CN218174858U - PI stiffening plate suitable for die cutting process - Google Patents
PI stiffening plate suitable for die cutting process Download PDFInfo
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- CN218174858U CN218174858U CN202222617643.3U CN202222617643U CN218174858U CN 218174858 U CN218174858 U CN 218174858U CN 202222617643 U CN202222617643 U CN 202222617643U CN 218174858 U CN218174858 U CN 218174858U
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- stiffening plate
- cutting process
- glue
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- adhesive
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Abstract
The application relates to the technical field of electronic circuits, in particular to a PI stiffening plate suitable for a die cutting process. It includes: a PI stiffening plate; the outer layer glue is uniformly coated on the PI stiffening plate; and the micro-adhesive film is attached to one side surface of the outer layer adhesive, which is far away from the PI reinforcing plate. This application can effectively prevent the glue film of PI stiffening plate from type, leads to dust pollution to glue the face, influences the attached to the flexible circuit board of PI stiffening plate.
Description
Technical Field
The application relates to the technical field of electronic circuits, in particular to a PI stiffening plate suitable for a die cutting process.
Background
In recent years, the FPC (flexible printed circuit) industry is rapidly developed, the refinement degree of circuits is higher and higher, the traditional cutting process cannot meet the requirement on precision, and manufacturers gradually give up the traditional cutting process and use the die cutting process. Compared with the traditional cutting process, the die cutting process has higher efficiency and higher processing precision.
However, for the FPC using a PI (Polyimide Film) stiffener, the conventional PI stiffener uses release paper or release Film as a protective layer, the release force is greatly affected by the viscosity of the adhesive layer, the volume is easily affected by the external environment due to unstable release force, and a large amount of dust is generated during die cutting of the release paper, so that the outer adhesive surface of the bonded circuit board is polluted and difficult to clean. Therefore, it is necessary to develop a PI reinforced plate suitable for the die cutting process.
SUMMERY OF THE UTILITY MODEL
In order to prevent effectively that the glue film of PI stiffening plate from type, lead to dust pollution to glue the face, influence the attached to the flexible circuit board of PI stiffening plate on, this application provides a PI stiffening plate who is suitable for cross cutting technology, adopts following technical scheme:
a PI stiffening plate suitable for a die cutting process comprises: a PI stiffening plate; the outer layer glue is uniformly coated on the PI reinforcing plate; and the micro-adhesive film is attached to one side surface of the outer layer adhesive, which is far away from the PI reinforcing plate.
Through adopting above-mentioned technical scheme, evenly coat outer glue at the PI stiffening plate through the coating machine, paste little mucosa on outer glue, can ensure that little mucosa from the type force is stable, effectively avoid the PI stiffening plate to appear from the type at the cross cutting in-process, avoid dust pollution outer glue, influence the use of follow-up PI stiffening plate.
Optionally, the thickness of the PI reinforcing plate is 25-300 μm.
By adopting the technical scheme, the thickness of the PI reinforcing plate is set to be 25-300 mu m, so that a user can conveniently select the PI reinforcing plate according to the requirements of different thicknesses.
Optionally, the thickness of the outer layer glue is 12-60 μm.
By adopting the technical scheme, the thickness of the outer layer glue is set to be 12-60 mu m, so that a user can conveniently use the coating machine to select different thicknesses for coating according to the requirements of different bonding degrees, and the firmness of bonding to the flexible circuit board is ensured.
Optionally, the release force of the micro-mucosa is 5-20g.
By adopting the technical scheme, the release force of the micro-adhesive film is set to be 5-20g, so that the stability of the release force of the micro-adhesive film can be ensured, and a user can tear off the micro-adhesive film bonded flexible circuit board when using the PI reinforcing plate subsequently.
Optionally, the micro-mucosa is transparent, blue, red or brown.
By adopting the technical scheme, a user can conveniently select different colors of micro-mucosa to attach according to actual requirements.
Optionally, the outer layer adhesive is an adhesive layer formed by a polyacrylate adhesive or an epoxy adhesive.
By adopting the technical scheme, the outer layer adhesive is set to be the adhesive layer formed by the polyacrylate adhesive or the epoxy adhesive, so that the outer layer adhesive has high temperature resistance.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the outer glue of even coating of PI stiffening plate through the coating machine, the attached little mucosa of gluing on the outer glue can ensure that little mucosa from the type force is stable, effectively avoids the PI stiffening plate to appear in cross cutting in-process from the type, avoids dust pollution outer glue, influences the use of follow-up PI stiffening plate.
2. The thickness of the PI reinforcing plate is set to be 25-300 mu m, so that a user can conveniently select the thickness according to different thickness requirements.
3. By setting the thickness of the outer layer glue to be 12-60 mu m, a user can conveniently use a coating machine to select different thicknesses for coating according to the requirements of different bonding degrees.
Drawings
Fig. 1 is a schematic structural diagram of a PI stiffening plate suitable for a die cutting process disclosed in an embodiment of the present application.
Description of the reference numerals: 1. a PI stiffening plate; 2. outer layer glue; 3. micro-mucosa.
Detailed Description
The present application will be described in further detail below.
The embodiment of the application discloses a PI stiffening plate suitable for a die cutting process.
Referring to fig. 1, a PI stiffening plate suitable for a die cutting process includes: the PI reinforcing plate comprises a PI reinforcing plate 1, an outer layer adhesive 2 and a micro-adhesive film 3, wherein the outer layer adhesive 2 is uniformly coated on the PI reinforcing plate 1; the micro-adhesive film 3 is attached to one side surface of the outer layer adhesive 2 away from the PI reinforcing plate 1.
The reinforcing plate formed by the PI reinforcing plate 1 can play roles in thickening, reinforcing, supporting and the like on the local position of the flexible circuit board.
The micro-adhesive film 3 is used for coating the outer layer adhesive 2 on the PI reinforcing plate 1, and can be pressed and attached with the PI reinforcing plate after being baked and dried by a tunnel furnace to form the PI reinforcing plate suitable for the die cutting process; wherein, in this embodiment, through the structural design of PI stiffening plate 1, outer glue 2 and little mucosa 3, can avoid outer glue 2 adhesion foul in the 1 cross cutting process of PI stiffening plate, lead to the surface dirty, influence the fixed effect that follow-up PI stiffening plate 1 bonds to the flexible circuit.
Specifically, the PI stiffening plate 1 is also a polyimide film stiffening plate; the thickness of the PI reinforcing plate 1 can be 25-300 μm, and different thicknesses can be selected according to different requirements of users.
The outer layer glue 2 may be an adhesive layer formed by a polyacrylate adhesive or an epoxy adhesive, so that the outer layer glue 2 has a high temperature resistance while having a bonding property, and certainly, in this embodiment, the invention is not limited thereto, as long as the same technical effect can be achieved; the thickness of the outer layer glue 2 can be 12-60 μm, so that a user can conveniently select different thicknesses for coating according to the requirements of different bonding degrees by using a coating machine, and the firmness of bonding to the flexible circuit board is ensured.
The micro-adhesive film 3 can be a plastic film with micro-viscosity on one side, the side with the micro-viscosity is adhered to the outer layer adhesive 2, and the release force of the micro-adhesive film 3 is 5-20g, so that the micro-adhesive film 3 can have certain release force to be adhered to the outer layer adhesive 2, and a user can tear the PI reinforcing plate when adhering the PI reinforcing plate to the flexible circuit.
The micro mucous membrane 3 may be any color of transparent, blue, red, and brown, and may be selected by the user according to the need.
In summary, according to the PI stiffening plate suitable for the die cutting process disclosed in the embodiment of the application, the coating machine is used for uniformly coating the outer layer adhesive 2 on the PI stiffening plate 1, and the micro-adhesive film 3 is attached to the outer layer adhesive 2, so that the stability of the release force of the micro-adhesive film 3 can be ensured, the phenomenon that the PI stiffening plate 1 is released in the die cutting process is effectively avoided, and the influence on the use of the subsequent PI stiffening plate 1 caused by dust pollution on the outer layer adhesive 2 is avoided; the thickness of the PI reinforcing plate 1 is set to be 25-300 mu m, so that a user can conveniently select the thickness according to the requirements of different thicknesses; by setting the thickness of the outer layer glue 2 to be 12-60 mu m, a user can conveniently use a coating machine to select different thicknesses for coating according to the requirements of different bonding degrees, and the firmness of bonding to the flexible circuit board is ensured.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The utility model provides a be suitable for PI stiffening plate of cross cutting technology which characterized in that includes:
a PI reinforcing plate (1);
the outer layer glue (2) is uniformly coated on the PI reinforcing plate (1);
and the micro-adhesive film (3) is attached to one side surface of the outer layer adhesive (2) far away from the PI reinforcing plate (1).
2. PI stiffening plate according to claim 1, suitable for a die-cutting process, wherein the thickness of the PI stiffening plate (1) is 25-300 μ ι η.
3. PI stiffening plate adapted to a die-cutting process according to claim 1, characterised in that the thickness of the outer layer glue (2) is 12-60 μm.
4. PI stiffening plate according to claim 1, suitable for a die-cutting process, wherein the release force of the micro adhesive film (3) is 5-20g.
5. PI stiffening plate according to claim 1, adapted to a die-cutting process, wherein the micro-adhesive film (3) is any one of transparent, blue, red, brown.
6. The PI stiffening plate suitable for die cutting process according to claim 1, wherein the outer layer glue (2) is an adhesive layer formed by polyacrylate glue or epoxy glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222617643.3U CN218174858U (en) | 2022-09-28 | 2022-09-28 | PI stiffening plate suitable for die cutting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222617643.3U CN218174858U (en) | 2022-09-28 | 2022-09-28 | PI stiffening plate suitable for die cutting process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218174858U true CN218174858U (en) | 2022-12-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222617643.3U Active CN218174858U (en) | 2022-09-28 | 2022-09-28 | PI stiffening plate suitable for die cutting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218174858U (en) |
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2022
- 2022-09-28 CN CN202222617643.3U patent/CN218174858U/en active Active
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