of the corresponding portion of the bend guiding region.

In some examples, the circuit layer further includes a power line in addition to the placement unit and the connection line, wherein the power line is divided into a positive power line and a negative power line, wherein the upper edge portion 700a corresponds to the positive power line, the lower edge portion 700c corresponds to the negative power line, the positive power line is located in the upper edge portion 700a, and the negative power line is located in the lower edge portion. Therefore, in these examples, if the coverage of the flexible substrate by the circuit layer in the bend limiting region upper edge portion 700a is greater than the coverage of the flexible substrate by the circuit layer in the bend guiding region upper edge portion 700a, the line width of the positive power line in the bend limiting region is greater than the line width in the bend guiding region. If the coverage rate of the circuit layer on the flexible substrate in the lower edge part 700c of the bending limiting region is greater than that of the circuit layer on the flexible substrate in the lower edge part 700c of the bending guiding region, the line width of the part of the negative electrode power line, which is positioned in the bending limiting region, is greater than that of the part of the negative electrode power line, which is positioned in the bending guiding region.

In order to further increase the rigidity of the bending limiting region 701, in some examples of the present embodiment, a reinforcing member may be further disposed in the light strip 70, the reinforcing member being disposed only in the bending limiting region 701 and disposed inside the bending guiding region 702, so that the difference in rigidity between the bending limiting region 701 and the bending guiding region 702 may be further increased by using the reinforcing member. It will be appreciated that a reinforcement member may be provided in each of the bend limiting regions 701 on the light strip 70 to protect all of the flip-chip LED chips 72. But may alternatively be disposed only in a portion of the bend-limiting region 701, for example, in some examples of the present embodiment, no reinforcement is disposed in the bend-limiting region 701 at the ends of the light strip 70, because the bend is less likely to occur at the ends of the light strip. In other examples, the bending limiting region 701 adjacent to the cut mark on the light strip 70 is not provided with a reinforcing member, because the cut mark is cut indication information provided by a light strip manufacturer to a user, and the mark user can cut the light strip 70 from the cut position to obtain two sub light strips, so that the cut position becomes the end of the sub light strip after cutting, and bending is not easy to occur.

Several configurations of stiffeners are provided below by way of example:

the first method is as follows: a back auxiliary wiring provided on the back surface of the flexible substrate 711 may be used as a reinforcing member, and the back auxiliary wiring may be at least partially electrically connected to the wiring layer 712. Here, the front and back surfaces of the flexible substrate 711 are briefly explained: the flexible substrate 711 employed in the light strip 70 is typically relatively thin, so the thickness of the flexible substrate 711 is negligible, in which case the flexible substrate 711 includes only upper and lower surfaces. The front surface of the flexible substrate 711 is the surface on which the LED chip 72 is mounted, and the surface opposite to the surface on which the LED chip is mounted is the back surface of the flexible substrate. It should be noted that, in these examples, the back auxiliary lines may not constitute a circuit structure that works independently, but are auxiliary lines or auxiliary circuits on the front line layer of the flexible substrate 711, for example, some back auxiliary lines in this embodiment may be auxiliary power lines, so as to provide current for the line layer on the front side of the flexible substrate 711, and avoid the problem that the power lines on the front side of the flexible substrate 711 cannot carry large current due to being too thin. Through mutually supporting of both sides power cord, can satisfy the demand of each flip-chip LED chip 72 to the electric current in lamp area 70 under the condition of guaranteeing lamp area 70 safety.

The second method comprises the following steps: an insulating substrate provided on the back surface of the flexible substrate 711 may be used as the reinforcing member, and in this case, the provision of the reinforcing member has no electrical influence on the wiring layer 712, the flip LED chip 72, and the like on the front surface of the flexible substrate 711, but the strength and rigidity of the bending-restricting region may be increased because the insulating substrate is located only in the bending-restricting region 701. In some examples of the present embodiment, the insulating substrate may be provided only in a part of the bending limitation region. In another example, an insulating substrate for reinforcement is disposed in each bending limiting region on the back surface of the flexible substrate 711, see fig. 8: the position of the insulating substrate 74 in the width direction of the light strip 70 is the same as the position of the flip LED chip 72 in the width direction of the light strip 70, the size of the insulating substrate 74 is slightly larger than the size of the flip LED chip 72, and the area occupied by the insulating substrate 74 on the flexible substrate 711 can completely cover the area occupied by the flip LED chip 72 on the flexible substrate 711.

In both of the above examples, the reinforcing member is provided on the back surface of the flexible substrate 711, but in fact, the reinforcing member may be provided on the front surface of the flexible substrate 711 in addition to the back surface of the flexible substrate 711:

the third method comprises the following steps: the reinforcing member may be a transparent adhesive disposed on the light emitting surface of the flip LED chip 72, and the transparent adhesive has a relatively high rigidity after being cured, so as to enhance the rigidity of the bending limiting region 701. It should be understood that the transparent adhesive layer formed by the transparent adhesive is different from the encapsulating adhesive layer 73, and the encapsulating adhesive layer 73 generally covers the whole area of the front surface of the flexible substrate 711 without difference between the bending limiting region 701 and the bending guiding region 702. In some examples of this embodiment, the transparent adhesive may be a first fluorescent adhesive, and the first fluorescent adhesive covered on different flip LED chips 72 may be different, so as to not only enhance the rigidity of the bending limiting region 701 and protect the flip LED chips 72, but also enable the light strip 70 to emit at least two lights with different color temperatures.

In addition, the reinforcing member may be disposed on the front surface of the flexible substrate 711 and located under the flip LED chip 72, for example, the reinforcing member is an insulating heat dissipation layer, which not only has better rigidity, but also can conduct heat generated by the flip LED chip 72 in the working process to a region other than the region where the flip LED chip 72 is located due to good heat conduction performance, so as to avoid the problem that the flip LED chip 72 is damaged due to long-time working in a high-temperature environment.

The lamp area that this embodiment provided, not only can utilize the circuit layer in the restriction district of buckling to protect flip-chip LED chip, but also can be through extra, only set up the rigidity in the restriction district of buckling is further increased to the reinforcement piece in the restriction district of buckling, thereby increase the rigidity difference between restriction district of buckling and the guidance district of buckling, position "guide" to buckling takes place in the guidance district, avoid buckling the position at flip-chip LED chip place, thereby reduce the electric connection failure between flip-chip LED chip and the circuit layer, the probability that flip-chip LED chip itself became invalid, promote the lamp area quality, reinforcing lamp area user experience.

Example three:

in order to make the advantages and details of the light strip provided by the present invention clearer for those skilled in the art, the present embodiment will be further described with reference to the specific examples, please refer to fig. 9:

the present embodiment provides a light strip 90, which includes an FPC 91, a plurality of flip LED chips 92, and an encapsulation adhesive layer 93 covering the flip LED chips 92 in the light strip 90.

Please further refer to fig. 10: the FPC 91 includes a flexible substrate 911 and a circuit layer disposed on one surface of the flexible substrate 911, where the circuit layer includes a positive power line 912a, a negative power line 912b, and a plurality of placement units 912c disposed along the length direction of the light strip 90, the positive power line is located at the upper edge portion of the flexible substrate 911, and the negative power line is located at the lower edge portion. Meanwhile, the circuit layer further includes a connection line for connecting two adjacent placing units 912 c. The placing unit 912c is composed of an upper placing block and a lower placing block, the upper placing block and the lower placing block are electrically isolated from each other, and the placing blocks are arranged on the lamp strip 90 along the width direction of the lamp strip.

Many flip-chip LED chips 92 set up on the unit 912c of placing on the circuit layer, and in this embodiment, lamp area 90 includes two at least lamp area shearing units, and each flip-chip LED chip in every lamp area shearing unit all establishes ties. In the present embodiment, all the flip-chip LED chips 92 on the light strip 90 are oriented in the same direction on the light strip 90, the first electrode (for example, the first electrode may be an anode, and it is understood by those skilled in the art that the first electrode may also be a cathode, but the corresponding second electrode should be an anode) is located above and electrically connected to the upper placement block of the placement unit 912c, and the second electrode is located below and electrically connected to the lower placement block of the placement unit 912 c.

In the present embodiment, each bending limiting region includes only one flip LED chip 92, and thus there is only one placing unit 912c in one bending limiting region. Specifically, the range of the bending limiting region in the length direction of the light strip 90 is the same as the range occupied by the placing unit 912c in the length direction of the light strip. Therefore, the connection lines between the placement units 912c in this embodiment only include inter-region connection lines, and do not include intra-region connection lines. In this embodiment, the line widths of the positive power line at the positions of the flexible substrate 911 are the same, and the line widths of the negative power line at the positions of the flexible substrate 911 are also the same, so that in order to make the coverage rate of the circuit layer in the bending limiting region larger than that in the bending guiding region, it is necessary to ensure that the coverage rate of the circuit layer in the middle part of the bending limiting region is larger than that in the middle part of the bending guiding region: as can be clearly seen from fig. 10, the line width of the interval connecting line is much smaller than the dimensions of the upper and lower placement blocks in the width direction of the light strip.

Assuming that n flip-chip LED chips are included in one strip cutting unit, n placing units should be included in the strip cutting unit: continuing to combine with fig. 10, the upper placing block of the first placing unit in the lamp strip cutting unit is connected with the positive power line, and the lower placing block is electrically connected with the upper placing block of the second placing unit; the lower placing block of the second placing unit is electrically connected with the upper placing block of the third placing unit … … in sequence until the lower placing block of the (n-1) th placing unit is electrically connected with the upper placing block of the nth placing unit, and the lower placing block of the nth placing unit is electrically connected with the negative power line.

The lamp area that this embodiment provided can utilize the difference of placing unit and interval connecting line space linewidth to form the restriction district of buckling and the guide region of buckling to make the lamp area buckle and be difficult for taking place in the region of placing the unit place, thereby protect the flip-chip LED chip that sets up on placing the unit, reduce the lamp area and buckle the influence that brings the flip-chip LED chip, maintained the lamp area performance.

The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims

1. A lamp belt is characterized by comprising an FPC (flexible printed circuit), a plurality of flip LED chips and a packaging adhesive layer covering the light emitting surfaces of the flip LED chips, wherein the FPC comprises a flexible substrate and a circuit layer arranged on the surface of the flexible substrate; the lamp band is divided into a plurality of bending limiting areas and a plurality of bending guiding areas along the length direction, and the bending limiting areas and the bending guiding areas are arranged alternately; in the bending limiting area, the coverage rate of the circuit layer to the flexible substrate is greater than that of the circuit layer to the flexible substrate in the bending guide area; the flip LED chip is arranged on the circuit layer in the bending limiting area, the electrode of the flip LED chip is electrically connected with the circuit layer, and at least one flip LED chip is arranged in one bending limiting area.

2. The light strip of claim 1, wherein the bend limiting region is rectangular, and a length of one side of the rectangle is equal to a width of the light strip, and a length of the other side of the rectangle is greater than a dimension of the flip-chip LED chips in a length direction of the light strip and less than a distance between two adjacent flip-chip LED chips.

3. The light strip of claim 1, wherein said light strip has both a flip-chip LED chip and a resistor disposed in at least one bend limiting region.

4. The light strip of claim 1, further comprising a reinforcing member in the light strip, wherein the reinforcing member is only located in the bend-limiting region.

5. The light strip of claim 4, wherein the reinforcing member is disposed in a manner comprising at least one of:

the reinforcing piece is a back auxiliary circuit arranged on the back surface of the flexible substrate, the back surface of the flexible substrate is the other surface opposite to the surface where the circuit layer is arranged, and at least one part of the back auxiliary circuit is electrically connected with the circuit layer;

6. A light strip according to any one of claims 1 to 5, wherein the wiring layer located in the bending limiting region comprises a placement unit disposed along the length direction of the light strip, the placement unit is composed of an upper placement block and a lower placement block disposed along the width direction of the light strip, each flip LED chip corresponds to only one placement unit, the flip LED chips are located on the placement units, one of the first and second electrodes is electrically connected to the upper placement block of the placement unit, and the other is electrically connected to the lower placement block of the placement unit; the circuit layer is still including setting up in the guiding region of buckling, be used for the electric connection two interval connecting wires of placing the unit in the restriction region of buckling, the line width size of interval connecting wire is less than go up, down place the piece and be following the size of lamp area width direction.

7. The light strip of claim 6, wherein said wiring layer further comprises an in-region wiring for electrically connecting two placement units within a bend limiting region, said in-region wiring having a line width dimension smaller than the dimensions of said upper and lower placement blocks in the width direction of said light strip.

8. The light strip of claim 6, wherein each of the flip-chip LED chips corresponds to each of the placement units one-to-one, and a first electrode of each of the flip-chip LED chips is electrically connected to an upper placement block of the corresponding placement unit, and a second electrode is electrically connected to a lower placement block of the corresponding placement unit; the upper placing block in the Nth placing unit on the lamp belt is electrically connected with the lower placing block in the (N-1) th placing unit, the lower placing block in the Nth placing unit on the lamp belt is electrically connected with the upper placing block in the (N + 1) th placing unit, and N is more than or equal to 2.

9. A light strip according to claim 6, wherein said light strip is a double-sided light strip, and said placement units on one side of said flexible substrate are matched in size and placement position to placement units on the other side.

10. A light strip according to any one of claims 1 to 5, wherein the bending limiting region and the bending guiding region are each dividable into an edge portion and a middle portion in the width direction of the light strip, wherein the position of the middle portion in the width direction of the light strip corresponds to the position of the flip LED chip in the width direction of the light strip, and the dimension of the middle portion in the width direction of the light strip is larger than the dimension of the flip LED chip in the width direction of the light strip; the coverage rate of the flexible substrate by the circuit layer in the middle part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the middle part of the bending guide area; and/or the coverage rate of the flexible substrate by the circuit layer in the edge part of the bending limiting area is greater than that of the flexible substrate by the circuit layer in the edge part of the bending guide area.

11. The light strip of claim 10, wherein said edge portions are an upper edge portion and a lower edge portion, said upper edge portion and said lower edge portion being located on opposite sides of said intermediate portion; the coverage rate of the circuit layer in the upper edge part of the bending limiting area to the flexible substrate is greater than that of the circuit layer in the upper edge part of the bending guiding area to the flexible substrate; and/or the coverage rate of the circuit layer in the lower edge part of the bending limiting area to the flexible substrate is greater than that of the circuit layer in the lower edge part of the bending guide area to the flexible substrate.