CN203690340U - WFCOB light source - Google Patents
WFCOB light source Download PDFInfo
- Publication number
- CN203690340U CN203690340U CN201420022863.4U CN201420022863U CN203690340U CN 203690340 U CN203690340 U CN 203690340U CN 201420022863 U CN201420022863 U CN 201420022863U CN 203690340 U CN203690340 U CN 203690340U
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- CN
- China
- Prior art keywords
- light source
- wfcob
- groove
- metal substrate
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a WFCOB light source which is a COB light source composed of a (W) groove and a (FR) fluorine rubber pipe for short. The WFCOB light source is characterized in that N grooves are formed along a y coordinate axis of a metal base board through punching to form multiple groove bowl cups, and two ends of each groove are provided with electrode boards and are sleeved in technical structures, e.g., insulation rubber pipes. The injection moulding technology, the aluminum/copper substrate bonding technology, the substrate silvering technology and the box dam technology are not required by the support, a plenty of disadvantages in the technologies above are completely settled, compared with an integrated light source or an aluminum substrate COB light source, the WFCOB light source has a simple structure, cost of the support decreases by 80%, phosphor and packaging glue decrease about 70%, the WFCOB light source has properties of high temperature resistance and high efficiency and greatly reduces making cost.
Description
Technical field:
The utility model relates to a kind of LED light source, relates in particular to a kind of COB integrated optical source, definitely says a kind of COB light source that adopts groove (W) and fluorine sebific duct (FR) framework to manufacture, and is called for short WFCOB light source.
Background technology:
LED encapsulation technology is the middle tie of upstream chip and downstream light fixture, the quality of LED light source and price depend on encapsulation framework greatly, that is the selecting to play and take over from the past and set a new course for the future of the design of package support and relevant auxiliary materials, lead the effect of the overall situation, the strong numerous designers of industry are making great efforts to seek to utilize package support to solve the heat radiation of LED, light efficiency, life-span, this problem of cost, so market has occurred multifarious, package support in different poses and with different expressions, a feast for the eyes from straight cutting-mono--SMD-COB, emerge in an endless stream, the fast-developing market demand of the hysteresis of LED package support research at present, also do not have a kind of by acknowledged standard frame both at home and abroad, COB integrated optical source is because it is in heat radiation, luminous intensity distribution, the light sources such as single of cost geometric ratio and SMD have a clear superiority in, industry generally believes it is the inexorable trend of future development, the basic fundamental of COB light source requires: the one, establish box dam structure, blocking fluorescence epoxy glue does not make it excessive, the 2nd, chip electrode is connected to extraneous driving power with stent electrode by routing and connect, all support Designs all will be around observing these two basic demands, at present widely popular integrated light source bracket and aluminium (copper) substrate COB support all has certain shortcoming: adopt plastic injection-moulded integrated light source bracket because plastics PPA can flavescence efflorescence under high temperature and ultraviolet ray are irradiated, cause ventilative water inlet, failure rate is very high, do circuit connection and adopt aluminium or copper base COB support all will rely on PCB, adopt FR4 fiber process for pressing to form, its interlayer contains insulating cement, this not only increases light source thermal resistance, and be difficult for routing and welding, hot operation meeting is stuck up skin and is come off, and very poor this of this substrate surface reflecting effect is to affect luminous intensity, the main cause that system light efficiency is not high.
Utility model content:
The purpose of this utility model aim to provide a kind of simple in structure, be easy to produce, low cost of manufacture, and can realize the high light efficiency of LED, low light attenuation, high temperature resistant, long-life to overcome the deficiency that has now technology.
The technical scheme that the utility model adopts is for achieving the above object:
A kind of WFCOB light source, comprise metal substrate, it is characterized in that: described metal substrate has N groove along the punching of y reference axis, form multiple groove bowl cups, in bowl cup, be provided with N LED chip by the viscose glue sealing of heating, be provided with battery lead plate and put insulation rubber tube at described groove two ends, metal substrate is established crimping by its parcel insulation, and the electrode of LED chip is guided to the positive and negative two ends of battery lead plate after connecting by gold thread become parallel circuits and draw with external power and be connected from four jiaos of metal substrates.
Described metal substrate punching has N groove bowl cup, groove hypotenuse is degree oblique angle, 60-± 10, bottom land width 1-5MM, groove depth 0.5-0.8mm, is coated in fluorescent material epoxy glue in groove bowl cup and by LED chip and gold thread and covers, the sealing by heating, material is copper or the aluminium sheet of high heat conduction, preferred high reflective mirror aluminium sheet here, and thickness is at 0.3-3mm, its shape is square, circular, strip or wherein any one shape of polygon, and periphery is established installing hole.
Described insulation rubber tube material is silicon or fluorine sebific duct, preferred resistant to elevated temperatures Teflon pipe here, and wall thickness 0.1-0.5mm, internal diameter 1-5mm, in the middle of it, at respective grooves bowl cup position, punching has electrode routing gap, and the electrode of LED chip and battery lead plate complete bonding in gap.
Described battery lead plate is wide for the thick 0.1-0.5mm copper coin of 1-5mm or flat type copper wire, and surface is through silver-plated processing.
Brief description of the drawings:
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Fig. 1 is a kind of WFCOB light source of the utility model planar structure schematic diagram.
Fig. 2 is the left cutaway view of a kind of WFCOB light source of the utility model.
Fig. 3 is the right cutaway view of a kind of WFCOB light source of the utility model.
Fig. 4 is a kind of WFCOB light source of the utility model schematic diagram of mutually connecting.
Fig. 5 is a kind of WFCOB light source of the utility model schematic diagram parallel with one another.
Fig. 6 is that a kind of WFCOB light source of the present invention is equipped with rectangular flexible glue lens schematic diagram.
Wherein: metal substrate 1, LED chip 2, elargol 3, insulation rubber tube 4, battery lead plate 5, metal wire 6, fluorescent material epoxy glue 7, flexible glue lens 8.
Embodiment:
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is described further, be to be understood that embodiment described below, only for explaining the utility model, does not limit the utility model.
Embodiment 1: see accompanying drawing 1-3,
A kind of WFCOB light source, comprise metal substrate 1, it is characterized in that: described metal substrate 1 has N groove along the punching of y reference axis, form multiple groove bowl cups, in bowl cup, be provided with N LED chip 2 by viscose glue 3 sealing of heating, be provided with battery lead plate 5 and put insulation rubber tube 4 at described groove two ends, metal substrate 1 is established crimping by its parcel insulation, the electrode of LED chip 2 is guided to the positive and negative two ends of battery lead plate 5 after by gold thread 6 series connection to be become parallel circuits and draws with external power and be connected from 1 four jiaos of metal substrates, finally at groove bowl cup mid point fluorescent glue 7, LED chip 2 is wrapped up to heating cure.
Described metal substrate 1 material is copper or the aluminium sheet of high heat conduction, periphery is established installing hole, here the preferred high minute surface aluminium sheet of reflecting rate, reflecting rate is up to more than 98%, not only improve light extraction efficiency, many drawbacks such as expensive, the easy sulfuration of also thoroughly having exempted that metal-plated silver process brings, minute surface aluminium thickness is at 0.3-3mm, and its shape is square, circular, strip or wherein any one shape of polygon.
Described metal substrate 1 punching has N groove, groove hypotenuse to be degree oblique angle, 60-± 10, is reflexed light ring shape, can improve LED light efficiency 5-10% because high reflectance reflexed light ring has optically focused.
Adopt the minute surface aluminium sheet of high reflecting rate, not only thoroughly get rid of and moulded integrated light source bracket due to plastics PPA meeting flavescence efflorescence under high temperature and ultraviolet ray irradiation, cause ventilative water inlet and lost efficacy, also got rid of the dependence of aluminium (copper) substrate COB to FR4 fiber process for pressing, thoroughly solved aluminium base and be difficult for routing welding, a skin spillout technique difficult problem is stuck up in hot operation meeting.
Described metal substrate 1 punching has N groove bowl cup, the dark 0.5-0.8mm of cup, and preferred 0.6mm, than the conventional dark reduction of integrated optical source cup approximately 60%, can save fluorescent material and packaging plastic cost greatly here.
Described battery lead plate 5 is placed in glass bottom side fluorine sebific duct 6 and is entangled with its plate 1 of metal and insulate, and its material is the thick 0.1-0.5mm copper coin of wide 1-5mm or flat type copper wire, and through electroplating processes.
Described insulation rubber tube 4 materials are silicon or fluorine, preferred Teflon sebific duct here, and its heatproof, more than 200 degree, guarantees that light source long term high temperature can be not aging, improved the heat resistance of light source.
Described fluorescent material mixing silica gel 7 is after the silica gel of high transmission rate, high refractive index is mixed by a certain percentage with fluorescent material, to be filled into base to pull in bowl cup, and LED chip 2 and gold thread 6 are covered, and solidifies by high-temperature baking.
Embodiment 2: see accompanying drawing 3
The present embodiment is a kind of rectangular series mould set spread pattern on embodiment 1 basis, in Fig. 3 figure and Fig. 4, multiple light source positive and negative electrode head and the tail is connected in series, and can form the platoon module of different capacity, different voltages, as LED day-light lamp, wall lamp etc.
Embodiment 3: see accompanying drawing 4:
The present embodiment is another kind of rectangular module spread pattern in parallel on embodiment 2 bases, in Fig. 4 by multiple light source positive and negative electrodes mutually and connect, can form the platoon module of different capacity, can realize more powerful composite module, be mainly used in high-power illumination occasion, as high-power ceiling light, flood light etc.
Embodiment 4: see accompanying drawing 7:
The present embodiment is on embodiment 1 basis, to have increased by group leader's bar flexible glue lens 8, described flexible glue lens 8 are by a kind of high transmission rate, the two group of high index of refraction silica gel injects the moulding of heating of strip groove mould, be cut into Len req, be close to cementation with fluorescent material mixing silica gel 7, because flexible glue lens 8 have optically focused and anaclasis effect, because flexible glue lens 8 have optically focused and anaclasis effect, , not only improve luminous efficiency of source, also got rid of fluorescent glue hybrid technique, thoroughly break away from and joined powder, stir evenly, vacuumize, encapsulating, point glue, the loaded down with trivial details manufacture technologies such as test, greatly reduce cost of labor, this will be to change technological revolution of encapsulation general layout undoubtedly.
A kind of WFCOB light source of the utility model obvious advantage compared with existing COB integrated optical source is:
1. employing metal-integral structure, has got rid of integrated optical source Shooting Technique, has thoroughly solved PPA and has irradiated lower meeting flavescence, efflorescence, breathes freely and cause product failure because of high temperature and ultraviolet ray, has improved the heatproof characteristic of light source.
2. adopt high-temperature resistant insulating material hard-pressed bale battery lead plate technology, having got rid of COB light source relies on aluminium (copper) substrate process for pressing, thoroughly solve the high thermal resistance of aluminium (copper) substrate, be difficult for routing and many drawbacks such as skin comes off are stuck up in welding, hot operation, improved the heatproof characteristic of light source.
3. adopt high reflective mirror aluminium, got rid of substrate silver plating process, the drawbacks such as expensive, the easy sulfuration that has thoroughly overcome that silver plating process brings.
4. adopt glue post lens, not only improved luminous efficiency of source, also got rid of fluorescent glue hybrid technique, thoroughly break away from and joined powder, stir evenly, vacuumize, the loaded down with trivial details manufacture technologies such as encapsulating, some glue, test, greatly reduce cost of labor, and this will be to change technological revolution of encapsulation general layout undoubtedly.
5. adopt trench technique, not only reduce the consumption of 60% fluorescent glue, also improved 10% light efficiency simultaneously
6. adopt platoon structure technology, can conveniently intercept the different length width of support and change the combination of row's example, be conducive to realize system modular, power is changed arbitrarily.
7. compared with integrated optical source or aluminium base COB light source, simple in structure, support cost approximately 80%, fluorescent material and packaging plastic have also reduced approximately 70%.Significantly reduce manufacturing cost.
Based on above-mentioned characteristics of principle, the embodiment of a kind of WFCOB light source of the utility model is only preferred embodiment, practical application can also extend to more CONSTRUCTED SPECIFICATION and broader applications example, all any amendments within the utility model claim practical range, be equal to or replace and all should fall into claim scope of the present utility model within.
Claims (5)
1. a WFCOB light source, comprise metal substrate (1), it is characterized in that: described metal substrate (1) has N groove along the punching of y reference axis, form multiple groove bowl cups, in bowl cup, be provided with N LEDs chip (2) by viscose glue (3) sealing of heating, be provided with battery lead plate (5) at described groove two ends and put insulation rubber tube (4), metal substrate (1) is established crimping by its parcel insulation, the electrode of LED chip (2) becomes parallel circuits and draws and external power connects from (1) four jiao of metal substrate by guiding to the positive and negative two ends of battery lead plate (5) after gold thread (6) series connection, finally at groove bowl cup mid point fluorescent glue (7), LED chip (2) is wrapped up to heating cure.
2. a kind of WFCOB light source according to claim 1 is characterized in that: described metal substrate (1) punching has N groove bowl cup, groove hypotenuse is 60 ± 10 degree oblique angles, bottom land width 1-5MM, groove depth 0.5-0.8mm, fluorescent material epoxy glue (7) is coated in groove bowl cup and by LED chip (2) and gold thread (6) and is covered, the sealing by heating.
3. a kind of WFCOB light source according to claim 1 and 2 is characterized in that described metallic plate (1), periphery is established installing hole, material is copper or the aluminium sheet of high heat conduction, here preferred high reflective mirror aluminium sheet, thickness is at 0.3-3mm, and its shape is square, circular, strip or wherein any one shape of polygon.
4. a kind of WFCOB light source according to claim 1 is characterized in that: described insulation rubber tube (4) material is silicon or fluorine sebific duct, here preferred resistant to elevated temperatures Teflon pipe, wall thickness 0.1-0.5mm, internal diameter 1-5mm, in the middle of it, at respective grooves bowl cup position, punching has electrode routing gap, and the electrode of LED chip (2) and battery lead plate (5) complete bonding in gap.
5. it is characterized in that according to a kind of WFCOB light source described in claim 1 or 4: described battery lead plate (5) is wide for the thick 0.1-0.5mm copper coin of 1-5mm or flat type copper wire, and surface is through silver-plated processing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420022863.4U CN203690340U (en) | 2013-05-28 | 2014-01-06 | WFCOB light source |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN201320296453.4 | 2013-05-28 | ||
CN201320296453 | 2013-05-28 | ||
CN201420022863.4U CN203690340U (en) | 2013-05-28 | 2014-01-06 | WFCOB light source |
Publications (1)
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CN203690340U true CN203690340U (en) | 2014-07-02 |
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CN201420022863.4U Expired - Fee Related CN203690340U (en) | 2013-05-28 | 2014-01-06 | WFCOB light source |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电(厦门)有限公司 | LED integrated module |
CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明(厦门)有限公司 | Surface attaching type holder and multi-chip photoelectric device |
-
2014
- 2014-01-06 CN CN201420022863.4U patent/CN203690340U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电(厦门)有限公司 | LED integrated module |
CN104659186B (en) * | 2015-02-12 | 2017-06-20 | 矽照光电(厦门)有限公司 | A kind of LED integration modules |
CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明(厦门)有限公司 | Surface attaching type holder and multi-chip photoelectric device |
CN108538997B (en) * | 2018-03-29 | 2020-05-05 | 开发晶照明(厦门)有限公司 | Surface mount type support and multi-chip photoelectric device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20160106 |