CN103200770A - Asymmetric pressing control slab warping structure of multilayer printed circuit board - Google Patents

Asymmetric pressing control slab warping structure of multilayer printed circuit board Download PDF

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Publication number
CN103200770A
CN103200770A CN 201310129561 CN201310129561A CN103200770A CN 103200770 A CN103200770 A CN 103200770A CN 201310129561 CN201310129561 CN 201310129561 CN 201310129561 A CN201310129561 A CN 201310129561A CN 103200770 A CN103200770 A CN 103200770A
Authority
CN
China
Prior art keywords
film layers
layer
printed circuit
circuit board
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201310129561
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Chinese (zh)
Inventor
李泽清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
APCB Electronics Kunshan Co Ltd
Original Assignee
APCB Electronics Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by APCB Electronics Kunshan Co Ltd filed Critical APCB Electronics Kunshan Co Ltd
Priority to CN 201310129561 priority Critical patent/CN103200770A/en
Publication of CN103200770A publication Critical patent/CN103200770A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an asymmetric pressing control slab warping structure of a multilayer printed circuit board. A film layer is arranged between every two adjacent line layers, the film layers between the top layer of line layer and the central line layer are sequenced, the film layers between the bottom layer of line layer and the central line layer are sequenced, two film layers with the same sequence number are defined as relative film layers, the thicknesses of the two films layers in each pair of relative film layers are different, and each film layer is provided with a plurality of hollow parts. The asymmetric pressing control slab warping structure of the multilayer printed circuit board is capable of reducing slab warping effectively, and the slab warping rate is controlled to be lower than 0.75%.

Description

The asymmetric pressing control board of multilayer printed circuit board sticks up structure
Technical field
The invention belongs to multilayer board structure field, be specifically related to a kind ofly can effectively reduce the pressing structure that plate sticks up.
Background technology
In the prior art, between the adjacent layer of multilayer printed circuit board generally by the PP(polypropylene) the glue-line pressing bonds together, specifically be one whole the PP of between adjacent layer, superposeing respectively, make adjacent layer bond together by PP by hot pressing then, and all PP glue-lines all are identical thickness, because layers of material has different harmomegathus, therefore the multilayer printed circuit board of this structure occurs plate easily and sticks up problem.
Summary of the invention
In order to overcome above-mentioned defective, the asymmetric pressing control board that the invention provides a kind of multilayer printed circuit board sticks up structure, the asymmetric pressing control board of this multilayer printed circuit board sticks up structure can effectively be reduced plate and stick up, and makes plate stick up rate control below 0.75%, and simple in structure, easy to implement.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of asymmetric pressing control board of multilayer printed circuit board sticks up structure, has film layers between the adjacent lines layer, to sort successively from top line layer to the film layers between the line layer of center, to sort successively from wiring underlayer layer to the film layers between the line layer of center, and two film layers that sequence number is identical are defined as relative film layers, each is to the thickness difference of two film layers of relative film layers, and every layer of described film layers has some sky portions that drag for.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Preferably, the described sky portion that drags for is rectangle.
Preferably, described film layers is the PP glue-line.
The invention has the beneficial effects as follows: it mainly is that each two film layers to relative film layers is adopted different thickness that the asymmetric pressing control board of multilayer printed circuit board of the present invention sticks up structure, form asymmetric pressing structure, and first every layer of described film layers is processed into has some sky portions that drag for reply material harmomegathus before pressing, therefore can effectively reduce plate and stick up, make plate stick up rate control below 0.75%.
Description of drawings
Fig. 1 is profile of the present invention;
Fig. 2 is film layers structure chart of the present invention.
Embodiment
Below by specific instantiation explanation the specific embodiment of the present invention, those of ordinary skills understand advantage of the present invention and effect easily by the content that this specification discloses.
Embodiment: a kind of asymmetric pressing control board of multilayer printed circuit board sticks up structure, has film layers 2 between the adjacent lines layer 1, to sort successively from top line layer to the film layers between the line layer of center, to sort successively from wiring underlayer layer to the film layers between the line layer of center, and two film layers that sequence number is identical are defined as relative film layers, each is to the thickness difference of two film layers of relative film layers, and every layer of described film layers has some sky portions 21 that drag for.
The described sky portion that drags for is preferably rectangle, but is not limited thereto.
Described film layers is preferably the PP glue-line, but is not limited thereto.
The present invention adopts different thickness with each two film layers to relative film layers, form asymmetric pressing structure, and first every layer of described film layers is processed into has some sky portions that drag for reply material harmomegathus before pressing, therefore can effectively reduce plate and stick up, make plate stick up rate control below 0.75%.

Claims (3)

1. the asymmetric pressing control board of a multilayer printed circuit board sticks up structure, has film layers between the adjacent lines layer, it is characterized in that: will sort successively from top line layer to the film layers between the line layer of center, to sort successively from wiring underlayer layer to the film layers between the line layer of center, and two film layers that sequence number is identical are defined as relative film layers, each is to the thickness difference of two film layers of relative film layers, and every layer of described film layers has some sky portions that drag for.
2. the asymmetric pressing control board of multilayer printed circuit board as claimed in claim 1 sticks up structure, it is characterized in that: the described sky portion that drags for is rectangle.
3. the asymmetric pressing control board of multilayer printed circuit board as claimed in claim 1 sticks up structure, it is characterized in that: described film layers is the PP glue-line.
CN 201310129561 2013-04-15 2013-04-15 Asymmetric pressing control slab warping structure of multilayer printed circuit board Pending CN103200770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201310129561 CN103200770A (en) 2013-04-15 2013-04-15 Asymmetric pressing control slab warping structure of multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201310129561 CN103200770A (en) 2013-04-15 2013-04-15 Asymmetric pressing control slab warping structure of multilayer printed circuit board

Publications (1)

Publication Number Publication Date
CN103200770A true CN103200770A (en) 2013-07-10

Family

ID=48723075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201310129561 Pending CN103200770A (en) 2013-04-15 2013-04-15 Asymmetric pressing control slab warping structure of multilayer printed circuit board

Country Status (1)

Country Link
CN (1) CN103200770A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211563A (en) * 2016-08-31 2016-12-07 竞陆电子(昆山)有限公司 Four-layer circuit board is anti-sticks up structure
CN107041082A (en) * 2016-11-18 2017-08-11 江门崇达电路技术有限公司 The PCB process for pressing of dissymmetrical structure
CN109996400A (en) * 2019-04-04 2019-07-09 江西景旺精密电路有限公司 A method of improving asymmetric folded structure pcb board and sticks up

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211563A (en) * 2016-08-31 2016-12-07 竞陆电子(昆山)有限公司 Four-layer circuit board is anti-sticks up structure
CN107041082A (en) * 2016-11-18 2017-08-11 江门崇达电路技术有限公司 The PCB process for pressing of dissymmetrical structure
CN109996400A (en) * 2019-04-04 2019-07-09 江西景旺精密电路有限公司 A method of improving asymmetric folded structure pcb board and sticks up
CN109996400B (en) * 2019-04-04 2022-02-18 江西景旺精密电路有限公司 Method for improving asymmetric stacked PCB (printed circuit board) warping

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130710