CN102421242A - Flanged brass circuit board - Google Patents
Flanged brass circuit board Download PDFInfo
- Publication number
- CN102421242A CN102421242A CN2011102255730A CN201110225573A CN102421242A CN 102421242 A CN102421242 A CN 102421242A CN 2011102255730 A CN2011102255730 A CN 2011102255730A CN 201110225573 A CN201110225573 A CN 201110225573A CN 102421242 A CN102421242 A CN 102421242A
- Authority
- CN
- China
- Prior art keywords
- layer circuit
- circuit board
- epoxy resin
- copper plate
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses a flanged brass circuit board, which comprises a copper plate, a top-layer circuit, a bottom-layer circuit, an epoxy substrate and an epoxy resin plug hole, wherein the copper plate, the top-layer circuit, the bottom-layer circuit and the epoxy substrate are fixed together through the epoxy resin plug hole; the copper plate is arranged on the top-layer circuit; the epoxy substrate is positioned between the top-layer circuit and the bottom-layer circuit; and a convex surface is designed at the outer side of the copper plate. According to the flanged brass circuit board disclosed by the invention, the epoxy resin plug hole process is adopted, so that possibility of sound leakage of the substrate is avoided, echo effect is enhanced, and therefore stereoscopic effect is enhanced; due to adoption of a flanged copper scheme, when a PCB (Printed Circuit Board) is assembled with a shell of a telephone receiver, a bulge part of the PCB is blocked in the shell directly rather than connection through screws, so that assembly cost is saved, and possibility of sound leakage caused by screwing screw holes is reduced, therefore echo effect is ensured, and a more outstanding stereoscopic effect of sound is achieved.
Description
Technical field
The present invention relates to a kind of wiring board, especially a kind of protruding copper circuit board.
Background technology
Wiring board is one of critical component indispensable on the electronic product, arrives television set greatly, refrigerator; Little purposes is very extensive to electronic equipments such as earphones, and the quality of the wiring board of on earphone, using can have influence on the sound effect of earphone; Be directly connected to the quality problems of earphone; Like product has Lou sound phenomenon in the market, phenomenons such as stereo distortion, and this all is the problem of wiring board on the earphone.
Summary of the invention
The present invention is directed to the deficiency of prior art, provide a kind of and can make the stereo of earphone, echo effect is good, does not have the protruding copper circuit board that leaks sound.
The present invention adopts following technical scheme to realize its purpose: a kind of protruding copper circuit board; It is characterized in that: this protruding copper circuit board comprises copper coin, top line, wiring underlayer, epoxy base material and epoxy resin consent; The epoxy resin consent is fixed together copper coin, top line, wiring underlayer and epoxy base material; Copper coin is positioned on the top line, and the epoxy base material is between top line and wiring underlayer, and the copper coin outside is designed with convex surface.
The beneficial effect that technical scheme provided by the invention can reach is: the present invention adopts epoxy resin consent technology, lets substrate not have the chance of leaking sound, has strengthened echo effect, thereby has strengthened stereoeffect; Adopt protruding copper scheme, can be connected without screw when assembling, directly let the pcb board ledge snap in shell with receiver shell; Practiced thrift assembly cost; Also reduce the leakage sound possibility that causes because of the turn of the screw hole, thereby guaranteed echo effect, given prominence to the stereoeffect of sound more.
Description of drawings
Fig. 1 is a sectional view of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in further detail:
As shown in Figure 1; Be sectional view of the present invention, a kind of protruding copper circuit board comprises copper coin 3, top line 4, wiring underlayer 6, epoxy base material 5 and epoxy resin consent 2; Epoxy resin consent 2 is fixed together copper coin 3, top line 4, wiring underlayer 6 and epoxy base material 5; Copper coin 3 is positioned on the top line 4, and epoxy base material 5 is between top line 4 and wiring underlayer 6, and copper coin 3 outsides are designed with convex surface 1.The present invention adopts epoxy resin consent technology, lets substrate not have the chance of leaking sound, has strengthened echo effect, thereby has strengthened stereoeffect; Adopt protruding copper scheme, can be connected without screw when assembling, directly let the pcb board ledge snap in shell with receiver shell; Practiced thrift assembly cost; Also reduce the leakage sound possibility that causes because of the turn of the screw hole, thereby guaranteed echo effect, given prominence to the stereoeffect of sound more.
Claims (2)
1. protruding copper circuit board; It is characterized in that: this protruding copper circuit board comprises copper coin, top line, wiring underlayer, epoxy base material and epoxy resin consent; The epoxy resin consent is fixed together copper coin, top line, wiring underlayer and epoxy base material; Copper coin is positioned on the top line, and the epoxy base material is between top line and wiring underlayer.
2. according to the said protruding copper circuit board of claim 1, it is characterized in that: the copper coin outside is designed with convex surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102255730A CN102421242A (en) | 2011-08-08 | 2011-08-08 | Flanged brass circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102255730A CN102421242A (en) | 2011-08-08 | 2011-08-08 | Flanged brass circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102421242A true CN102421242A (en) | 2012-04-18 |
Family
ID=45945398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102255730A Pending CN102421242A (en) | 2011-08-08 | 2011-08-08 | Flanged brass circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102421242A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
| US20020038725A1 (en) * | 2000-08-21 | 2002-04-04 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| US20040121266A1 (en) * | 2002-12-23 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN201854497U (en) * | 2010-09-20 | 2011-06-01 | 苏州市三生电子有限公司 | Improved circuit board |
-
2011
- 2011-08-08 CN CN2011102255730A patent/CN102421242A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
| US20020038725A1 (en) * | 2000-08-21 | 2002-04-04 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| US20040121266A1 (en) * | 2002-12-23 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN201854497U (en) * | 2010-09-20 | 2011-06-01 | 苏州市三生电子有限公司 | Improved circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120418 |