CN102404933A - Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board - Google Patents
Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board Download PDFInfo
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- CN102404933A CN102404933A CN2011103576368A CN201110357636A CN102404933A CN 102404933 A CN102404933 A CN 102404933A CN 2011103576368 A CN2011103576368 A CN 2011103576368A CN 201110357636 A CN201110357636 A CN 201110357636A CN 102404933 A CN102404933 A CN 102404933A
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Abstract
The invention relates to a metal core printed circuit board (MCPCB) for improving the heat conduction efficiency, particularly longitudinal thermal conductivity and a method for making the same. The MCPCB comprises a layer of single-face printed circuit board, a layer of metal substrate with a boss and pit structure, a glue bonding layer and at least one heat through hole, wherein the glue bonding layer is used for bonding the printed circuit board and the metal substrate together, and the heat through hole runs through the single-face printed circuit board and the glue bonding layer. As a bottleneck part (namely, an insulating layer) in a heat transfer path of the conventional MCPCB is eliminated, a boss of the metal substrate is directly bonded with a heat dissipation part of an electronic device on the surface of the circuit board through the heat through hole, compared with the conventional MCPCB, the longitudinal thermal conductivity of the MCPCB can be improved by about one hundred times, the problem of excessive longitudinal resistance of the MCPCB during application of the conventional high-power light emitting diode (LED) can be solved, and the MCPCB is particularly applicable to a single LED with package power of more than 5W.
Description
Technical field
The present invention relates to a kind of metal base printed circuit board that promotes the especially vertical thermal conductivity of heat transfer efficiency and preparation method thereof; Mainly solve the existing excessive problem of the vertical thermal resistance of metal base printed circuit board in High Power LED (LED) application process, be particularly useful for the LED of single package power more than 5W.
Background technology
LED is used widely at lighting field at present, and single the above LED of 3W generally can adopt metal base printed circuit board (MCPCB) as circuit carrier and heat eliminating medium in application.Existing MCPCB is owing to adopt metal composite substrate (copper base or aluminium base), and the common FR4 printed circuit board (PCB) (PCB) that the following LED of 1W adopted before thermal conductivity was compared has had bigger lifting.Yet, although aluminium base even copper base have good thermal conductivity, reach 205W/mK and 380W/mK respectively, because the needs of electric insulation and preparation technology's restriction all have a layer insulating between present MCPCB circuit layer and the metal substrate.The thermal conductivity of this insulating barrier has only about 0.8～2.0W/mK, causes vertical thermal conductivity of existing MCPCB to have only 2～4W/mK, far can not satisfy the radiating requirements of high-capacity LED.
In use,, will cause LED joint temperature too high, cause luminous efficiency to descend, reduce the LED life-span, more possibly directly burn chip when serious as can not in time heat being distributed because the energy consumption of LED 70～90% is converted into heat energy.LED is because the restriction of encapsulating structure, and front end generally adopts the materials such as epoxy resin, plastics or glass of high transmission rate for printing opacity, and thermal conductivity is all lower.Particularly when using the encapsulation of plastic lens or cover glass; In order to protect the direct brilliant line of LED wafer and base plate for packaging; Plastic lens or cover glass directly do not contact with the LED wafer but reserve certain gap; Therefore during LED used, heat was few from the ratio that front end distributes, and the heat more than 90% all need reach radiator from LED base plate for packaging back via circuit board with heat conducting mode at last.In the application, LED generally need be welded and on circuit board, supply power, and heat also need penetrate the radiator that circuit board could arrive the back.Therefore, the quality of the heat radiation of LED mainly can be considered from three ranks: one is the height that the package level heat radiation depends primarily on the LED packaging thermal resistance; Another is vertical capacity of heat transmission and lateral heat diffusion ability that the plate heat radiation depends primarily on MCPCB; Another is the structure and layout that system-level heat radiation depends primarily on whole outside cooling system.Because vertical thermal conductivity of existing MCPCB is lower; Become the bottleneck of high-capacity LED entire heat dissipation road warp; So the present invention mainly concentrates on the heat radiation of plate level, solve the existing excessive problem of metal base printed circuit board thermal resistance, significantly improve vertical thermal conductivity of metal base printed circuit board.
Summary of the invention
The present invention is primarily aimed at the existing still lower problem of the vertical thermal conductivity of MCPCB; Through punching the heat passage partial insulating layer; Let metal substrate directly contact with the LED back; Owing to removed the metal copper foil insulating barrier two layer medium that especially thermal conductivity is extremely low at heat passage position; The heat-transfer path of whole M CPCB is directly become by original " metal copper foil-insulating barrier-metal substrate " and has only one deck " metal substrate ", so vertical thermal conductivity of whole M CPCB is the thermal conductivity of metal substrate aluminium or copper, thereby vertical thermal conductivity that can existing MCPCB promotes nearly a hundred times.
The printed circuit board (PCB) of metal substrate penetration heat path of the present invention mainly is made up of three parts: one deck single-surface single-layer or multilayer board, layer of metal substrate and the tack coat that connects printed circuit board (PCB) and metal substrate.The material of metal substrate is the thermal conductivity good metal, like copper, aluminium or copper alloy, aluminium alloy.Tack coat is epoxy jelly membrane, epoxy glass cloth bonding sheet or other resistant to elevated temperatures binding materials, can allow when follow-up surface soldered, in the reflow soldering hot environment, still to guarantee its viscosity.Printed circuit board (PCB) has three-decker at least again: circuit layer, the insulating barrier of fitting with metal substrate and be exposed to outside resistance weldering protective layer.There is through hole at heat passage position at printed circuit board (PCB) and tack coat, and in the through hole, there is a convex closure on metal substrate and printed circuit board (PCB) composition surface.The convex closure surface can be directly and LED heat radiation position fit through soldering, forming be the heat passage that the good metal of thermal conductivity forms entirely, with the caloric value of LED efficiently to vertically transmission and of back to horizontal proliferation all around.For the ease of on metal substrate, forming convex closure, at the convex closure back one pit is arranged, in use the pit and the metal substrate back side can attach thermal interfacial material, can't influence its heat transfer property.For simplifying mould structure and the cost that forms convex closure, the convex closure perisporium can be an inclined-plane, is an angle theta with the metal substrate normal direction.When combining with the LED soldering, because the wetting and capillarity of solder flux and convex closure, solder flux can be filled the angle theta of convex closure side face and the slit between the through hole automatically, forms well to coat, and increases the weld force of LED and circuit board.For preventing short circuit, there is a dielectric to cut off around the circuit of circuit layer and the through hole.
Also disclosed the method for the printed circuit board (PCB) for preparing this metal substrate penetration heat path simultaneously.The manufacturing process of existing MCPCB be through laminating technology at metal substrate composite insulation layer regeneration circuit, therefore more difficult perforate is punched to metal substrate.The present invention is through changing preparation technology; Make the rigidity PCB or the flexible PCB of common non-metal base plate earlier; After the perforate with the metal substrate combined shaping of processed after MCPCB, thereby can significantly promote the vertical thermal conductivity of MCPCB with simple preparation technology, the low and suitable volume production of cost.Concrete preparation process is following:
1, a single-clad board is provided, can be designed to single layer board or multilayer circuit board, can adopt common FR4 rigid circuit board, also can adopt flexible electric circuit board by actual user demand.
2, paste one deck binding material at the single-clad board back side; This binding material can be selected epoxy jelly membrane, epoxy glass cloth bonding sheet or other resistant to elevated temperatures binding materials for use, can allow when follow-up LED surface soldered, in the reflow soldering hot environment, still to guarantee its viscosity.In the practical operation,, can cover one deck release liners on its surface, again it torn when bonding for the protection tack coat.
3, cut heat through-hole and profile at circuit board and tack coat thereof, the heat through-hole size shape is decided according to the cooling pad at LED encapsulation back.There is dielectric to cut off around circuit and the heat through-hole, can not communicates, in case short circuit.
4, cut metal substrate profile and form convex closure at a side surface.Metal substrate generally adopts plasticity good metal such as copper, aluminium, is convenient to the panel beating punching process, can develop and print a pit with punch die at the back that will form convex closure, under the Plastic Forming effect, can form convex closure.The height of convex closure should be slightly less than the thickness of circuit board, and the convex closure size shape is decided according to the cooling pad at LED encapsulation back.
5, pressing circuit board and metal substrate.Convex closure is alignd with heat through-hole, and under certain pressure and temperature action, tack coat is with circuit board and metal substrate close adhesion.
Description of drawings
Fig. 1 is the stratiform schematic cross-section of one embodiment of the invention
Fig. 2 is the schematic cross-section with multilayer circuit of one embodiment of the invention
Fig. 3 is one embodiment of the invention and LED applying sketch map
Fig. 4 is one embodiment of the invention and radiator applying sketch map
Fig. 5 is the circuit board perspective view consistent with metal substrate of one embodiment of the invention
Fig. 6 is the Rigid Flex MCPCB perspective view of one embodiment of the invention
Fig. 7 is the layer structure sketch map of an existing MCPCB
Fig. 8 A is preparation process 1 sketch map of one embodiment of the invention
Fig. 8 B is preparation process 2 sketch mapes of one embodiment of the invention
Fig. 8 C is preparation process 3 sketch mapes of one embodiment of the invention
Fig. 8 D is preparation process 4 sketch mapes of one embodiment of the invention
Fig. 8 E is preparation process 5 sketch mapes of one embodiment of the invention
Embodiment
Below in conjunction with embodiment and accompanying drawing the present invention is done further explain, but the scope that the present invention requires to protect is not limited to the scope that embodiment representes.Without departing from the present invention, can make the change of structure and others and as other embodiment, the various aspects of each embodiment and each different embodiment thereof can make up use in any suitable manner to it.So, accompanying drawing with detail will be counted as in essence descriptive and nonrestrictive.
Fig. 1 is the stratiform schematic cross-section of an embodiment of the printed circuit board (PCB) of metal substrate penetration heat path of the present invention.The printed circuit board (PCB) of this metal substrate penetration heat path mainly is made up of three parts: printed circuit board (PCB) 101, metal substrate 102 and the tack coat 103 that connects printed circuit board (PCB) 101 and metal substrate 102.The material of metal substrate 102 is the thermal conductivity good metal, like copper, aluminium or copper alloy, aluminium alloy.Tack coat 103 is epoxy jelly membrane, epoxy glass cloth bonding sheet or other resistant to elevated temperatures binding materials, can allow when follow-up LED surface soldered broken ring adhesion properties in the reflow soldering hot environment.Printed circuit board (PCB) 101 has three-decker at least again: at least one deck circuit layer 1011, the insulating barrier 1012 of fitting with metal substrate 102 and be exposed to outside resistance weldering protective layer 1013.Resistance weldering protective layer 1013 leaves perforate 1014 in the LED electrode area, and circuit layer 1011 is linked to each other with the LED electrode.There is through hole 104 at heat passage position at printed circuit board (PCB) 101 and tack coat 103.At through hole 104 tappings, metal substrate 102 has a convex closure 1031 with printed circuit board (PCB) 101 composition surfaces, and these convex closure 1031 surfaces are a plane and a little less than the outer surface of solder mask sheath 1013, are convenient to tight pressing printed circuit board (PCB) 101 and metal substrate 102.Directly fit through soldering with LED heat radiation position in convex closure 1031 surface, forming be the heat passage that the good metal of thermal conductivity forms entirely, with the caloric value of LED efficiently to the vertical transmission in back and to horizontal proliferation all around.For the ease of on metal substrate 102, forming convex closure 1031, at convex closure 1031 backs one pit 1032 is arranged, in use the pit 1032 and metal substrate 102 back sides can attach thermal interfacial material.In order to simplify mould structure and the cost that forms convex closure 1031, convex closure 1031 perisporiums can be an inclined-plane, are an angle theta with metal substrate 102 normal direction in addition.When combining with the LED soldering, because the wetting and capillarity of solder flux and convex closure 1031, solder flux can be filled the slit between convex closure 1031 side face angle theta and the through hole 104 automatically, forms well to coat, and increases the weld force of LED and circuit board.For preventing short circuit, circuit layer 1011 can not link to each other with through hole 104, must have a dielectric 1016 to cut off, and dielectric 1016 is filled to circuit layer 1011 spaces by resistance weldering protective layer 1013 and formed.
Fig. 2 is another embodiment stratiform schematic cross-section with multilayer board of metal substrate penetration heat path of the present invention.Form by three parts equally: printed circuit board (PCB) 101, metal substrate 102 and the tack coat 103 that connects printed circuit board (PCB) 101 and metal substrate 102.Be that with the difference of a last embodiment this printed circuit board (PCB) 101 is double-layer printing circuit board, has two-tier circuit layer 1011 and insulating barrier 1012.Through hole 104 runs through all layers of tack coat 103 and printed circuit board (PCB) 101.All circuit must keep open circuit with through hole 104, are cut off by dielectric 1016.Convex closure 1031 height and back pit 1032 on the metal substrate 102 should be made corresponding change with the thickness of printed circuit board (PCB) 101, make the outer surface of convex closure 1031 upper surfaces a little less than resistance weldering protective layer 1013.The rest may be inferred, and the printed circuit board (PCB) of metal substrate penetration heat path of the present invention can be more multilayer board, because heat-transfer path is that metal substrate 102 directly contacts with LED, therefore can keep good heat-conducting equally.
Fig. 3 is the printed circuit board (PCB) of metal substrate penetration heat path of the present invention and the schematic cross-section of LED applying.Be welded with LED 301 on the printed circuit board (PCB) 101; Convex closure 1031 on LED 301 back heat dissipation region and the metal substrate 102 is combined closely through soldering 302; Thereby the heat that LED 301 distributes is passed to metal substrate 102 apace, then via metal substrate 102 to the back vertically transmit and to around horizontal proliferation.Because the wetting and capillarity of soldering 302 flux and convex closure 1031; Solder flux can automatically fill convex closure 1031 top plan with and the slit at inclined-plane angle theta place on every side; Form good the coating, thereby increase the welding applying power of LED and circuit board, and form good heat-conducting medium.Electrode area at LED 301 is connected through soldering 302 and circuit layer 1011 electricity.
Fig. 4 is complete application implementation example of printed circuit board (PCB) of metal substrate penetration heat path of the present invention.Through soldering 302 welding fixed L ED 301, the circuit layer on LED 301 electrodes and the circuit board 101 is connected on printed circuit board (PCB), and the convex closure on heat dissipation region and the metal substrate 102 1031 is connected simultaneously.Connect metal substrate 102 and radiating element 402 at metal substrate 102 back sides through attaching thermal interfacial material 401; Utilize the soft characteristic of thermal interfacial material 401 matter under the effect of pressure, to fill pit 1032 simultaneously, thereby all can there be good thermo-contact at the metal substrate 102 whole back sides with radiating element 402.The heat that LED 301 distributes passes to metal substrate 102 apace; Vertically transmit and, dissipate to the back via metal substrate 102 then thereby can pass to radiating element 402 via thermal interfacial material 401 through the whole back side of metal substrate 102 to horizontal proliferation all around.
Fig. 5 is the circuit board of one embodiment of the invention and the sketch map of external circuit Pin locations.Circuit board 101 can adopt rigidity FR4 printed circuit board (PCB), also can adopt flexible electric circuit board, with the printed circuit board (PCB) of metal substrate 102 pressures and formation metal substrate penetration heat path.In this embodiment, circuit board 101 is in full accord with metal substrate 102 overall dimensions, and external circuit pin 501 all is arranged in the substrate scope, thereby constitutes the rigid circuit board of metal substrate penetration heat path.It is the rectangle that is confined to this illustrated example that the shape of circuit board has more than, and can be square, circle, hexagon or other shapes according to the installation needs, on circuit board and metal substrate, also location hole and mounting hole site can be set as required.
Fig. 6 is the printed circuit board (PCB) of metal substrate penetration heat path of the present invention and another embodiment sketch map of external circuit Pin locations.Be that with the maximum difference of a last embodiment this circuit board 101 adopts flexible electric circuit board; And overall dimension is different with metal substrate 102; Can be according to installing and outside wiring needs; Extension 601 through flexible electric circuit board is arranged at the substrate outside with circuit pin 501, thereby constitutes a kind of soft or hard bond base circuit board.Extension 601 can be arranged on diverse location and can be designed to difformity according to actual.Therefore; This embodiment has disclosed the printed circuit board (PCB) of metal substrate penetration heat path of the present invention can be under the prerequisite that guarantees the vertical heat conductivility of entire circuit plate; Process a kind of soft or hard bond base circuit board; Attractive in appearance and save the demand of outside wiring space to satisfy wiring, be suitable for the lightening design of product.
Fig. 7 is existing metal base printed circuit board stratiform schematic cross-section.Metal substrate 701 1 sides are covered with insulating barrier 702, and copper foil layer 703 is arranged on insulating barrier 702, are used for etched circuit and heat conductive pad 7031, and there is one deck resistance weldering protective layer 704 copper foil layer 703 tops.During application, through soldering layer 705 fixed L ED 706.The heat that LED 706 distributes passes to heat conductive pad 7031 via soldering layer 705, and heat must just can be conveyed to metal substrate 701 through insulating barrier 702 then.In whole heat-transfer path; Soldering layer 705; Copper Foil heat conductive pad 7031 and metal substrate 701 are metal material, and thermal conductivity is preferably arranged, but the thermal conductivity of insulating barrier 702 generally has only about 0.8～2.0W/mK; Become the bottleneck of entire heat dissipation path, cause vertical thermal conductivity of existing whole metal base printed circuit board can only reach 2～4W/mK.
Therefore the present invention is directed to the existing lower problem of the vertical thermal conductivity of MCPCB; Through improving the manufacture craft of existing metal base printed circuit board; Punch insulating barrier, circuit layer and the resistance weldering protective layer at heat passage position; Let metal substrate directly contact with the LED back, owing to removed the extremely low insulating barrier of heat passage position thermal conductivity, the heat-transfer path of whole M CPCB is directly become by original " metal copper foil-insulating barrier-metal substrate " and has only one deck " metal substrate "; Therefore vertical thermal conductivity of whole M CPCB is the thermal conductivity of metal substrate aluminium or copper, and vertical thermal conductivity that can have MCPCB now promotes nearly a hundred times.Below specify the preparation method of the printed circuit board (PCB) of metal substrate penetration heat path of the present invention:
Fig. 8 A is the sketch map of the preparation process 1 of one embodiment of the invention.The first step provides a single-clad board 101; At least contain one deck circuit layer 1011, a layer insulating 1012 and resistance weldering protective layer 1013; Resistance weldering protective layer 1013 leaves welding position 1014 and exposes fixedly electronic device of circuit 1015 solderings, and need not to reserve the Copper Foil cooling pad at electronic device heat passage position.This printed circuit board (PCB) can be designed to single layer board or multilayer circuit board by actual user demand, can adopt common FR4 rigid circuit board, also can adopt flexible electric circuit board.
Fig. 8 B is the sketch map of the preparation process 2 of one embodiment of the invention.Second step was that one deck tack coat 103 is pasted at single-clad board 101 back sides.This tack coat 103 can be selected epoxy jelly membrane, epoxy glass cloth bonding sheet or other resistant to elevated temperatures binding materials for use, can allow when follow-up LED surface soldered, in the reflow soldering hot environment, still to guarantee its viscosity.In the practical operation,, can cover one deck release liners on its surface, again it torn when bonding for protection tack coat 103.
Fig. 8 C is preparation process 3 sketch mapes of one embodiment of the invention.The 3rd step was to cut heat through-hole 104 and circuit board 101 peripheral shape together with tack coat 103.Heat through-hole 104 size shape are decided according to the cooling pad at LED encapsulation back.Circuit can not communicate with heat through-hole 104, is cut off by dielectric 1016, and dielectric 1016 is filled to circuit layer 1011 spaces by resistance weldering protective layer 1013 and formed.
Fig. 8 D is preparation process 4 sketch mapes of one embodiment of the invention.The 4th step was to cut metal substrate 102 profiles and form convex closure 1031 at a side surface.Can adopt the panel beating punching process to process, can develop and print a pit 1032 with punch die at the back that will form convex closure 1031, metal substrate 102 general copper, aluminium or its alloys of adopting all have good plasticity, under the effect of Plastic Forming, can form convex closure 1031.The height of convex closure 1031 is slightly less than the thickness of circuit board 101, and convex closure 1031 size shape are decided according to the cooling pad at LED encapsulation back.In order to simplify mould structure and the cost that forms convex closure 1031, convex closure 1031 perisporiums can be an inclined-plane, with metal substrate 102 normal direction θ in a certain angle.When combining with the LED soldering, because the wetting and capillarity of solder flux and convex closure 1031, solder flux can be filled the slit between convex closure 1031 side face angle theta and the through hole 104 automatically, forms well to coat, and increases the weld force of LED and circuit board.
Fig. 8 E is preparation process 5 sketch mapes of one embodiment of the invention.Last the 5th step is circuit board 101 and metal substrate 102 pressings.Convex closure 1031 is alignd with heat through-hole 104, and tack coat 103 is under certain pressure and temperature action, with circuit board 101 and metal substrate 102 close adhesion.
Though the said embodiment of reference shows especially and has described the present invention, one skilled in the art will appreciate that and can make change to its form and details, and can not depart from the scope of the present invention.Therefore, more than describe and be intended to provide example embodiment of the present invention, and the scope of the invention does not receive the restriction of this concrete example that provides.
Claims (15)
1. one kind promotes the printed circuit board (PCB) of vertical thermal conductivity through metal substrate penetration heat path, and comprising: one deck single-clad board is characterized in that: can be rigid circuit board, also can be flexible electric circuit board; One deck gummed tack coat is positioned at the single-clad board back, it is characterized by the high temperature resistant bonding material; At least one heat through-hole is characterized in that: run through single-clad board and gummed tack coat; The layer of metal substrate is characterized in that: fit with the single-clad board back side, at the heat through-hole corresponding position boss is arranged, the boss back side is to there being pit.
2. single-clad board according to claim 1 is characterized in that: can be single layer board and also can be multilayer circuit board.
3. single-clad board according to claim 1 is characterized in that: there is insulating protective layer at its back side, and there is resistance weldering protective layer in the front.
4. single-clad board according to claim 1 is characterized in that: big I of shape and metal substrate are in full accord, and fitting with metal substrate forms the rigid metal base circuit board.
5. single-clad board according to claim 1 is characterized in that: big I of shape and metal substrate are inconsistent, adopt flexible electric circuit board to protrude in metal substrate and form a kind of soft or hard bond base circuit board.
6. gummed tack coat according to claim 1 is characterized in that: the gummed tack coat is epoxy jelly membrane, epoxy glass cloth bonding sheet or other resistant to elevated temperatures binding materials.
7. heat through-hole according to claim 1 is characterized in that: its profile is consistent with the shape of the LED encapsulation back cooling pad that is carried.
8. heat through-hole according to claim 1 is characterized in that: heat through-hole and peripheral circuit line keep certain distance, in case short circuit.
9. metal substrate according to claim 1 is characterized in that: the metal substrate material is copper, aluminium or its alloy.
10. metal substrate according to claim 1 is characterized in that: metal substrate thickness is 0.5mm ~ 3.0mm.
11. the boss on the metal substrate according to claim 1 is characterized in that: boss relies on its back of drift punching press of respective shapes size to make metal substrate generation plastic deformation and is shaped.
12. the boss on the metal substrate according to claim 1 is characterized in that: the boss height should not be higher than the thickness of single-clad board.
13. the boss on the metal substrate according to claim 1 is characterized in that: boss perisporium and substrate surface normal direction are in a certain angle.
14. the boss on the metal substrate according to claim 1 is characterized in that: boss base profile size is consistent with heat through-hole profile size.
15. a preparation method who is used for the printed circuit board (PCB) of the said metal substrate penetration heat of claim 1 path may further comprise the steps: (1) preparation single-clad board can be made into rigid circuit board or flexible electric circuit board, single layer board or multilayer circuit board; (2) paste resistant to elevated temperatures binding material at the single-clad board back side; (3) stamping-out heat through-hole and profile on the single-clad board behind the gum; (4) cut metal substrate and develop and print convex closure; (5) metal substrate convex closure corresponding circuits plate heat through-hole, pressing single-clad board and metal substrate form a kind of printed circuit board (PCB) of metal substrate penetration heat path.
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| CN107371323A (en) * | 2017-08-07 | 2017-11-21 | 绵阳市维博电子有限责任公司 | A kind of heat dissipating method suitable for electronic water pump for automobile power device |
| CN111048651A (en) * | 2019-12-27 | 2020-04-21 | 广州市鸿利秉一光电科技有限公司 | High-reflectivity UVLED substrate and production method |
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