CN204929396U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN204929396U CN204929396U CN201520771506.2U CN201520771506U CN204929396U CN 204929396 U CN204929396 U CN 204929396U CN 201520771506 U CN201520771506 U CN 201520771506U CN 204929396 U CN204929396 U CN 204929396U
- Authority
- CN
- China
- Prior art keywords
- individual layer
- circuit board
- layer circuit
- wiring board
- board group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a multilayer circuit board, include superimposed a plurality of individual layer circuit board group in proper order, individual layer circuit board group is including a plurality of superimposed individual layer circuit boards in proper order, the edge of individual layer circuit board is provided with fixing hole, and the individual layer circuit board in the same individual layer circuit board group is connected through the gim peg that pierces through fixing hole, the lateral overlap of individual layer circuit board group has the design resin layer, be equipped with the insulating layer between the adjacent individual layer circuit board group. The utility model discloses still set up fixing hole at the edge of individual layer circuit board, the individual layer circuit board in the same individual layer circuit board group is connected through the gim peg that pierces through fixing hole, can effectively improve the counterpoint precision of a plurality of individual layer circuit boards in the individual layer circuit board group, avoids it to squint in press and fit process. The effect of design resin layer is the shape of fixed individual layer circuit board group, cushions the ambient pressure simultaneously, avoids individual layer circuit board group when final pressfitting becomes multilayer circuit board, because of the too big deformation of pressure.
Description
Technical field
The utility model relates to a kind of printed substrate, is specifically related to a kind of multilayer circuit board.
Background technology
Along with the develop rapidly of electronic technology, the use of electronic product is also more and more extensive, and wiring board (PCB) is the vitals of electronic product.Due to line function design more sophisticated, existing wiring board improves number of, lines, area in the mode increasing the circuit number of plies, realizes complicated line design.Existing multilayer circuit board is generally made by the mode of direct pressing, between each sandwich circuit, is communicated with by various heavy copper hole.When the number of plies of sheet material is too high, easily cause each laminate material to offset in bonding processes, the contraposition in the heavy copper hole of impact, causes heavy copper hole to lose conducting effect.
Utility model content
In view of this, the utility model discloses a kind of multilayer circuit board without interlayer skew.
The purpose of this utility model is achieved through the following technical solutions: a kind of multilayer circuit board, comprise multiple individual layer wiring board groups superimposed successively, described individual layer wiring board group comprises multiple individual layer wiring board superimposed successively, the edge of described individual layer wiring board is provided with fixed via, and the individual layer wiring board in same individual layer wiring board group is connected by the gim peg penetrating fixed via; The side of described individual layer wiring board group is coated with molding resin layer.
The utility model, by the multiple individual layer wiring boards grouping in multilayer circuit board, forms multiple individual layer wiring board group, after shaping separately between each individual layer wiring board group, then is built up overall multilayer circuit board successively.Due to the individual layer wiring board negligible amounts between each individual layer wiring board group, the skew of interlayer is less likely to occur, the precision of contraposition between individual layer wiring board can be guaranteed, avoid heavy copper hole because of skew inefficacy.Especially, the utility model also arranges fixed via at the edge of individual layer wiring board, individual layer wiring board in same individual layer wiring board group is connected by the gim peg penetrating fixed via, effectively can improve the aligning accuracy of the multiple individual layer wiring boards in individual layer wiring board group, avoid it to offset in bonding processes.In the utility model, the side of described individual layer wiring board group is coated with molding resin layer, can be made up of any one resin, as epoxy resin, Merlon etc.The effect of molding resin layer is the shape of fixing individual layer wiring board group, and simultaneous buffering ambient pressure being avoided individual layer wiring board group when being finally pressed into multilayer circuit board, being out of shape because pressure is excessive.Insulating barrier can select any one existing techniques in realizing.
Further, the inner side of described molding resin layer is provided with the holding tank of multiple tracks longitudinal direction; The edge of molding resin layer is provided with sawtooth, and between adjacent individual layer wiring board group, the sawtooth of its molding resin layer can be engaged mutually.
Be pressed in the process of multilayer line board finished product in multiple individual layer wiring board group, when pressing pressure, temperature are higher, easily there is volumetric expansion in individual layer wiring board.Holding tank can hold the volume expanding and increase, and prevents molding resin layer from damaging; Sawtooth then can increase the positioning precision between adjacent individual layer wiring board group.
Further, the edge of described individual layer wiring board group is also provided with anti-slip veins.
Anti-slip veins can avoid individual layer wiring board group to slide in bonding processes, offset.
Accompanying drawing explanation
Fig. 1 is exploded view of the present utility model.
Fig. 2 is the part sectioned view of the one-sided wiring board group of the utility model.
Fig. 3 is partial top view of the present utility model.
Embodiment
The utility model to be described in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of multilayer circuit board, as Fig. 1, comprise 3 superimposed successively individual layer wiring board groups 1, as Fig. 2 and Fig. 3, described individual layer wiring board group 1 comprises multiple individual layer circuit 2 superimposed successively, the edge of described individual layer wiring board is provided with fixed via 3, and the individual layer wiring board in same individual layer wiring board group is connected by the gim peg 4 penetrating fixed via; The side of described individual layer wiring board group is coated with molding resin layer 5.
Further, the inner side of described molding resin layer is provided with the holding tank 6 of multiple tracks longitudinal direction; The edge of molding resin layer is provided with sawtooth 7, and between adjacent individual layer wiring board group, the sawtooth of its molding resin layer can be engaged mutually.
Further, the edge of described individual layer wiring board group is also provided with anti-slip veins 8.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (3)
1. a multilayer circuit board, comprise multiple individual layer wiring board groups superimposed successively, described individual layer wiring board group comprises multiple individual layer wiring board superimposed successively, it is characterized in that: the edge of described individual layer wiring board is provided with fixed via, the individual layer wiring board in same individual layer wiring board group is connected by the gim peg penetrating fixed via; The side of described individual layer wiring board group is coated with molding resin layer.
2. multilayer circuit board according to claim 1, is characterized in that: the inner side of described molding resin layer is provided with the holding tank of multiple tracks longitudinal direction; The edge of molding resin layer is provided with sawtooth, and between adjacent individual layer wiring board group, the sawtooth of its molding resin layer can be engaged mutually.
3. multilayer circuit board according to claim 1, is characterized in that: the edge of described individual layer wiring board group is also provided with anti-slip veins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771506.2U CN204929396U (en) | 2015-10-08 | 2015-10-08 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771506.2U CN204929396U (en) | 2015-10-08 | 2015-10-08 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204929396U true CN204929396U (en) | 2015-12-30 |
Family
ID=54978488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520771506.2U Expired - Fee Related CN204929396U (en) | 2015-10-08 | 2015-10-08 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204929396U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
-
2015
- 2015-10-08 CN CN201520771506.2U patent/CN204929396U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
| CN109600940B (en) * | 2018-11-29 | 2021-02-05 | 广东骏亚电子科技股份有限公司 | Multi-layer board pressing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20211008 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |