WO2016127524A1

WO2016127524A1 - Led illuminating device and led lamp

Info

Publication number: WO2016127524A1
Application number: PCT/CN2015/080161
Authority: WO
Inventors: 杨亚西
Original assignee: 深圳市西德利集团有限公司
Priority date: 2015-02-11
Filing date: 2015-05-29
Publication date: 2016-08-18
Also published as: CN104676376B; CN104676376A

Abstract

An LED illuminating device (100) comprises: a base (10), made of a metal radiating material; a mirror surface aluminum plate (50), laminated on and attached to the base (10) in a cold pressing manner, wherein at least one area of the surface of the mirror surface aluminum plate (50) is a die bonding area; multiple naked LED chips (40), directly bonded to a die bonding area of the mirror surface aluminum plate (50) by binder; a circuit board (30), mounted on the base (10), wherein the LED chips (40) and the circuit board (30) form electrical connections in a wire bonding manner; and a packaging gel (20), at least forming potting coverage to the die bonding area. Also disclosed is an LED illuminating lamp (200) using the LED illuminating device (100). According to the LED illuminating device (100) and the LED lamp (200), the transmission path of heat emitted from an LED is greatly reduced compared with that of a surface-mount packaging structure and that of a COB packaging structure, the radiating effect is good, and the reliability and the service life of the LED are greatly improved.

Description

LED lighting device and LED lamp

Technical field

The present invention relates to the field of LED lighting technology. In particular, the present invention relates to an illumination device formed of an LED chip which can be used as a component for manufacturing an LED lamp. The present invention also relates to such an LED lamp.

Background technique

For the use of LED lighting fixtures, a large number of LED components need to be integrated on one module to achieve the required illumination, but the photoelectric conversion efficiency of the LED is not high, and most of the electrical energy is finally converted into thermal energy. Heat is one of the biggest threats to LEDs. It not only affects the electrical performance of LEDs, but may eventually lead to LED failure. When the temperature of LEDs rises, the LED's luminous intensity will decrease, the main wavelength of the light will shift, the life will be seriously reduced, and the light will be accelerated. decline). Therefore, how to keep LEDs for a long time and continuous reliable work is the biggest technical problem of LED packaging or application.

Summary of the invention

The technical problem to be solved by the present invention is to provide an LED lighting device and an LED lamp, and the LED lighting device and the LED lamp have the characteristics of good heat dissipation effect.

The technical solution adopted by the present invention to solve the technical problem thereof is: an LED lighting device comprising: a base made of a metal heat dissipating material; and a mirror aluminum plate which is press-bonded to the base by cold pressing At least one surface of the surface is a solid crystal region; a plurality of bare LED chips are directly attached to the solid crystal region of the mirror aluminum plate by an adhesive; a circuit board mounted on the base, and the LED The chip and the circuit board are electrically connected by wire bonding; and an encapsulant that forms a potting cover on at least the solid crystal region.

As a modification of the above technical solution, the mirror aluminum plate is cold pressed into a recess formed in the susceptor.

As a further improvement of the above technical solution, the periphery of the dimple has a covering body formed by extrusion covering the edge of the mirror aluminum plate.

As a further improvement of the above technical solution, the lighting device further includes a plug or socket drawn from the circuit board.

As a further improvement of the above technical solution, the base is further provided with a mounting structure for fixing the reflective cup or the lens.

The present invention also provides an LED lamp using the above LED lighting device.

The present invention also provides an LED lamp comprising a lamp housing made of a heat dissipating material and the LED lighting device described above, the LED lighting device being adhered to the lamp housing through its base and passing through a fixed structure and The lamp housing is fixed.

As a modification of the above technical solution, the fixing structure comprises a fixing ring and a card hole on the lamp housing, the fixing ring has a claw corresponding to the card hole, and the fixing ring is buckled on the LED lighting device The claw passes through the corresponding card hole, and the LED lighting device can be locked and fixed on the lamp housing by rotating the fixing ring, and the fixing ring is rotated in the opposite direction, so that the LED lighting device can be Remove from the lamp housing.

As a further improvement of the above technical solution, the card hole comprises a first hole and a second hole communicating therewith and relatively narrow, the claw comprising an extension extending along a circumference of the fixing ring and perpendicular to the extension a bent section that can be inserted into and through the first aperture, the extension being slidable within the second aperture.

As a further improvement of the above technical solution, the back surface of the light source base extends with a plurality of heat dissipation fins, and the access hole of the lamp housing is provided with an access hole corresponding thereto.

In the LED lighting device and the LED lamp of the invention, the heat transfer path of the LED is greatly reduced compared with the chip package structure and the COB package structure, the heat dissipation effect is good, and the reliability and life of the LED can be greatly improved.

DRAWINGS

The invention will now be further described with reference to the drawings and embodiments.

1 is a schematic structural view of a LED chip package structure in the prior art;

2 is a schematic structural view of a COB package structure of an LED in the prior art;

3 is a schematic view showing the overall structure of an illumination device according to an embodiment of the present invention;

Figure 4 is an exploded perspective view of the lighting device of Figure 3;

Figure 5 is a schematic view showing the relationship between the base of the illumination device of Figure 3 and the mirror aluminum plate;

6 is a schematic diagram showing the relationship between a pedestal and a mirror aluminum plate of another embodiment of the illumination device;

7 is a schematic structural view of an LED lamp according to an embodiment of the present invention;

Figure 8 is an exploded perspective view of the LED lamp of the embodiment of Figure 7;

Figure 9 is a schematic view of the operation of the LED lamp of Figure 7.

detailed description

The concept, the specific structure and the technical effects of the present invention will be clearly and completely described in conjunction with the embodiments and the accompanying drawings in order to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.

It should be noted that, unless otherwise stated, when a feature is called “fixed”, “connected”, “set”, “installed” on another feature, it can be directly fixed, connected, set or installed in another One feature can also be indirectly fixed and connected to another feature. Further, the descriptions of the upper, lower, left, right, and the like used in the present invention are merely relative to the mutual positional relationship of the respective components of the present invention in the drawings. Moreover, "a" or "an" in the present invention means one or more, and "multiple" or "multiple" in the present invention means two or more.

Moreover, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art, unless otherwise defined. The terminology used in the description herein is for the purpose of description

It is well known to those skilled in the art that for a light-emitting diode composed of a PN junction, when a forward current flows from the PN junction, the PN junction has a heat loss. For a power LED, the drive current is generally several hundred milliamperes or more, PN. The current density of the junction is very large, so the temperature rise of the PN junction is more pronounced. As the junction temperature of the chip increases, the brightness of the LED will no longer continue to increase proportionally with the current, indicating thermal saturation, and the efficiency of the chip's luminous efficiency will also decrease, and the brightness of the LED will decrease. Therefore, the heating problem of the LED not only affects the life of the LED device, but also affects the brightness of the light. Those skilled in the art have long made various improvements from various aspects such as LED materials, fabrication processes, package structures, etc. Good solution to this technical problem.

In general, the heating problem of LED can be solved from two aspects: one is to improve the internal quantum efficiency during the internal period of the LED, thereby reducing the conversion of electric energy to thermal energy, and actively reducing the heat; the second is to improve the LED from the peripheral design of the LED. The lighting device and the heat dissipation capability of the luminaire reduce the adverse effects of heat on the LED.

However, for technical reasons, the current common approach to solving this problem is to improve the heat dissipation capability through LED lighting device design and LED luminaire design. To improve the heat dissipation capability of LED lighting devices, it is necessary to optimize the LED package structure, and to reduce the thermal resistance by performing a reliable thermal design, so that the heat generated by the PN junction can be dissipated as quickly as possible. To improve the heat dissipation capability of LED lamps, it is necessary to add auxiliary cooling devices (mainly heat sinks) to transfer the heat generated by the LED lighting devices to the cooling device to dissipate the heat.

In terms of LED package structure, SMD package (Surface Mounted) is widely used at present. Devices) and COB packages (chip on board).

First, referring to FIG. 1, an SMD package structure is shown, which includes a bracket 10, a heat sink 20, an LED chip 40 bonded to the heat sink 20 by an adhesive 30, and is taken out from the LED chip 40. Two pins 50, potting compound 60 and lens 70. When the package structure is applied in a luminaire, high-temperature reflow soldering is required on the aluminum substrate, and the aluminum substrate is further connected to the heat sink. The heat transfer path generated by the LED chip is: LED chip-adhesive-heat sink- Aluminum substrate insulation layer - aluminum substrate substrate - heat sink - the outside world.

Referring again to FIG. 2, a COB package structure is illustrated. The package structure includes an aluminum substrate 10, an insulating layer 20 attached to the substrate 10, a circuit layer 30, and a potting region surrounded by the wall glue 40. The LED chips 50 are adhered to the substrate inside the potting region 60 by an adhesive, and the LED chips 50 are bonded to the wiring layer of the substrate surface layer by the bonding wires 70 to achieve electrical connection. When the package structure is applied in the luminaire, the substrate is further connected to the heat sink, and the heat transfer path generated by the LED chip is: LED chip-adhesive-aluminum substrate insulating layer-aluminum substrate substrate-heat sink-outside.

For these two types of package structures, there are many links of heat conduction, and although there is no obvious gap between the two interfaces that are in contact with each other, the actual surface between the interfaces is actually due to the unevenness of the surface of the material. There are still small gaps that are not conducive to diffusion, thus greatly increasing the overall thermal resistance.

In view of this, the present invention provides an LED illumination device 100 of an embodiment. Referring to FIG. 3, FIG. 3 is a schematic overall structural view of the illumination device 100. As can be seen from the figure, the device has a metal heat dissipation material. The susceptor 10 further has an encapsulant 20 for sealing and insulating the components of the LED chip, the circuit board and the like which will be described below.

Referring to FIG. 4, which is an exploded perspective view of the illumination device 100 of FIG. 3, it can be seen that the illumination device 100 of the present embodiment further has a circuit board 30 and a plurality of bare LED chips 40. The circuit board 30 is mounted to the susceptor 10, and the LED chips 40 are directly adhered to the die-bonding area of the mirror-aluminum plate (not shown in FIG. 4) to be described below by means of an adhesive, the LED chips 40 and the circuit board 30. Electrical connections are made by wire bonding. In the present embodiment, the encapsulant 20 covers the entire solid crystal region and the wiring board 30 by potting, and it is also possible if the encapsulant 20 covers only the solid crystal region.

Referring to FIG. 5, a cross-sectional view of the pedestal 10 of the illumination device 100 of the present embodiment is laminated with a mirrored aluminum plate 50. It can be seen that when the mirror aluminum plate 50 is pressed against the susceptor 10, the upper surface thereof is exposed. Outside, at least one region on the upper surface is a solid crystal region for fixing the LED chip 40 mentioned above. Preferably, after the mirror aluminum plate 50 is pressed into the base 10, the top plane thereof is flush with the upper surface of the base 10, that is, at the same level.

Although the LED chip can be directly attached to the susceptor 10 made of a heat dissipating material, however, since the surface of the susceptor 10 is rough, this may seriously affect the light-emitting efficiency of the illuminating device, and therefore, the mirror aluminum plate 50 is used as a bearing LED chip. The carrier can effectively increase the luminous flux of the illumination device. As the mirror aluminum plate 50, in the present embodiment, it is pressed into the susceptor 10 by cold pressing, which makes the bonding between the mirror aluminum plate 50 and the susceptor 10 as a heat sink very close. There is no gap in the interface, which facilitates the rapid diffusion of heat.

Referring to Figure 6, in another preferred embodiment, the mirrored aluminum plate 50 is cold pressed into a recess formed by cold pressing on the base 10. The pit may be pre-preformed or may be formed simultaneously by press-fitting the mirror aluminum plate 50 by cold pressing. At the periphery of the pit, there is a covering body 11 formed by pressing covering the edge of the mirror aluminum plate 50. By the action of the covering body 11, the mirror aluminum plate 50 can be firmly fixed to the base 10 to be more tightly coupled with the base 10 and also prevented from falling off.

Figure 3 As shown in FIG. 4, in the present embodiment, the susceptor 10 itself is a heat sink, preferably a pure aluminum pedestal, and the heat generated by the LED chip is radiated to the outside through the susceptor. Moreover, a plurality of heat dissipation fins 12 are preferably extended at the bottom of the base 10 to increase the surface area and improve the heat dissipation capability.

Further, on the susceptor 10, a mounting structure 13 for fixing a reflecting cup or a lens is also formed to facilitate further application of the lighting device of the present embodiment.

Referring to FIG. 4, in order to facilitate the user's use of the illumination device, especially for ordinary non-professionals, the illumination device of the present embodiment preferably further includes a plug or socket 60 drawn from the circuit board, correspondingly if The corresponding socket or plug is provided on the device using this device, which can be easily installed and replaced to solve the problem of assembly and maintenance of the LED lighting device.

In the illumination device 100 provided by the embodiment, the heat transfer path of the LED is: LED chip-adhesive-mirror-plate aluminum-base-outside, and the heat transfer link is greatly reduced compared with the chip package structure and the COB package structure. There is also no interface thermal resistance, and the base itself, which is an integral part of the illumination device, can function to dissipate heat to the external space, so that the heat dissipation capability of the illumination device is greatly improved compared to the aforementioned package structure. When the lighting device is used, there is no need to add a heat sink, and it is convenient in assembly and use.

The illumination device 100 can be used directly as a lighting fixture, which can also be applied indirectly to various LED fixtures.

For example, it may be mounted in a luminaire having a lamp housing made of a heat dissipating material, and the LED lighting device of the present embodiment is attached to the lamp housing through its pedestal and passed through a fixed structure The lamp housing is fixed so that the heat of the pedestal can be transmitted to the lamp housing, and the lamp housing can be used for heat dissipation. The LED lighting device can be fixed to the lamp housing by a conventional fixing structure such as a screw.

Referring to Figure 7, an LED lighting fixture 200 of one embodiment of the present invention is applied to the aforementioned lighting device 100 to form a lighting fixture. As shown in the figure, the lighting fixture 200 includes a lamp housing 210 of the luminaire (only a part of the lamp housing is shown for ease of understanding), a fixing ring 220, and an illumination device fixed to the lamp housing 210 by the fixing ring (in the figure) Not shown), the base of the lighting device is in close contact with the lamp housing so that heat can be transferred to the lamp housing 210.

Referring to Fig. 8, an exploded perspective view of the lighting fixture 200 shown in Fig. 7, wherein the lamp housing 210 is made of a heat dissipating material, and therefore, it can function to dissipate the heat it loads into the surrounding space.

The lamp housing 210 has a plurality of card holes uniformly distributed on a circumference, and each of the card holes specifically includes a first hole 2101 and a second hole 2102 communicating with the second hole 2102 so as to be a whole. L shape. The fixing ring 220 and the hole on the lamp housing 210 form a fixed structure.

On the fixing ring 220, there is a corresponding claw corresponding to the hole, the claw specifically includes an extending portion 2201 extending along the circumference of the fixing ring 220 and a bending portion 2202 perpendicular to the extending portion, and the bending portion 2202 can be The first hole 2101 that passes through the card hole of the lamp housing 210 is inserted, but cannot pass through the second hole 2102, and the extension portion 2201 can slide in the second hole 2102 in the circumferential direction.

9, the lighting device 100 can be mounted to the lamp housing 210 by placing the lighting device 100 at a corresponding position of the lamp housing 210, and then fastening the lighting device 100 with the fixing ring 220 such that the fixing ring 220 The upper claw corresponds to the position of the hole on the lamp housing 210. At this time, the fixing ring 220 is pressed, so that the bent portion 2202 of the claw is inserted through the first hole 2101, and then the buckle 220 is rotated, thereby causing the claw The extension portion 2201 slides in the second hole 2102 in the circumferential direction, at which time the illumination device 100 is locked on the lamp housing 210. If the lighting device 100 needs to be removed, the fixing ring 220 can be reversely rotated, which is very simple and easy to grasp and operate for non-professionals.

As shown in FIG. 8 , a rear surface of the base of the illumination device 100 extends with a plurality of heat dissipation fins 12 , and the access hole of the lamp housing is provided with an access hole 2103 corresponding thereto when the illumination device 100 is locked. These heat sink fins 12 will pass through these access holes 2103 when they are on the lamp housing 210.

Of course, for the lighting device 100, when it has a socket or a plug, in general, the matching plug or socket is disposed in the lamp housing of the LED lamp, and therefore, at this time, on the lamp housing. Set the hole through which the plug or socket passes.

When the illumination device 100 is locked on the lamp housing 210, its base is in close contact with the lamp housing, thereby transferring its heat to the lamp housing 210, and dissipating heat by the lamp housing 210. For the lamp, the surface area of the lamp housing 210 It is usually very large and can effectively dissipate the heat from the LEDs to the surrounding space. In the prior art, the heat sink connected to the LED lighting device is often placed in a closed environment inside the lamp, and the heat dissipation effect is difficult to ensure compared with the lamp of the present invention.

The above is a detailed description of the preferred embodiments of the present invention, but the present invention is not limited to the embodiments, and various equivalent modifications or substitutions can be made by those skilled in the art without departing from the spirit of the invention. Such equivalent modifications or alternatives are intended to be included within the scope of the claims.

Claims

An LED lighting device, comprising:

a pedestal made of a metal heat sink material;

a mirrored aluminum plate attached to the susceptor by cold pressing, and at least one region of the surface thereof is a solid crystal region;

a plurality of bare LED chips directly attached to the solid crystal region of the mirror aluminum plate by an adhesive;

a circuit board mounted on the base, and the LED chip and the circuit board are electrically connected by wire bonding;

An encapsulant that forms a potting cover on at least the die-bonding region.
The LED lighting device of claim 1 wherein said mirrored aluminum plate is cold pressed into a recess formed in the base.
The LED lighting device according to claim 2, wherein the periphery of the dimple has a covering body formed by pressing to cover an edge of the mirror aluminum plate.
The LED lighting device according to any one of claims 1 to 3, characterized in that the lighting device further comprises a plug or socket which is led out from the wiring board.
The LED lighting device according to any one of claims 1 to 3, characterized in that the base is further provided with a mounting structure for fixing a reflecting cup or a lens.
An LED luminaire characterized by comprising the LED lighting device of any of claims 1-5.
An LED lamp characterized by comprising a lamp housing made of a heat dissipating material, and further comprising the LED lighting device according to any one of claims 1 to 5, wherein the LED lighting device is in close contact with the base thereof The lamp housing is fixed to the lamp housing by a fixing structure.
The LED lamp according to claim 7, wherein the fixing structure comprises a fixing ring and a card hole on the lamp housing, the fixing ring has a claw corresponding to the card hole, and the fixing ring is buckled After the LED illumination device is mounted, the claw passes through a corresponding card hole, and the LED illumination device can be locked and fixed on the lamp housing by rotating the fixing ring, and the fixing ring is rotated in the opposite direction. The LED lighting device can then be removed from the lamp housing.
The LED lamp of claim 8 wherein said card aperture includes a first aperture and a second aperture that is in communication therethrough and that is relatively narrow, said jaw includes an extension extending along a circumference of the retention ring and a bent section perpendicular to the extension, the bent section being insertable and passing through the first hole, the extension being slidable within the second hole.
The LED lamp according to any one of claims 7 to 9, wherein a plurality of heat dissipating fins are arranged on a back surface of the light source base, and a corresponding connection is arranged on the accessing position of the lamp housing. Into the hole.