CN212204126U - LED lamp strip - Google Patents

Abstract

The embodiment of the utility model provides a LED lamp area places the unit setting in the restriction district of buckling in the circuit layer, and is used for connecting two interval connecting wires settings of placing the unit in the restriction district of buckling and in the guide district of buckling, and places the line width that the piece is greater than interval connecting wire at LED lamp area width direction's size in the unit, so, buckle the restriction district and buckle more difficult than the guide district of buckling. Receive exogenic action when LED lamp area, take place to buckle, buckle and take place in the guiding region of buckling more easily, and, the embodiment of the utility model provides an on the circuit layer of flip-chip LED chip setting in the restriction region of buckling, so, utilize the restriction region of buckling and buckle the difference of rigidity between the guiding region, can effectively protect the flip-chip LED chip in the restriction region of buckling, reduce the influence of lamp area in-process stress to flip-chip LED chip in the restriction region of buckling, promote the reliability of being connected with circuit layer electricity of flip-chip LED chip in the restriction region of buckling.

Description

LED lamp strip

Technical Field

The utility model relates to a LED field especially relates to a LED lamp area.

Background

The LED strip is a strip-shaped LED product formed by assembling LEDs on a Flexible Printed Circuit (FPC), and has the advantages of long service life, energy saving and environmental protection, and thus has been increasingly widely used in the field of lighting. In the process of transporting and selling the LED lamp strip, in order to save occupied space, the LED lamp strip is usually bent into a coil; when using the LED strip, people may fix the LED strip on a wall or furniture, but the general situation is that the LED strip installation surface may not be completely flat, and the LED strip is bent along with the shape of the installation surface such as the wall or the furniture surface. The LED chips in the LED lamp strip can be damaged and lose efficacy due to stress caused by bending in the bending process, so that the lighting effect of the LED lamp strip is influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a lamp area, the main technical problem who solves is: the problem of current lamp area damage because buckle easily, the quality is not high is solved.

In order to solve the technical problem, an embodiment of the present invention provides an LED lamp strip, which includes an FPC, a plurality of flip LED chips, and an encapsulation adhesive layer covering a light emitting surface of the flip LED chips, wherein the FPC includes a flexible substrate and a circuit layer disposed on a surface of the flexible substrate; the LED lamp strip is divided into a plurality of bending limiting areas along the length direction, and the area between two adjacent bending limiting areas is a bending guide area; the circuit layer comprises placing units arranged in the bending limiting areas along the length direction of the LED lamp strip, and each bending limiting area comprises at least one placing unit; the placing unit is composed of an upper placing block and a lower placing block which are arranged along the width direction of the LED lamp strip, the inverted LED chip is positioned on the placing unit, one of a first electrode and a second electrode of the inverted LED chip is electrically connected with the upper placing block of the placing unit, and the other electrode of the inverted LED chip is electrically connected with the lower placing block of the placing unit; the flip LED chips are divided into at least two groups, and the chip groups are connected in series; the number of the flip LED chips in at least one chip group is more than or equal to 2, the first electrodes of all the flip LED chips in the same chip group are electrically connected, the second electrodes of all the flip LED chips in the same chip group are electrically connected, and the electrode arrangement directions of all the flip LED chips in the same chip group are the same; the circuit layer is characterized by further comprising connecting wires used for being electrically connected with two placing units, the connecting wires are arranged in the bending guide area and used for being electrically connected with two interval connecting wires used for placing the units in the bending limiting area, and the line width size of each interval connecting wire is smaller than the size of the upper placing block and the lower placing block in the width direction of the LED lamp strip.

Optionally, the placing units correspond to the flip LED chips one to one, the upper placing blocks corresponding to the same chip group are electrically connected to each other, and the lower placing blocks corresponding to the same chip group are electrically connected to each other.

Optionally, one placing unit corresponds to a plurality of flip LED chips at the same time.

Optionally, each chip set includes a plurality of flip-chip LED chips, and the placing units correspond to the chip sets one to one.

Optionally, at least a part of the connecting wire is arranged in parallel to the length direction of the LED strip; and the connecting end of the connecting wire and the placing block in the placing unit is positioned at one end of the placing block far away from the inverted LED chip, or the connecting end of the connecting wire and the placing block in the placing unit is positioned at the middle part of the placing block.

Optionally, the connecting lines between the placing units corresponding to the same chip set are all parallel to the length direction of the LED strip.

Optionally, in two adjacent placing units respectively corresponding to the two adjacent chip sets, the lower placing block of the previous placing unit is electrically connected with the upper placing block of the next placing unit, and the connecting line between the two is composed of a part parallel to the length direction of the LED strip and a part parallel to the width direction of the LED strip.

Optionally, the circuit layer of the LED strip further includes a power line, where the power line includes a positive power line and a negative power line that are arranged along the length direction of the LED strip and are respectively located at two sides of the placing unit; the line width of the power line in the bending limiting area is larger than that in the bending guide area.

Optionally, at least two placing units are arranged in one bending limiting area, the connecting line further comprises an in-area connecting line used for electrically connecting the two placing units in the bending limiting area, and the line width of the in-area connecting line is smaller than the dimensions of the upper placing block and the lower placing block in the width direction of the LED strip.

Optionally, the LED light strip further includes a back auxiliary circuit disposed on the back of the flexible substrate, the back of the flexible substrate is another surface opposite to the surface where the circuit layer is disposed, the back auxiliary circuit is only located in the bending limiting region, and at least a portion of the back auxiliary circuit is electrically connected to the circuit layer.

The utility model has the advantages that:

an embodiment of the utility model provides a LED lamp area, including FPC, many flip-chip LED chips and cover the encapsulation glue film on flip-chip LED chip light emitting area, FPC includes flexible substrate and sets up the circuit layer on flexible substrate surface. The LED lamp strip is divided into a plurality of bending limiting areas along the length direction, and the area between two adjacent bending limiting areas is a bending guide area. The circuit layer comprises placing units arranged in the bending limiting areas along the length direction of the LED lamp strip, and each bending limiting area comprises at least one placing unit; the placing unit is composed of an upper placing block and a lower placing block which are arranged along the width direction of the LED lamp strip, the inverted LED chip is positioned on the placing unit, one of a first electrode and a second electrode of the inverted LED chip is electrically connected with the upper placing block of the placing unit, and the other electrode of the inverted LED chip is electrically connected with the lower placing block of the placing unit; the flip LED chips are divided into at least two groups, and the electrode arrangement directions of the flip LED chips belonging to the same chip group on the corresponding placement units are the same. The chip sets are connected in series, the number of the flip LED chips in at least one chip set is more than or equal to 2, the first electrodes of the flip LED chips in the same chip set are electrically connected, and the second electrodes of the flip LED chips in the same chip set are electrically connected; the circuit layer is characterized by further comprising connecting wires used for being electrically connected with two placing units, the connecting wires are arranged in the bending guide area and used for being electrically connected with two interval connecting wires used for placing the units in the bending limiting area, and the line width size of each interval connecting wire is smaller than the size of the upper placing block and the lower placing block in the width direction of the LED lamp strip. Because the placing units in the circuit layer are arranged in the bending limiting areas, the interval connecting lines for connecting the placing units in the two bending limiting areas are arranged in the bending guide areas, and the size of the placing blocks in the width direction of the LED lamp strip in the placing units is larger than the line width of the interval connecting lines, the bending limiting areas are more difficult to bend than the bending guide areas. Receive exogenic action when LED lamp area, when taking place to buckle, buckle and take place in the guiding area of buckling more easily, and, because the embodiment of the utility model provides an on the flip-chip LED chip sets up the circuit layer in the restriction area of buckling, so, utilize the restriction area of buckling and buckle the difference of rigidity between the guiding area, can effectively protect the flip-chip LED chip in the restriction area of buckling, reduce the influence of lamp area in-process stress of buckling to flip-chip LED chip in the restriction area of buckling, promote the reliability of flip-chip LED chip and circuit layer electricity connection in the restriction area of buckling, reinforcing lamp area quality, extension lamp area life.

Other features and corresponding advantages of the invention are set forth in the following part of the specification, and it is to be understood that at least some of the advantages become apparent from the description of the invention.

Drawings

Fig. 1 is a front view of a first LED strip provided in a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of the LED strip in fig. 1;

fig. 3 is a schematic view of an alternative placing unit provided in the first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second LED strip provided in the first embodiment of the present invention;

fig. 5a is a schematic view of another alternative placing unit provided in the first embodiment of the present invention;

fig. 5b is a schematic view of another alternative placing unit provided in the first embodiment of the present invention;

fig. 6a is a schematic view of a position of a connecting end between a placing unit and a connecting line provided in a first embodiment of the present invention;

fig. 6b is another schematic view of a position of a connecting end between the placing unit and the connecting line provided in the first embodiment of the present invention;

fig. 6c is another schematic view of the position of the connecting end between the placing unit and the connecting line provided in the first embodiment of the present invention;

fig. 7 is a schematic structural diagram of an LED strip provided in an embodiment of the present invention;

fig. 8 is a front view of another LED strip provided in the second embodiment of the present invention;

fig. 9 is a front view of a LED strip provided in the third embodiment of the present invention;

fig. 10 is a schematic structural diagram of the LED strip in fig. 9.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

in order to solve the problem that an LED chip in an existing LED strip is easily bent and fails to work due to the LED strip, thereby resulting in a LED strip with low quality, the present embodiment provides an LED strip, please refer to the front view of the LED strip provided by the present embodiment shown in fig. 1:

the LED strip 10 includes an FPC11, a plurality of flip LED chips 12, and an encapsulation adhesive layer 13 covering a light emitting surface of the flip LED chips 12. Please further refer to the schematic structural diagram of the LED strip 10 shown in fig. 2: the FPC11 includes a flexible substrate 111 and a wiring layer 112 provided on a surface of the flexible substrate 111. Each flip LED chip 12 in the LED strip 10 is disposed on the wiring layer 112, and an electrode of the flip LED chip 12 is electrically connected to the wiring layer 112.

In the present embodiment, the LED strip 10 may be divided into a plurality of bending limiting regions 101 and a plurality of bending guiding regions 102 along the length direction thereof, and the bending limiting regions 101 and the bending guiding regions 102 are alternately arranged. Each flip-chip LED chip 12 is disposed on the circuit layer 112 in the bending limiting region 101, and at least one flip-chip LED chip 12 is disposed in one bending limiting region 101.

The circuit layer 112 includes a placing unit disposed along the length direction of the LED strip 10 in the bending limiting region, see fig. 2: the placing units 20 are mainly used for placing the flip LED chips 12 and realizing electrical connection of the flip LED chips 12, and are arranged in the bending limiting region 101 along the length direction of the LED strip, that is, the placing units 20 on the LED strip 10 are arranged in a row along the length direction of the LED strip 10. Typically, at least one placement unit 20 is included in one of the bend limiting areas. The specific structure of the placing unit 20 is shown in fig. 3: the placing unit 20 is composed of two placing blocks, an upper placing block 21 and a lower placing block 22, which are arranged along the width direction of the LED strip 10. The upper placing block 21 and the lower placing block 22 are electrically isolated, and two electrodes of the flip LED chip 12 are electrically connected to the two placing blocks of the placing unit 20, respectively.

The plurality of flip LED chips 12 on the LED strip 10 may be divided into at least two groups, and the number of flip LED chips in at least one chip group is greater than or equal to 2. The chip groups are connected in series, but the flip LED chips in the same chip group belong to a parallel relation, that is, the first electrodes of the flip LED chips 12 in the same chip group are electrically connected, and the second electrodes of the flip LED chips 12 in the same chip group are electrically connected.

In order to facilitate the electrical connection between the flip LED chips 12 in the same chip set, in this embodiment, the electrodes of the flip LED chips in the same chip set on the placing unit 20 are arranged in the same direction, for example, the first electrodes of the flip LED chips in a certain chip set are all on the top and are electrically connected with the top placing block of the corresponding placing unit 20; the second electrodes are all arranged at the lower part and are electrically connected with the lower placing blocks of the corresponding placing units 20. However, it will be understood by those skilled in the art that in theory, the electrode arrangement orientation of each flip-chip LED chip 12 in the same chip set may also be different, but in this case, the wiring layer on the FPC11 may be relatively complicated when the FPC11 is prepared.

Although one flip LED chip 12 only corresponds to one placing unit 20, it can be understood by those skilled in the art that, because the flip LED chips 12 in the same chip set are in parallel relationship with each other, the first electrodes of the parallel flip LED chips 12 are electrically connected together, and the second electrodes are also electrically connected together, so that there can be one placing unit 20 corresponding to two or even more flip LED chips at the same time, for example, please refer to fig. 4, where one placing unit 20 corresponds to multiple flip LED chips 12 at the same time, the first electrodes of the flip LED chips 12 are electrically connected to the upper placing block of the placing unit 20, and the second electrodes are electrically connected to the lower placing block of the placing unit 20. In some examples of the present embodiment, all flip-chip LED chips 12 in one chip set correspond to the same placing unit 20, and the placing units 20 correspond to the chip sets one to one. Therefore, in these examples, the flip LED chips 12 corresponding to one placing unit 20 belong to the same chip group. In other examples, a plurality of flip-chip LED chips 12 in the same chip set may be disposed on two or more placing units 20, respectively. For example, it is assumed that a plurality of flip LED chips in the same chip group are separately provided on two placing units 20, the upper placing blocks of the two placing units 20 are electrically connected together, and the lower placing blocks are also electrically connected together.

In some examples of the present embodiment, please continue to refer to fig. 2, the corresponding relationship between the flip LED chips 12 and the placing units 20 may also be one-to-one, that is, only one flip LED chip 12 is disposed on one placing unit 20, in this case, if a chip set includes n flip LED chips, at least n placing units 20 should correspond to the chip set in general. Each flip LED chip 12 is disposed on a placement unit 20 corresponding to the flip LED chip 12, a first electrode of the flip LED chip 12 is electrically connected to an upper placement block 21 of the placement unit 20, and a second electrode is electrically connected to a lower placement block 22.

In fig. 2 and 4, the specifications of the upper placing block 21 and the lower placing block 22 of the placing unit 20 are completely the same, but in other examples of the present embodiment, the shapes and/or sizes of the two placing blocks of the placing unit 20 may not be the same. For example, in the placement unit 50a shown in fig. 5a, the area of the upper placement block 51a is significantly larger than the area of the lower placement block 52 a. In addition, the shape of the placement block may be circular, parallelogram, polygonal, or even irregular, in addition to the rectangular shape shown in fig. 4. For example, in fig. 5b, the upper and lower placing blocks in the placing unit 50b are both elliptical.

Needless to say, since the chip sets in the LED strip 10 need to be connected in series, connecting wires must be used to connect the placement units 20 of different chip sets; furthermore, if the flip-chip LED chips 12 in one chip set are disposed on two or more placement units 20, connection lines are also required to electrically connect the placement units 20 corresponding to the same chip set. Therefore, in the present embodiment, the circuit layer 112 includes the connecting lines in addition to the placing unit 20. In this embodiment, each bending limiting region 101 is provided with at least one placing unit, so that each bending limiting region 101 at least includes one flip LED chip 12 therein. In order to realize the electrical connection of the flip LED chips 12 in the different bending limiting regions 101, the connecting lines are required to connect the placing units 20 in the different bending limiting regions 101, and such connecting lines for realizing the placing units in the different bending limiting regions 101 are interval connecting lines, and the interval connecting lines are arranged in the bending guiding region 102, please continue to refer to fig. 2. It should be understood that the inter-region connection lines 30 may be "line" shaped, since the inter-region connection lines 30 are only used to electrically connect the placement units 20 in two adjacent bending limitation areas 101, i.e., the line width of the inter-region connection lines 30 is not required in practical situations. In this embodiment, the line width of the interval connecting line 30 is smaller than the dimension of the placing block in the width direction of the LED strip 10. It should be understood that the so-called "line width" of the interval connection lines 30 is actually the width dimension of the interval connection lines perpendicular to the direction of current flow therein, and therefore, the "width" direction of the interval connection lines 30 is not the same as the width direction of the LED strip 10.

Because the line width of the interval connecting line 30 is smaller than the sizes of the upper placing block 21 and the lower placing block 22 in the width direction of the LED strip 10, when the LED strip is bent in the length direction, the interval connecting line 20 is more easily bent in the bending guide area 102 rather than the bending limiting area 101, and the bending limiting area 101 is provided with the unit 20, so that the effect that the rigidity of the bending limiting area 101 is greater than that of the bending guide area 102 is achieved by the arrangement of the unit 20 and the interval connecting line 30.

In some examples of the present embodiment, at least two placing units 20 are simultaneously included in one bending limiting region 101, so that not only the placing units in different bending limiting regions need to be electrically connected, but also the placing units 20 in the same bending limiting region need to be electrically connected, and therefore, in these examples, the connecting lines of the circuit layer 112 include not only the inter-region connecting lines 30 but also the inter-region connecting lines. In the LED strip 10, the adjacent placing units 20 are usually electrically connected, and the connection across the placing units 20 is usually not occurred, so the intra-area connection wires mainly achieve the electrical connection between the adjacent placing units 20 in one bending limitation area 101.

It should be understood that, since the interconnection line is located in the bending limiting region 101, the wider the interconnection line, the higher the coverage of the flexible substrate 111 by the circuit layer 112 of the bending limiting region 101, and naturally, the more rigid the bending limiting region 101 is, the less easily the interconnection line is bent. Therefore, in theory, the larger the line width dimension of the interconnection line in the region, the better. Therefore, in this embodiment, the line width of the connection line in the region may be greater than the size of the placement block in the width direction of the LED strip 10, or may be equal to the size of the placement block in the width direction of the LED strip 10. However, in some examples of the present embodiment, it is required that the line width of the interconnection line in the region is also smaller than the dimension of the placement block in the width direction of the LED strip. Because if the line width of the connection line in the region is greater than or equal to the dimension of the placement block in the width direction of the LED strip, if the bending occurs in the bending limiting region 101, the bending position is likely to occur at the position of the placement block, that is, at the position of the flip LED chip 12, thereby affecting the reliability of the electrical connection between the flip LED chip 12 and the upper and lower placement blocks 21 and 22. Especially, when the size of the placing block in the width direction of the LED strip is smaller than the line width of the connecting line in the region, once the bending is generated in the bending limiting region, the bending position is likely to be generated at the place where the placing block is located, and thus, the LED strip 10 is very easy to be damaged in the bending process.

It is understood that the inter-zone connection lines 30 and the inter-zone connection lines are required to connect two placement units 20 arranged along the length direction of the LED strip 10, and therefore, both of the two connection lines should generally run along the length direction of the LED strip 10, so in some examples of the present embodiment, at least a portion of each connection line is parallel to the length direction of the LED strip 10.

Since the electrodes of the flip-chip LED chips in the same chip group are arranged in the same direction on the corresponding placement units 20 in some examples, to realize the parallel connection between the flip-chip LED chips, it is only necessary to electrically connect the upper placement blocks of the placement units corresponding to the chip group, and to electrically connect the lower placement blocks of the placement units 20. In some examples, the connecting lines between the placement units 20 corresponding to the same chip set are always parallel to the length direction of the LED strip.

In some examples, not only the electrode arrangement orientations of the flip-chip LED chips 12 in the same chip set are the same, but also the electrode arrangement orientations of all the flip-chip LED chips 12 in the whole LED strip 10 are the same: for example, in a certain LED strip 10, the first electrodes of all flip-chip LED chips 12 are electrically connected to the upper placement blocks 21 of the corresponding placement units 20, and the second electrodes of all flip-chip LED chips 12 are electrically connected to the lower placement blocks 22 of the corresponding placement units 20, in this example, the electrode arrangement orientations of the flip-chip LED chips in the adjacent chip groups are the same. In this case, in order to realize the series connection between the adjacent chip groups, for two adjacent placing units of two adjacent chip groups (for convenience of description, these two adjacent placing units are hereinafter referred to as "front group last placing unit" and "rear group first placing unit", respectively), it is necessary to electrically connect the lower placing block of the front group last placing unit and the upper placing block of the rear group first placing unit. In some examples, the connecting line between the two is composed of a portion parallel to the length direction of the LED strip and a portion parallel to the width direction of the LED strip.

In still other examples, the electrodes of the flip-chip LED chips 12 in each chip group are oriented in the same direction, but the electrodes of the flip-chip LED chips in adjacent chip groups are oriented in opposite directions. In this case, in order to realize the serial connection of adjacent chip groups, the lower placement block of the front group end placement unit may be directly electrically connected to the lower placement block of the rear group end placement unit, or it is also possible to electrically connect the upper placement block of the front group end placement unit to the upper placement block of the rear group end placement unit. In this case, the connecting lines for connecting two adjacent chip groups may also be arranged parallel to the length direction of the LED strip all the time.

In this embodiment, the connection ends of the connection lines and the placement blocks in the placement unit 20 may be located at one end of the placement blocks away from the corresponding flip LED chip 12, as shown in fig. 6 a. Of course, those skilled in the art will understand that, in some examples, the connection end of the connection line and the placement block in the placement unit 20 may also be located on one side of the placement block parallel to the length direction of the LED strip, instead of on one side of the placement block parallel to the width direction of the LED strip as shown in fig. 6 a. Alternatively, in some examples of this embodiment, the connecting end may be located in the middle of the placement block, as shown in fig. 6 b. Of course, in some examples of the present embodiment, the connecting terminal may be located at one end of the placement block near the corresponding flip-chip LED chip 12, see fig. 6 c.

It should be understood that the components in the LED strip 10 include resistors in addition to the flip-chip LED chips 12, and in some examples of the present embodiment, adjacent chip sets in the LED strip 10 may be connected in series through the resistors. In some examples, the resistor in the LED strip 10 may be disposed on the placement unit 20, and one end of the resistor is electrically connected to the upper placement block 21, and the other end is electrically connected to the lower placement block 22. Among these examples, the placing unit 20 in the LED strip 10 can not only protect the flip-chip LED chip 12 from being bent, but also protect the resistor from being damaged during the bending of the LED strip 10. However, in other examples, considering that the resistor is disposed on the FPC11 by means of a patch, and thus the electrical connection with the wiring layer 112 on the FPC11 is more reliable than that of the flip LED chip 12, in these examples, the resistor may not be protected by the placing unit 20, and thus the resistor is not disposed on the placing unit 20 but disposed between two adjacent placing units 20.

In some examples of this embodiment, the LED strip 10 may be a double-sided LED strip, that is, the circuit layer 112 and the flip-chip LED chip 12 are disposed on both the upper surface and the lower surface of the flexible substrate 111, and in order to avoid collision of the bending limiting regions on both sides, it may be ensured that the placing unit 20 on one side of the flexible substrate 111 matches with the placing unit 20 on the other side in size and in setting position, so that it may be ensured that the bending limiting regions 101 on both sides of the LED strip 10 are completely the same, and the bending guiding regions 102 are also completely the same.

The LED lamp area that this embodiment provided utilizes and places the piece in the circuit layer and is greater than the characteristics of interval connecting wire linewidth at LED lamp area width direction's size, has increased the bending limitation district that sets up flip LED chip and has not set up the regional rigidity difference of the bending guide of flip LED chip through placing the unit. Can guarantee like this that LED lamp area receives external force and when having to take place to buckle, the position of buckling can appear in the guide area of buckling as far as possible, and then can realize the protection to flip-chip LED chip, avoids the problem that flip-chip LED chip became invalid at the in-process that the lamp area buckles, compares in current LED lamp area, and the reliability of the LED lamp that this embodiment provided is higher.

Example two:

the present embodiment will be described with reference to the following examples on the basis of the first embodiment:

the LED strip may be divided into a plurality of bending limiting regions spaced apart from each other along the length direction, the region between two adjacent bending limiting regions is a bending guiding region, and the LED strip may also be divided into at least two regions along the width direction, in some examples of the present embodiment, as shown in fig. 7, the LED strip 70 may be divided into an edge portion and a middle portion 700b along the width direction thereof, in other words, both the bending limiting regions and the bending guiding regions may be divided into the edge portion and the middle portion along the width direction of the LED strip 70. The position of the middle portion 700b in the width direction of the LED strip 70 corresponds to the position of the flip LED chip 72 in the width direction of the LED strip, and the dimension of the middle portion 700b in the width direction of the LED strip is larger than the dimension of the flip LED chip 72 in the width direction of the LED strip. In short, each flip-chip LED chip 72 on the LED strip 70 is located in the middle portion 700b, and in this embodiment, each placement unit in the LED strip 70 and each section connection line of the bending limitation section are also located in the middle portion.

The edge portion may be divided into an upper edge portion 700a and a lower edge portion 700c, and the upper edge portion 700a and the lower edge portion 700c are respectively located on two opposite sides of the middle portion 700 b. Wherein the upper edge portion 700a is closer to the upper placement block and the lower edge portion 700c is closer to the lower placement block. In some examples, the circuit layer further includes a power line in addition to the placement unit and the connection line, wherein the power line is divided into a positive power line and a negative power line, the position of the positive power line corresponds to the position of the upper edge portion 700a, the position of the negative power line corresponds to the position of the lower edge portion 700c, the positive power line is located in the upper edge portion 700a, and the negative power line is located in the lower edge portion 700 c.

Considering that the dimension of the placement block in the middle portion in the width direction of the LED strip 70 is larger than the line width of the section connecting lines, the rigidity of the middle portion of the bending limiting region must be larger than the rigidity of the middle portion of the bending guiding region. Therefore, as long as the rigidity of the edge portion in the bend limiting region and the rigidity of the edge portion in the bend guiding region do not differ much, the rigidity of the bend limiting region must be greater than the rigidity of the bend guiding region as a whole, which is sufficient to ensure a lower probability of occurrence of a bend location in the bend limiting region relative to the bend location in the bend guiding region. Therefore, as long as the line width of the power line in the bending limiting area is not less than the line width of the power line in the bending guide area, the bending position can be made to appear in the bending guide area without the flip LED chip as far as possible. In some examples of the present embodiment, the line width of the power line in the entire LED strip 70 is uniform, and does not differ from the bending limiting region to the bending guiding region. In some other examples of the present embodiment, a line width of a portion of the power line located in the bending limiting region is greater than a line width of a portion located in the bending guiding region; and/or the line width of the part of the negative power line, which is positioned in the bending limiting area, is larger than the line width of the part of the negative power line, which is positioned in the bending guide area.

In order to further increase the rigidity of the bending limiting region 701, in some examples of the present embodiment, a reinforcing member may be further disposed in the LED strip 70, and the reinforcing member is disposed only in the bending limiting region 701 and disposed inside the bending guiding region 702, so that the difference in rigidity between the bending limiting region 701 and the bending guiding region 702 may be further increased by using the reinforcing member. It will be appreciated that a stiffener may be provided in each of the bend limiting regions 701 on the LED strip 70 to protect all of the flip-chip LED chips 72. However, it may be selectively disposed only in a portion of the bending limiting region 701, for example, in some examples of the present embodiment, no reinforcement is disposed in the bending limiting region 701 at the end and the end of the LED strip 70, because the possibility of bending occurring at the end and the end of the LED strip is relatively low. In other examples, the bending limiting region 701 adjacent to the cut mark on the LED strip 70 is not provided with a reinforcing member, because the cut mark is cut indication information provided by a manufacturer of the LED strip to a user, and the mark user can cut the LED strip 70 from the cut position to obtain two sub LED strips, so that the cut position becomes the end of the sub LED strip after cutting, and bending is not easy to occur.

Several configurations of stiffeners are provided below by way of example:

the first method is as follows: a back auxiliary wiring provided on the back surface of the flexible substrate 711 may be used as a reinforcing member, and the back auxiliary wiring may be at least partially electrically connected to the wiring layer 712. Here, the front and back surfaces of the flexible substrate 711 are briefly explained: the flexible substrate 711 employed in the LED strip 70 is typically relatively thin, so the thickness of the flexible substrate 711 is negligible, in which case the flexible substrate 711 includes only upper and lower surfaces. The front surface of the flexible substrate 711 is the surface on which the LED chip 72 is mounted, and the surface opposite to the surface on which the LED chip is mounted is the back surface of the flexible substrate. It should be noted that, in these examples, the back auxiliary lines may not constitute a circuit structure that works independently, but are auxiliary lines or auxiliary circuits on the front line layer of the flexible substrate 711, for example, some back auxiliary lines in this embodiment may be auxiliary power lines, so as to provide current for the line layer on the front side of the flexible substrate 711, and avoid the problem that the power lines on the front side of the flexible substrate 711 cannot carry large current due to being too thin. Through mutually supporting of both sides power cord, can satisfy the demand of each flip-chip LED chip 72 to the electric current in LED lamp area 70 under the circumstances of guaranteeing LED lamp area 70 safety.

The second method comprises the following steps: an insulating substrate provided on the back surface of the flexible substrate 711 may be used as the reinforcing member, and in this case, the provision of the reinforcing member has no electrical influence on the wiring layer 712, the flip LED chip 72, and the like on the front surface of the flexible substrate 711, but the strength and rigidity of the bending-restricting region may be increased because the insulating substrate is located only in the bending-restricting region 701. In some examples of the present embodiment, the insulating substrate may be provided only in a part of the bending limitation region. In another example, an insulating substrate for reinforcement is disposed in each bending limiting region on the back surface of the flexible substrate 711, see fig. 8: the position of the insulating substrate 74 in the width direction of the LED strip 70 is the same as the position of the flip LED chip 72 in the width direction of the LED strip 70, the size of the insulating substrate 74 is slightly larger than the size of the flip LED chip 72, and the area occupied by the insulating substrate 74 on the flexible substrate 711 can completely cover the area occupied by the flip LED chip 72 on the flexible substrate 711.

In both of the above examples, the reinforcing member is provided on the back surface of the flexible substrate 711, but in fact, the reinforcing member may be provided on the front surface of the flexible substrate 711 in addition to the back surface of the flexible substrate 711:

the third method comprises the following steps: the reinforcing member may be a transparent adhesive disposed on the light emitting surface of the flip LED chip 72, and the transparent adhesive has a relatively high rigidity after being cured, so as to enhance the rigidity of the bending limiting region 701. It should be understood that the transparent adhesive layer formed by the transparent adhesive is different from the encapsulating adhesive layer 73, and the encapsulating adhesive layer 73 generally covers the whole area of the front surface of the flexible substrate 711 without difference between the bending limiting region 111 and the bending guiding region 712. In some examples of this embodiment, the transparent adhesive may be a first fluorescent adhesive, and the first fluorescent adhesive covered on different flip LED chips 72 may be different, so as to not only enhance the rigidity of the bending limiting region 701 and protect the flip LED chips 72, but also enable the LED strip 70 to emit at least two lights with different color temperatures.

In addition, the reinforcing member may be disposed on the front surface of the flexible substrate 711 and located under the flip LED chip 72, for example, the reinforcing member is an insulating heat dissipation layer, which not only has better rigidity, but also can conduct heat generated by the flip LED chip 72 in the working process to a region other than the region where the flip LED chip 72 is located due to good heat conduction performance, so as to avoid the problem that the flip LED chip 72 is damaged due to long-time working in a high-temperature environment.

The LED lamp area that this embodiment provided, not only can utilize the circuit layer in the restriction district of buckling to protect flip-chip LED chip, but also can be through extra, only set up the rigidity that further increases the restriction district of buckling at the reinforcement piece in the restriction district of buckling, thereby increase the rigidity difference between restriction district of buckling and the guidance district of buckling, position "guide" to buckling takes place in the guidance district, avoid buckling the position at flip-chip LED chip place, thereby reduce the probability that electric connection became invalid between flip-chip LED chip and the circuit layer, flip-chip LED chip itself became invalid, promote LED lamp area quality, reinforcing LED lamp area user experience.

Example three:

in order to make the advantages and details of the LED strip provided by the present invention clearer for those skilled in the art, the present embodiment will be further described with reference to specific examples, please refer to fig. 9:

the present embodiment provides an LED strip 90, where the LED strip 90 includes an FPC 91, a plurality of flip LED chips 92, and an encapsulant layer 93 covering the flip LED chips 92, and the LED strip 90 further includes a resistor 94.

Please further refer to fig. 10: the FPC 91 includes a flexible substrate 911 and a wiring layer 912 provided on one surface of the flexible substrate 911, the wiring layer 912 includes a positive power line 912a, a negative power line 912b, and a plurality of placement units 912c provided in the length direction of the LED strip 90, the positive power line is located at the upper edge portion of the flexible substrate 911, the negative power line is located at the lower edge portion, and the placement units 912c are located at the middle portion of the flexible substrate 911. Meanwhile, the circuit layer 912 further includes a connection line for connecting two adjacent placing units 912 c. The placing unit 912c is composed of an upper placing block and a lower placing block, the upper placing block and the lower placing block are electrically isolated from each other, and the placing blocks are arranged on the LED strip 90 along the width direction of the LED strip.

In this embodiment, the flip LED chips 92 correspond to the placing units 912c one-to-one, and only one placing unit 912c is disposed in one bending limiting region, so that each bending limiting region only protects one flip LED chip 92. Specifically, the range of the bending limiting region in the length direction of the LED strip 90 is the same as the range occupied by the placing unit 912c in the length direction of the LED strip. Therefore, the connection lines between the placement units 912c in this embodiment only include inter-region connection lines, and do not include intra-region connection lines. In this embodiment, the line width of the positive power line is uniform at each location of the flexible substrate 911, and the line width of the negative power line is also uniform at each location of the flexible substrate 911, so that in order to make the rigidity in the bending limitation region greater than the rigidity in the bending guidance region, it is necessary to ensure that the coverage rate of the circuit layer in the middle portion of the bending limitation region is greater than the coverage rate of the circuit layer in the middle portion of the bending guidance region: as can be clearly seen from fig. 10, the line width of the interval connecting line is much smaller than the dimensions of the upper and lower placing blocks in the width direction of the LED strip.

In this embodiment, each flip LED chip may be divided into a plurality of chip groups, each chip group includes at least two flip LED chips 92, for example, it is assumed that 90 flip LED chips 92 are totally included in the LED strip 90 shown in fig. 10, and the chip groups are divided into 30 chip groups, and each three chip groups constitute a strip cutting unit (a so-called "strip cutting unit" is actually a parallel branch having one end connected to the positive power line 912a and the other end connected to the negative power line 912 b). In the following, one of the strip cutting units X is taken as an example: the lamp strip cutting unit X comprises a chip group a, a chip group b and a chip group c, and each chip group comprises three flip LED chips 92. The chip set a and the chip set b are directly connected in series through a connecting line, and the chip set b and the chip set c are connected in series through a resistor.

It is needless to say that there are 9 placement units corresponding to the tape cutting unit X in total, and the 9 placement units are disposed on the flexible base 911 at intervals from each other along the length direction of the LED tape. The 9 flip LED chips in the lamp strip cutting unit X are disposed on the corresponding placement unit 912c according to the same electrode arrangement direction, for example, the first electrode of each flip LED chip 92 is electrically connected to the upper placement block of the corresponding placement unit 912c, and the second electrode is electrically connected to the lower placement block of the corresponding placement unit 912 c. The upper placing blocks of the three placing units corresponding to the chip set a are connected through interval connecting lines, and meanwhile, the lower placing blocks of the three placing units are also connected through interval connecting lines; the upper placing blocks of the three placing units corresponding to the chip set b are connected through interval connecting lines, and meanwhile, the lower placing blocks of the three placing units are also connected through interval connecting lines; the upper placing blocks of the three placing units corresponding to the chip set c are connected through interval connecting lines, and meanwhile, the lower placing blocks of the three placing units are also connected through interval connecting lines. As can be seen from fig. 10, the interval connection lines connecting the adjacently placed units in the chipset are all arranged parallel to the LED strip 90.

The upper placing blocks of the three placing units corresponding to the chip set a are electrically connected with the positive power line 912a, and the lower placing blocks are electrically connected with the upper placing blocks corresponding to the chip set b; the lower placing block corresponding to the chip set b is electrically connected with the upper placing block corresponding to the chip set c through a resistor 94; the lower placement block of the chip group c is electrically connected to the negative power supply line 912 b. In the LED strip 90 shown in fig. 10, a part of the interval connecting lines for connecting the two chip sets is arranged parallel to the length direction of the LED strip, and the other part is arranged along the width direction of the LED strip.

In this embodiment, the connection end of the interval connection line and the placing block is located at one end of the placing block far away from the corresponding flip-chip LED chip.

The encapsulating adhesive layer 93 covers the flip LED chip 92, and may cover the entire front surface of the FPC 91, or even form a full package for the FPC 91. However, the surface of the encapsulant layer 93 corresponding to the light emitting surface of the flip-chip LED chip 92 should have a certain light transmittance.

The LED lamp area that this embodiment provided can utilize the difference of placing unit and interval connecting line space linewidth to form the restriction district of buckling and the guide region of buckling to make LED lamp area buckle and be difficult for taking place in the region of placing the unit place, thereby protect the flip-chip LED chip that sets up on placing the unit, reduce the influence that LED lamp area is buckled and is brought flip-chip LED chip, maintained LED lamp area performance.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims (10)

1. The LED lamp strip is characterized by comprising an FPC (flexible printed circuit), a plurality of flip LED chips and a packaging adhesive layer covering the light emitting surfaces of the flip LED chips, wherein the FPC comprises a flexible substrate and a circuit layer arranged on the surface of the flexible substrate; the LED lamp strip is divided into a plurality of bending limiting areas along the length direction, and the area between two adjacent bending limiting areas is a bending guide area; the circuit layer comprises placing units arranged in the bending limiting areas along the length direction of the LED lamp strip, and one bending limiting area comprises at least one placing unit; the LED lamp strip comprises a placing unit, an inverted LED chip and a first electrode, wherein the placing unit is composed of an upper placing block and a lower placing block which are arranged along the width direction of the LED lamp strip, the inverted LED chip is positioned on the placing unit, one of the first electrode and the second electrode is electrically connected with the upper placing block of the placing unit, and the other electrode is electrically connected with the lower placing block of the placing unit; the flip LED chips are divided into at least two groups, and the chip groups are connected in series; the number of the flip LED chips in at least one chip group is more than or equal to 2, the first electrodes of all the flip LED chips in the same chip group are electrically connected, the second electrodes of all the flip LED chips in the same chip group are electrically connected, and the electrode arrangement directions of all the flip LED chips in the same chip group are the same; the circuit layer is still including being used for the electricity to connect two connecting wires of placing the unit, the connecting wire is including setting up in the guide area of buckling, be used for two electric connection to buckle the interval connecting wire of placing the unit in the restriction district, the line width size of interval connecting wire is less than go up, down place the piece and be following LED lamp area width direction's size.

2. The LED light strip of claim 1, wherein the placement units are in one-to-one correspondence with the flip-chip LED chips, the top placement blocks corresponding to the same chip set are electrically connected to each other, and the bottom placement blocks corresponding to the same chip set are electrically connected to each other.

3. The LED light strip of claim 1, wherein one placement unit corresponds to a plurality of flip-chip LED chips at the same time.

4. The LED strip of claim 3, wherein each of said chip groups includes a plurality of flip-chip LED chips therein, said placement units corresponding to said chip groups one-to-one.

5. The LED light strip according to claim 1, wherein at least a portion of the connecting wires are arranged parallel to a length direction of the LED light strip; and the connecting wire with place the link of piece in the unit and be located place the piece and keep away from the one end that sets up flip-chip LED chip, or the connecting wire with place the link of piece in the unit and be located place the middle part of piece.

6. The LED strip according to claim 5, wherein the connecting wires between the placement units corresponding to the same chipset are parallel to the length direction of the LED strip.

7. The LED strip according to claim 5, wherein the lower placement block of the previous placement unit is electrically connected to the upper placement block of the next placement unit in two adjacent placement units respectively corresponding to two adjacent chip sets, and the connection line therebetween is composed of a portion parallel to the length direction of the LED strip and a portion parallel to the width direction of the LED strip.

8. The LED strip according to any one of claims 1 to 7, wherein the circuit layer of the LED strip further comprises a power line, and the power line comprises a positive power line and a negative power line which are arranged along the length direction of the LED strip and are respectively located at two sides of the placement unit; the line width of the power line in the bending limiting area is larger than that of the power line in the bending guide area.

9. The LED strip of any of claims 1-7, wherein at least two placement units are disposed in a bend limiting region, the connection line further comprising an intra-region connection line for electrically connecting the two placement units in the bend limiting region, the intra-region connection line having a line width dimension smaller than the dimensions of the upper and lower placement blocks along the width direction of the LED strip.

10. The LED tape according to any one of claims 1-7, further comprising a back trace disposed on a back surface of the flexible substrate, wherein the back surface of the flexible substrate is opposite to the surface on which the trace layer is disposed, and the back trace is only located in the bending limited region and at least a portion of the back trace is electrically connected to the trace layer.

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