CN101478862A - Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board - Google Patents
Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board Download PDFInfo
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- CN101478862A CN101478862A CNA2008100626166A CN200810062616A CN101478862A CN 101478862 A CN101478862 A CN 101478862A CN A2008100626166 A CNA2008100626166 A CN A2008100626166A CN 200810062616 A CN200810062616 A CN 200810062616A CN 101478862 A CN101478862 A CN 101478862A
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Abstract
The invention relates to a blind hole, buried hole, and porefilling craft for a multi-layer high-density interconnect printed circuit board, which is characterized in that the blind hole, buried hole, and porefilling craft for a multi-layer high-density interconnect printed circuit board firstly generates even brick red or black oxide layer on the copper surface of a printed circuit board provided with bores utilizing liquid medicine; with roughness of the generated oxide layer, the oxide layer can be closely connected with an adhesive tablet and can avoid an influence on reliability of the product from the surface of pig copper and cuprous chloride formed by a pressing high temperature reaction; then a traditional screen printing is carried out. The craft is characterized in that resin is filled into an appointed hole and laminating of the adhesive tablet is carried out within a time limit, then a vacuum compressing craft is carried out. The blind hole, buried hole, and porefilling craft for a multi-layer high-density interconnect printed circuit board can shorten the production labor hour and improve productivity.
Description
Technical field
The present invention relates to the circuit board of electron trade, be specifically related to multi-layered high density interconnected printed circuit board blind hole, buried via hole process for filling hole.
Background technology
Along with the serious hope of electronic industry product is light and handy day by day, reach the complicated demand of function and grow with each passing day, force the continual research and development innovation of upstream supply chain, promote the technical merit of autonomous industry.
With regard to printed circuit board (PCB), high-density interconnect technology is striden the most application of the whole electronic industry of foot from eight zero years so far for the initial stage development, such as the sci-tech product now of mobile phone, mobile personal computer, wireless communication product, numeral action secretary, digital satellite navigation system or the like, its exploitation degree that is applied to industry how could only be grown up with multiple and be described.
The technological process that the traditional high density interconnect sheet material of following introduction is produced:
The copper-clad base plate material that adopts epoxy and glass fabric to form, the circuit board manufacturer according to the substrate utilance of optimum efficiency with copper-clad base plate cut institute must size after, input as follow-up loaded down with trivial details technology, at first utilize the microetch technology that erosion is stung on the copper surface of substrate, form the certain roughness of plate face, make itself and liquid photoresistance printing ink form good binding by the corrosional roughness of microetch, then the needed inner line figure of product is utilized the technology of image transfer, be that egative film is exposed on the copper-clad base plate, see through the polymerization reaction of photoresist and UV light, with the figure video picture on the plate face, later use etching soup is stung erosion to the part copper of polymerization reaction not, sting the promptly remaining later needed line pattern of erosion, the photoresist that will produce polymerization reaction is at last removed the making of just having finished internal layer circuit afterwards.
After the circuit check through the automated optical instrument, the internal layer circuit plate of finishing done be different from black, the brown oxidation processes of copper face that the internal layer microetch is stung the erosion amount, can be effectively in producing through the vacuum of stage high temperature and high pressure through oxidation processes internal layer circuit plate later and the semi-solid preparation sticky piece combine closely, and the semi-solid preparation sticky piece has also acquired complete crosslinked and curing reaction because of this stage HTHP, and the force fit plate that reaction is finished is the input of next process.
Machine drilling, the drill point of tungsten-cobalt alloy is under the drive of equipment high speed rotating, cooperate position, the hole program that drives the board aiming, the coordinate figure of position, hole each output of program is implemented on the primary force fit plate, this procedure also is the important step of conducting between layer and the layer, also be the important step that progressively realizes machine drill buried via hole in traditional high density interconnect sheet material, the perforated plate of finishing is the input of next process.
The heat that is produced because of the cutting of the high speed rotating of drill point makes the resin fusion in the board structure, and the cooling back forms the glue slag.
Hole wall also needed the structure of glue slag is broken up before metallized process, its purpose that also has another deep layer is complete being attached on the hole wall of chemical copper energy that follow-up displacement obtains, make it can become the good metal conductor, the technology of later use metallide with copper smooth be deposited on hole wall and plate face, this step also is called whole plate and electroplates, and then metallization electroplate later is one of its important link in traditional high density plate material, filling holes with resin, add inserts with epoxy resin and come the filling perforation consent, its can be compatible with sticky piece in resin system, moreover its reaction can not have volatility as printing ink later and makes it praised highly by industry.
Consumption electronic products in recent years more and more trend towards composite multifunction and palpus is compact, therefore must import the favor that multi-layered high-density can meet vast society on circuit design, and multilayer will be mixed the design along with the internal layer buried via hole.Fig. 1 is the schematic diagram of interior buried via hole.The capable resin filling perforation of depending merely on glass cloth of Jing will derive copper face depression (causing the outermost layer circuit to make defective) and filling perforation cavity reliability problems such as (high temperature explosions) if without handling internal layer buried via hole (thickness of slab is greater than 0.6mm) in advance.
Resin fill the electroplate finish after the baking polymerization again after the smooth processing of too high cutting brush wheel, follow-uply be secondary internal layer video picture and handle, just the photoresist kenel here is transformed into the kenel of solid-state dry film by primary liquid printing ink form, secondary internal layer circuit is through image transfer, after the product examine of delineation of the erosion copper of circuit and optical instrument finishes promptly as the input of next process.
The operation of pressing has again realized the notion of its machine drill buried via hole of high density interconnect sheet material, still the operation of pressing plate is general for the first time together for its operating principle, utilize stage temperature and the pressure crosslinking curing that semi-solid preparation sticky piece energy is complete and form good bonding force, in addition primary machine drilling is imbedded in the inside of secondary force fit plate with alligatoring circuit copper face later
The one procedure of following after the pressing plate is also promptly left the copper window for the preparation of time procedure for the second time, certainly singly just only this is a kind of for the pattern of the preparation in this road, just do introduction with the copper window here, the notion of windowing is to carve on the copper surface for the technology of the copper face behind the secondary pressing plate being utilized once more image transfer to expose base material part and make it can help the making of later process, and this follow-up operation is a laser punching, the infrared light beam of laser can be formed the blind hole that does not penetrate by sticky piece resin system wherein a large amount of absorption and gasification on the surface, make that the interconnection technique of high density interconnect sheet material is brought into play incisively and vividly.
Follow-uply pass through machine drilling again, the metallization of plate face and hole wall and image transfer technology be outer field circuit video picture, become after the operations such as delineation to the semi-finished product of printed circuit board (PCB), and thing followed technology was anti-welding after semi-finished product were finished.
Anti-weldingly claim its welding resistance again or every weldering, it is the higher one procedure of technology content in the printed circuit board technology, it is general that its operating principle also is same as image transfer, utilize the mode of screen painting that liquid photosensitive and thermohardening type printing ink are covered on the whole plate face, after its surface is subjected to hot curing, the mode of then utilizing image transfer is with the needed weld pad zone video picture of electronic package, at last it is being subjected to hot curing fully, anti-solder ink is in the majority with green in the early stage printed circuit technology, Gu anti-weldingly be called green lacquer again, its tin cream that mainly act as its high temperature when the promptly isolated downstream assembling of weldering dealer assembles directly contacts with unnecessary copper face, cause short circuit, and that another effect is is attractive in appearance.
Literal also is to utilize the code of the mode of screen painting with the product electronic original part, the sign literal of authentication that client's production code member, material pass through or the like be made in earlier on the half tone again ink printing with thermohardening type in the surface and baking make it finish curing reaction.
The operation of following after word production finishes is moulding, its operating principle is similar with boring, difference is that the programming output of the milling cutter of moulding is to be expression way with the path, and boring is to be used as program output with the coordinate of position, hole, and the effect of moulding is the size of product requirement is implemented on the circuit board from programming.
Last several procedures are surface treatment, the test of Electronic Performance and the check of final mass in regular turn, because of its characteristic of copper metal comparatively active easily and the context generation oxidation that changes, and then influence the subsides part quality of downstream assembly plant, Gu its topmost effect of surface treatment is promptly carried out anti-oxidant treatment at the copper face in weld pad zone is long-pending.
The defective of above-mentioned technology is that resin filling perforation aftertreatment technology step is many, and follow-up sticky piece and resin pressing formation layering.
Summary of the invention
In order to overcome above-mentioned defective, the purpose of this invention is to provide multi-layered high density interconnected printed circuit board blind hole, buried via hole process for filling hole.
To achieve these goals, the present invention adopts following technical scheme:
Multi-layered high density interconnected printed circuit board blind hole, buried via hole, process for filling hole, the printed circuit board copper surface that utilized liquid medicine will have boring before this generates the oxide layer of uniform rufous or black, using the roughness that generates oxide layer can combine closely its and sticky piece and can avoid pig copper surface and pressing pyroreaction and the stannous chloride that forms influences the reliability of product, be traditional silk screen printing afterwards, it is characterized in that: resin is inserted in the hole of appointment and in the time limit, done the superimposed of sticky piece, carry out vacuum pressing-combining technology again.
The temperature of the required pressing of above-mentioned vacuum pressing-combining technology is 150～200 ℃, and pressure is 70～350pai, vacuum degree is-720～-500mmHg.
Above-mentioned silk screen printing be earlier with the hole drill of required filling on aluminium flake, again porose aluminium flake is opened and replaced traditional silk cloth to the wooden screen frame and throw the net, do media with the aluminium flake half tone resin extender is directly printed the operation of filling perforation on the plate face after cupric oxide is handled, and under printed circuit board, vent panel is installed.
The steam vent size of above-mentioned vent panel is to offer according to the density or the size of printed circuit board through hole.
The present invention changes to positive flow process in traditional multi-layer sheet technology with former negative film flow process after finishing metallization, all process steps before this is identical with general traditional multi-layer sheet flow process, and production time lifting production efficiency can be effectively shortened in this change.Be in alligatoring place of circuit surface after secondary internal layer circuit is by product examine, follow-up filling holes with resin is the important marrow of whole innovative development, give up in the metallization back the directly step of filling holes with resin, the flow process of the substitute is filling holes with resin is incorporated in the pressure programming, and the consent of resin remains the mode of utilizing wire mark certainly.In order effectively to save loaded down with trivial details production technology, thereby research and development department scrutinize molecular structure, the contrast copper face alligatoring of material the quality of production, redefine the screen cloth printing operating type, visit with regard to the production moving-wire of the special characteristics of press equipment and change equipment with the flow process of filling holes with resin can be complete be compatible with single processing procedure, production man-hour has been shortened in this invention greatly, and effectively reduces cost and then promote competitiveness of product.
Description of drawings
Fig. 1 is the interior buried via hole schematic diagram of prior art;
Fig. 2 is a process chart of the present invention.
Specific embodiments
The invention will be further described below in conjunction with embodiment:
With reference to shown in Figure 2, the multi-layered high density interconnected printed circuit board blind hole, buried via hole, process for filling hole, (1) the printed circuit board copper surface that utilized liquid medicine will have boring before this generates the oxide layer of uniform rufous or black, using the roughness that generates oxide layer can combine closely its and sticky piece and can avoid pig copper surface and pressing pyroreaction and the stannous chloride that forms influences the reliability of product, (2) be traditional silk screen printing afterwards, earlier with the hole drill of required filling on aluminium flake, again porose aluminium flake is opened and replaced traditional silk cloth to the wooden screen frame and throw the net, do media directly prints resin extender filling perforation on the plate face after the cupric oxide processing operation with the aluminium flake half tone, and under printed circuit board, vent panel is installed, resin is inserted in the hole of appointment and in the time limit, done the superimposed of sticky piece, carry out vacuum pressing-combining technology again.
Vacuum pressing-combining technology, it is divided into seven sections pressing processes, first section pressing-in temp is 140 ℃, time is 20 minutes, pressure is 70pai, be 10 minutes pressure rising time, second section pressing-in temp is 160 ℃, time is 15 minutes, pressure is 200pai, be 10 minutes pressure rising time, the 3rd section pressing-in temp is 175 ℃, time is 15 minutes, pressure is 300pai, be 15 minutes pressure rising time, the 4th section pressing-in temp is 200 ℃, time is 20 minutes, pressure is 350pai, be 10 minutes pressure rising time, the 5th section pressing-in temp is 200 ℃, time is 20 minutes, pressure is 350pai, be 15 minutes pressure rising time, the 6th section pressing-in temp is 200 ℃, time is 60 minutes, pressure is 350pai, the step-down time is 90 minutes, and the 7th section pressing-in temp is 140 ℃, time is 10 minutes, and pressure is 100pai, the step-down time is 10 minutes.
At last, should be pointed out that above embodiment only is the more representational example of the present invention.Obviously, technical scheme of the present invention is not limited to the foregoing description, and many distortion can also be arranged.All distortion that those of ordinary skill in the art can directly derive or associate from content disclosed by the invention all should be thought protection scope of the present invention.
Claims (5)
1, the multi-layered high density interconnected printed circuit board blind hole, buried via hole, process for filling hole, it is characterized in that: the multi-layered high density interconnected printed circuit board blind hole, buried via hole, process for filling hole, the printed circuit board copper surface that utilized liquid medicine will have boring before this generates the oxide layer of uniform rufous or black, using the roughness that generates oxide layer can combine closely its and sticky piece and can avoid pig copper surface and pressing pyroreaction and the stannous chloride that forms influences the reliability of product, be traditional silk screen printing afterwards, it is characterized in that: resin is inserted in the hole of appointment and in the time limit, done the superimposed of sticky piece, carry out vacuum pressing-combining technology again.
2, multi-layered high density interconnected printed circuit board blind hole according to claim 1, buried via hole, process for filling hole, it is characterized in that: above-mentioned silk screen printing for earlier with the hole drill of required filling on aluminium flake, again porose aluminium flake is opened and replaced traditional silk cloth to the wooden screen frame and throw the net, do media with the aluminium flake half tone resin extender is directly printed the operation of filling perforation on the plate face after cupric oxide is handled, and under printed circuit board, vent panel is installed.
3, multi-layered high density interconnected printed circuit board blind hole according to claim 2, buried via hole, process for filling hole is characterized in that: the steam vent size of vent panel is to offer according to the density or the size of printed circuit board through hole.
4, multi-layered high density interconnected printed circuit board blind hole according to claim 1, buried via hole, process for filling hole is characterized in that: the temperature of the required pressing of vacuum pressing-combining technology is 150～200 ℃, and pressure is 70～350pai, vacuum degree is-720～-500mmHg.
5, multi-layered high density interconnected printed circuit board blind hole according to claim 4, buried via hole, process for filling hole, it is characterized in that: vacuum pressing-combining technology, it is divided into seven sections pressing processes, first section pressing-in temp is 140 ℃, time is 20 minutes, pressure is 70pai, be 10 minutes pressure rising time, second section pressing-in temp is 160 ℃, time is 15 minutes, pressure is 300pai, be 10 minutes pressure rising time, the 3rd section pressing-in temp is 175 ℃, time is 15 minutes, pressure is 350pai, be 15 minutes pressure rising time, the 4th section pressing-in temp is 200 ℃, time is 20 minutes, pressure is 350pai, be 10 minutes pressure rising time, the 5th section pressing-in temp is 200 ℃, time is 20 minutes, pressure is 350pai, be 15 minutes pressure rising time, and the 6th section pressing-in temp is 200 ℃, time is 60 minutes, and pressure is 350pai, the step-down time is 90 minutes, the 7th section pressing-in temp is 140 ℃, time is 10 minutes, and pressure is 100pai, the step-down time is 10 minutes.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100626166A CN101478862A (en) | 2008-11-29 | 2008-11-29 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
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| CNA2008100626166A CN101478862A (en) | 2008-11-29 | 2008-11-29 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772280B (en) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | Mesh screen plughole process method |
| CN101720167B (en) * | 2009-11-20 | 2012-06-06 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN102523700A (en) * | 2011-12-23 | 2012-06-27 | 胜宏科技（惠州）股份有限公司 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
| CN102612278A (en) * | 2012-03-05 | 2012-07-25 | 景旺电子（深圳）有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| CN102638948A (en) * | 2012-04-25 | 2012-08-15 | 梅州市志浩电子科技有限公司 | Manufacturing method of printed circuit board |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN105636359A (en) * | 2015-12-30 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Resistance welding processing method of package substrate |
| CN106793500A (en) * | 2016-11-15 | 2017-05-31 | 智恩电子(大亚湾)有限公司 | A kind of wiring board text printout method |
| CN108990276A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | High-low pressure integratedization complex copper aluminium bus array control panel manufacture craft |
| CN113811087A (en) * | 2021-08-31 | 2021-12-17 | 深圳市众阳电路科技有限公司 | Production method of PCB blind hole applying PP rubber plug |
| CN114760779A (en) * | 2022-06-15 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Filling method for copper embedded block of multilayer printed board |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720167B (en) * | 2009-11-20 | 2012-06-06 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101772280B (en) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | Mesh screen plughole process method |
| CN102523700A (en) * | 2011-12-23 | 2012-06-27 | 胜宏科技（惠州）股份有限公司 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
| CN102523700B (en) * | 2011-12-23 | 2015-05-27 | 胜宏科技（惠州）股份有限公司 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
| CN102612278B (en) * | 2012-03-05 | 2014-09-10 | 深圳市景旺电子股份有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| CN102612278A (en) * | 2012-03-05 | 2012-07-25 | 景旺电子（深圳）有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| CN102638948A (en) * | 2012-04-25 | 2012-08-15 | 梅州市志浩电子科技有限公司 | Manufacturing method of printed circuit board |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN103709605B (en) * | 2013-12-30 | 2016-04-20 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin, preparation method and consent aluminium base |
| CN105636359A (en) * | 2015-12-30 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Resistance welding processing method of package substrate |
| CN105636359B (en) * | 2015-12-30 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | Package substrate resistance welding processing method |
| CN106793500A (en) * | 2016-11-15 | 2017-05-31 | 智恩电子(大亚湾)有限公司 | A kind of wiring board text printout method |
| CN108990276A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | High-low pressure integratedization complex copper aluminium bus array control panel manufacture craft |
| CN113811087A (en) * | 2021-08-31 | 2021-12-17 | 深圳市众阳电路科技有限公司 | Production method of PCB blind hole applying PP rubber plug |
| CN114760779A (en) * | 2022-06-15 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Filling method for copper embedded block of multilayer printed board |
| CN114760779B (en) * | 2022-06-15 | 2022-09-02 | 四川英创力电子科技股份有限公司 | Filling method for copper embedded block of multilayer printed board |
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