CN204593036U - A kind of LED illumination device and LED lamp - Google Patents

Abstract

The utility model discloses a kind of LED illumination device, it comprises a pedestal be made up of heat dissipation metal material; One minute surface aluminium sheet, it is attached on described pedestal by mode pressing of colding pressing, and its surface has at least a region to be die bond region; Many naked LED chip, it is directly attached to the die bond region of described minute surface aluminium sheet by adhesive glue; One wiring board, it is arranged on pedestal, and described LED chip and this wiring board form electrical connection by the mode of wire bonding; One packing colloid, it at least forms embedding to described die bond region and covers.The invention also discloses the light fixture applying above-mentioned LED illumination device.LED illumination device of the present utility model and LED lamp, the bang path of the heat sent by LED is that comparatively paster encapsulating structure and COB encapsulating structure greatly reduce, and good heat dissipation effect, the reliability of LED and life-span can increase substantially.

Description

A kind of LED illumination device and LED lamp

Technical field

The utility model relates to technical field of LED illumination, and particularly, the utility model relates to a kind of illuminating device formed by LED chip, and this illuminating device can be used for as parts manufacturing LED lamp, and the utility model also relates to this LED lamp.

Background technology

For the use of LED illumination lamp, need a large amount of LED element to be integrated in reach required illumination on a module, but the photoelectric transformation efficiency of LED is not high, and most electric energy has finally all changed into heat energy.Heat has become one of biggest threat of LED, not only affects the electric property of LED, and LED finally may be caused to lose efficacy (after the temperature of LED raises, reduction, the skew of luminous dominant wavelength, life-span seriously reduce and accelerate light decay by the luminous intensity of LED).Therefore, how allowing LED keep continuing work reliably is for a long time the maximum technical problem of current LED or application.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of LED illumination device and LED lamp, and this LED illumination device and LED has good heat dissipation effect feature.

The utility model solves the technical scheme that its technical problem adopts: a kind of LED illumination device, comprising: a pedestal be made up of heat dissipation metal material; One minute surface aluminium sheet, it is attached on described pedestal by mode pressing of colding pressing, and its surface has at least a region to be die bond region; Many naked LED chip, it is directly attached to the die bond region of described minute surface aluminium sheet by adhesive glue; One wiring board, it is arranged on pedestal, and described LED chip and this wiring board form electrical connection by the mode of wire bonding; One packing colloid, it at least forms embedding to described die bond region and covers.

As the improvement of technique scheme, described minute surface aluminium sheet is colded pressing in a pit be formed on pedestal.

As the further improvement of technique scheme, described pit periphery has the cladding of the coated described specular aluminium panel edges formed by extruding.

As the further improvement of technique scheme, described illuminating device also comprises a plug or socket of drawing from wiring board.

As the further improvement of technique scheme, described pedestal is also provided with the mounting structure for fixation reflex cup or lens.

The utility model also provides a kind of LED lamp applying above-mentioned LED illumination device.

The utility model also provides a kind of LED lamp, and it comprises makes lamp housing and above-mentioned LED illumination device by heat sink material, and described LED illumination device is adjacent on described lamp housing by its pedestal, and is fixed by a fixed structure and described lamp housing.

As the improvement of technique scheme, described fixed structure comprises a retainer ring and is positioned at the hole clipping on lamp housing, this retainer ring has the claw corresponding with described hole clipping, this retainer ring is buckled in after on described LED illumination device, described claw is through the hole clipping corresponding with it, LED illumination device can be locked on described lamp housing by this retainer ring of turn, this retainer ring of turn in the opposite direction, then LED illumination device can be taken off from lamp housing.

As the further improvement of technique scheme, described hole clipping comprise the first hole and communicate with it and the second hole of relative narrowness, described claw comprises the extension and the bending section vertical with this extension of extending along retainer ring circumference, this bending section can insert and by described first hole, can slide in this extension in this second hole.

As the further improvement of technique scheme, the back side of described light source base is extended some radiating fins, the access digit of described lamp housing is provided with access aperture corresponding with it.

LED illumination device of the present utility model and LED lamp, the bang path of the heat sent by LED is that comparatively paster encapsulating structure and COB encapsulating structure greatly reduce, and good heat dissipation effect, the reliability of LED and life-span can increase substantially.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the utility model is further illustrated.

Fig. 1 is the structural representation of LED paster encapsulating structure in prior art;

Fig. 2 is the structural representation of the COB encapsulating structure of LED in prior art;

The overall structure schematic diagram of the illuminating device of Fig. 3 the utility model embodiment;

Fig. 4 is the decomposing schematic representation of illuminating device in Fig. 3;

Fig. 5 is pedestal and the minute surface aluminium sheet relation schematic diagram of illuminating device in Fig. 3;

Fig. 6 is pedestal and the minute surface aluminium sheet relation schematic diagram of the illuminating device of another embodiment;

Fig. 7 is the structural representation of the LED lamp of the utility model embodiment;

Fig. 8 is the decomposing schematic representation of the LED lamp of embodiment in Fig. 7;

Fig. 9 is the operation chart of LED lamp in Fig. 7.

Detailed description of the invention

Be clearly and completely described below with reference to embodiment and the accompanying drawing technique effect to design of the present utility model, concrete structure and generation, to understand the purpose of this utility model, scheme and effect fully.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.

It should be noted that, if no special instructions, when a certain feature is called as " fixing ", " connection ", " setting ", " installation " in another feature, it directly can fix, connects, arranges or be arranged in another feature, also indirectly can fix, be connected in another feature.In addition, it is only for the mutual alignment relation of each part of the utility model in accompanying drawing that the upper and lower, left and right used in the utility model etc. describe.And " one " in the utility model or " one " refers to one or more, " many " or " multiple " in the utility model refer to two or more.

In addition, unless otherwise defined, all technology used herein are identical with the implication that those skilled in the art understand usually with scientific terminology.The term used in description is herein to describe specific embodiment, instead of in order to limit the utility model.

Those skilled in the art know, for the light emitting diode be made up of PN junction, when forward current flows through from PN junction, PN junction has heating loss, and for power LED, drive current generally is more than hundreds of milliampere, the current density of PN junction is very large, so the temperature rise of PN junction is more obvious.Along with the increase of junction temperature of chip, light-emitting diode luminance will no longer continue along with current in proportion improves, and demonstrate thermal saturation phenomenon, the luminous efficiency efficiency of chip also can reduce thereupon, and LED luminance declines.Therefore, the heating problem of LED not only has influence on the life-span of LED component, also can affect luminosity, those skilled in the art carries out various improvement from many aspects such as LED material, manufacture craft, encapsulating structures for a long time, is all to wish to can be good at solving this technical problem.

In general, the heating problem of LED can be solved from two aspects: one is improve the internal quantum efficiency during LED inside, thus reduces the transformation of energy of electric energy thermotropism, initiatively reduces heating; Two is from LED periphery design, reduces the adverse effect of heating to LED by the heat-sinking capability improving LED illumination device and light fixture.

But due to technical reason, addressing this problem the mode generally adopted at present is designed by LED illumination device layout and LED lamp to improve its heat-sinking capability.Improve the heat-sinking capability by LED illumination device, just need to optimize LED encapsulation structure, by carrying out reliable thermal design to reduce thermal resistance, the heat that PN junction is produced can distribute as soon as possible.And the heat-sinking capability of LED lamp will be improved, just need to increase auxiliary cooling device (mainly radiator), the heat that LED illumination device produces is passed to cooling device, heat is distributed.

With regard to the encapsulating structure of LED, the extensive use of current institute be SMD encapsulation (Surface Mounted Devices) and COB encapsulation (chip on board) two classes.

First, with reference to figure 1, it illustrates a kind of SMD encapsulating structure, this encapsulating structure comprises support 10, heat sink 20, the LED chip 40 be bonded in by adhesive glue 30 on heat sink 20, two pins 50, casting glue 60 and the lens 70 of drawing from LED chip 40.When this encapsulating structure is applied in light fixture, high temperature reflux is needed to be welded on aluminium base, aluminium base is connected with radiator more further, and the bang path of the heat produced by LED chip is: LED chip-adhesive glue-heat sink-aluminium-base plate insulating layer-aluminium base substrate-radiator-external world.

Referring again to Fig. 2, it illustrates a kind of COB encapsulating structure, this encapsulating structure comprises an aluminium base 10, the insulating barrier 20 be attached on substrate 10, line layer 30 and the potting area that surrounded by enclosure wall glue 40, multiple LED chip 50 is sticked on the substrate of inside, potting area 60 by adhesive glue, and these LED chip 50 be bonded in substrate top layer by bonding line 70 line layer on realize electrical connection.When this encapsulating structure is applied in light fixture, substrate is connected with radiator further, and the bang path of the heat produced by LED chip is: LED chip-adhesive glue-aluminium-base plate insulating layer-aluminium base substrate-radiator-external world.

For this two class wrapper structure, whole heat conducting link is numerous, although the obvious gap that naked eyes can be observed can't be had between contact with each other two interfaces, but due to the out-of-flatness of material surface, between these interfaces, reality still also exists trickle space, be unfavorable for diffusion, therefore considerably increase overall thermal resistance.

In view of this; the utility model provides the LED illumination device 100 of an embodiment; with reference to Fig. 3; Fig. 3 is the overall structure schematic diagram of this illuminating device 100; can see from this figure; this device has a pedestal be made up of heat dissipation metal material 10, also has a packing colloid 20, for by the component sealings such as LED chip described below, wiring board, insulation protect.

With reference to figure 4, be the decomposing schematic representation of illuminating device 100 in Fig. 3, can see, the illuminating device 100 of the present embodiment also has wiring board 30 and many naked LED chip 40.Wiring board 30 is installed on pedestal 10, LED sheet 40 is then directly attached to by adhesive glue in the die bond region of minute surface aluminium sheet described below (not shown in Fig. 4), forms electrical connection between these LED chip 40 and wiring boards 30 by the mode of wire bonding.In the present embodiment, packing colloid 20 is covered whole die bond region and wiring board 30 by the mode of embedding, is also fine if this packing colloid 20 only covers die bond region.

With reference to figure 5, on the pedestal 10 of the illuminating device 100 of the present embodiment, pressing has the cross-sectional schematic of minute surface aluminium sheet 50, can see, when minute surface aluminium sheet 50 is pressed together on after on pedestal 10, its upper surface exposes outside, a region is had at least to be die bond region at this upper surface, for fixing LED chip 40 above-mentioned.Preferably, this minute surface aluminium sheet 50 is being pressed into after on pedestal 10, and its top planes is concordant with the upper surface of pedestal 10, is namely in same level.

Although can directly LED chip be fitted on the pedestal 10 be made up of heat sink material, but, because pedestal 10 surface is comparatively coarse, this can have a strong impact on the light extraction efficiency of illuminating device, therefore, using the carrier of minute surface aluminium sheet 50 as carrying LED chip, the luminous flux of illuminating device can be made to effectively improve.And as minute surface aluminium sheet 50, in this enforcement, be that the mode by colding pressing is pressed in pedestal 10, this make minute surface aluminium sheet 50 and as radiator pedestal 10 between combination closely, there is not any space in interface therebetween, is beneficial to the rapid diffusion of heat.

With reference to figure 6, in another preferred embodiment, minute surface aluminium sheet 50 to be formed in by colding pressing by colding pressing one in the pit on pedestal 10.This pit can be prefabricated formation in advance, also can be pressed into minute surface aluminium sheet 50 by the mode of colding pressing and be formed simultaneously.Be there is at this pit periphery the cladding 11 at coated described minute surface aluminium sheet 50 edge formed by extruding.By the effect of cladding 11, minute surface aluminium sheet 50 can be securely held on pedestal 10, make it be combined with pedestal 10 more tight and can prevent it from coming off.

As shown in Fig. 3 and Fig. 4, in this enforcement, pedestal 10 itself is exactly a radiator, and can be preferably fine aluminium pedestal, the heat produced by LED chip be dispersed into the external world by this pedestal.Further, some radiating fins 12 are preferably extended in the bottom of pedestal 10, to increase surface area, improve heat-sinking capability.

In addition, on pedestal 10, the mounting structure 13 for fixation reflex cup or lens is also formed with, so that the further expansive approach of the illuminating device of the present embodiment.

With reference to figure 4, user for the ease of this illuminating device uses, especially be convenient to common layman use, the illuminating device of the present embodiment also preferably includes a plug or socket 60 of drawing from wiring board, accordingly, if arrange corresponding socket or plug on the equipment using this device, then can carry out easily installing and changing, to solve the assembling of LED illumination device and to safeguard the problem of inconvenience.

The illuminating device 100 that the present embodiment provides, the bang path of the heat sent by LED is: LED chip-adhesive glue-minute surface aluminium sheet-pedestal-external world, its heat transfer link comparatively paster encapsulating structure and COB encapsulating structure greatly reduces, also not Presence of an interface thermal resistance, and, pedestal itself as this illuminating device part can play the effect of outwardly space radiates heat, and make this illuminating device compared to aforementioned encapsulation structure, heat-sinking capability significantly improves.This illuminating device is in use, without the need to additional radiator again, also much convenient in assembling, uses.

This illuminating device 100 can directly use as lighting separately, and it also can be applied in various LED lamp indirectly.

Such as, it can be installed in light fixture, this light fixture has makes lamp housing by heat sink material, and the LED illumination device of the present embodiment is adjacent on described lamp housing by its pedestal, and fixed by a fixed structure and described lamp housing, thus the heat of pedestal can be passed to lamp housing, utilize lamp housing to dispel the heat.The conventional fixed structures such as screw can be utilized LED illumination device and lamp housing to be fixed.

With reference to figure 7, the LED illumination lamp 200 of the embodiment that the utility model provides, it applies aforesaid illuminating device 100, thus forms lighting.As shown in the drawing, this lighting 200 comprises the lamp housing 210(of light fixture for the ease of understanding, only show a part for lamp housing in figure), retainer ring 220 and the ring that is fixed be fixed to illuminating device (not shown) on lamp housing 210, pedestal and the lamp housing of this illuminating device fit tightly, thus its heat can be passed to lamp housing 210.

With reference to the decomposing schematic representation of lighting 200 shown in figure 8, Fig. 7, wherein, lamp housing 210 is made up of heat sink material, and therefore, it can play the space effect of distributing towards periphery of the heat of its load.

This lamp housing 210 has several and is distributed in a hole clipping circumferentially, each hole clipping specifically comprise the first hole 2101 and communicate with it and the second hole 2102 of relative narrowness, make hole clipping on the whole in a L shape.Above-mentioned retainer ring 220 then forms a fixed structure with the hole clipping on lamp housing 210.

And on retainer ring 220, there is the claw corresponding with hole clipping, this claw specifically comprises the extension 2201 and the bending section 2202 vertical with this extension of extending along retainer ring 220 circumference, this bending section 2202 can be inserted through the first hole 2101 of the hole clipping of lamp housing 210, but cannot the second hole 2102 be passed through, and circumferentially can slide in the second hole 2102 in this extension 2201.

Composition graphs 9, illuminating device 100 can be installed on lamp housing 210 by following manner: after illuminating device 100 being placed on the relevant position of lamp housing 210, be buckled on this illuminating device 100 with retainer ring 220, make the claw on retainer ring 220 corresponding with the hole clipping position on lamp housing 210, now, withhold retainer ring 220, the bending section 2202 of claw is made to be inserted through the first hole 2101, then this clasp 220 is rotated, thus circumferentially slided in the extension 2201 of claw in the second hole 2102, now, illuminating device 100 is locked on lamp housing 210.If need illuminating device 100 to take off, then reverse turn retainer ring 220, very easy, for layman, is also easily grasp and operation.

As shown in Figure 8, the back side of the pedestal of illuminating device 100 is extended some radiating fins 12, the access digit of described lamp housing is provided with access aperture 2103 corresponding with it, when illuminating device 100 is locked on lamp housing 210, these radiating fins 12 will through these access aperture 2103.

Certainly, for illuminating device 100, when it has socket or plug, generally, match with it and plug or socket be then arranged in the lamp housing of LED lamp, therefore, now, lamp housing also to arrange the hole passed through for plug or socket.

Illuminating device 100 is when being locked on lamp housing 210, its pedestal and lamp housing close contact, thus its heat is passed to lamp housing 210, lamp housing 210 is utilized to dispel the heat, for light fixture, the surface area of lamp housing 210 is normally very large, effectively the heat that LED sends can be dispersed into surrounding space.And in prior art, under the radiator be connected with LED illumination device is often placed in the enclosed environment of lamp interior, compared with light fixture of the present utility model, its radiating effect is difficult to ensure.

More than that better enforcement of the present utility model is illustrated, but the utility model is created and is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit, and these equivalent distortion or replacement are all included in the application's claim limited range.

Claims (10)

1. a LED illumination device, is characterized in that, comprising:

One pedestal be made up of heat dissipation metal material;

One minute surface aluminium sheet, it is attached on described pedestal by mode pressing of colding pressing, and its surface has at least a region to be die bond region;

Many naked LED chip, it is directly attached to the die bond region of described minute surface aluminium sheet by adhesive glue;

One wiring board, it is arranged on pedestal, and described LED chip and this wiring board form electrical connection by the mode of wire bonding;

One packing colloid, it at least forms embedding to described die bond region and covers.

2. LED illumination device according to claim 1, is characterized in that: described minute surface aluminium sheet is colded pressing in a pit be formed on pedestal.

3. LED illumination device according to claim 2, is characterized in that: described pit periphery has the cladding of the coated described specular aluminium panel edges formed by extruding.

4. the LED illumination device according to any one of claims 1 to 3, is characterized in that: described illuminating device also comprises a plug or socket of drawing from wiring board.

5. the LED illumination device according to any one of claims 1 to 3, is characterized in that: described pedestal is also provided with the mounting structure for fixation reflex cup or lens.

6. a LED lamp, is characterized in that, it comprises the LED illumination device as described in any one of claim 1-5.

7. a LED lamp, it is characterized in that, it comprises makes lamp housing by heat sink material, also comprises the LED illumination device as described in any one of claim 1-5, described LED illumination device is adjacent on described lamp housing by its pedestal, and is fixed by a fixed structure and described lamp housing.

8. LED lamp according to claim 7, it is characterized in that: described fixed structure comprises a retainer ring and is positioned at the hole clipping on lamp housing, this retainer ring has the claw corresponding with described hole clipping, this retainer ring is buckled in after on described LED illumination device, described claw is through the hole clipping corresponding with it, LED illumination device can be locked on described lamp housing by this retainer ring of turn, this retainer ring of turn in the opposite direction, then LED illumination device can be taken off from lamp housing.

9. LED lamp according to claim 8, it is characterized in that: described hole clipping comprise the first hole and communicate with it and the second hole of relative narrowness, described claw comprises the extension and the bending section vertical with this extension of extending along retainer ring circumference, this bending section can insert and by described first hole, can slide in this extension in this second hole.

10. the LED lamp according to any one of claim 7 to 9, is characterized in that: the back side of described pedestal is extended some radiating fins, the access digit of described lamp housing is provided with access aperture corresponding with it.