CN104218138A - WFCOB (trench and fluororubber chip-on-board) light source - Google Patents
WFCOB (trench and fluororubber chip-on-board) light source Download PDFInfo
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- CN104218138A CN104218138A CN201410019771.5A CN201410019771A CN104218138A CN 104218138 A CN104218138 A CN 104218138A CN 201410019771 A CN201410019771 A CN 201410019771A CN 104218138 A CN104218138 A CN 104218138A
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- light source
- wfcob
- groove
- metal substrate
- bowl cup
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- 229920001973 fluoroelastomer Polymers 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 16
- 239000004411 aluminium Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 229920006335 epoxy glue Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920000297 Rayon Polymers 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006253 efflorescence Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 206010037844 rash Diseases 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010237 hybrid technique Methods 0.000 description 2
- 238000004643 material aging Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A WFCOB (trench and fluororubber chip-on-board) light source is a COB light source made with trenches W and FR pipes. The WFCOB light source is characterized in that N trenches are made in a metal substrate along a coordinate axis y by stamping, a plurality of trench cups are formed, electrodes are arranged at two ends of each trench and sleeved with insulating rubber pipes, and other technical structures are provided. The substrate is made with no need for injection molding, an aluminum (copper) substrate bonding process is not required, a substrate slivering process is not required, a glue damming process is not required, the defects of the processes above are thoroughly solved; compared with the integrated light source or aluminum substrate COB light source, the WFCOB light source is simpler in structure, the cost is decreased by about 80%, and fluorescent powder and packaging glue are decreased by about 70%; the COB light source is resistant to high temperature and high in luminous efficiency, and manufacture cost is greatly decreased.
Description
Technical field:
The present invention relates to a kind of LED light source, particularly relate to a kind of COB integrated optical source, be Specifically a kind of COB light source adopting groove (W) and fluorine sebific duct (FR) framework to manufacture, be called for short WFCOB light source.
Background technology:
LED technology is the middle tie of upstream chip and downstream light fixture, the quality of LED light source and price depend on encapsulation framework greatly, that is the selecting to play and take over from the past and set a new course for the future of the design of package support and relevant auxiliary materials, lead the effect of the overall situation, the strong numerous designers of industry are making great efforts to seek to utilize package support to solve the heat radiation of LED, light efficiency, life-span, this problem of cost, so market occurs multifarious, package support in different poses and with different expressions, a feast for the eyes from straight cutting-mono--SMD-COB, emerge in an endless stream, the market demand of delayed fast development studied by current LED support, also do not have a kind of by acknowledged standard frame both at home and abroad, COB integrated optical source is because it is in heat radiation, luminous intensity distribution, the light sources such as cost geometric ratio single and SMD have a clear superiority in, industry generally believes it is the inexorable trend of future development, the main technique requirements of COB light source is: one is to establish box dam structure, blocking fluorescence epoxy glue does not make it excessive, two is chip electrode will be connected to extraneous driving power with stent electrode by routing to connect, all support Designs all will around observing these two basic demands, at present widely popular integrated light source bracket and aluminium (copper) substrate COB support all have certain shortcoming: adopt plastics injection moulding integrated light source bracket to turn yellow under high temperature and Ultraviolet radiation efflorescence due to plastics PPA, cause ventilative water inlet, failure rate is very high, and adopt aluminium or copper base COB support all to rely on PCB do circuit connect, FR4 fiber process for pressing is adopted to form, its interlayer contains insulating cement, this not only increases light source thermal resistance, and not easily routing and welding, hot operation can be stuck up skin and be come off, and very poor this of this substrate surface reflecting effect affects luminous intensity, the main cause that system light efficiency is not high.
Summary of the invention:
Object of the present invention aim to provide a kind of structure simple, be easy to produce, low cost of manufacture, and LED specular removal, low light attenuation, high temperature resistant, long-life can be realized to overcome the deficiency having now technology.
The technical solution adopted in the present invention is for achieving the above object:
A kind of WFCOB light source, comprise metal substrate, it is characterized in that: described metal substrate has N number of groove along the punching of y reference axis, form multiple groove bowl cup, in bowl cup, be provided with N LED chip to be heated sealing by viscose glue, be provided with battery lead plate at described groove two ends and insulation rubber tube on cover, metal substrate is established crimping wrap up and is insulated, and the electrode of LED chip guides to the positive and negative two ends of battery lead plate after being connected by gold thread become parallel circuits and be connected with external power from the extraction of metal substrate corner.
Described metal substrate punching has N number of groove bowl cup, groove hypotenuse is degree oblique angles, 60-± 10, slot bottom width 1-5MM, groove depth 0.5-0.8mm, to be coated in fluorescent material epoxy glue in groove bowl cup and LED chip and gold thread to be covered, the sealing by heating, material is copper or the aluminium sheet of high heat conduction, here preferred high reflective mirror aluminium sheet, and thickness is at 0.3-3mm, its shape is square, circular, strip or polygon wherein any one shape, and periphery establishes installing hole.
Described insulation rubber tube material is silicon or fluorine sebific duct, here preferred resistant to elevated temperatures Teflon pipe, wall thickness 0.1-0.5mm, internal diameter 1-5mm, and in the middle of it, in respective grooves bowl cup portion position, punching has electrode routing gap, and electrode and the battery lead plate of LED chip complete bonding in gap.
Described battery lead plate is wide is the thick O.1-0.5mm copper coin of 1-5mm or flat type copper wire, and surface is through silver-plated process.
Accompanying drawing illustrates:
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Fig. 1 is a kind of WFCOB source plane of the present invention structural representation.
Fig. 2 is the left cutaway view of a kind of WFCOB light source of the present invention.
Fig. 3 is the right cutaway view of a kind of WFCOB light source of the present invention.
Fig. 4 is that a kind of WFCOB light source of the present invention is connected schematic diagram mutually.
Fig. 5 is a kind of WFCOB light source of the present invention schematic diagram parallel with one another.
Fig. 6 is that a kind of WFCOB light source of the present invention is equipped with rectangular flexible glue lens schematic diagram.
Wherein: metal substrate 1, LED chip 2, elargol 3, insulation rubber tube 4, battery lead plate 5, metal wire 6, fluorescent material epoxy glue 7, flexible glue lens 8.
Embodiment:
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention will be further described, being to be understood that embodiment described below only for explaining the present invention, not limiting the present invention.
Embodiment 1: see accompanying drawing 1-3,
A kind of WFCOB light source, comprise metal substrate 1, it is characterized in that: described metal substrate 1 has N number of groove along the punching of y reference axis, form multiple groove bowl cup, in bowl cup, be provided with N LED chip 2 to be heated sealing by viscose glue 3, insulation rubber tube 4 on described groove two ends are provided with battery lead plate 5 and overlap, metal substrate 1 is established crimping to be wrapped up and is insulated, the electrode of LED chip 2 guides to the positive and negative two ends of battery lead plate 5 after being connected by gold thread 6 become parallel circuits and be connected with external power from metal substrate 1 four jiaos extraction, finally at groove bowl cup mid point fluorescent glue 7, LED chip 2 is wrapped up heating cure.
Described metal substrate 1 material is copper or the aluminium sheet of high heat conduction, periphery establishes installing hole, here the minute surface aluminium sheet that preferably reflecting rate is high, reflecting rate is up to more than 98%, not only increase light extraction efficiency, also thoroughly eliminate many drawbacks such as high cost, the easily sulfuration that metal-plated silver process brings, minute surface aluminium thickness is at 0.3-3mm, and its shape is square, circular, strip or polygon wherein any one shape.
Described metal substrate 1 punching has N number of groove, and groove hypotenuse is degree oblique angles, 60-± 10, in reflexed light ring shape, because high reflectance reflexed light ring has optically focused can improve LED light effect 5-10%.
Adopt the minute surface aluminium sheet of high reflecting rate, not only thoroughly get rid of and moulded integrated light source bracket due to plastics PPA and to turn yellow under high temperature and Ultraviolet radiation efflorescence, cause ventilative water inlet and lost efficacy, also aluminium (copper) substrate COB has been got rid of to the dependence of FR4 fiber process for pressing, thoroughly solve aluminium base not easily routing welding, hot operation can stick up a skin spillout technique difficult problem.
Described metal substrate 1 punching has N number of groove bowl cup, the dark 0.5-0.8mm of cup, here preferred 0.6mm, and reduction about 60% darker in the integrated optical source cup of routine, can save fluorescent material and packaging plastic cost greatly.
Described battery lead plate 5 is placed in a glass bottom side fluorine sebific duct 6 and is entangled and insulate with its plate 1 of metal, and its material is the thick 0.1-0.5mm copper coin of wide 1-5mm or flat type copper wire, and through electroplating processes.
Described insulation rubber tube 4 material is silicon or fluorine, here preferred Teflon sebific duct, and its heatproof, more than 200 degree, is guaranteed that light source long term high temperature can not be aging, improve the heat resistance of light source.
Described fluorescent material mixing silica gel 7 is filled into base after being mixed by a certain percentage with fluorescent material by the silica gel of high transmission rate, high refractive index to pull in bowl cup, LED chip 2 and gold thread 6 covered, solidified by high-temperature baking.
Embodiment 2: see accompanying drawing 3
The present embodiment is a kind of rectangular series mould set spread pattern on embodiment 1 basis, is connected in series by multiple light source positive and negative electrode head and the tail, can forms the platoon module of different capacity, different voltage, as LED fluorescent tube lamp, wall lamp etc. in Fig. 3 figure and Fig. 4.
Embodiment 3: see accompanying drawing 4:
The present embodiment is another kind of rectangular modular arrangements form in parallel on embodiment 2 basis, in the diagram by multiple light source positive and negative electrode mutually and connect, the platoon module of different capacity can be formed, more powerful composite module can be realized, be mainly used in high-power illumination occasion, as high-power ceiling light, flood light etc.
Embodiment 4:
The present embodiment is on embodiment 1 basis, add group leader's bar flexible glue lens 8, described flexible glue lens 8 are by a kind of high transmission rate, high index of refraction two group silica gel injects strip groove mould and heats shaping, be cut into Len req, cementation is close to fluorescent material mixing silica gel 7, because flexible glue lens 8 have optically focused and anaclasis effect, , not only increase luminous efficiency of source, also fluorescent glue hybrid technique has been got rid of, thoroughly break away from and joined powder, stir evenly, vacuumize, encapsulating, point glue, the loaded down with trivial details manufacture technologies such as test, greatly reduce cost of labor, this will be change the technological revolution of encapsulation general layout undoubtedly.
A kind of WFCOB light source of the present invention obvious advantage compared with existing COB integrated optical source is:
1. adopt metal-integral structure, got rid of integrated optical source Shooting Technique, thoroughly solve PPA because turning yellow under high temperature and Ultraviolet radiation, efflorescence, ventilative and cause product failure, improve the temperature-resistance characteristic of light source.
2. adopt high-temperature resistant insulating material hard-pressed bale battery lead plate technology, get rid of COB light source to rely on aluminium (copper) substrate process for pressing, thoroughly solve aluminium (copper) substrate high thermal resistance, not easily routing and welding, hot operation and stick up many drawbacks such as skin comes off, improve the temperature-resistance characteristic of light source.
3. adopt high reflective mirror aluminium, got rid of substrate silver plating process, thoroughly overcome the drawback such as high cost, easy sulfuration that silver plating process brings.
4. adopt glue post lens, not only increase luminous efficiency of source, also got rid of fluorescent glue hybrid technique, thoroughly break away from and joined powder, stir evenly, vacuumize, encapsulating, loaded down with trivial details manufacture technology such as some glue, test etc., greatly reduce cost of labor, and this will be change the technological revolution of encapsulation general layout undoubtedly.
5. adopt trench technique, not only reduce the consumption of 60% fluorescent glue, also improve 10% light efficiency simultaneously.
6. adopt platoon structure technology, conveniently can intercept the different length width of support and change the combination of row's example, be conducive to realizing system modular, power is changed arbitrarily.
7., compared with integrated optical source or aluminium base COB light source, structure is simple, and support cost reduces about 80%, and fluorescent material and packaging plastic also reduce about 70%.Significantly reduce manufacturing cost.
Based on above-mentioned characteristics of principle, the embodiment of a kind of WFCOB light source of the present invention is only preferred embodiment, practical application can also extend to more CONSTRUCTED SPECIFICATION and broader applications example, all any amendments within the claims in the present invention practical range, equivalent or replace and all should fall within right of the present invention.
Claims (5)
1. a WFCOB light source, comprise metal substrate (1), it is characterized in that: described metal substrate (1) has N number of groove along the punching of y reference axis, form multiple groove bowl cup, in bowl cup, be provided with N LEDs chip (2) to be heated sealing by viscose glue (3), be provided with battery lead plate (5) at described groove two ends and put insulation rubber tube (4), metal substrate (1) is established crimping to be wrapped up and insulate, the electrode of LED chip (2) becomes parallel circuits and to draw from metal substrate (1) corner by guiding to battery lead plate (5) positive and negative two ends after gold thread (6) series connection and connect with external power, finally at groove bowl cup mid point fluorescent glue (7), LED chip (2) is wrapped up heating cure.
2. a kind of WFCOB light source according to claim 1 is characterized in that: described metal substrate (1) punching has N number of groove bowl cup, groove hypotenuse is 60 ± 10 degree of oblique angles, slot bottom width 1-5MM, groove depth 0.5-0.8mm, fluorescent material epoxy glue (7) to be coated in groove bowl cup and LED chip (2) and gold thread (6) to be covered, the sealing by heating.
3. a kind of WFCOB light source according to claim 1 and 2 is characterized in that described metallic plate (1), periphery establishes installing hole, material is copper or the aluminium sheet of high heat conduction, here preferred high reflective mirror aluminium sheet, thickness is at 0.3-3mm, and its shape is square, circular, strip or polygon wherein any one shape.
4. a kind of WFCOB light source according to claim 1 is characterized in that: described insulation rubber tube (4) material is silicon or fluorine sebific duct, here preferred resistant to elevated temperatures Teflon pipe, wall thickness 0.1-0.5mm, internal diameter 1-5mm, in the middle of it, in respective grooves bowl cup portion position, punching has electrode routing gap, and electrode and the battery lead plate (5) of LED chip (2) complete bonding in gap.
5. a kind of WFCOB light source according to claim 1 or 4 is characterized in that: described battery lead plate (5) is wide is the thick 0.1-0.5mm copper coin of 1-5mm or flat type copper wire, and surface is through silver-plated process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410019771.5A CN104218138A (en) | 2013-06-04 | 2014-01-06 | WFCOB (trench and fluororubber chip-on-board) light source |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310216220.3 | 2013-06-04 | ||
| CN201310216220 | 2013-06-04 | ||
| CN201410019771.5A CN104218138A (en) | 2013-06-04 | 2014-01-06 | WFCOB (trench and fluororubber chip-on-board) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104218138A true CN104218138A (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410019771.5A Pending CN104218138A (en) | 2013-06-04 | 2014-01-06 | WFCOB (trench and fluororubber chip-on-board) light source |
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| Country | Link |
|---|---|
| CN (1) | CN104218138A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016127524A1 (en) * | 2015-02-11 | 2016-08-18 | 深圳市西德利集团有限公司 | Led illuminating device and led lamp |
| CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明（厦门）有限公司 | Surface attaching type holder and multi-chip photoelectric device |
| CN109899709A (en) * | 2017-12-11 | 2019-06-18 | 广州爱宇森照明科技有限公司 | A kind of wall lamp |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
-
2014
- 2014-01-06 CN CN201410019771.5A patent/CN104218138A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016127524A1 (en) * | 2015-02-11 | 2016-08-18 | 深圳市西德利集团有限公司 | Led illuminating device and led lamp |
| CN109899709A (en) * | 2017-12-11 | 2019-06-18 | 广州爱宇森照明科技有限公司 | A kind of wall lamp |
| CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明（厦门）有限公司 | Surface attaching type holder and multi-chip photoelectric device |
| CN108538997B (en) * | 2018-03-29 | 2020-05-05 | 开发晶照明（厦门）有限公司 | Surface mount type support and multi-chip photoelectric device |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
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Application publication date: 20141217 |