CN207421857U - A kind of flexibility filament - Google Patents
A kind of flexibility filament Download PDFInfo
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- CN207421857U CN207421857U CN201721579290.5U CN201721579290U CN207421857U CN 207421857 U CN207421857 U CN 207421857U CN 201721579290 U CN201721579290 U CN 201721579290U CN 207421857 U CN207421857 U CN 207421857U
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- base material
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- chip
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Abstract
The utility model is related to a kind of flexible filaments, including base material, the chipset being mainly made of several chips, conductive component and the filament leg for being arranged at chipset both ends made of transparent material, the chipset is electrically connected by conductive component and is mounted on base material with filament leg, fluorescent glue is coated on the exposed surface of chipset, the base material is integrally formed with fluorescent powder or the base material is integrally formed with conductive powder, fluorescent powder.The base material of the utility model is made of transparent material so that base material has good translucency.Base material is integrally formed with fluorescent powder, the saturating blue light in bottom surface of the contact surface or base material of chip and base material can be avoided, so as to reduce the difficulty of manufacturing process and cost；Base material is integrally formed with conductive powder, fluorescent powder, also so that base material has good thermal conductivity, so as to be conducive to do the power of big flexible filament, and then increases the luminous flux of the utility model.
Description
Technical field
The utility model is related to field of illumination lamp technology, specifically, refer to a kind of flexible filament.
Background technology
As ordinary incandescent lamp progressively exits illumination market, LED type lighting source is capturing rapidly entire illumination city
.For LED type lighting source mostly using light emitting diode as light source, light emitting diode is that one kind can convert electrical energy into can
See the solid state semiconductor devices of light, electric energy directly can be converted into visible ray by it.The core of LED is a light emitting diode
Chip, its one end is cathode, and the other end is the anode for connecting power supply.Flexible filament is used as illumination or ornament lamp, due to
Its moulding is similar to the incandescent lamp being widely present in the market, in the environment of wideling popularize reducing energy consumption in the whole world, in addition its appearance
Moulding meets aesthetic standards and caters to the love knot of missing old times or old friends of people, and is increasingly welcomed by the general public.
Flexible filament currently on the market is mainly made using two kinds of base materials as support assorted packaging technology, a kind of
It is flexible FPC materials or plastic film, includes transparent or semitransparent two kinds；Another kind is flexible metallic material, such as flexible aluminium base
Plate.But existing flexibility filament, due to the limitation of its production technology, causes following very important ask occur in evolution
Topic：
According to FPC materials or the flexible filament of plastic sheeting making, since its base material thermal conductivity factor is low, under normal circumstances
It only less than 0.2, therefore is severely limited on high-power filament is made, since it can not radiate, i.e., cannot lead to chip
Larger electric current is crossed, so that the power of flexible filament cannot be done greatly, luminous flux is relatively low, luminous flux attenuation is serious, main at present
The ornament lamp of less demanding to illuminating light flux is used it for, and is unable to large area substitution illuminator and uses.
In addition, using FPC materials or the flexible filament of plastic sheeting making, the table to base material is needed in process of production
The bottom surface coating fluorescent glue of the contact surface or base material of face and chip and base material, to prevent the blue light that chip is sent due to not leading to
It crosses fluorescent glue and directly projects, so as to cannot get required white light.This production technology for needing coated on both sides fluorescent glue, pole
The production efficiency of flexible filament is affected greatly, and scrap build cost is increased.
According to the flexible filament that flexible metallic material makes, poor in flexibility, stress is larger during bending, easily disconnected
Line causes dead lamp, and the reverse side of flexible metallic material is light tight, and reverse side light source is not fully utilized, and seriously affects and pushes away
Extensively, it is impossible to which large area substitution illuminator uses.If flexible metallic substrate is done to thin, the saturating blue light in bottom surface of base material, equally
Coated on both sides fluorescent glue is needed, adds the difficulty and cost of technique.It is therefore it provides a kind of without in contact of the chip with base material
Face or the flexible filament of the bottom surface of base material coating fluorescent glue, are those skilled in the art's technical problems to be solved.
Utility model content
In view of this, the purpose of the utility model is to overcome the deficiencies in the prior art, a kind of flexible filament is provided, with solution
The problem of certainly existing flexible filament needs to coat fluorescent glue in the bottom surface of the contact surface or base material of chip and base material.
Technical solution is used by the utility model solves its technical problem：
A kind of flexible filament is provided, including base material, the chipset being mainly made of several chips made of transparent material, is led
Electrical component and the filament leg for being arranged at chipset both ends, the chipset are electrically connected with filament leg by conductive component
And on base material, coated with fluorescent glue, the base material and fluorescent powder integrated molding or described on the exposed surface of chipset
Base material is integrally formed with conductive powder, fluorescent powder.
The operation principle of the utility model is：The filament leg at chipset both ends powers on, and chipset shines, due to core
Piece group is installed in filament leg on base material, and base material is made of clear material, therefore base material has good translucency.
In addition, base material is integrally formed with fluorescent powder, the saturating blue light in bottom surface of the contact surface or base material of chip and base material can be avoided, so as to nothing
Fluorescent glue need to be coated in the bottom surface of the contact surface or base material of chip and base material, it is only necessary to be coated on the exposed surface of chipset glimmering
Optical cement.Base material is integrally formed with conductive powder, fluorescent powder, big soft so as to be conducive to do also so that base material has good thermal conductivity
Property filament power, and then increase the utility model luminous flux.
Based on the above technical solutions, the utility model can also do following improvement.
Further, the conductive component includes conducting wire and conductor, passes through conducting wire and conductor string between each chip in chipset
Connection is in parallel, and chipset is connected by conducting wire with the filament leg at both ends, and each chip is just loaded on base material.
Further, the conductor is in ㄣ type structures, and the horizontal segment of conductor is arranged between adjacent chips, the vertical section of conductor
The both sides of chip are arranged at, and the vertical section of conductor one side is connected by conducting wire with the positive or negative pole of chip, and conductor is another
The vertical section of side is connected by conducting wire with the cathode or anode of adjacent chips.
Further, the horizontal segment of the conductor is in I-shaped structure, the vertical section of conductor one side and I-shaped structure it is upper
Horizontal segment is connected, and the vertical section of conductor opposite side is connected with the lower horizontal segment of I-shaped structure.
Further, the filament leg is equipped with extension, and the conducting wire is vertical or oblique pull is in the length direction of base material.
Further, the conductor is the conductor bar being connected on the filament leg of both ends, and each chip passes through in chipset
Conductor in parallel is between two conductor bars.
Further, opened up on the conductor bar jagged.
Further, further include respectively with the integrally formed metal lead wire of both ends filament leg, the metal lead wire is arranged at
The edge of base material.
Further, the material of the base material is plastics, silica gel, rubber or resin, coated on chipset exposed surface
Fluorescent glue semicircular in shape strip or rectangular strip.
Further, the filament leg is equipped with pre- curved mouth, connecting hole, anode identification hole and welding alignment mark hole,
In connecting hole coated with area be more than connecting hole profile and with the fluorescent glue of substrate adhesion.
Compared with prior art, the utility model has the following advantages and advantageous effect：
(1) base material of the utility model is made of transparent material so that base material has good translucency.Base material with it is glimmering
Light powder is integrally formed, and the saturating blue light in bottom surface of the contact surface or base material of chip and base material can be avoided, without in chip and base
The contact surface of material or the bottom surface coating fluorescent glue of base material reduce the difficulty and cost of manufacturing process；Base material and conductive powder, fluorescence
Powder is integrally formed, and also so that base material has good thermal conductivity, so as to be conducive to do the power of big flexible filament, and then increases this
The luminous flux of utility model.
(2) flexible filament of the prior art needs the attaching copper foil on base material first to produce pad, then by upside-down mounting
Can luminescence chip binding agent done with tin cream be adhered to correspondence position, then heat or cross Reflow Soldering by hot plate and melt tin cream, it is cold
But heater chain is formed afterwards.The conductive component of the utility model uses the combination of conducting wire and conductor, and one side conducting wire is convenient for
It is connected with chip, without pad is fabricated separately again, reduces the manufacture cost of flexible filament, enable each chip in chipset
Just loaded on base material；On the other hand, conducting wire contributes to the fast speed heat of flexible filament to be evenly distributed with conductor, is further conducive to do big soft
The power of property filament.
(3) flexible filament is usually due to the use of needing or handsome in appearance and it is bent, the utility model chip
On conducting wire it is vertical or oblique pull is in the length direction of base material, when being bent to flexible filament, conducting wire is not easy to be pulled off, and has
Beneficial to the bending of flexible filament.
(4) the conductor horizontal segment of the utility model is in I-shaped structure, when being bent to flexible filament, I-shaped knot
The middle part weakness of structure can be bent first, so as to which the conducting wire for protecting connection chip is not easy to be pulled off.
(5) the utility model is provided with and the integrally formed metal lead wire of filament leg, on the one hand, since metal lead wire is soft
Good toughness can play base material the supporting role of skeleton, and flexible filament is made to be not easy by curved disconnected；On the other hand, since metal draws
Line helps to radiate, moreover it is possible to the power of flexible filament be promoted to do greatly.
(6) connecting hole on the utility model filament leg can make filament leg is more firm to be connected on base material, just
Pole identification hole quickly identifies the positive terminal of flexible filament convenient for user, and welding alignment mark hole connects other convenient for filament leg
Electric elements.
(7) since flexible filament in secondary operation or continues easily to be bent in production process, the utility model is in lamp
Pre- curved mouth is provided on silk pin, when filament leg needs external other components and bends, due to the presence of pre- curved mouth, meeting
It is bent first in pre- bent port part, so as to which the chipset conducting wire on the inside of filament leg be protected to be not easy stress by curved disconnected, extension
The service life of the utility model.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the cut-away view of the utility model；
Fig. 2 is a kind of embodiment figure of each chip-in series in chipset；
Fig. 3 is the another embodiment figure of each chip-in series in chipset；
Fig. 4 is the embodiment figure of each chip parallel connection in chipset；
Fig. 5 is the structure diagram of the utility model base material；
In figure, 1-base material；2-chip；21-conducting wire；22-conductor；23-metal lead wire；24-conductor bar；25-lack
Mouthful；3-fluorescent glue；4-filament leg；5-pre- curved mouth；6-extension；7-connecting hole；8-anode identification hole；9-welding
Alignment mark hole.
Specific embodiment
It, below will be to the technology of the utility model to make the purpose of this utility model, technical solution and advantage clearer
Scheme is described in detail.Obviously, the described embodiments are only a part of the embodiments of the utility model rather than comprehensive
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not before creative work is made
Obtained all other embodiment is put, belongs to the scope that the utility model is protected.
Embodiment 1：
A kind of flexibility filament, as shown in Figures 1 to 5, including base material 1, chipset, conductive component and filament leg 4, base
Material 1 and fluorescent powder are integrally formed or base material 1 is integrally formed with conductive powder, fluorescent powder, chipset by it is several can luminescence chip
2 compositions, conductive component include conducting wire 21 and conductor 22.Wherein, conducting wire 21 can be alloy wire, silver wire or copper wire etc., excellent here
Select gold thread；22 preferred copper foil of conductor, can also be gold-plated or silver-plated on copper foil.Filament leg 4 is arranged at chipset both ends, chipset
It is electrically connected and is mounted on base material 1 by conductive component with filament leg 4, fluorescence is coated on the exposed surface of chipset
Glue 3, different from flexible filament made of existing flexible aluminum substrate or FPC, the 3 semicircular in shape strip of fluorescent glue of the utility model or
Rectangular strip.
As shown in Figure 1, Figure 2 with shown in Fig. 5, conductor 22 is in ㄣ type structures, and the horizontal segment of conductor 22 is arranged between adjacent chips 2
Middle separated time on, the vertical section of 22 horizontal segment both sides of conductor is arranged at the both sides of chip 2.As shown in Fig. 2, the anode of chip 2 or
A conducting wire 21 is connected between the vertical section of 22 one side of cathode and conductor, the cathode or anode and conductor 22 of adjacent chips 2 are another
Another conducting wire 21 is connected between the vertical section of side, makes to connect with conductor 22 by conducting wire 21 between adjacent chips 2.Two conducting wires
21 can be oblique pull in the length direction of base material 1 or perpendicular to the length direction of base material 1, due to the flexible filament of bending
When, conducting wire 21 is minimum perpendicular to the length direction stress of base material 1, therefore preferably conducting wire 21 makes perpendicular to the length direction of base material 1
In bending process, conducting wire 21 is not easy to be pulled off flexible filament.The so Xun Huan connection of chip 2, conducting wire 21 and conductor 22, finally
Form flexible heater chain.It can also be installed according to illumination needs in the region that is enclosed with vertical section of horizontal segment of conductor 22
Multiple chips 2.
In addition, in order to ensure convenient connecting wire 21 between the chip 2 of two ends of chipset and filament leg 4,
Extension 6 is provided on filament leg 4, extension 6 is from filament leg 4 to the extension of chipset inside and parallel to the length of base material 1
Spend direction.
The base material 1 of the utility model is made of transparent material so that base material 1 has good translucency.Base material 1 with it is glimmering
Light powder is integrally formed, and the saturating blue light in bottom surface of the contact surface or base material 1 of chip 2 and base material 1 can be avoided, without in chip 2
Fluorescent glue 3 is coated with the contact surface of base material 1 or the bottom surface of base material 1, it is only necessary to coat fluorescent glue on the exposed surface of chipset
3, reduce the difficulty and cost of manufacturing process.Base material 1 is integrally formed with conductive powder, fluorescent powder, additionally aids enhancing flexible light
The thermal conductivity of silk so as to be conducive to do the power of big flexible filament, can be used as headlamp.Conductive component is used and led
The combination of line 21 and conductor 22 on the one hand convenient for the connection with chip 2, without pad is fabricated separately again, reduces flexibility
The manufacture cost of filament enables each chip 2 in chipset just loaded on base material；On the other hand, conducting wire 21 has with conductor 22
The fast speed heat for helping flexible filament is evenly distributed with, so as to be conducive to do the power of big flexible filament.
Embodiment 2：
As preference, for the utility model is better achieved, further optimize on the basis of above-described embodiment, especially
Using following setting structures：
As shown in figure 3, as another embodiment, the horizontal segment of above-mentioned ㄣ types conductor 22 can be made into I-shaped knot
Structure, the vertical section of 22 one side of conductor are connected with the upper horizontal segment of I-shaped structure, the vertical section and I-shaped of 22 opposite side of conductor
The lower horizontal segment of type structure is connected.When being bent to flexible filament, the middle part weakness of I-shaped structure can be bent first,
So as to which the conducting wire 21 for further protecting connection chip 2 is not easy to be pulled off.When the spacing between adjacent two chip 2 is larger, work
The middle part of font structure can also play certain supporting role, so as to ensure that the globality of flexible filamentray structure, and work as phase
When spacing between adjacent two chips 2 is larger, can also according to illumination needs, the upper horizontal segment of conductor 22, lower horizontal segment and
Multiple chips 2 are installed in the region that vertical section is enclosed.
Embodiment 3：
As preference, for the utility model is better achieved, the present embodiment can also use following setting structures：
As shown in figure 4, conductor 22 is arranged to the conductor bar being connected on both ends filament leg 4 24, in chipset
Between each chip 2 is parallel to two conductor bars 24 by conducting wire 21, parallel way can install more chips 2, so as to more added with
Beneficial to the needs for meeting user's illumination, and conducting wire 21 appoints right vertical or oblique pull in the length direction of base material 1, to ensure flexible light
Conducting wire 21 is not easy to be pulled off during silk bending.In addition, jagged 25 are opened up on conductor bar 24, and when flexible filament is bent, conductor
Due to weak at notch 25, meeting bend item 24 here first, and then conducting wire 21 is also protected to be not easy to be pulled off.
Embodiment 4：
As preference, for the utility model is better achieved, further optimize on the basis of above-described embodiment, especially
Using following setting structures：
As shown in Figures 1 to 4, in order to play the supporting role of skeleton to base material 1, the utility model is made in bending process
It is not easily broken and there is certain intensity, draw on filament leg 4 integrally formed with metal lead wire 23,23 preferred copper of metal lead wire
Line, metal lead wire 23 are arranged at the both sides of conductor 22, and positioned at the edge of base material 1.The setting of metal lead wire 23 additionally aids soft
Property filament integral heat sink, so as to contribute to doing for flexible filament wattage big, being widely used in it will to headlamp luminous flux
Seek high lamps and lanterns.
Embodiment 5：
As preference, for the utility model is better achieved, further optimize on the basis of above-described embodiment, especially
Using following setting structures：
As shown in Figures 1 to 4, filament leg 4 is equipped with connecting hole 7, anode identification hole 8 and welding alignment mark hole 9,
It is more than 7 profile of connecting hole and the fluorescent glue 3 adhered to base material 1 coated with area in connecting hole 7, enables fluorescent glue 3 as rivet
Equally it is connected to what filament leg 4 consolidated on base material 1；Anode identification hole 8 is quickly identifying flexible filament just convenient for user
Extremely, weld alignment mark hole 9 and connect other electric elements convenient for filament leg 4.In order to avoid the core of 4 inside of filament leg
Piece group is broken by curved, and pre- curved mouth 5 is additionally provided on filament leg 4, and when being bent to filament leg 4, pre- curved mouth 5 can be curved first
It is bent.
Embodiment 6：
As preference, for the utility model is better achieved, further optimize on the basis of above-described embodiment, especially
Using following setting structures：
The material of above-mentioned base material 1 is the transparent materials such as plastics, silica gel, rubber or resin, plastics, silica gel, rubber or resin
Good flexibility and translucency are respectively provided with, and plastics, silica gel, rubber or resin can be with conductive powder and/or fluorescent powders
It is integrally formed.
Embodiment 7：
As preference, for the utility model is better achieved, further optimize on the basis of above-described embodiment, especially
Using following setting structures：
The length of base material 1 is more than 20 millimeters, and width is 0.5~5 millimeter, and thickness is 0.025~0.5 millimeter, so as to
Make the quantity of chip 2 on base material 1 for 15~400, to meet the needs of illumination.
The above is only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, in the technical scope that any one skilled in the art discloses in the utility model, variation can be readily occurred in
Or replace, it should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model should be with the power
Subject to the protection domain of profit requirement.
Claims (10)
1. a kind of flexibility filament, it is characterised in that：Including base material made of transparent material (1), mainly it is made of several chips (2)
Chipset, conductive component and the filament leg (4) for being arranged at chipset both ends, the chipset and filament leg (4) are logical
It crosses conductive component to be electrically connected and install on a substrate (1), coated with fluorescent glue (3), the base on the exposed surface of chipset
Material (1) is integrally formed with fluorescent powder or the base material (1) is integrally formed with conductive powder, fluorescent powder.
2. flexibility filament according to claim 1, it is characterised in that：The conductive component includes conducting wire (21) and conductor
(22), conducting wire (21) are passed through by conducting wire (21) and conductor (22) serial or parallel connection, chipset between each chip (2) in chipset
It is connected with the filament leg (4) at both ends, each chip (2) is just loaded on base material (1).
3. flexibility filament according to claim 2, it is characterised in that：The conductor (22) is in ㄣ type structures, conductor (22)
Horizontal segment be arranged between adjacent chips (2), the vertical section of conductor (22) is arranged at the both sides of chip (2), and conductor
(22) vertical section of one side is connected by conducting wire (21) with the positive or negative pole of chip (2), the vertical section of conductor (22) opposite side
It is connected by conducting wire (21) with the cathode or anode of adjacent chips (2).
4. flexibility filament according to claim 3, it is characterised in that：The horizontal segment of the conductor (22) is in I-shaped knot
Structure, the vertical section of conductor (22) one side are connected with the upper horizontal segment of I-shaped structure, the vertical section of conductor (22) opposite side with
The lower horizontal segment of I-shaped structure is connected.
5. flexibility filament according to claim 4, it is characterised in that：The filament leg (4) is equipped with extension (6), institute
State that conducting wire (21) is vertical or oblique pull is in the length direction of base material (1).
6. flexibility filament according to claim 2, it is characterised in that：The conductor (22) is to be connected to both ends filament
Conductor bar (24) on pin (4), each chip (2) is parallel to by conducting wire (21) between two conductor bars (24) in chipset.
7. flexibility filament according to claim 6, it is characterised in that：It is opened up jagged (25) on the conductor bar (24).
8. flexibility filament according to any one of claims 1 to 7, it is characterised in that：It further includes and draws respectively with both ends filament
Foot (4) integrally formed metal lead wire (23), the metal lead wire (23) are arranged at the edge of base material (1).
9. flexibility filament according to any one of claims 1 to 7, it is characterised in that：The material of the base material (1) is modeling
Material, silica gel, rubber or resin, coated on fluorescent glue (3) the semicircular in shape strip or rectangular strip on chipset exposed surface.
10. flexibility filament according to any one of claims 1 to 7, it is characterised in that：The filament leg (4) is equipped with
Pre- curved mouth (5), connecting hole (7), anode identification hole (8) and welding alignment mark hole (9), connecting hole (7) is interior to be coated with area
The fluorescent glue (3) adhered to more than connecting hole (7) profile and with base material (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721579290.5U CN207421857U (en) | 2017-11-22 | 2017-11-22 | A kind of flexibility filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721579290.5U CN207421857U (en) | 2017-11-22 | 2017-11-22 | A kind of flexibility filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207421857U true CN207421857U (en) | 2018-05-29 |
Family
ID=62304349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721579290.5U Active CN207421857U (en) | 2017-11-22 | 2017-11-22 | A kind of flexibility filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207421857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244066A (en) * | 2018-10-12 | 2019-01-18 | 深圳市欣上科技有限公司 | Without substrate filament framework, without substrate flexibility filament, light source and manufacturing method without substrate filament framework |
-
2017
- 2017-11-22 CN CN201721579290.5U patent/CN207421857U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244066A (en) * | 2018-10-12 | 2019-01-18 | 深圳市欣上科技有限公司 | Without substrate filament framework, without substrate flexibility filament, light source and manufacturing method without substrate filament framework |
| CN109244066B (en) * | 2018-10-12 | 2024-06-25 | 深圳市欣上科技有限公司 | Non-base filament structure, non-base flexible filament, light source and manufacturing method of non-base filament structure |
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