CN204291558U - A kind of HDI printed board with stability - Google Patents
A kind of HDI printed board with stability Download PDFInfo
- Publication number
- CN204291558U CN204291558U CN201420697448.9U CN201420697448U CN204291558U CN 204291558 U CN204291558 U CN 204291558U CN 201420697448 U CN201420697448 U CN 201420697448U CN 204291558 U CN204291558 U CN 204291558U
- Authority
- CN
- China
- Prior art keywords
- plate body
- central layer
- soft central
- adhesive sheet
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of HDI printed board with stability, include the plate body of hard circuit board, the upper and lower end face of described plate body all arranges soft central layer by silicone adhesive sheet bonding, the upper surface of the soft central layer of described plate body upper surface arranges copper foil layer by silicone adhesive sheet, and the lower surface of the soft central layer of the lower surface of described plate body also arranges copper foil layer by silicone adhesive sheet; The utility model is not high for existing technical stability, the problem of non-refractory, the upper and lower end face of plate body and two ends are adopted to be provided with soft central layer, soft central layer the phenomenon can avoiding hard plate easy fracture is set, the effect of buffering can be played when being impacted, bondd by silicone adhesive sheet between plate body and soft central layer, copper foil layer is more high temperature resistant while making the stability of product very high, electric conductivity is also better, described copper foil layer is arranged on semi-solid preparation layer, enhances electric conductivity and the stability of product while reducing production cost.
Description
Technical field
The utility model relates to printed circuit board field, is specifically related to a kind of HDI printed board with stability.
Background technology
At present, existing HDI printed board comprises circuit board, setting blind hole etc. on circuit boards, causes existing HDI printed board stability bad, and non-refractory, the as easy as rolling off a log damage causing printed board.
Utility model content
For above problems of the prior art, the utility model provides a kind of HDI printed board with stability, and more high temperature resistant while making the stability of product very high like this, electric conductivity is also better.
The utility model is achieved through the following technical solutions:
A kind of HDI printed board with stability, include the plate body of hard circuit board, described plate body upper, lower surface all arranges soft central layer by silicone adhesive sheet bonding, the upper surface of the soft central layer of described plate body upper surface arranges copper foil layer by silicone adhesive sheet, the lower surface of the soft central layer of the lower surface of described plate body also arranges copper foil layer by silicone adhesive sheet, the two ends of described plate body also arrange soft central layer by silicone adhesive sheet between the soft central layer of the upper and lower end face of described plate body, bondd by silicone adhesive sheet between the soft central layer of the upper and lower end face of described plate body and the soft central layer at described plate body two ends,
Described soft central layer arranges blind hole, the blind hole inwall plating of described soft central layer is provided with layers of copper, the copper foil layer that blind hole and the described soft central layer end face of the soft central layer of described plate body upper and lower end face are arranged and described plate body communicate, and being filled with silica gel in described blind hole, the blind hole of the soft central layer of described plate body communicates with described plate body.
Further, described plate body is made up of substrate and upper and lower semi-solid preparation layer, bondd by silicone adhesive sheet between described substrate and upper prepreg, also bondd by silicone adhesive sheet between described substrate and lower prepreg, described substrate arranges buried via hole, described buried via hole inwall also plates and is provided with layers of copper, and described buried via hole communicates with described upper and lower semi-solid preparation layer through silicone adhesive sheet, is also filled with silica gel in described buried via hole.
The beneficial effects of the utility model are: not high for existing technical stability, the problem of non-refractory, the upper and lower end face of plate body and two ends are adopted to be provided with soft central layer, soft central layer the phenomenon can avoiding hard plate easy fracture is set, the effect of buffering can be played when being impacted, bondd by silicone adhesive sheet between plate body and soft central layer, copper foil layer is more high temperature resistant while making the stability of product very high, electric conductivity is also better, described copper foil layer is arranged on semi-solid preparation layer, electric conductivity and the stability of product is enhanced while reducing production cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1 is plate body; 2 is silicone adhesive sheet; 3 is soft central layer; 4 is copper foil layer; 5 is blind hole; 6 is layers of copper; 7 is silica gel; 8 is substrate; 9 is upper prepreg; 10 is second cured layer; 11 is buried via hole.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
Please refer to Fig. 1, the utility model provides a kind of HDI printed board with stability, include the plate body 1 of hard circuit board, described plate body 1 upper, lower surface all arranges soft central layer 3 by silicone adhesive sheet 2 bonding, the upper surface of the soft central layer 3 of described plate body 1 upper surface arranges copper foil layer 4 by silicone adhesive sheet 2, the lower surface of the soft central layer 3 of the lower surface of described plate body 1 also arranges copper foil layer 4 by silicone adhesive sheet 2, the two ends of described plate body 1 also arrange soft central layer 3 by silicone adhesive sheet 2 between the soft central layer 3 of the upper and lower end face of described plate body 1, bondd by silicone adhesive sheet 2 between the soft central layer 3 of the upper and lower end face of described plate body 1 and the soft central layer 3 at described plate body 1 two ends, carry out bonding by silicone adhesive sheet and can increase stability and simultaneously heat dispersion is fine, the upper and lower end face of plate body and two ends are provided with soft central layer, soft central layer the phenomenon can avoiding hard plate easy fracture is set, the effect of buffering can be played when being impacted.
Described soft central layer 3 arranges blind hole 5, the blind hole 5 inwall plating of described soft central layer 3 is provided with layers of copper 6, the copper foil layer 4 that blind hole 5 and described soft central layer 3 end face of the soft central layer 3 of described plate body 1 upper and lower end face are arranged and described plate body 1 communicate, and be filled with silica gel 7 in described blind hole 5, the blind hole 5 of the soft central layer of described plate body 13 communicates with described plate body 1, the plating of blind hole internal layer is provided with layers of copper, conducting plate body and soft central layer, the silica gel of simultaneously filling in blind hole saves resource, reduce the waste to copper, because this reducing cost, alleviate the weight of integral slab.
Please refer to Fig. 1, preferably, described plate body 1 by substrate 8 with upper, second cured layer 9, 10 are formed, bondd by silicone adhesive sheet 2 between described substrate 8 and upper prepreg 9, also bondd by silicone adhesive sheet 2 between described substrate 8 and lower prepreg 10, described substrate 8 arranges buried via hole 11, the substrate of conducting plate body and upper and lower prepreg, described buried via hole 11 inwall also plates and is provided with layers of copper 6, described buried via hole 11 through silicone adhesive sheet 2 with described on, second cured layer 9, 10 communicate, also silica gel 7 is filled with in described buried via hole 11, save resource, reduce the waste to copper, because this reducing cost, alleviate the weight of integral slab.
Plate body is by substrate and upper, second cured layer is formed, bondd by silicone adhesive sheet between substrate and upper and lower prepreg, carry out bonding by silicone adhesive sheet and can increase stability and simultaneously heat dispersion is fine, the upper and lower end face of plate body and two ends are provided with soft central layer, soft central layer the phenomenon can avoiding hard plate easy fracture is set, the effect of buffering can be played when being impacted, bondd by silicone adhesive sheet between plate body and soft central layer, copper foil layer is more high temperature resistant while making the stability of product very high, electric conductivity is also better, described copper foil layer is arranged on semi-solid preparation layer, electric conductivity and the stability of product is enhanced while reducing production cost.
The utility model is not high for existing technical stability, the problem of non-refractory, the upper and lower end face of plate body and two ends are adopted to be provided with soft central layer, soft central layer the phenomenon can avoiding hard plate easy fracture is set, the effect of buffering can be played when being impacted, bondd by silicone adhesive sheet between plate body and soft central layer, copper foil layer is more high temperature resistant while making the stability of product very high, electric conductivity is also better, described copper foil layer is arranged on semi-solid preparation layer, enhances electric conductivity and the stability of product while reducing production cost.
Claims (2)
1. one kind has the HDI printed board of stability, it is characterized in that: the plate body (1) including hard circuit board, described plate body (1) upper, lower surface is all passed through silicone adhesive sheet (2) bonding and is arranged soft central layer (3), the upper surface of the soft central layer (3) of described plate body (1) upper surface arranges copper foil layer (4) by silicone adhesive sheet (2), the lower surface of the soft central layer (3) of the lower surface of described plate body (1) also arranges copper foil layer (4) by silicone adhesive sheet (2), also soft central layer (3) is set by silicone adhesive sheet (2) between the soft central layer (3) that the two ends of described plate body (1) are positioned at the upper and lower end face of described plate body (1), bondd by silicone adhesive sheet (2) between the soft central layer (3) of the upper and lower end face of described plate body (1) and the soft central layer (3) at described plate body (1) two ends,
Described soft central layer (3) arranges blind hole (5), blind hole (5) the inwall plating of described soft central layer (3) is provided with layers of copper (6), the copper foil layer (4) that blind hole (5) and described soft central layer (3) end face of the soft central layer (3) of described plate body (1) upper and lower end face are arranged and described plate body (1) communicate, and being filled with silica gel (7) in described blind hole (5), the blind hole (5) of described plate body (1) soft central layer (3) communicates with described plate body (1).
2. a kind of HDI printed board with stability according to claim 1, it is characterized in that: described plate body (1) by substrate (8) with upper, second cured layer (9, 10) form, bondd by silicone adhesive sheet (2) between described substrate (8) and upper prepreg (9), also bondd by silicone adhesive sheet (2) between described substrate (8) and lower prepreg (10), described substrate (8) is arranged buried via hole (11), described buried via hole (11) inwall also plates and is provided with layers of copper (6), described buried via hole (11) through silicone adhesive sheet (2) with described on, second cured layer (9, 10) communicate, also silica gel (7) is filled with in described buried via hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420697448.9U CN204291558U (en) | 2014-11-19 | 2014-11-19 | A kind of HDI printed board with stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420697448.9U CN204291558U (en) | 2014-11-19 | 2014-11-19 | A kind of HDI printed board with stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204291558U true CN204291558U (en) | 2015-04-22 |
Family
ID=52874682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420697448.9U Expired - Fee Related CN204291558U (en) | 2014-11-19 | 2014-11-19 | A kind of HDI printed board with stability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204291558U (en) |
-
2014
- 2014-11-19 CN CN201420697448.9U patent/CN204291558U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20181119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |