CN108712816A - Prevent the Rigid Flex of soft board bending fracture - Google Patents
Prevent the Rigid Flex of soft board bending fracture Download PDFInfo
- Publication number
- CN108712816A CN108712816A CN201810552262.7A CN201810552262A CN108712816A CN 108712816 A CN108712816 A CN 108712816A CN 201810552262 A CN201810552262 A CN 201810552262A CN 108712816 A CN108712816 A CN 108712816A
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- China
- Prior art keywords
- soft board
- layer
- prepreg
- cover film
- windowing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention relates to a kind of Rigid Flexs preventing soft board bending fracture, it is characterized in that：Including soft board layer, upper layer cover film and lower layer's cover film, the size ratio soft board bending at least big 0.5mm in region of upper layer cover film and lower layer's cover film are covered on the surface of soft board sandwich circuit；Prepreg and first time prepreg in the upper and lower surface setting first of the soft board laminar substrate, on prepreg and first time prepreg correspond to soft board on first and bend region and open up the first windowing；Upper hardboard layer and lower hardboard layer is arranged in the surface of prepreg and first time prepreg on described first, and soft board bending region is corresponded on upper hardboard layer and lower hardboard layer and opens up the second windowing；Prepreg and second time prepreg in the surface of the upper hardboard layer and lower hardboard layer setting second, soft board is corresponded on second bend region and open up third and open a window on prepreg and second time prepreg.The present invention can prevent Rigid Flex bending fracture, promote the quality and reliability of product.
Description
Technical field
The present invention relates to a kind of Rigid Flexs preventing soft board bending fracture, belong to printed-board technology field.
Background technology
With lightening, integrated, multifunction the development trend of consumption electronic product, the making to printed circuit board
Technological requirement is higher and higher.This trend is complied with, soft or hard combination printed wiring board can be increasingly becoming the important portion of printed circuit board
Point, one of which have cavity can buried capacitor bury the Rigid Flex of resistance and can also increase with the demand in market.Soft or hard knot
Plywood is in one or more rigid printed wiring board as its name suggests, includes to constitute whole essential one piece or more
Block flexible printed wiring board, effect use connector so that being reduced when electronic product assembles, considerably increase reliability, signal
Transmission faster, finished size smaller the advantages that.
The feature of Rigid Flex maximum itself is exactly to save assembling space, can be arbitrarily bent when finished product assembles, but just
It is can have the risk that soft board has fracture because can arbitrarily be bent.
Invention content
The purpose of the present invention is overcoming the deficiencies in the prior art, providing a kind of preventing the soft or hard of soft board bending fracture
Board can prevent Rigid Flex bending fracture, promote the quality and reliability of product.
According to technical solution provided by the invention, a kind of Rigid Flex preventing soft board bending fracture, it is characterized in that：Packet
Soft board laminar substrate is included, soft board laminar substrate includes upper copper face, insulating layer and lower copper face, and upper copper face and lower copper face are respectively arranged at insulation
The upper and lower surface of layer, being made on upper copper face and lower copper face has circuit；It is covered each by upper layer covering on the surface of the circuit
The size ratio soft board of film and lower layer's cover film, upper layer cover film and lower layer's cover film bends at least big 0.5mm in region, upper layer covering
Film and the unilateral of lower layer's cover film will put in hardboard area at least 0.25mm；It is respectively set in the upper and lower surface of the soft board laminar substrate
Prepreg and first time prepreg on first correspond to soft board bending on first on prepreg and first time prepreg
Region opens up the first windowing；On described first the surface of prepreg and first time prepreg be respectively set upper hardboard layer and
Lower hardboard layer corresponds to soft board bending region on upper hardboard layer and lower hardboard layer and opens up the second windowing；In the upper hardboard layer and
Prepreg and second time prepreg on second is respectively set in the surface of lower hardboard layer, on second under prepreg and second
Soft board bending region is corresponded on prepreg opens up third windowing.
Further, the size ratio soft board of first windowing bends the small 0.25-0.5mm in region.
Further, the size of second windowing and soft board bending area size etc. are big.
Further, the size ratio soft board of the third windowing bends the big 0.25-0.5mm in region.
Cover film is put in hardboard and can not bend region by the present invention closely to be pressed, and folding s tress can be eliminated in bending,
The prepreg of soft board the upper and lower is stretched into soft board simultaneously and bends region, is covered using the gummosis blocking of prepreg after pressing
The edge of epiphragma and hardboard layer fishing window is in direct contact, and is avoided the edge that cover film is dragged for window out-of-flatness by hardboard layer from crushing, is prevented
Only Rigid Flex bending fracture, promotes the quality and reliability of product.
Description of the drawings
Fig. 1 is the structural schematic diagram of the soft board laminar substrate.
Fig. 2 is the schematic diagram that protection cover film is made on soft board circuit.
Fig. 3 is the schematic diagram of prepreg on described first.
Fig. 4 is the schematic diagram of the upper hardboard layer.
Fig. 5 is the schematic diagram of prepreg on described second.
Fig. 6 is the schematic diagram of the Rigid Flex.
Reference sign：Under the upper copper faces of 1-, 2- insulating layers, 3- under copper face, 4- cover films, the upper layers 41- cover film, 42-
Hardboard under prepreg, first time prepreg of 52-, the windowings of 6- first, the upper hardboard layers of 71-, 72- on layer cover film, 51- first
Layer, 8- second open a window, prepreg, second time prepreg of 92-, 10- thirds open a window on 91- second.
Specific implementation mode
With reference to specific attached drawing, the invention will be further described.
The principle of the present invention is cover film is put in hardboard can not to bend region closely to be pressed, and can be eliminated in bending curved
Stress is rolled over, while the prepreg of soft board the upper and lower is stretched into soft board and bends region, utilizes the stream of prepreg after pressing
Glue stops that cover film and the edge of hardboard layer fishing window are in direct contact, and cover film is avoided to be dragged for the edge of window out-of-flatness by hardboard layer
It crushes, prevents Rigid Flex bending fracture, promote the quality and reliability of product.
As shown in fig. 6, the Rigid Flex of the present invention for preventing soft board bending to be broken includes soft board laminar substrate, soft board layer
Substrate includes upper copper face 1, insulating layer 2 and lower copper face 3, and upper copper face 1 and lower copper face 3 are respectively arranged at the upper and lower surface of insulating layer 2,
Being made on upper copper face 1 and lower copper face 3 has circuit；It is covered each by upper layer cover film 41 on the surface of the circuit and lower layer is covered
The size ratio soft board of epiphragma 42, upper layer cover film 41 and lower layer's cover film 42 bends at least big 0.5mm in region, i.e. upper layer cover film
41 and the unilateral of lower layer's cover film 42 to put in hardboard area at least 0.25mm；It is set respectively in the upper and lower surface of the soft board laminar substrate
Prepreg 51 and first time prepreg 52 on first are set, it is right on prepreg 51 and first time prepreg 52 on first
Soft board bending region is answered to open up the first windowing 6, the size ratio soft board of the first windowing 6 bends the small 0.25-0.5mm in region；Described
Hardboard layer 71 and lower hardboard layer 72 is respectively set in the surface of prepreg 51 and first time prepreg 52 on first, upper hard
Soft board bending region is corresponded on plate layer 71 and lower hardboard layer 72 opens up the second windowing 8, the size of the second windowing 8 and soft board bent area
Domain sizes etc. are big；It is respectively set on second under prepreg 91 and second on the surface of the upper hardboard layer 71 and lower hardboard layer 72
Prepreg 92, on second corresponding to soft board bending region on prepreg 91 and second time prepreg 92 opens up third windowing
10, the size ratio soft board of third windowing 10 bends the big 0.25-0.5mm in region.
Embodiment 1：A kind of processing technology for the Rigid Flex for preventing soft board bending to be broken, includes the following steps：
（1）As shown in Figure 1, preparing soft board laminar substrate, the model 0.002 of soft board laminar substrate, " H/H OZ, supplier are that Kunshan is new
Raise Electron Material Co., Ltd；The soft board laminar substrate includes upper copper face 1, insulating layer 2, lower copper face 3, and respectively in upper copper face 1
Circuit is made with lower copper face 3；
（2）Make the cover film 4 of protection soft board circuit, including upper layer cover film 41 and lower layer's cover film 42, model FGA
0525, supplier is Kun Tai rainbows Electron Material Co., Ltd；4 size ratio soft board of the cover film bends the big 1.27mm in region；
（3）As shown in Fig. 2, the cover film made is fitted on soft board layer；
（4）As shown in figure 3, making prepreg 51 and first time prepreg 52 on first, 106 65% Low of model
Flow EM285, supplier are Kunshan platform photoelectron material Co., Ltd；The first windowing 6 is opened up in corresponding soft board bending region,
First 6 size ratio soft boards of windowing bend the small 0.5mm in region；
（5）As shown in figure 4, making upper hardboard layer 71 and lower hardboard layer 72,0.005 " H/H OZ EM285 of model, supplier
For Kunshan platform photoelectron material Co., Ltd；The second windowing 8 is opened up in corresponding soft board bending region, the second 8 sizes of windowing and soft
It is big that plate bends area size etc.；
（6）As shown in figure 5, making prepreg 91 and second time prepreg 92 on second, 1,080 65% Low of model
Flow EM285, supplier are Kunshan platform photoelectron material Co., Ltd；Third windowing 10 is opened up in corresponding soft board bending region,
Third 10 size ratio soft boards of windowing bend the big 0.5mm in region；
（7）Copper foil and lower copper foil in preparation；
（8）Pressing：As shown in fig. 6, by prepreg 51 on prepreg 91 on upper copper foil, second, upper hardboard layer 71, first,
Soft board laminar substrate, first time prepreg 52, lower hardboard layer 72, second time prepreg 92, lower copper foil are in order from top to bottom
It sets gradually, is pressed；This specifically requires to produce to press for the first time according to client's lamination；
（9）It is produced according to normal flow, makes drilling, copper facing, circuit, anti-welding, surface treatment etc.；
（10）It is produced by required flow, completes production.
Embodiment 2：A kind of processing technology for the Rigid Flex for preventing soft board bending to be broken, includes the following steps：
（1）As shown in Figure 1, preparing soft board laminar substrate, the model 0.002 of soft board substrate, " H/H OZ, supplier are that Kunshan is newly raised
Electron Material Co., Ltd；The soft board laminar substrate includes upper copper face 1, insulating layer 2, lower copper face 3, and respectively in 1 He of upper copper face
Lower copper face 3 makes circuit；
（2）Make the cover film 4 of protection soft board circuit, including upper layer cover film 41 and lower layer's cover film 42, model FGA
0525, supplier is Kun Tai rainbows Electron Material Co., Ltd；4 size ratio soft board of the cover film bends the big 1.5mm in region；
（3）As shown in Fig. 2, the cover film made is fitted on soft board layer；
（4）As shown in figure 3, making prepreg 51 and first time prepreg 52 on first, 106 65% Low of model
Flow EM285, supplier are Kunshan platform photoelectron material Co., Ltd；The first windowing 6 is opened up in corresponding soft board bending region,
First 6 size ratio soft boards of windowing bend the small 0.25mm in region；
（5）As shown in figure 4, making upper hardboard layer 71 and lower hardboard layer 72,0.005 " H/H OZ EM285 of model, supplier
For Kunshan platform photoelectron material Co., Ltd；The second windowing 8 is opened up in corresponding soft board bending region, the second 8 sizes of windowing and soft
It is big that plate bends area size etc.；
（6）As shown in figure 5, making prepreg 91 and second time prepreg 92 on second, 1,080 65% Low of model
Flow EM285, supplier are Kunshan platform photoelectron material Co., Ltd；Third windowing 10 is opened up in corresponding soft board bending region,
Third 10 size ratio soft boards of windowing bend the big 0.25mm in region；
（7）Copper foil and lower copper foil in preparation；
（8）Pressing：As shown in fig. 6, by prepreg 51 on prepreg 91 on upper copper foil, second, upper hardboard layer 71, first,
Soft board laminar substrate, first time prepreg 52, lower hardboard layer 72, second time prepreg 92, lower copper foil are in order from top to bottom
It sets gradually, is pressed；This specifically requires to produce to press for the first time according to client's lamination；
（9）It is produced according to normal flow, makes drilling, copper facing, circuit, anti-welding, surface treatment etc.；
（10）It is produced by required flow, completes production.
Claims (4)
1. a kind of Rigid Flex preventing soft board bending fracture, it is characterized in that：Including soft board laminar substrate, soft board laminar substrate includes
Upper copper face（1）, insulating layer（2）With lower copper face（3）, upper copper face（1）With lower copper face（3）It is respectively arranged at insulating layer（2）Up and down
Surface, in upper copper face（1）With lower copper face（3）Upper making has circuit；It is covered each by upper layer cover film on the surface of the circuit
（41）With lower layer's cover film（42）, upper layer cover film（41）With lower layer's cover film（42）Size ratio soft board bending region it is at least big
0.5mm, upper layer cover film（41）With lower layer's cover film（42）Unilateral to put in hardboard area at least 0.25mm；In the soft board layer
Prepreg on first is respectively set in the upper and lower surface of substrate（51）With first time prepreg（52）, the prepreg on first
（51）With first time prepreg（52）Upper corresponding soft board bending region opens up the first windowing（6）；The semi-solid preparation on described first
Piece（51）With first time prepreg（52）Surface hardboard layer is respectively set（71）With lower hardboard layer（72）, in upper hardboard layer
（71）With lower hardboard layer（72）Upper corresponding soft board bending region opens up the second windowing（8）；In the upper hardboard layer（71）With it is lower hard
Plate layer（72）Surface prepreg on second is respectively set（91）With second time prepreg（92）, the prepreg on second
（91）With second time prepreg（92）Upper corresponding soft board bending region opens up third windowing（10）.
2. the Rigid Flex as described in claim 1 for preventing soft board bending fracture, it is characterized in that：First windowing（6）
Size ratio soft board bend the small 0.25-0.5mm in region.
3. the Rigid Flex as described in claim 1 for preventing soft board bending fracture, it is characterized in that：Second windowing（8）
Size and soft board bending area size etc. it is big.
4. the Rigid Flex as described in claim 1 for preventing soft board bending fracture, it is characterized in that：The third windowing（10）
Size ratio soft board bend the big 0.25-0.5mm in region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552262.7A CN108712816A (en) | 2018-05-31 | 2018-05-31 | Prevent the Rigid Flex of soft board bending fracture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552262.7A CN108712816A (en) | 2018-05-31 | 2018-05-31 | Prevent the Rigid Flex of soft board bending fracture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108712816A true CN108712816A (en) | 2018-10-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810552262.7A Pending CN108712816A (en) | 2018-05-31 | 2018-05-31 | Prevent the Rigid Flex of soft board bending fracture |
Country Status (1)
| Country | Link |
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| CN (1) | CN108712816A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
| CN113056091A (en) * | 2021-05-07 | 2021-06-29 | 高德（无锡）电子有限公司 | Super high-rise arbitrary layer interconnection soft-hard combined printed circuit board and processing technology thereof |
| CN113645772A (en) * | 2020-05-11 | 2021-11-12 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex board and manufacturing method thereof |
| CN114980572A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Rigid-flexible circuit board and processing method |
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| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN205847725U (en) * | 2016-04-20 | 2016-12-28 | 高德（无锡）电子有限公司 | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper |
| CN208317114U (en) * | 2018-05-31 | 2019-01-01 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
-
2018
- 2018-05-31 CN CN201810552262.7A patent/CN108712816A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN205847725U (en) * | 2016-04-20 | 2016-12-28 | 高德（无锡）电子有限公司 | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper |
| CN208317114U (en) * | 2018-05-31 | 2019-01-01 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
| CN113645772A (en) * | 2020-05-11 | 2021-11-12 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex board and manufacturing method thereof |
| CN114980572A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Rigid-flexible circuit board and processing method |
| CN113056091A (en) * | 2021-05-07 | 2021-06-29 | 高德（无锡）电子有限公司 | Super high-rise arbitrary layer interconnection soft-hard combined printed circuit board and processing technology thereof |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181026 |
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| RJ01 | Rejection of invention patent application after publication |