CN113645772B - Rigid-flex board and manufacturing method thereof - Google Patents
Rigid-flex board and manufacturing method thereof Download PDFInfo
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- CN113645772B CN113645772B CN202010393359.5A CN202010393359A CN113645772B CN 113645772 B CN113645772 B CN 113645772B CN 202010393359 A CN202010393359 A CN 202010393359A CN 113645772 B CN113645772 B CN 113645772B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A manufacturing method of a rigid-flex board comprises the following steps: providing an inner layer circuit substrate, wherein the inner layer circuit substrate comprises a first hard area, a second hard area and a flexible area; laminating a first adhesive layer and a first copper foil layer on the inner layer circuit substrate; electrically connecting the first copper foil layer and the inner layer circuit substrate and manufacturing the first copper foil layer to form a first layer-added circuit layer; attaching a second adhesive layer to the first adhesive layer in the flexible region; pressing a second substrate layer and a second copper foil layer on the first layer-adding circuit layer, electrically connecting the second copper foil layer and the first layer-adding circuit layer and manufacturing the second copper foil layer to form a second layer-adding circuit layer; the second substrate layer and the second layer-adding circuit layer are provided with first windows, and the second adhesive layer is exposed from the first windows. The invention also relates to a rigid-flex board. The soft and hard combined board and the manufacturing method thereof provided by the invention can solve the problem that the liquid medicine residue pollutes the circuit and the board surface and solve the problem of carbon residue after black shadow.
Description
Technical Field
The invention relates to the field of manufacturing of circuit boards, in particular to a rigid-flex printed circuit board and a manufacturing method thereof.
Background
Compared with the design of a common rigid circuit board and a flexible circuit board, the rigid-flex circuit board has the advantages of thinness, lightness, easy assembly, better product reliability and the like, and is used for electrical signal transmission. However, due to the technical complexity and price factor, the circuit board is mainly used for high-price, high-quality and small-quantity high-order circuit boards such as military affairs and medical treatment. As the requirements of middle-high-order consumer electronic products (mobile phones, computers, light, thin and super-notebook computers, etc.) for quality, thinness, shortness and shortness become more stringent, the proportion of the circuit board to the rigid-flex board design is increasing.
However, the rigid-flex printed circuit board in the prior art needs to be uncapped in the flexible region, copper is generally formed on the substrate layer of the flexible region and plated with copper, but in the electroplating process, liquid medicine can remain in damaged gaps, and in subsequent processes, the remaining liquid medicine can react with other liquid medicine, so that the circuit and the board surface can be polluted. The copper foil is directly pressed or copper is plated after a shading process is performed on a Polyimide (PI) of the flexible region, however, the direct pressing of the copper foil can damage the copper foil of the flexible region, and after the shading process, carbon residue exists on the PI of the flexible region, and a problem of residual liquid medicine also exists.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a rigid-flex board, which can solve the problems of chemical solution residue polluting the circuit and the board surface and carbon residue after shadows.
In addition, it is also necessary to provide a rigid-flex board manufactured by the rigid-flex board manufacturing method.
A manufacturing method of a rigid-flex board comprises the following steps: providing an inner layer circuit substrate, wherein the inner layer circuit substrate comprises at least a first hard area, a second hard area and a flexible area; pressing a first additional laminated structure on one surface of the inner layer circuit substrate, wherein the first additional laminated structure comprises a first adhesive layer formed on the inner layer circuit substrate and a first copper foil layer formed on the first adhesive layer; electrically connecting the first copper foil layer and the inner layer circuit substrate, and manufacturing the first copper foil layer to form a first build-up circuit layer, wherein the first build-up circuit layer is positioned in the first hard zone and the second hard zone, and the first binder layer positioned in the flexible zone is not covered by the first build-up circuit layer; attaching a second adhesive layer to the first adhesive layer in the flexible region; pressing a second build-up lamination on the first build-up circuit layer, wherein the second build-up lamination comprises a second base material layer formed on the first build-up circuit layer and a second copper foil layer formed on the second binder layer, and the second copper foil layer is electrically connected with the first build-up circuit layer and is manufactured to form a second build-up circuit layer; the second substrate layer and the second layer-adding circuit layer are provided with a first window, and the second adhesive layer is exposed from the first window.
Further, before laminating a first build-up layer on the inner layer circuit substrate, the method further includes: and pseudo-laminating the first adhesive layer and the first copper foil layer.
Further, "electrically connecting the first copper foil layer and the inner layer circuit substrate" includes: forming at least one first blind hole from the first copper foil layer to the inner layer circuit substrate in a concave mode; and forming a first conductive column in the first blind hole through a shadow process and selective plating, wherein the first conductive column is electrically connected with the first copper foil layer and the inner layer circuit substrate.
Further, a first gap is provided between the first build-up wiring layer and the second adhesive layer, and a part of the second base material layer (or the second adhesive layer) is filled in the first gap.
Furthermore, the first adhesive layer and the second adhesive layer are made of polyimide pure glue.
Further, the second copper foil layer located in the flexible region is pressed on the second adhesive layer.
Further, after "fabricating the second copper foil layer to form a second build-up circuit layer", the method further includes: and forming a first protective layer on the second build-up circuit layer, wherein the first protective layer is positioned in the first hard area and the second hard area.
Furthermore, while pressing a first adhesive layer and a first copper foil layer on a surface of the inner circuit substrate, the method further includes: pressing a third adhesive layer and a third copper foil layer on the other surface of the inner-layer circuit substrate; the method for manufacturing the multilayer printed circuit board comprises the following steps of electrically connecting the first copper foil layer and the inner layer circuit substrate, and manufacturing the first copper foil layer to form a first multilayer circuit layer, and simultaneously: electrically connecting the third copper foil layer and the inner layer circuit substrate, and manufacturing the third copper foil layer to form a third build-up circuit layer, wherein the third adhesive layer positioned in the flexible region is not covered by the third build-up circuit layer; the method further includes, while "attaching a second adhesive layer to the first adhesive layer located in the flexible region": attaching a fourth adhesive layer to the third adhesive layer in the flexible region; the method comprises the following steps that when a second substrate layer and a second copper foil layer are pressed on the first layer-adding circuit layer to electrically connect the second copper foil layer with the first layer-adding circuit layer and form the second copper foil layer into a second layer-adding circuit layer, the method further comprises the following steps: and pressing a third base material layer and a fourth copper foil layer on the third layer-added circuit layer, electrically connecting the fourth copper foil layer with the third layer-added circuit layer and manufacturing the fourth copper foil layer to form a fourth layer-added circuit layer, wherein the third base material layer and the fourth layer-added circuit layer are provided with a second window, and the fourth binder layer is exposed from the second window.
Further, after "fabricating the fourth copper foil layer to form a fourth build-up wiring layer", the method further includes: and forming a second protective layer on the fourth build-up circuit layer, wherein the second protective layer is positioned in the first hard area and the second hard area.
The rigid-flex board is manufactured by the manufacturing method of the rigid-flex board.
The invention provides a soft and hard combined board and a manufacturing method thereof.A first/third adhesive layer is adopted for layer increasing, a second/fourth adhesive layer is pasted on the first/third adhesive layer positioned in a flexible region, then the layer increasing is carried out, the copper foil layer positioned on the second/fourth adhesive layer in the flexible region is etched while a layer increasing circuit layer is formed on the corresponding copper foil layer, and the windowing is realized. In the process, the pure copper foil (the second copper foil layer/the fourth copper foil layer) is directly contacted with the second/fourth adhesive layer, so that a compact structure can be formed, the problem that liquid medicine enters to pollute circuits and board surfaces due to poor compactness of the copper can be solved, and the problem of carbon residue after black shadow can be solved.
Drawings
Fig. 1 is a cross-sectional view of an inner layer circuit substrate, a first build-up layer, and a third build-up layer according to a first embodiment of the present invention.
Fig. 2 is a cross-sectional view of the first additional stacked structure and the third additional stacked structure shown in fig. 1 respectively laminated on two opposite surfaces of the inner-layer circuit substrate.
Fig. 3 is a cross-sectional view of the first and third build-up layers shown in fig. 2 electrically connected to the inner layer circuit substrate, and the first and third copper foil layers of the first and third build-up layers are formed to form first and third build-up circuit layers.
Fig. 4 is a cross-sectional view of the first and third adhesive layers of the first and third build-up layers in the flexible region shown in fig. 3 with second and fourth adhesive layers attached thereto.
Fig. 5 is a cross-sectional view of the first and third build-up wiring layers shown in fig. 4 after a second build-up layer and a fourth build-up layer are laminated thereon, respectively.
Fig. 6 is a cross-sectional view of the third build-up layer and the fourth build-up layer shown in fig. 5 electrically connected to the first and second build-up line layers, respectively.
Fig. 7 is a cross-sectional view of the second-level fourth copper foil layer of the second build-up structure and the fourth build-up structure shown in fig. 6, which is formed by forming a second build-up circuit layer and a fourth build-up circuit layer, respectively, and attaching (or printing) the first and second protective layers to the second and fourth build-up circuit layers to form a rigid-flex board.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made on the detailed implementation, structure, features and effects of the rigid-flex board and the manufacturing method thereof provided by the present invention with reference to the accompanying drawings 1-7 and the preferred implementation. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 7, the present invention provides a method for manufacturing a rigid-flex board 100, including the steps of:
step S1, please refer to fig. 1-2, providing an inner circuit substrate 10, a first build-up stack 20, and a third build-up stack 30, and laminating the first build-up stack 20 and the third build-up stack 30 on opposite surfaces of the inner circuit substrate 10.
The inner circuit board 10 is divided into a flexible region 101, and a first hard region 102 and a second hard region 103 located on two sides of the flexible region 101.
In the present embodiment, the inner circuit board 10 includes a first substrate layer 11, and a first inner circuit layer 12 and a second inner circuit layer 13 formed on opposite surfaces of the first substrate layer 11. The first inner circuit layer 12 and the second inner circuit layer 13 are electrically connected through at least one conductive via 14.
The material of the first substrate layer 11 is one of flexible materials such as Polyimide (PI), Modified Polyimide (MPI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), Polyethylene (PE), Teflon (Teflon), Liquid Crystal Polymer (LCP), polyvinyl chloride (PVC), ABF (Ajinomoto builed-up Film), and the like. Preferably, the material of the first substrate layer 11 is PI.
In other embodiments, the inner circuit board 10 may further include more conductive circuit layers and substrate layers, and the substrate layer is made of a flexible material.
The first build-up layer 20 includes a first adhesive layer 21 and a first copper foil layer 22. The first adhesive layer 21 is formed on the first inner wiring layer 12 and filled in the conductive blind via 14, and the first copper foil layer 22 is formed on the first adhesive layer 21.
The third build-up layer 30 includes a third adhesive layer 31 and a third copper foil layer 32. The third adhesive layer 31 is formed on the second inner layer wiring layer 13, and the third copper foil layer 32 is formed on the third adhesive layer 31.
Before the first build-up structure 20 and the third build-up structure 30 are laminated on the inner layer circuit board, the method further includes the following steps: the first adhesive layer 21 and the first copper foil layer 22 are temporarily bonded together, and the third adhesive layer 31 and the third copper foil layer 32 are temporarily bonded together.
In the present embodiment, the first adhesive layer 21 and the third adhesive layer 31 are made of polyimide pure glue.
Step S2, please refer to fig. 3, in which the first copper foil layer 22 and the first inner circuit layer 12 are electrically connected, and the first copper foil layer 22 is fabricated to form a first build-up circuit layer 25; and electrically connecting the third copper foil layer 32 and the second inner circuit layer 13, and forming a third build-up circuit layer 35 from the third copper foil layer 32.
Wherein, first build-up circuit layer 25 and third build-up circuit layer 35 are located first hard zone 102 and in second hard zone 103, are located in the flexible zone 101 first binder layer 21 is not covered by first build-up circuit layer 25, is located in the flexible zone 101 third binder layer 31 is not covered by third build-up circuit layer 35.
The "electrically connecting the first copper foil layer 22 and the first inner circuit layer 12" includes the steps of: first, at least one first blind via 23 is formed by recessing the first copper foil layer 22 toward the first inner circuit layer 12. Next, a first conductive pillar 24 is formed in the first blind via 23 by a shadow process and selective plating, and the first conductive pillar 24 is electrically connected to the first copper foil layer 22 and the first inner circuit layer 12.
The "electrically connecting the third copper foil layer 32 and the second inner circuit layer 13" includes the steps of: first, at least one second blind via 33 is formed by recessing the third copper foil layer 32 toward the second inner circuit layer 13. Next, a second conductive pillar 34 is formed in the second blind via 33 by a shadow process and selective plating, and the second conductive pillar 34 is electrically connected to the third copper foil layer 32 and the second inner circuit layer 13.
In step S3, please refer to fig. 4, a second adhesive layer 26 and a fourth adhesive layer 36 are respectively attached to the first adhesive layer 21 and the third adhesive layer 31 in the flexible region 101.
A first gap 104 is formed between the first build-up circuit layer 25 and the second adhesive layer 26, and a second gap 105 is formed between the third build-up circuit layer 35 and the fourth adhesive layer 36.
In step S4, please refer to fig. 5, a second build-up stack 40 and a fourth build-up stack 50 are laminated on the first build-up circuit layer 25 and the third build-up circuit layer 35, respectively.
The second build-up layer 40 includes a second substrate layer 41 formed on the first build-up layer 25 and a second copper foil layer 42. The second substrate layer 41 is located in the first rigid region 102 and the second rigid region 103 and filled in the first gap 104. The second copper foil layer 42 is formed on the second base material layer 41 and the second adhesive layer 26. The second copper foil layer 42 is in direct contact with the second adhesive layer 26 and may form a dense structure.
The fourth build-up layer 50 includes a third substrate layer 51 and a fourth copper foil layer 52 formed on the third build-up layer circuit layer 35. The third substrate layer 51 is located in the first rigid region 102 and the second rigid region 103 and filled in the second gap 105. The fourth copper foil layer 52 is formed on the third base material layer 51 and the fourth adhesive layer 36. The fourth copper foil layer 52 is in direct contact with the fourth adhesive layer 36 and may form a dense structure.
Step S5, please refer to fig. 6-7, electrically connecting the second copper foil layer 42 and the first build-up circuit layer 25, and forming a second build-up circuit layer 45 from the second copper foil layer 42; and electrically connecting the fourth copper foil layer 52 with the third build-up circuit layer 35 and manufacturing the fourth copper foil layer 52 to form a fourth build-up circuit layer 55.
The second substrate layer 41 and the second build-up circuit layer 45 have a first window 106 thereon, and the second adhesive layer 26 is exposed from the first window 106. The third substrate layer 51 and the fourth build-up circuit layer 55 have a second window 107 thereon, and the fourth adhesive layer 36 is exposed from the second window 107.
Wherein "electrically connecting the second copper foil layer 42 and the first build-up wiring layer 25" includes the steps of: first, at least one third blind via 43 is formed by recessing from the second copper foil layer 42 to the first build-up circuit layer 25. Next, a third conductive pillar 44 is formed in the third blind via 43 by a shadow process and selective plating, and the third conductive pillar 44 is electrically connected to the second copper foil layer 42 and the first build-up circuit layer 25.
The step of electrically connecting the fourth copper foil layer 52 and the third build-up wiring layer 35 includes: first, at least one fourth blind via 53 is formed by recessing the fourth copper foil layer 52 toward the third build-up circuit layer 35. Next, a fourth conductive pillar 54 is formed in the fourth blind via 53 by a shadow process and selective plating, and the fourth conductive pillar 54 is electrically connected to the fourth copper foil layer 52 and the third build-up circuit layer 35.
In step S6, referring to fig. 7, a first protection layer is formed on the second build-up circuit layer, and a second protection layer is formed on the fourth build-up circuit layer.
Wherein the first protective layer 61 and the second protective layer 62 are located within the first rigid region 102 and the second rigid region 103.
In other embodiments, the third adhesive layer 31, the third build-up wiring layer 35, the fourth adhesive layer 36, the third base material layer 51, the fourth build-up wiring layer 55, and the second shield layer 62 may not be included.
In another embodiment, the build-up may be continued on the second build-up wiring layer 45 and/or the fourth build-up wiring layer 55.
Referring to fig. 7, the present invention further provides a rigid-flex board 100, wherein the rigid-flex board 100 is manufactured by the manufacturing method of the rigid-flex board 100.
Wherein the rigid-flex board 100 comprises an inner circuit board 10, a first adhesive layer 21 and a third adhesive layer 31 formed on the opposite surfaces of the inner circuit board 10, a first build-up circuit layer 25 formed on the first adhesive layer 21, a third build-up circuit layer 35 formed on the third adhesive layer 31, a second adhesive layer 26 formed on the first adhesive layer 21, and a fourth adhesive layer 36 formed on the third adhesive layer 31, a second base material layer 41 formed on the first build-up wiring layer 25, a third base material layer 51 formed on the third build-up wiring layer 35, a second build-up wiring layer 45 formed on the second base material layer 41, a fourth build-up wiring layer 55 formed on the third base material layer 51, a first shield layer 61 formed on the second build-up wiring layer 45, and a second shield layer 62 formed on the fourth build-up wiring layer 55.
The inner circuit board 10 is divided into a flexible region 101, and a first hard region 102 and a second hard region 103 located on two sides of the flexible region 101. The second binder layer 26 and the fourth binder layer 36 are located in the flexible region 101, the first build-up circuit layer 25, the second substrate layer 41, the second build-up circuit layer 45, the first protective layer 61, the third build-up circuit layer 35, the third substrate layer 51, the fourth build-up circuit layer 55 and the second protective layer 62 are located in the first hard region 102 and the second hard region 103. The rigid-flex printed circuit board 100 further includes a first window 106 and a second window 107 corresponding to the flexible region 101, the first window 106 penetrates through the second multilayer circuit layer 45 and the second substrate layer 41, the second window 107 penetrates through the fourth multilayer circuit layer 55 and the third substrate layer 51, the second adhesive layer 26 is exposed from the first window 106, and the fourth adhesive layer 36 is exposed from the second window 107.
In the present embodiment, the inner circuit board 10 includes a first substrate layer 11, and a first inner circuit layer 12 and a second inner circuit layer 13 formed on opposite surfaces of the first substrate layer 11. The first inner circuit layer 12 and the second inner circuit layer 13 are electrically connected through at least one conductive via 14.
Wherein the first adhesive layer 21 is formed on the first inner-layer wiring layer 12, and the third adhesive layer 31 is formed on the second inner-layer wiring layer 13. The first build-up circuit layer 25 is electrically connected to the first inner circuit layer 12 through at least one first conductive post 24, the second build-up circuit layer 45 is electrically connected to the first build-up circuit layer 25 through at least one third conductive post 44, the third build-up circuit layer 35 is electrically connected to the second inner circuit layer 13 through at least one second conductive post 34, and the fourth build-up circuit layer 55 is electrically connected to the third build-up circuit layer 35 through at least one fourth conductive post 54.
The material of the first substrate layer 11 is one of flexible materials such as Polyimide (PI), Modified Polyimide (MPI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), Polyethylene (PE), Teflon (Teflon), Liquid Crystal Polymer (LCP), polyvinyl chloride (PVC), ABF (Ajinomoto builed-up Film), and the like. Preferably, the material of the first substrate layer 11 is PI.
In other embodiments, the inner circuit board 10 may further include more conductive circuit layers and substrate layers, and the substrate layer is made of a flexible material.
In other embodiments, the rigid-flex board 100 may not include the third adhesive layer 31, the third build-up circuit layer 35, the fourth adhesive layer 36, the third base material layer 51, the fourth build-up circuit layer 55, and the second protective layer 62.
In other embodiments, the rigid-flex board 100 may further include a build-up circuit layer located in the first rigid region 102 and the second rigid region 103, and an adhesive layer located in the flexible region 101.
The invention provides a soft-hard combined board and a manufacturing method thereof.A first/third adhesive layer is adopted for layer increasing, a second/fourth adhesive layer is pasted on the first/third adhesive layer positioned in a flexible region, then the layer increasing is carried out, the copper foil layer positioned on the second/fourth adhesive layer in the flexible region is etched off while a corresponding copper foil layer is manufactured to form a layer increasing circuit layer, and the windowing is realized. In the process, the pure copper foil (the second copper foil layer/the fourth copper foil layer) is directly contacted with the second/fourth adhesive layer, so that a compact structure can be formed, the problem that liquid medicine enters to pollute circuits and board surfaces due to poor compactness of the copper can be solved, and the problem of carbon residue after black shadow can be solved. In addition, the second/fourth adhesive layer can also reduce the step difference between the first/second hard regions and the flexible region, so that the problem of copper foil breakage caused by too large step difference can be further reduced.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
providing an inner layer circuit substrate, wherein the inner layer circuit substrate comprises at least a first hard area, a second hard area and a flexible area;
pressing a first additional laminated structure on one surface of the inner-layer circuit substrate, wherein the first additional laminated structure comprises a first adhesive layer formed on the inner-layer circuit substrate and a first copper foil layer formed on the first adhesive layer;
electrically connecting the first copper foil layer and the inner layer circuit substrate, and manufacturing the first copper foil layer to form a first build-up circuit layer, wherein the first build-up circuit layer is positioned in the first hard zone and the second hard zone, and the first binder layer positioned in the flexible zone is not covered by the first build-up circuit layer;
attaching a second adhesive layer to the first adhesive layer in the flexible region; and
pressing a second build-up lamination on the first build-up circuit layer, wherein the second build-up lamination comprises a second base material layer formed on the first build-up circuit layer and a second copper foil layer formed on the second adhesive layer, and the second copper foil layer is electrically connected with the first build-up circuit layer and is manufactured to form a second build-up circuit layer; the second substrate layer and the second layer-adding circuit layer are provided with a first window, and the second adhesive layer is exposed from the first window.
2. The method for manufacturing a rigid-flex board according to claim 1, wherein before laminating a first build-up layer on the inner circuit substrate, the method further comprises:
and pseudo-laminating the first adhesive layer and the first copper foil layer.
3. The method of manufacturing the rigid-flex board according to claim 1, wherein electrically connecting the first copper foil layer and the inner circuit substrate comprises:
forming at least one first blind hole from the first copper foil layer to the inner layer circuit substrate in a concave mode; and
and forming a first conductive column in the first blind hole through a shading process and selective electroplating, wherein the first conductive column is electrically connected with the first copper foil layer and the inner layer circuit substrate.
4. The method for manufacturing the rigid-flex board according to claim 1, wherein a first gap is formed between the first build-up circuit layer and the second adhesive layer, and a part of the second substrate layer or the second adhesive layer is filled in the first gap.
5. The method for manufacturing the rigid-flex board according to claim 1, wherein the first adhesive layer and the second adhesive layer are made of polyimide pure glue.
6. The method of claim 1, wherein the second copper foil layer in the flexible region is laminated to the second adhesive layer.
7. The method for manufacturing a rigid-flex board according to claim 1, further comprising, after the step of manufacturing the second copper foil layer to form a second build-up circuit layer:
and forming a first protective layer on the second build-up circuit layer, wherein the first protective layer is positioned in the first hard area and the second hard area.
8. The method for manufacturing a rigid-flex board according to claim 1, wherein the step of pressing a first adhesive layer and a first copper foil layer on a surface of the inner circuit substrate further comprises: pressing a third adhesive layer and a third copper foil layer on the other surface of the inner-layer circuit substrate; the method for manufacturing the multilayer printed circuit board comprises the following steps of electrically connecting the first copper foil layer and the inner layer circuit substrate, and manufacturing the first copper foil layer to form a first multilayer circuit layer, and simultaneously: electrically connecting the third copper foil layer and the inner layer circuit substrate, and manufacturing the third copper foil layer to form a third build-up circuit layer, wherein the third adhesive layer positioned in the flexible region is not covered by the third build-up circuit layer; the method further includes, while "attaching a second adhesive layer on the first adhesive layer located in the flexible region": attaching a fourth adhesive layer to the third adhesive layer in the flexible region; the method comprises the following steps that when a second substrate layer and a second copper foil layer are pressed on the first layer-adding circuit layer to electrically connect the second copper foil layer with the first layer-adding circuit layer and form the second copper foil layer into a second layer-adding circuit layer, the method further comprises the following steps: and pressing a third base material layer and a fourth copper foil layer on the third layer-added circuit layer, electrically connecting the fourth copper foil layer with the third layer-added circuit layer and manufacturing the fourth copper foil layer to form a fourth layer-added circuit layer, wherein the third base material layer and the fourth layer-added circuit layer are provided with a second window, and the fourth binder layer is exposed from the second window.
9. The method for manufacturing a rigid-flex board according to claim 8, further comprising, after the step of manufacturing the fourth copper foil layer to form a fourth build-up wiring layer:
and forming a second protective layer on the fourth build-up circuit layer, wherein the second protective layer is positioned in the first hard area and the second hard area.
10. A rigid-flex board, characterized in that the rigid-flex board is manufactured by the method for manufacturing the rigid-flex board according to any one of claims 1 to 9.
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| CN110536567B (en) * | 2018-05-25 | 2021-02-09 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of rigid-flexible circuit board |
| CN108712816A (en) * | 2018-05-31 | 2018-10-26 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
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