CN203181413U - Blind hole structure of printed circuit board, printed circuit board, and electronic product - Google Patents
Blind hole structure of printed circuit board, printed circuit board, and electronic product Download PDFInfo
- Publication number
- CN203181413U CN203181413U CN 201320047312 CN201320047312U CN203181413U CN 203181413 U CN203181413 U CN 203181413U CN 201320047312 CN201320047312 CN 201320047312 CN 201320047312 U CN201320047312 U CN 201320047312U CN 203181413 U CN203181413 U CN 203181413U
- Authority
- CN
- China
- Prior art keywords
- blind hole
- printed circuit
- circuit board
- pcb
- hole structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 238000009713 electroplating Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model provides a blind hole structure of a printed circuit board, the printed circuit board, and an electronic product. The blind hole structure of a printed circuit board comprises a blind hole disposed in the printed circuit board, and wherein an inner wall of the blind hole is provided with a copper plate, and resin is filled in the blind hole. The blind hole structure of the printed circuit board also comprises a copper plate covered on the blind hole and disposed on the resin. Since the blind hole structure of the printed circuit board uses resin to fill the blind holes, application amount of copper is reduced, electroplating cost is reduced, and electroplating time is reduced.
Description
Technical field
The utility model relates to art of printed circuit boards, particularly relates to a kind of blind hole structure, printed circuit board (PCB) and electronic product of printed circuit board (PCB).
Background technology
What present most of PCB(printed circuit board (PCB)) producer made that multistage blind hole adopts is one by one laminating, and namely laminates second-order blind holes again after making the single order blind hole is made multistage blind hole by that analogy.And when electroplating blind hole, the general employing filled out the plating method, and namely blind hole is directly filled up by electro-coppering.But this blind hole is filled out the plating method, owing to use more copper, causes the electroplating cost height, is unfavorable for the processing of internal layer thin wire and also has the long shortcoming of electroplating time.
The utility model content
Based on this, be necessary to provide a kind of blind hole structure that reduces electroplating time, reduces the printed circuit board (PCB) of electroplating cost.
A kind of blind hole structure of printed circuit board (PCB), comprise the blind hole that is opened in the printed circuit board (PCB), wherein said blind hole inwall is provided with copper plate, and fills up resin in the described blind hole, and the blind hole structure of described printed circuit board (PCB) also comprises and covers on the described blind hole and be arranged on copper plate on the described resin.
Among embodiment, the aspect ratio of described blind hole is greater than 1.2:1 therein.
Among embodiment, on the thickness direction of described printed circuit board (PCB), the cross section of described blind hole is trapezoidal therein.
A kind of multilayer board, described printed circuit board (PCB) is provided with the blind hole structure of described printed circuit board (PCB).
A kind of electronic product comprises described printed circuit board (PCB).
The blind hole structure of above-mentioned printed circuit board (PCB) owing to adopt resin filling blind hole, has reduced the use amount of copper, has reduced electroplating cost, has also reduced electroplating time simultaneously.
Description of drawings
Fig. 1 is the multistage blind hole schematic diagram of the printed circuit board (PCB) of present embodiment;
Fig. 2 is the blind hole structure figure of the printed circuit board (PCB) of present embodiment.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection range of the present utility model is made more explicit defining.
The printed circuit board (PCB) of one execution mode is provided with multistage blind hole at printed circuit board (PCB).The position of each rank blind hole is corresponding.
See also Fig. 1, be provided with second-order blind holes at four layer printed circuit boards 110.
See also Fig. 2, the blind hole structure 120 of each rank blind hole, comprise the blind hole 122 that is opened in the printed circuit board (PCB) 110, wherein blind hole 122 inwalls are provided with copper plate 124, and fill up resin 126 in the blind hole 122, the blind hole structure 120 of printed circuit board (PCB) also comprises and covers on the blind hole 122 and be arranged on copper plate 124 on the resin 126.
On printed circuit board (PCB) 110 thickness directions, the cross section of blind hole 122 is trapezoidal.The aspect ratio of blind hole 122 is 1.3:1.
The manufacturing process of the multistage blind hole of above-mentioned printed circuit board (PCB) 110 is: form blind hole 122 at printed circuit board (PCB) 110, electroplate formation copper plate 124 at the inwall of blind hole 122, the back is at the full resin 126 of the inside of blind hole 122 filling, electroplate at the upper surface of resin 126 at last and form copper plate 124, and carry out pressing, namely get the single order blind hole of printed circuit board (PCB) 110, after laminates second-order blind holes again, make multistage blind hole by that analogy, each rank blind hole all adopts the method for resin filling to fill out plating.
The electronic product of one execution mode comprises printed circuit board (PCB) 110 and the electronic component that links to each other with printed circuit board (PCB) 110.Wherein, printed circuit board (PCB) 110 is provided with blind hole structure 120.This electronic product can be mobile phone, computer, digital camera product.
The blind hole structure of above-mentioned printed circuit board (PCB) owing to adopt resin filling blind hole, has reduced the use amount of copper, has reduced electroplating cost, has reduced electroplating time; Simultaneously, contrast with filling out the plating method, reduced the copper layer thickness on blind hole inside and the printed circuit board (PCB), be convenient to the processing on fine rule road.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (5)
1. the blind hole structure of a printed circuit board (PCB), it is characterized in that, comprise the blind hole that is opened in the printed circuit board (PCB), wherein said blind hole inwall is provided with copper plate, and fill up resin in the described blind hole, the blind hole structure of described printed circuit board (PCB) also comprises and covers on the described blind hole and be arranged on copper plate on the described resin.
2. the blind hole structure of printed circuit board (PCB) according to claim 1 is characterized in that, the aspect ratio of described blind hole is greater than 1.2:1.
3. the blind hole structure of printed circuit board (PCB) according to claim 1 is characterized in that, on the thickness direction of described printed circuit board (PCB), the cross section of described blind hole is trapezoidal.
4. a printed circuit board (PCB) is characterized in that, described printed circuit board (PCB) is provided with the blind hole structure as any described printed circuit board (PCB) in the claim 1 ~ 3.
5. an electronic product is characterized in that, comprises the described printed circuit board (PCB) of claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047312 CN203181413U (en) | 2013-01-28 | 2013-01-28 | Blind hole structure of printed circuit board, printed circuit board, and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047312 CN203181413U (en) | 2013-01-28 | 2013-01-28 | Blind hole structure of printed circuit board, printed circuit board, and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203181413U true CN203181413U (en) | 2013-09-04 |
Family
ID=49078065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320047312 Expired - Fee Related CN203181413U (en) | 2013-01-28 | 2013-01-28 | Blind hole structure of printed circuit board, printed circuit board, and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203181413U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555014A (en) * | 2014-10-24 | 2016-05-04 | 三星电机株式会社 | Printed circuit board, electronic module and method of manufacturing the same |
| CN104780705B (en) * | 2014-01-10 | 2018-08-24 | 三星电机株式会社 | The method of substrate and manufacture substrate |
-
2013
- 2013-01-28 CN CN 201320047312 patent/CN203181413U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780705B (en) * | 2014-01-10 | 2018-08-24 | 三星电机株式会社 | The method of substrate and manufacture substrate |
| CN105555014A (en) * | 2014-10-24 | 2016-05-04 | 三星电机株式会社 | Printed circuit board, electronic module and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiujiang HuaXiang Technology Co., Ltd. Assignor: Shenzhen Huaxiang Rongzheng Electronic Co., Ltd. Contract record no.: 2014440020069 Denomination of utility model: Blind hole structure of printed circuit board, printed circuit board, and electronic product Granted publication date: 20130904 License type: Exclusive License Record date: 20140310 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20170128 |