WO2016127524A1 - Dispositif d'éclairage à del et lampe à del - Google Patents

Dispositif d'éclairage à del et lampe à del Download PDF

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Publication number
WO2016127524A1
WO2016127524A1 PCT/CN2015/080161 CN2015080161W WO2016127524A1 WO 2016127524 A1 WO2016127524 A1 WO 2016127524A1 CN 2015080161 W CN2015080161 W CN 2015080161W WO 2016127524 A1 WO2016127524 A1 WO 2016127524A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
lighting device
lamp housing
lamp
base
Prior art date
Application number
PCT/CN2015/080161
Other languages
English (en)
Chinese (zh)
Inventor
杨亚西
Original Assignee
深圳市西德利集团有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市西德利集团有限公司 filed Critical 深圳市西德利集团有限公司
Publication of WO2016127524A1 publication Critical patent/WO2016127524A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the present invention relates to the field of LED lighting technology.
  • the present invention relates to an illumination device formed of an LED chip which can be used as a component for manufacturing an LED lamp.
  • the present invention also relates to such an LED lamp.
  • LED lighting fixtures For the use of LED lighting fixtures, a large number of LED components need to be integrated on one module to achieve the required illumination, but the photoelectric conversion efficiency of the LED is not high, and most of the electrical energy is finally converted into thermal energy. Heat is one of the biggest threats to LEDs. It not only affects the electrical performance of LEDs, but may eventually lead to LED failure. When the temperature of LEDs rises, the LED's luminous intensity will decrease, the main wavelength of the light will shift, the life will be seriously reduced, and the light will be accelerated. decline). Therefore, how to keep LEDs for a long time and continuous reliable work is the biggest technical problem of LED packaging or application.
  • the technical problem to be solved by the present invention is to provide an LED lighting device and an LED lamp, and the LED lighting device and the LED lamp have the characteristics of good heat dissipation effect.
  • an LED lighting device comprising: a base made of a metal heat dissipating material; and a mirror aluminum plate which is press-bonded to the base by cold pressing At least one surface of the surface is a solid crystal region; a plurality of bare LED chips are directly attached to the solid crystal region of the mirror aluminum plate by an adhesive; a circuit board mounted on the base, and the LED The chip and the circuit board are electrically connected by wire bonding; and an encapsulant that forms a potting cover on at least the solid crystal region.
  • the mirror aluminum plate is cold pressed into a recess formed in the susceptor.
  • the periphery of the dimple has a covering body formed by extrusion covering the edge of the mirror aluminum plate.
  • the lighting device further includes a plug or socket drawn from the circuit board.
  • the base is further provided with a mounting structure for fixing the reflective cup or the lens.
  • the present invention also provides an LED lamp using the above LED lighting device.
  • the present invention also provides an LED lamp comprising a lamp housing made of a heat dissipating material and the LED lighting device described above, the LED lighting device being adhered to the lamp housing through its base and passing through a fixed structure and The lamp housing is fixed.
  • the fixing structure comprises a fixing ring and a card hole on the lamp housing, the fixing ring has a claw corresponding to the card hole, and the fixing ring is buckled on the LED lighting device The claw passes through the corresponding card hole, and the LED lighting device can be locked and fixed on the lamp housing by rotating the fixing ring, and the fixing ring is rotated in the opposite direction, so that the LED lighting device can be Remove from the lamp housing.
  • the card hole comprises a first hole and a second hole communicating therewith and relatively narrow, the claw comprising an extension extending along a circumference of the fixing ring and perpendicular to the extension a bent section that can be inserted into and through the first aperture, the extension being slidable within the second aperture.
  • the back surface of the light source base extends with a plurality of heat dissipation fins, and the access hole of the lamp housing is provided with an access hole corresponding thereto.
  • the heat transfer path of the LED is greatly reduced compared with the chip package structure and the COB package structure, the heat dissipation effect is good, and the reliability and life of the LED can be greatly improved.
  • FIG. 1 is a schematic structural view of a LED chip package structure in the prior art
  • FIG. 2 is a schematic structural view of a COB package structure of an LED in the prior art
  • FIG. 3 is a schematic view showing the overall structure of an illumination device according to an embodiment of the present invention.
  • Figure 4 is an exploded perspective view of the lighting device of Figure 3;
  • Figure 5 is a schematic view showing the relationship between the base of the illumination device of Figure 3 and the mirror aluminum plate;
  • FIG. 6 is a schematic diagram showing the relationship between a pedestal and a mirror aluminum plate of another embodiment of the illumination device
  • FIG. 7 is a schematic structural view of an LED lamp according to an embodiment of the present invention.
  • Figure 8 is an exploded perspective view of the LED lamp of the embodiment of Figure 7;
  • Figure 9 is a schematic view of the operation of the LED lamp of Figure 7.
  • the PN junction has a heat loss.
  • the drive current is generally several hundred milliamperes or more, PN.
  • the current density of the junction is very large, so the temperature rise of the PN junction is more pronounced.
  • the heating problem of the LED not only affects the life of the LED device, but also affects the brightness of the light.
  • the heating problem of LED can be solved from two aspects: one is to improve the internal quantum efficiency during the internal period of the LED, thereby reducing the conversion of electric energy to thermal energy, and actively reducing the heat; the second is to improve the LED from the peripheral design of the LED.
  • the lighting device and the heat dissipation capability of the luminaire reduce the adverse effects of heat on the LED.
  • the current common approach to solving this problem is to improve the heat dissipation capability through LED lighting device design and LED luminaire design.
  • To improve the heat dissipation capability of LED lighting devices it is necessary to optimize the LED package structure, and to reduce the thermal resistance by performing a reliable thermal design, so that the heat generated by the PN junction can be dissipated as quickly as possible.
  • To improve the heat dissipation capability of LED lamps it is necessary to add auxiliary cooling devices (mainly heat sinks) to transfer the heat generated by the LED lighting devices to the cooling device to dissipate the heat.
  • LED package structure SMD package (Surface Mounted) is widely used at present. Devices) and COB packages (chip on board).
  • an SMD package structure which includes a bracket 10, a heat sink 20, an LED chip 40 bonded to the heat sink 20 by an adhesive 30, and is taken out from the LED chip 40.
  • the heat transfer path generated by the LED chip is: LED chip-adhesive-heat sink- Aluminum substrate insulation layer - aluminum substrate substrate - heat sink - the outside world.
  • the package structure includes an aluminum substrate 10, an insulating layer 20 attached to the substrate 10, a circuit layer 30, and a potting region surrounded by the wall glue 40.
  • the LED chips 50 are adhered to the substrate inside the potting region 60 by an adhesive, and the LED chips 50 are bonded to the wiring layer of the substrate surface layer by the bonding wires 70 to achieve electrical connection.
  • the substrate is further connected to the heat sink, and the heat transfer path generated by the LED chip is: LED chip-adhesive-aluminum substrate insulating layer-aluminum substrate substrate-heat sink-outside.
  • FIG. 3 is a schematic overall structural view of the illumination device 100. As can be seen from the figure, the device has a metal heat dissipation material.
  • the susceptor 10 further has an encapsulant 20 for sealing and insulating the components of the LED chip, the circuit board and the like which will be described below.
  • the illumination device 100 of the present embodiment further has a circuit board 30 and a plurality of bare LED chips 40.
  • the circuit board 30 is mounted to the susceptor 10, and the LED chips 40 are directly adhered to the die-bonding area of the mirror-aluminum plate (not shown in FIG. 4) to be described below by means of an adhesive, the LED chips 40 and the circuit board 30. Electrical connections are made by wire bonding.
  • the encapsulant 20 covers the entire solid crystal region and the wiring board 30 by potting, and it is also possible if the encapsulant 20 covers only the solid crystal region.
  • a cross-sectional view of the pedestal 10 of the illumination device 100 of the present embodiment is laminated with a mirrored aluminum plate 50. It can be seen that when the mirror aluminum plate 50 is pressed against the susceptor 10, the upper surface thereof is exposed. Outside, at least one region on the upper surface is a solid crystal region for fixing the LED chip 40 mentioned above. Preferably, after the mirror aluminum plate 50 is pressed into the base 10, the top plane thereof is flush with the upper surface of the base 10, that is, at the same level.
  • the LED chip can be directly attached to the susceptor 10 made of a heat dissipating material, however, since the surface of the susceptor 10 is rough, this may seriously affect the light-emitting efficiency of the illuminating device, and therefore, the mirror aluminum plate 50 is used as a bearing LED chip.
  • the carrier can effectively increase the luminous flux of the illumination device.
  • the mirror aluminum plate 50 in the present embodiment, it is pressed into the susceptor 10 by cold pressing, which makes the bonding between the mirror aluminum plate 50 and the susceptor 10 as a heat sink very close. There is no gap in the interface, which facilitates the rapid diffusion of heat.
  • the mirrored aluminum plate 50 is cold pressed into a recess formed by cold pressing on the base 10.
  • the pit may be pre-preformed or may be formed simultaneously by press-fitting the mirror aluminum plate 50 by cold pressing.
  • a covering body 11 formed by pressing covering the edge of the mirror aluminum plate 50.
  • the susceptor 10 itself is a heat sink, preferably a pure aluminum pedestal, and the heat generated by the LED chip is radiated to the outside through the susceptor.
  • a plurality of heat dissipation fins 12 are preferably extended at the bottom of the base 10 to increase the surface area and improve the heat dissipation capability.
  • a mounting structure 13 for fixing a reflecting cup or a lens is also formed to facilitate further application of the lighting device of the present embodiment.
  • the illumination device of the present embodiment preferably further includes a plug or socket 60 drawn from the circuit board, correspondingly if The corresponding socket or plug is provided on the device using this device, which can be easily installed and replaced to solve the problem of assembly and maintenance of the LED lighting device.
  • the heat transfer path of the LED is: LED chip-adhesive-mirror-plate aluminum-base-outside, and the heat transfer link is greatly reduced compared with the chip package structure and the COB package structure.
  • the base itself which is an integral part of the illumination device, can function to dissipate heat to the external space, so that the heat dissipation capability of the illumination device is greatly improved compared to the aforementioned package structure.
  • the illumination device 100 can be used directly as a lighting fixture, which can also be applied indirectly to various LED fixtures.
  • the LED lighting device of the present embodiment may be mounted in a luminaire having a lamp housing made of a heat dissipating material, and the LED lighting device of the present embodiment is attached to the lamp housing through its pedestal and passed through a fixed structure
  • the lamp housing is fixed so that the heat of the pedestal can be transmitted to the lamp housing, and the lamp housing can be used for heat dissipation.
  • the LED lighting device can be fixed to the lamp housing by a conventional fixing structure such as a screw.
  • an LED lighting fixture 200 of one embodiment of the present invention is applied to the aforementioned lighting device 100 to form a lighting fixture.
  • the lighting fixture 200 includes a lamp housing 210 of the luminaire (only a part of the lamp housing is shown for ease of understanding), a fixing ring 220, and an illumination device fixed to the lamp housing 210 by the fixing ring (in the figure) Not shown), the base of the lighting device is in close contact with the lamp housing so that heat can be transferred to the lamp housing 210.
  • FIG. 8 an exploded perspective view of the lighting fixture 200 shown in Fig. 7, wherein the lamp housing 210 is made of a heat dissipating material, and therefore, it can function to dissipate the heat it loads into the surrounding space.
  • the lamp housing 210 has a plurality of card holes uniformly distributed on a circumference, and each of the card holes specifically includes a first hole 2101 and a second hole 2102 communicating with the second hole 2102 so as to be a whole. L shape.
  • the fixing ring 220 and the hole on the lamp housing 210 form a fixed structure.
  • the claw specifically includes an extending portion 2201 extending along the circumference of the fixing ring 220 and a bending portion 2202 perpendicular to the extending portion, and the bending portion 2202 can be
  • the first hole 2101 that passes through the card hole of the lamp housing 210 is inserted, but cannot pass through the second hole 2102, and the extension portion 2201 can slide in the second hole 2102 in the circumferential direction.
  • the lighting device 100 can be mounted to the lamp housing 210 by placing the lighting device 100 at a corresponding position of the lamp housing 210, and then fastening the lighting device 100 with the fixing ring 220 such that the fixing ring 220
  • the upper claw corresponds to the position of the hole on the lamp housing 210.
  • the fixing ring 220 is pressed, so that the bent portion 2202 of the claw is inserted through the first hole 2101, and then the buckle 220 is rotated, thereby causing the claw
  • the extension portion 2201 slides in the second hole 2102 in the circumferential direction, at which time the illumination device 100 is locked on the lamp housing 210. If the lighting device 100 needs to be removed, the fixing ring 220 can be reversely rotated, which is very simple and easy to grasp and operate for non-professionals.
  • a rear surface of the base of the illumination device 100 extends with a plurality of heat dissipation fins 12 , and the access hole of the lamp housing is provided with an access hole 2103 corresponding thereto when the illumination device 100 is locked. These heat sink fins 12 will pass through these access holes 2103 when they are on the lamp housing 210.
  • the matching plug or socket is disposed in the lamp housing of the LED lamp, and therefore, at this time, on the lamp housing. Set the hole through which the plug or socket passes.
  • the illumination device 100 When the illumination device 100 is locked on the lamp housing 210, its base is in close contact with the lamp housing, thereby transferring its heat to the lamp housing 210, and dissipating heat by the lamp housing 210.
  • the surface area of the lamp housing 210 It is usually very large and can effectively dissipate the heat from the LEDs to the surrounding space.
  • the heat sink connected to the LED lighting device is often placed in a closed environment inside the lamp, and the heat dissipation effect is difficult to ensure compared with the lamp of the present invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif d'éclairage à diodes électroluminescentes (DEL) (100) qui comprend : une base (10) faite d'un matériau rayonnant métallique ; une plaque d'aluminium à surface miroir (50) stratifiée sur la base (10) et fixée à celle-ci (10) par pressage à froid, au moins une zone de la surface de la plaque d'aluminium à surface miroir (50) étant une zone de collage de puce ; de multiples puces DEL nues (40) directement collées à une zone de collage de puce de la plaque d'aluminium à surface miroir (50) par un liant ; une carte de circuit imprimé (30) montée sur la base (10), les puces DEL (40) et la carte de circuit imprimé (30) formant des connexions électriques par soudage de fils ; un gel d'encapsulation (20) formant au moins une couverture d'enrobage de la zone de collage de puce. L'invention concerne également une lampe d'éclairage à DEL (200) utilisant le dispositif d'éclairage à DEL (100). Selon le dispositif d'éclairage à DEL (100) et la lampe à DEL (200), le chemin de transmission de la chaleur émise par une DEL est fortement réduit par comparaison à celui d'une structure d'encapsulation à montage en surface et à celui d'une structure d'encapsulation COB, l'effet de rayonnement est bon, la fiabilité et la durée de vie de la DEL sont considérablement améliorées.
PCT/CN2015/080161 2015-02-11 2015-05-29 Dispositif d'éclairage à del et lampe à del WO2016127524A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510073766.7A CN104676376B (zh) 2015-02-11 2015-02-11 一种led灯具
CN201510073766.7 2015-02-11

Publications (1)

Publication Number Publication Date
WO2016127524A1 true WO2016127524A1 (fr) 2016-08-18

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Country Status (2)

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CN (1) CN104676376B (fr)
WO (1) WO2016127524A1 (fr)

Cited By (1)

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WO2019224034A1 (fr) * 2018-05-22 2019-11-28 Mann+Hummel Gmbh Filtre à particules de poussière de frein, pièce de boîte à lumière pour un filtre à particules de poussière de frein et véhicule comprenant le filtre à particules de poussière de frein

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CN102544252A (zh) * 2011-07-05 2012-07-04 曹永革 一种利用基板高漫反射光学设计进行高效led芯片封装方法
CN102315208A (zh) * 2011-09-09 2012-01-11 福建省万邦光电科技有限公司 带有镶嵌陶瓷板的led光源封装结构
CN102623617A (zh) * 2012-04-12 2012-08-01 广州市鸿利光电股份有限公司 一种反射率高且散热好的cob铝基板及其制造工艺
CN104218138A (zh) * 2013-06-04 2014-12-17 汪绍芬 一种wfcob光源
CN203703684U (zh) * 2014-01-15 2014-07-09 深圳市杰科电子有限公司 用于低压室内供电系统的led灯具

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WO2019224034A1 (fr) * 2018-05-22 2019-11-28 Mann+Hummel Gmbh Filtre à particules de poussière de frein, pièce de boîte à lumière pour un filtre à particules de poussière de frein et véhicule comprenant le filtre à particules de poussière de frein
CN112119235A (zh) * 2018-05-22 2020-12-22 曼·胡默尔有限公司 制动尘粒过滤器、用于制动尘粒过滤器的照明壳体零件以及具有制动尘粒过滤器的车辆
US11493101B2 (en) 2018-05-22 2022-11-08 Mann+Hummel Gmbh Brake dust particle filter, lighting housing part for a brake dust particle filter, and vehicle with brake dust particle filter

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