CN114843254A - Mini LED backlight module and manufacturing method thereof - Google Patents
Mini LED backlight module and manufacturing method thereof Download PDFInfo
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- CN114843254A CN114843254A CN202210457978.5A CN202210457978A CN114843254A CN 114843254 A CN114843254 A CN 114843254A CN 202210457978 A CN202210457978 A CN 202210457978A CN 114843254 A CN114843254 A CN 114843254A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The application provides a Mini LED backlight module and a manufacturing method thereof, wherein the Mini LED backlight module comprises a plurality of LED chips, and each LED chip is provided with a chip bonding pad; the PCB comprises a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate; the circuit board comprises a plurality of adapter plate units, a plurality of circuit boards and a circuit board, wherein each adapter plate unit is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, and the front surface bonding pad and the back surface bonding pad are electrically connected; the back surface of the adapter plate unit is attached to the PCB substrate, and the plurality of back surface bonding pads are electrically connected with the plurality of PCB bonding pads in a one-to-one correspondence manner; the plurality of LED chips are inversely arranged on the front surfaces of the plurality of adapter plate units in a one-to-one correspondence manner, and the plurality of chip bonding pads are electrically connected with the plurality of front bonding pads in a one-to-one correspondence manner; the area of the back bonding pad is larger than that of the front bonding pad. The manufacturing method of the Mini LED backlight module can solve the technical problem that the cost is high when the Mini LED backlight module is manufactured by adopting an inverted COB packaging process.
Description
Technical Field
The application relates to the technical field of Mini LED backlight modules, in particular to a Mini LED backlight module and a manufacturing method thereof.
Background
In the manufacturing process of the Mini LED backlight module, because the flip COB packaging process does not need gold wires and a support for packaging, the heat dissipation is facilitated, and the cost advantage is achieved after the large scale, so that a plurality of the existing Mini LED backlight modules can be manufactured by the flip COB packaging process.
The conventional flip chip COB packaging process mainly comprises the step of directly printing a Mini LED chip on a PCB substrate, and because the Mini LED chip is small in size and a bonding pad on the Mini LED chip is also small, the process has high requirements on the size precision (such as the size of the bonding pad and the distance between the bonding pads) of the PCB substrate and the precision (such as solder paste printing precision, die bonding precision, reflow soldering precision and the like) of the process in order to ensure the accurate bonding of the chip and the PCB substrate.
And the high requirement to the PCB base plate makes the PCB base plate when making, in case there is a local problem, whole PCB base plate all can scrap, leads to the disability rate of PCB base plate itself very high. Moreover, even though the PCB substrate has no problem, the requirement on the process precision of printing the Mini LED chip on the PCB is very high, once the problem occurs in the printing process, the whole PCB substrate is scrapped due to the fact that the Mini LED chip cannot be repaired, and further the product reject ratio and the cost are very high.
Disclosure of Invention
The embodiment of the application provides a Mini LED backlight module to solve the technical problem of high cost when a flip COB packaging process is adopted to manufacture the Mini LED backlight module.
In order to achieve the purpose, the Mini LED backlight module provided by the application comprises a plurality of LED chips, wherein a chip bonding pad is formed on each LED chip; the PCB comprises a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate; the circuit board comprises a plurality of adapter board units, a circuit board and a circuit board, wherein each adapter board unit is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, and the front surface bonding pad and the back surface bonding pad are electrically connected; the back surface of the adapter plate unit is attached to the PCB substrate, and the plurality of back surface bonding pads are electrically connected with the plurality of PCB bonding pads in a one-to-one correspondence manner; the LED chips are inversely arranged on the front surfaces of the adapter plate units in a one-to-one correspondence mode, and the chip bonding pads are electrically connected with the front bonding pads in a one-to-one correspondence mode; the area of the back bonding pad is larger than that of the front bonding pad.
Optionally, in an embodiment, the front pads include a front positive pad and a front negative pad, and the back pads include a back positive pad and a back negative pad; the front positive electrode bonding pad is electrically connected with the back positive electrode bonding pad, and the front negative electrode bonding pad is electrically connected with the back negative electrode bonding pad; the distance between the back positive electrode bonding pad and the back negative electrode bonding pad is larger than the distance between the front positive electrode bonding pad and the front negative electrode bonding pad.
Optionally, in an embodiment, the PCB pad includes a PCB positive pad and a PCB negative pad, and a distance between the PCB positive pad and the PCB negative pad is not less than a distance between the back positive pad and the back negative pad.
Optionally, in an embodiment, an area of the PCB pad is not smaller than an area of the back pad.
Optionally, in an embodiment, the thickness of the interposer unit is not less than 0.1 mm and not more than 0.2 mm.
Optionally, in an embodiment, the interposer unit is made of BT material or BT-like material.
Optionally, in an embodiment, the adapter plate unit has a square shape.
The application also provides a manufacturing method of the Mini LED backlight module, which comprises the following steps:
providing an adapter plate, dividing the adapter plate into a plurality of blocks, wherein each block is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, the front surface bonding pad and the back surface bonding pad are electrically connected, and the area of the back surface bonding pad is larger than that of the front surface bonding pad;
providing a plurality of LED chips, wherein each LED chip is provided with a chip bonding pad, and the chip bonding pads and the front bonding pads are electrically connected in a one-to-one correspondence manner, so that the LED chips are inversely arranged on the front surfaces of the blocks;
cutting the adapter plate into a plurality of adapter plate units by taking one block with the LED chips in an inverted mode as a unit;
providing a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate, and the PCB bonding pads are electrically connected with the back bonding pads in a one-to-one correspondence manner, so that the adapter plate unit is attached to the PCB substrate.
Optionally, in an embodiment, when the back pad is formed on the back surface, the back pad is processed by using a gold plating process.
Optionally, in an embodiment, the plurality of chip pads and the plurality of front pads are electrically connected in a one-to-one correspondence by first solder paste soldering, and the plurality of PCB pads and the plurality of back pads are electrically connected in a one-to-one correspondence by second solder paste soldering; the melting point temperature of the first solder paste is greater than the melting point temperature of the second solder paste.
The Mini LED backlight module that this application provided is with the several LED chip flip-chip earlier on the keysets unit, then with several keysets unit welding on the PCB base plate. Compare in the traditional scheme with direct flip-chip of LED chip on the PCB base plate, this scheme is earlier with LED chip flip-chip on the keysets unit for flip-chip COB packaging technology's high requirement has just transferred to the keysets unit from the PCB base plate on, has had equally high requirement to the size precision of the face pad promptly and the technological precision that the LED chip assembled on the keysets unit. However, since the interposer unit only performs the switching function and several interposer units are used separately, even if there is a problem in the dimensional accuracy of the front pads on the interposer unit or a problem occurs when the LED chip is mounted on the interposer unit, only a single interposer unit is scrapped, and the scrapping cost is much lower than that of scrapping the entire PCB substrate.
In addition, because the LED chip is soldered to the PCB substrate through the interposer unit, the size of the PCB pad on the PCB substrate may be designed not according to the chip pad on the LED chip, but according to the back pad on the interposer unit. It can be understood that the size of the adapter plate unit bearing the LED chip is larger than that of the LED chip, the area of the back bonding pad is larger than that of the front bonding pad, and then the PCB bonding pad on the PCB substrate can be designed to be larger than that of the original PCB bonding pad, namely the precision requirement of the PCB substrate during manufacturing can be greatly reduced, and the rejection rate of the PCB substrate during manufacturing is greatly reduced. Simultaneously, compare in the traditional scheme with very little chip pad direct welding to PCB pad, the probability that goes wrong when welding the bigger back pad of area PCB pad is lower, and then can effectual improvement Mini LED backlight unit's yields, reduction in manufacturing cost.
Therefore, the Mini LED backlight module provided by the application effectively solves the technical problem of high cost when the Mini LED backlight module is manufactured by adopting an inverted COB packaging process.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic partial structural diagram of an embodiment of a Mini LED backlight module according to the present application;
FIG. 2 is a schematic structural diagram of an embodiment of a Mini LED backlight module according to the present application;
FIG. 3 is a schematic structural diagram of an embodiment of a transfer board according to the present application for mounting LED chips thereon;
FIG. 4 is a flowchart illustrating a manufacturing method of a Mini LED backlight module according to an embodiment of the present application;
fig. 5 is a flowchart of step S20 in fig. 4;
fig. 6 is a flowchart of step S40 in fig. 4.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | Mini |
22b | Front negative |
40 | |
| 20 | |
23 | |
50 | |
| 21 | |
23a | Back |
51 | |
| 22 | |
23b | Back |
51a | PCB |
| 22a | Front |
30 | |
51b | PCB negative electrode pad |
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a Mini LED backlight module to solve the problem of high cost when a flip COB packaging process is adopted to manufacture the Mini LED backlight module. The following description will be made with reference to the accompanying drawings.
In order to achieve the above purpose, as shown in fig. 1 and fig. 2, a Mini LED backlight module provided by the present application includes a plurality of LED chips, each of which has a chip pad formed thereon; the PCB comprises a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate; the circuit board comprises a plurality of adapter board units, a circuit board and a circuit board, wherein each adapter board unit is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, and the front surface bonding pad and the back surface bonding pad are electrically connected; the back surface of the adapter plate unit is attached to the PCB substrate, and the plurality of back surface bonding pads are electrically connected with the plurality of PCB bonding pads in a one-to-one correspondence manner; the LED chips are inversely arranged on the front surfaces of the adapter plate units in a one-to-one correspondence mode, and the chip bonding pads are electrically connected with the front bonding pads in a one-to-one correspondence mode; the area of the back bonding pad is larger than that of the front bonding pad.
The LED chip 30 is a Mini LED chip 30 with a flip-chip structure, that is, the LED chip 30 includes a sapphire substrate, an N-type GaN layer, a light emitting layer, and a P-type GaN layer from top to bottom, and a chip pad is formed on one side of the P-type GaN layer. Specifically, each of the chip pads on the LED chip 30 generally includes a P-electrode pad and an N-electrode pad that are disposed at an interval, and when the LED chip 30 is assembled on the interposer unit 40, the P-electrode pad is electrically connected to the positive electrode pad 22a on the interposer unit 40, and the N-electrode pad is electrically connected to the negative electrode pad 22b on the interposer unit 40. The chip pads and the front pads 22 on the interposer unit 40 can be electrically connected by conductive adhesive or by solder paste. After the LED chip 30 is assembled on the interposer unit 40, a protective adhesive may be filled between the LED chip 30 and the interposer unit 40 as needed. For the formation process or other structural components of the LED chip 30, reference may be made to the existing flip-chip LED chip technology, and detailed description thereof will not be given here.
Since the LED chip 30 is mounted on the PCB substrate 50 through the interposer unit 40, when a plurality of PCB pads 51 are designed on the PCB substrate 50, the PCB pads 51 can be designed in a size synchronized with the back pads 23 on the interposer unit 40, and the size are mutually referred and coordinated, so that the precision difficulty required to be met when the interposer unit 40 is mounted on the PCB substrate 50 is reduced, and the reject ratio and the manufacturing cost are reduced. Similarly, as shown in fig. 6, the PCB land 51 generally includes a PCB positive land 51a and a PCB negative land 51b disposed at an interval, the PCB positive land 51a is electrically connected to the back positive land 23a, and the PCB negative land 51b is electrically connected to the back negative land 23 b. The PCB land 51 and the back land 23 may be electrically connected by conductive paste or by solder paste. After the interposer unit 40 is assembled on the PCB substrate 50, the Mini LED backlight module 10 can be manufactured after the processes of inspection, testing, and the like are performed.
As shown in fig. 3, the interposer unit 40 may be cut from a larger interposer 20, and the interposer 20 may be a PCB board structure made of a BT board or a BT-like board. And because the interposer unit 40 mainly plays a role in switching between the LED chip 30 and the PCB substrate 50, the interposer unit 40 (interposer 20) does not need to have higher performance as the PCB substrate 50, and only needs to be able to meet the basic requirements of routing and temperature.
As shown in fig. 1, the area of the back pad 23 is larger than that of the front pad 22. Wherein, the area refers to the windowing area or the copper exposure area of the bonding pad. It will be appreciated that the front pads 22 on the interposer unit 40 need to be sized to fit the die pads of the LED chips 30 so that the higher precision die pads can be better soldered to the front pads 22, and then the LED chips 30 are mounted on the PCB substrate 50 through the interposer unit 40. When the area of the back bonding pad 23 is larger than the area of the front bonding pad 22, that is, the area of the back bonding pad 23 is larger than the area of the chip bonding pad, which is equivalent to enlarging the bonding pad area on the LED chip 30 for welding with the PCB substrate 50, at this time, the PCB substrate 50 can also be welded with the back bonding pad 23 through the PCB bonding pad 51 with a larger area, so that the precision requirement when the LED chip 30 is assembled on the PCB substrate 50 can be greatly reduced, which is beneficial to reducing the fraction defective caused by errors when the LED chip 30 is assembled on the PCB substrate 50, thereby reducing the manufacturing cost.
In summary, it can be understood that the Mini LED backlight module provided in the present application flip-chip the LED chips 30 on the interposer unit 40, and then solder the interposer units 40 to the PCB substrate 50. Compared with the traditional scheme of directly inversely installing the LED chip on the PCB substrate, the scheme firstly inversely installs the LED chip 30 on the adapter plate unit 40, so that the high requirement of the inversely installed COB packaging process is transferred to the adapter plate unit 40 from the PCB substrate 50, namely, the size precision of the front surface bonding pad 22 and the process precision of assembling the LED chip 30 on the adapter plate unit 40 have the same high requirement. However, since the interposer unit 40 only functions as a transfer and several interposer units 40 are used separately, even if there is a problem in the dimensional accuracy of the front pads 22 on the interposer unit 40 or a problem occurs when the LED chip 30 is mounted on the interposer unit 40, only a single interposer unit 40 is scrapped, and the scrapping cost is much lower than that of scrapping the entire PCB substrate 50.
In addition, since the LED chip 30 is soldered to the PCB substrate 50 through the interposer unit 40, the size of the PCB pad 51 on the PCB substrate 50 may not be designed according to the chip pad with higher precision on the LED chip 30, but may be designed according to the back pad 23 on the interposer unit 40. It can be understood that the size of the interposer unit 40 carrying the LED chip 30 is larger than that of the LED chip 30, the area of the back pad 23 is larger than that of the front pad 22, and further the PCB pad 51 on the PCB substrate 50 can be designed to be larger than the original size, that is, the accuracy requirement of the PCB substrate 50 during manufacturing is greatly reduced, which greatly reduces the rejection rate of the PCB substrate 50 during manufacturing. Meanwhile, compared with the traditional scheme of directly welding a small chip bonding pad to a PCB bonding pad, the probability of problems occurring when the back bonding pad 23 with a larger area is welded to the PCB bonding pad 51 is lower, the yield of the Mini LED backlight module 10 can be effectively improved, and the manufacturing cost is reduced.
Optionally, in an embodiment, as shown in fig. 1, the front pads 22 include a front positive pad 22a and a front negative pad 22b, and the back pads 23 include a back positive pad 23a and a back negative pad 23 b; the front positive electrode pad 22a is electrically connected with the back positive electrode pad 23a, and the front negative electrode pad 22b is electrically connected with the back negative electrode pad 23 b; the distance between the back surface positive electrode pad 23a and the back surface negative electrode pad 23b is larger than the distance between the front surface positive electrode pad 22a and the front surface negative electrode pad 22 b. When designing and manufacturing the bonding pad, the dimensional accuracy of the bonding pad comprises the area size of the positive bonding pad and the negative bonding pad, and the distance between the positive bonding pad and the negative bonding pad. It can be understood that the smaller the distance between the positive electrode pad and the negative electrode pad is, the greater the difficulty of accurate bonding is, and the higher the requirement on process precision is.
Therefore, since the pitch between the front positive electrode pad 22a and the front negative electrode pad 22b needs to be adapted to the pitch between the P electrode pad and the N electrode pad on the LED chip 30, when the pitch between the back positive electrode pad 23a and the back negative electrode pad 23b is larger than the pitch between the front positive electrode pad 22a and the front negative electrode pad 22b, the pitch between the back positive electrode pad 23a and the back negative electrode pad 23b is also larger than the pitch between the P electrode pad and the N electrode pad. The LED chip 30 is welded to the PCB substrate 50 through the back positive electrode pad 23a and the back negative electrode pad 23b on the adapter plate unit 40, which is equivalent to enlarging the distance between two electrode pads on the LED chip 30 that can be welded to the PCB substrate 50, reducing the process precision requirement when the LED chip 30 is assembled to the PCB substrate 50, and is beneficial to improving the yield and reducing the manufacturing cost.
Optionally, in an embodiment, as shown in fig. 2, an area of the PCB pad 51 is not smaller than an area of the back pad 23. Specifically, the area of the PCB pad 51 may be the same as the area of the back pad 23, or may be larger than the area of the back pad 23, so that the manufacturing accuracy of the PCB substrate 50 may be reduced, and the rejection rate of the PCB substrate 50 during manufacturing may be reduced. Even the Mini LED backlight module 10 can be manufactured by directly using the PCB substrate 50 of the conventional specification, thereby reducing the manufacturing cost.
In another embodiment, as shown in fig. 2, the PCB land 51 includes a PCB positive land 51a and a PCB negative land 51b, and a distance between the PCB positive land 51a and the PCB negative land 51b is not less than a distance between the back positive land 23a and the back negative land 23 b. Specifically, the interval between the PCB positive electrode pad 51a and the PCB negative electrode pad 51b may be equal to or greater than the interval between the back positive electrode pad 23a and the back negative electrode pad 23 b. It can be understood that the larger the distance between the PCB positive electrode pad 51a and the PCB negative electrode pad 51b is, the lower the requirement for the dimensional accuracy when the PCB substrate 50 is manufactured and the requirement for the process accuracy when the interposer unit 40 is welded on the PCB substrate 50 are, the easier the interposer unit 40 is to accurately bond the LED chip 30 to the PCB substrate 50, which is beneficial to improving the product yield and reducing the manufacturing cost, thereby realizing considerable economic benefits.
Optionally, in an embodiment, the thickness of the interposer unit 40 is not less than 0.1 mm and not more than 0.2 mm, for example, may be 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, and the like. It can be understood that if the thickness of the interposer unit 40 is less than 0.1 mm, the manufacturing of the interposer unit 40 itself and the mounting difficulty of the flip-chip LED chip 30 are both large, which not only affects the efficiency, but also results in a high defective rate. If the thickness of the interposer unit 40 is greater than 0.2 mm, a large height difference (compared to the height on the PCB substrate 50 before the LED chips 30 are not mounted) is generated after the interposer unit 40 is mounted on the PCB substrate 50, and an optical defect is caused by the excessively large height difference, thereby affecting the performance of the Mini LED backlight module 10. Therefore, when the thickness range of the adapter plate unit 40 is between 0.1 mm and 0.2 mm, the mounting of the LED chip 30 on the adapter plate unit 40 is facilitated, and the structure of the Mini LED backlight module 10 is further enabled to be added with the adapter plate unit 40 without causing other negative effects, so that the original good performance of the Mini LED backlight module 10 is ensured.
Alternatively, in one embodiment, the interposer unit 40 is made of BT material or BT-like material, it can be appreciated that BT material and BT-like material are currently thinner resin substrates, which can make the thickness of the interposer unit 40 be in the range of 0.1 mm to 0.2 mm.
In another embodiment, the shape of the interposer unit 40 is square, and the interposer unit 40 with a square structure is not only easier to cut, but also beneficial to positioning when being mounted on the PCB substrate 50, thereby improving bonding efficiency and accuracy.
In the embodiment of the present application, please refer to fig. 1 to 4, the method for manufacturing the Mini LED backlight module 10 includes the following steps:
step S10: the method comprises the steps of providing an adapter plate 20, dividing the adapter plate 20 into a plurality of blocks 21, wherein each block 21 is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad 22 is formed on the front surface, a back surface bonding pad 23 is formed on the back surface, the front surface bonding pad 22 is electrically connected with the back surface bonding pad 23, and the area of the back surface bonding pad is larger than that of the front surface bonding pad.
The interposer 20 may be a PCB structure made of a BT board or a BT-like board, and because the interposer 20 mainly performs a transferring function between the LED chip 30 and the PCB substrate 50, the interposer 20 does not need to have a higher performance as the PCB substrate 50, and only needs to meet the basic requirements of routing and temperature. The size of the interposer 20 may be set according to the size of the PCB substrate 50 or the number of LED chips 30 to be mounted, and the shape of the interposer 20 may be a square plate and have opposite front and back surfaces.
As shown in fig. 3, this step further divides the interposer 20 into a plurality of blocks 21, specifically, the plurality of blocks 21 may be divided by drawing grid lines on the front and back surfaces of the interposer 20, and the specific number of the blocks 21 may be the same as the number of the LED chips 30 actually required to be mounted, or may be greater than the number of the LED chips 30 actually required to be mounted, so as to avoid the situation that some blocks 21 have problems and some LED chips 30 are mounted everywhere.
As shown in fig. 1, each block 21 has a front pad 22 formed on the front surface and a back pad 23 formed on the back surface. Generally, the front pads 22 include front positive pads 22a and front negative pads 22b disposed at intervals, and the back pads 23 include back positive pads 23a and back negative pads 23 b. The electrical connection between the front pad 22 and the back pad 23 specifically means that the front positive pad 22a is electrically connected to the back positive pad 23a, and the front negative pad 22b is electrically connected to the back negative pad 23 b. The front pads 22 and the back pads 23 may be electrically connected to each other by wires arranged in the interposer 20, or may be electrically connected directly by via holes.
Step S20: providing a plurality of LED chips 30, forming a chip pad on each LED chip 30, electrically connecting the chip pads with the front pads 22 in a one-to-one correspondence manner, so that the LED chips 30 are flip-chip mounted on the front surface of the block 21.
The LED chip 30 is a Mini LED chip 30 with a flip-chip structure, that is, the LED chip 30 includes a sapphire substrate, an N-type GaN layer, a light emitting layer, and a P-type GaN layer from top to bottom, and a chip pad is formed on one side of the P-type GaN layer. Specifically, each of the chip pads on the LED chip 30 generally includes a P electrode pad and an N electrode pad that are disposed at an interval, and when the LED chip 30 is assembled on the interposer 20, the P electrode pad is electrically connected to the positive electrode pad 22a on the interposer 20, and the N electrode pad is electrically connected to the negative electrode pad 22b on the interposer 20. The chip pads and the front pads 22 on the interposer 20 can be electrically connected by conductive paste or by solder paste. After the LED chip 30 is assembled on the interposer 20, a protective adhesive may be filled between the LED chip 30 and the interposer 20 as needed. For the formation process or other structural components of the LED chip 30, reference may be made to the existing flip-chip LED chip technology, and a detailed description thereof will not be provided herein.
Step S30: the interposer 20 is cut into a plurality of interposer units 40 in units of one block 21 to which the LED chip 30 is flip-mounted.
Specifically, as shown in fig. 1 and 3, after the plurality of LED chips 30 are respectively flip-mounted on the plurality of blocks 21 in a one-to-one correspondence, the interposer 20 is cut into a plurality of interposer units 40 by taking one block 21 as a unit, that is, one interposer unit 40 includes one block 21 and one LED chip 30 flip-mounted on the block 21. The size and shape of the interposer unit 40 are not specifically limited herein, and may be the same as the divided block 21, or smaller than the block 21, or may be designed in corresponding size and shape according to the size of the PCB substrate 50 or the distance between the PCB pads 51 on the PCB substrate 50.
In addition, during cutting, the cutting can be performed by laser cutting, or by stamping with a stamping die, or by other methods capable of cutting the adapter plate 20, and the specific method can be selected according to actual conditions. The plurality of cut interposer units 40 may be supported by a chip braid, or may be directly supported by a blue film originally used for supporting the LED chips 30, and the plurality of cut interposer units 40 are transported to the next process.
Step S40: providing a PCB substrate 50, wherein a plurality of PCB pads 51 are formed on the PCB substrate 50, and the PCB pads 51 and the back pads 23 are electrically connected in a one-to-one correspondence manner, so that the adapter plate unit 40 is installed on the PCB substrate 50.
Since the LED chip 30 is assembled on the PCB substrate 50 through the interposer unit 40, when the PCB substrate 50 is designed with a plurality of PCB pads 51, the PCB pads 51 can be designed in a size synchronized with the back pads 23 on the interposer unit 40, and the two pads are mutually referred and coordinated, so that the accuracy difficulty required to be met when the interposer unit 40 is assembled on the PCB substrate 50 is lower, and the reject ratio and the manufacturing cost are further reduced. Similarly, as shown in fig. 2, the PCB land 51 generally includes a PCB positive land 51a and a PCB negative land 51b disposed at an interval, the PCB positive land 51a is electrically connected to the back positive land 23a, and the PCB negative land 51b is electrically connected to the back negative land 23 b. The PCB land 51 and the back land 23 may be electrically connected by conductive paste or by solder paste. After the interposer unit 40 is assembled on the PCB substrate 50, the Mini LED backlight module 10 can be manufactured after the processes of inspection, testing, and the like are performed.
In summary, in the method for manufacturing a Mini LED backlight module provided in the present application, the LED chips 30 are flip-mounted on the interposer unit 40, and then the interposer units 40 are soldered to the PCB substrate 50. Compared with the traditional scheme of directly inversely installing the LED chip on the PCB substrate, the scheme firstly inversely installs the LED chip 30 on the adapter plate unit 40, so that the high requirement of the inversely installed COB packaging process is transferred to the adapter plate unit 40 from the PCB substrate 50, namely, the size precision of the front surface bonding pad 22 and the process precision of assembling the LED chip 30 on the adapter plate unit 40 have the same high requirement. However, since the interposer unit 40 only functions as a transfer and several interposer units 40 are used separately, even if there is a problem in the dimensional accuracy of the front pads 22 on the interposer unit 40 or a problem occurs when the LED chip 30 is mounted on the interposer unit 40, only a single interposer unit 40 is scrapped, and the scrapping cost is much lower than that of scrapping the entire PCB substrate 50.
In addition, since the LED chip 30 is soldered to the PCB substrate 50 through the interposer unit 40, the size of the PCB pad 51 on the PCB substrate 50 may not be designed according to the chip pad with higher precision on the LED chip 30, but may be designed according to the back pad 23 on the interposer unit 40. It can be understood that the size of the interposer unit 40 carrying the LED chip 30 is larger than that of the LED chip 30, the area of the back pad 23 is larger than that of the front pad 22, and further the PCB pad 51 on the PCB substrate 50 can be designed to be larger than the original size, that is, the accuracy requirement of the PCB substrate 50 during manufacturing is greatly reduced, which greatly reduces the rejection rate of the PCB substrate 50 during manufacturing. Meanwhile, compared with the traditional scheme of directly welding a small chip bonding pad to a PCB bonding pad, the probability of problems occurring when the back bonding pad 23 with a larger area is welded to the PCB bonding pad 51 is lower, the yield of the Mini LED backlight module 10 can be effectively improved, and the manufacturing cost is reduced.
Optionally, in an embodiment, as shown in fig. 5, step S20 includes:
s21: providing a plurality of LED chips 30, wherein each LED chip 30 is provided with a chip bonding pad;
s22: coating a first solder paste on the front surface pads 22 of the block 21;
s23: a plurality of the chip bonding pads are correspondingly attached to the front bonding pads 22 one by one through the first solder paste;
s24: placing the adapter plate 20 with the plurality of LED chips 30 attached thereon into a reflow soldering furnace, sintering and solidifying the first solder paste to electrically connect the chip bonding pads and the front bonding pads 22;
s25: the interposer 20 is taken out from the reflow oven, and the flip-chip mounting of the LED chip 30 on the front surface of the block 21 is completed.
Meanwhile, as shown in fig. 6, step S40 includes:
s41: providing a PCB substrate 50, wherein a plurality of PCB pads 51 are formed on the PCB substrate 50;
s42: coating a second solder paste on the PCB pad 51;
s43: the plurality of adapter plate units 40 are correspondingly attached to the plurality of PCB pads 51 through the second solder paste one by one;
s44: placing the PCB substrate 50 with the plurality of interposer units 40 attached thereon into a reflow furnace, sintering and solidifying the second solder paste to electrically connect the back pads 23 and the PCB pads 51;
s45: and taking the PCB substrate 50 out of the reflow oven to finish the mounting of the adapter plate unit 40 on the PCB substrate 50.
As can be seen from the above process steps, the interposer unit 40 needs to enter the reflow oven twice, that is, the interposer unit enters the reflow oven together with the uncut interposer 20 for the first time, and enters the reflow oven with the PCB substrate 50 for the second time. Therefore, in order to protect the front pads 22 and the back pads 23 on the interposer 20 before the Mini LED backlight module 10 is manufactured, and ensure the smooth soldering of the pads, when the front pads 22 are formed on the front surface, the front pads 22 are processed by using an OSP (Organic solder resist film/copper protecting agent) process, so that the front pads 22 can be protected by the OSP before the soldering with the chip pads is actually completed, and when the interposer 20 is placed in a reflow furnace, the OSP film covering the front pads 22 is easily and rapidly removed by the flux, so that the exposed front pads 22 can be combined with the melted first solder paste to form a firm solder joint in a very short time, and the stable soldering and electrical connection between the front pads 22 and the chip pads can be realized.
If the back pads 23 are also processed by using the OSP process, when the interposer 20 is placed in the reflow oven, the OSP film on the back pads 23 is removed by the flux at a high temperature, and at this time, the back pads 23 are exposed and easily oxidized after the interposer 20 is taken out from the reflow oven, which is not favorable for the subsequent electrical connection with the PCB pads 51. Therefore, when the back pad 23 is formed on the back surface, the back pad 23 is processed by a gold plating process, that is, palladium is replaced on the surface of the back pad 23 by a chemical reaction, a nickel-phosphorus alloy layer is chemically plated on the basis of palladium nuclei, and then a gold layer is plated on the surface of nickel by the replacement reaction. And furthermore, the problem that the OSP film is invalid when the back bonding pad 23 enters a reflow oven for the first time after the OSP process is also carried out is solved, and the smooth proceeding of the subsequent process is ensured.
Optionally, in an embodiment, a plurality of the chip pads and a plurality of the front pads 22 are electrically connected in a one-to-one correspondence by first solder paste soldering, and a plurality of the PCB pads 51 and a plurality of the back pads 23 are electrically connected in a one-to-one correspondence by second solder paste soldering; the melting point temperature of the first solder paste is greater than the melting point temperature of the second solder paste. Similarly, as can be seen from the above steps S20 and S40, the first solder paste between the chip pad and the front pad 22 enters the reflow furnace in step S20, and then enters the reflow furnace again in the subsequent step S40 after being sintered and solidified. Therefore, in order to prevent the first solder paste from being re-melted when entering the reflow oven for the second time, the scheme also enables the melting point temperature of the first solder paste to be higher than that of the second solder paste, for example, the first solder paste can adopt high-temperature solder paste, and the second solder paste adopts medium-temperature solder paste or low-temperature solder paste; or the first solder paste adopts medium-temperature solder paste, and the second solder paste adopts low-temperature solder paste. Due to the design, the problem of unstable connection or poor electric contact between the chip bonding pad and the front bonding pad 22 caused by remelting of the first solder paste can be avoided, the reject ratio can be reduced, and the reliability of the Mini LED backlight module 10 can be ensured.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The method for manufacturing the Mini LED backlight module provided in the embodiment of the present application is described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A Mini LED backlight module is characterized by comprising:
the LED chip comprises a plurality of LED chips, wherein a chip bonding pad is formed on each LED chip;
the PCB comprises a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate; and the number of the first and second groups,
the circuit board comprises a plurality of adapter plate units, a plurality of circuit boards and a circuit board, wherein each adapter plate unit is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, and the front surface bonding pad and the back surface bonding pad are electrically connected;
the back surface of the adapter plate unit is attached to the PCB substrate, and the plurality of back surface bonding pads are electrically connected with the plurality of PCB bonding pads in a one-to-one correspondence manner;
the LED chips are inversely arranged on the front surfaces of the adapter plate units in a one-to-one correspondence mode, and the chip bonding pads are electrically connected with the front bonding pads in a one-to-one correspondence mode;
the area of the back bonding pad is larger than that of the front bonding pad.
2. The Mini LED backlight module of claim 1, wherein the front side pads comprise a front side positive pad and a front side negative pad, and the back side pads comprise a back side positive pad and a back side negative pad;
the front positive electrode bonding pad is electrically connected with the back positive electrode bonding pad, and the front negative electrode bonding pad is electrically connected with the back negative electrode bonding pad;
the distance between the back positive electrode bonding pad and the back negative electrode bonding pad is larger than the distance between the front positive electrode bonding pad and the front negative electrode bonding pad.
3. The Mini LED backlight module of claim 2, wherein the PCB pads comprise a PCB positive pad and a PCB negative pad, and the distance between the PCB positive pad and the PCB negative pad is not less than the distance between the back positive pad and the back negative pad.
4. The Mini LED backlight module of claim 1, wherein the area of the PCB pads is not less than the area of the back side pads.
5. The Mini LED backlight module of any one of claims 1 to 4, wherein the thickness of the interposer unit is not less than 0.1 mm and not more than 0.2 mm.
6. The Mini LED backlight module of claim 5, wherein the interposer unit is made of BT material or BT-like material.
7. The Mini LED backlight module of any one of claims 1 to 4, wherein the interposer unit is square in shape.
8. A manufacturing method of a Mini LED backlight module is characterized by comprising the following steps:
providing an adapter plate, dividing the adapter plate into a plurality of blocks, wherein each block is provided with a front surface and a back surface which are opposite to each other, a front surface bonding pad is formed on the front surface, a back surface bonding pad is formed on the back surface, the front surface bonding pad and the back surface bonding pad are electrically connected, and the area of the back surface bonding pad is larger than that of the front surface bonding pad;
providing a plurality of LED chips, wherein each LED chip is provided with a chip bonding pad, and the chip bonding pads and the front bonding pads are electrically connected in a one-to-one correspondence manner, so that the LED chips are inversely arranged on the front surfaces of the blocks;
cutting the adapter plate into a plurality of adapter plate units by taking one block with the LED chips in an inverted mode as a unit;
providing a PCB substrate, wherein a plurality of PCB bonding pads are formed on the PCB substrate, and the PCB bonding pads are electrically connected with the back bonding pads in a one-to-one correspondence manner, so that the adapter plate unit is attached to the PCB substrate.
9. The method for manufacturing a Mini LED backlight module according to claim 8, wherein the back pads are processed by a gold plating process when the back pads are formed on the back surface.
10. The method of claim 8, wherein the plurality of die pads are electrically connected to the plurality of front pads in a one-to-one correspondence by a first solder paste solder joint, and the plurality of PCB pads are electrically connected to the plurality of back pads in a one-to-one correspondence by a second solder paste solder joint; the melting point temperature of the first solder paste is greater than the melting point temperature of the second solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210457978.5A CN114843254A (en) | 2022-04-27 | 2022-04-27 | Mini LED backlight module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210457978.5A CN114843254A (en) | 2022-04-27 | 2022-04-27 | Mini LED backlight module and manufacturing method thereof |
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| CN114843254A true CN114843254A (en) | 2022-08-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393688A (en) * | 2023-12-11 | 2024-01-12 | 元旭半导体科技(无锡)有限公司 | Display module, preparation method and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393688A (en) * | 2023-12-11 | 2024-01-12 | 元旭半导体科技(无锡)有限公司 | Display module, preparation method and display device |
| CN117393688B (en) * | 2023-12-11 | 2024-03-08 | 元旭半导体科技(无锡)有限公司 | Display module, preparation method and display device |
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