CN216291557U

CN216291557U - PCB assembly and power supply with same

Info

Publication number: CN216291557U
Application number: CN202122175980.7U
Authority: CN
Inventors: 不公告发明人
Original assignee: Mornsun Guangzhou Science and Technology Ltd
Current assignee: Mornsun Guangzhou Science and Technology Ltd
Priority date: 2021-09-09
Filing date: 2021-09-09
Publication date: 2022-04-12
Anticipated expiration: 2031-09-09

Abstract

The utility model provides a PCB assembly and a power supply with the same, wherein the PCB assembly comprises: the PCB comprises a PCB substrate, wherein the surface of the PCB substrate is divided into a first area and a second area, and the second area is provided with a bonding pad; the plastic packaging layer covers the first area and the second area, an isolation layer is arranged in the second area, the isolation layer avoids the bonding pad, and the plastic packaging layer covers the second area through the isolation layer, so that the binding force of the plastic packaging layer and the isolation layer is smaller than that of the plastic packaging layer and the first area. Through the technical scheme provided by the application, the problem of high cost of local plastic package of the PCB assembly in the related technology can be solved.

Description

PCB assembly and power supply with same

Technical Field

The utility model relates to the technical field of power supplies, in particular to a PCB assembly and a power supply with the same.

Background

At present, when a PCB assembly is partially plastic-packaged, a plastic package mold is selected, a pad is avoided in the mold, and then component or pin assembly is performed on the exposed pad.

However, the plastic package mold in the related art has high cost, and the mold has poor compatibility with the size of the product, and can only manufacture the product with a certain size.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB assembly and a power supply with the same, and aims to solve the problem that the cost of local plastic package of the PCB assembly in the related art is high.

According to an aspect of the present invention, there is provided a PCB assembly including: the PCB comprises a PCB substrate, wherein the surface of the PCB substrate is divided into a first area and a second area, and the second area is provided with a bonding pad; the plastic packaging layer covers the first area and the second area, an isolation layer is arranged in the second area, the isolation layer avoids the bonding pad, and the plastic packaging layer covers the second area through the isolation layer, so that the binding force of the plastic packaging layer and the isolation layer is smaller than that of the plastic packaging layer and the first area.

By applying the technical scheme of the utility model, the PCB assembly comprises the PCB substrate and the plastic package layer, the surface of the PCB substrate is divided into the first area and the second area, and the plastic package layer covers the first area and the second area. An isolation layer is arranged in the second area, the isolation layer avoids the bonding pad arrangement of the second area, and the plastic packaging layer covers the second area through the isolation layer. After the plastic envelope is accomplished, need to amputate the plastic envelope layer on the second region, because the cohesion of plastic envelope layer and isolation layer is less than the cohesion of plastic envelope layer and first region, can take off the plastic envelope layer on the second region smoothly to because the pad can not bond with the plastic envelope layer, after taking off the plastic envelope layer on the second region, the pad can directly expose, need not to get rid of the isolation layer again, have easy operation and advantage with low costs.

Further, the first area is provided with an adhesive layer, and the plastic package layer is connected with the first area through the adhesive layer. Through setting up the adhesive linkage, after the plastic envelope is accomplished, can guarantee that the plastic envelope layer firmly bonds in the first region of PCB base plate.

Furthermore, the adhesive layer is connected with the surface of the PCB substrate, and the isolation layer is connected with the surface of the PCB substrate. Specifically, the surface of the first area of the PCB substrate is provided with an adhesive layer, and the surface of the second area of the PCB substrate is provided with an isolation layer.

Furthermore, the first area and the second area are both provided with adhesive layers, and the adhesive layers are connected with the surface of the PCB substrate and are positioned between the isolation layer of the second area and the PCB substrate. The lower part of the isolation layer can be the surface of the PCB substrate, and the lower part of the isolation layer can also be the surface of an adhesive layer on the PCB substrate.

Furthermore, the plastic package layer is provided with a dividing line, and the adhesive layer of the first area and the isolation layer of the second area are respectively positioned on two sides of the dividing line. After the plastic package is finished, the plastic package layer is cut along the dividing line, and at the moment, the plastic package layer on the second area can be taken down. Because the bonding layer is arranged on the first area, the plastic packaging layer on the first area can be firmly bonded on the surface of the PCB substrate, and then local plastic packaging is realized.

Furthermore, the material of the bonding layer comprises printing ink, and the bonding layer has the advantages of low cost and simple structure.

Furthermore, the isolation layer is made of silica gel or metal or modified ink, and has the advantages of low cost and simple structure.

Furthermore, the PCB substrate comprises a resin substrate or a ceramic substrate, so that the PCB substrate can be conveniently connected with other components, and the resin and the ceramic can play an insulating role.

Furthermore, plastic package layers are arranged on the upper surface and the lower surface of the PCB substrate, adhesive layers are arranged on the upper surface and the lower surface of the PCB substrate, and at least one of the upper surface and the lower surface of the PCB substrate is provided with an isolation layer; and/or the isolation layer is positioned at the edge part of the PCB substrate. After the plastic package is completed, the plastic package layer is cut along the dividing line, and part of the plastic package layer on the upper surface and/or the lower surface of the PCB substrate can be taken down, so that the local plastic package is realized.

According to another aspect of the present invention, there is provided a power supply comprising a PCB assembly, the PCB assembly being provided as described above. Therefore, the power supply can smoothly cut off the plastic package layer on the second area after plastic package is completed, local plastic package is realized, and the bonding pad can be directly exposed without removing the isolation layer after the plastic package layer on the second area is taken down because the bonding pad can not be bonded with the plastic package layer, so that the power supply has the advantages of simplicity in operation and low cost.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

fig. 1 is a schematic structural diagram of a PCB substrate of a PCB assembly according to an embodiment of the present invention;

FIG. 2 illustrates a cross-sectional view of a PCB substrate of a PCB assembly provided by an embodiment of the present invention;

FIG. 3 illustrates a cross-sectional view of an uncut molding layer of a PCB assembly provided by an embodiment of the utility model;

FIG. 4 illustrates a cross-sectional view of a PCB assembly provided by an embodiment of the present invention after cutting a molding layer;

fig. 5 shows a schematic structural diagram of a PCB assembly provided by an embodiment of the present invention.

Wherein the figures include the following reference numerals:

10. a PCB substrate; 11. a first region; 12. a second region; 13. dividing the lines; 20. a plastic packaging layer; 30. an isolation layer; 40. and (7) bonding the layers.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 shows a schematic structural diagram of a PCB substrate of a PCB assembly provided in an embodiment of the present invention, fig. 2 shows a cross-sectional view of the PCB substrate of the PCB assembly provided in the embodiment of the present invention, and fig. 3 shows a cross-sectional view of an uncut molding layer of the PCB assembly provided in the embodiment of the present invention.

As shown in fig. 1 to 3, an embodiment of the present invention provides a PCB assembly including a PCB substrate 10 and a molding layer 20, a surface of the PCB substrate 10 is divided into a first area 11 and a second area 12, and the molding layer 20 covers the first area 11 and the second area 12. Wherein, be provided with the pad in the second region 12, second region 12 is provided with isolation layer 30, and isolation layer 30 dodges the pad setting, and plastic-sealed layer 20 covers on second region 12 through isolation layer 30 to make the cohesion of plastic-sealed layer 20 and isolation layer 30 be less than the cohesion of plastic-sealed layer 20 and first region 11.

By applying the PCB assembly provided by the embodiment, after the plastic package is completed, the plastic package layer 20 on the second region 12 needs to be cut off, because the bonding force between the plastic package layer 20 and the isolation layer 30 is smaller than the bonding force between the plastic package layer 20 and the first region 11, the plastic package layer 20 on the second region 12 can be smoothly taken down, the local plastic package is realized, and because the bonding pad does not bond with the plastic package layer 20, after the plastic package layer 20 on the second region 12 is taken down, the bonding pad can be directly exposed, the isolation layer 30 does not need to be removed again, and the PCB assembly has the advantages of simple operation and low cost.

It should be noted that, the bonding force between the plastic package layer 20 and the isolation layer 30 is smaller than the bonding force between the plastic package layer 20 and the first area 11, which means that the bonding force between the plastic package layer 20 and the isolation layer 30 is smaller, after the plastic package is completed, the plastic package layer 20 located in the second area 12 is convenient to remove, and the bonding force between the plastic package layer 20 and the first area 11 is larger, and after the plastic package is completed, the plastic package layer 20 can be firmly fixed in the first area 11.

In this embodiment, the bonding force refers to an adhesive force to which the plastic package layer 20 is subjected, and the plastic package layer 20 is firmly fixed if the bonding force is large, and the plastic package layer 20 is convenient to remove if the bonding force is small.

In this embodiment, the bonding pads are made of a metal material, after the plastic package is completed, the bonding pads are not bonded to the plastic package layer 20, and the metal bonding pads on the second region 12 are directly exposed and can be directly used for welding and assembling.

In this embodiment, no pad is disposed in the first region 11 of the PCB substrate 10.

As shown in fig. 1, in the present embodiment, the first region 11 is provided with an adhesive layer 40, and the molding layer 20 is connected to the first region 11 through the adhesive layer 40. By providing the adhesive layer 40, after the plastic package is completed, the plastic package layer 20 can be securely bonded to the first region 11 of the PCB substrate 10.

The separator 30 and the adhesive layer 40 are both thin films and have a small thickness. Generally, the thickness of the spacer layer 30 is in the range of 10nm to 70nm, and the thickness of the adhesive layer 40 is in the range of 10nm to 70 nm.

In the present embodiment, the adhesive layer 40 is connected to the surface of the PCB substrate 10, and the isolation layer 30 is connected to the surface of the PCB substrate 10. Specifically, the surface of the first region 11 of the PCB substrate 10 is provided with the adhesive layer 40, and the surface of the second region 12 of the PCB substrate 10 is provided with the isolation layer 30.

In other embodiments, the adhesive layer 40 may be disposed on both the first region 11 and the second region 12, the adhesive layer 40 is connected to the entire surface of the PCB substrate 10, and the isolation layer 30 of the second region 12 is connected to the surface of the adhesive layer 40 of the second region 12.

That is, the lower side of the isolation layer 30 may be the surface of the PCB substrate 10, and the lower side of the isolation layer 30 may also be the surface of the adhesive layer 40 on the PCB substrate 10.

Fig. 4 shows a cross-sectional view of a PCB assembly provided by an embodiment of the present invention after cutting a molding layer. As shown in fig. 1, 3 and 4, the plastic package layer 20 has a dividing line 13 on the surface thereof, and the adhesive layer 40 of the first region 11 and the isolation layer 30 of the second region 12 are respectively located on both sides of the dividing line 13. After the plastic package is completed, the plastic package layer 20 is cut along the dividing line 13, and at this time, the plastic package layer 20 on the second region 12 can be removed. Due to the fact that the bonding layer 40 is arranged on the first area 11, the plastic package layer 20 on the first area 11 can be firmly bonded to the surface of the PCB substrate 10, and therefore local plastic package is achieved.

In this embodiment, the material of the adhesive layer 40 includes printing ink, which has the advantages of low cost and simple structure. Wherein the printing ink comprises AUS308 ink.

Specifically, the adhesive layer 40 may be coated on the surface of the PCB substrate 10 using a screen printing process or a laser spraying process.

It should be noted that, if the surface of the PCB substrate 10 is coated with the glue substance, the glue substance is not adhered to the plastic package layer, and after molding, the plastic package layer on the glue substance is cut and removed, and then the glue substance is removed, so as to expose the metal pad on the PCB substrate 10, thereby achieving the purpose of local plastic package. The method is troublesome for adding the glue substances, the glue substances are required to be added after the PCB substrate 10 is successfully manufactured, the covering precision of the glue substances is difficult to control, the process for removing the glue substances after plastic packaging and cutting is complex, and special equipment or more working hours are required.

The isolation layer 30 may be made of silica gel, metal or modified ink. The isolation layer 30 is made of the materials, and has the advantages of low cost and simple structure. The modified ink is a printing ink subjected to special treatment, so that the surface bonding force of the ink is reduced. In this example, the modified ink included the following inks: the surface of the ink AUS308 is modified to ensure that the water drop angle on the surface is more than 70 degrees.

Specifically, the material of the isolation layer 30 includes a metal, such as copper.

Specifically, the isolation layer 30 may be coated on the surface of the PCB substrate 10 using a screen printing process or a laser spraying process.

In this embodiment, the PCB substrate 10 includes a resin substrate or a ceramic substrate, which facilitates connection between the PCB substrate 10 and other components, and both the resin and the ceramic can perform an insulating function.

Fig. 5 shows a schematic structural diagram of a PCB assembly provided by an embodiment of the present invention. As shown in fig. 3 to 5, the upper surface and the lower surface of the PCB substrate 10 are both provided with the molding compound layer 20, the upper surface and the lower surface of the PCB substrate 10 are both provided with the adhesive layer 40, the upper surface and the lower surface of the PCB substrate 10 are fixedly bonded to the molding compound layer 20 through the adhesive layer 40, and at least one of the upper surface and the lower surface of the PCB substrate 10 is provided with the isolation layer 30.

In this embodiment, after the plastic molding is completed, the plastic molding layer 20 is cut along the dividing line 13, and a part of the plastic molding layer 20 on the lower surface of the PCB substrate 10 can be removed to realize the partial plastic molding.

As shown in fig. 4 and 5, the isolation layer 30 is located at the edge of the PCB substrate 10 to facilitate the removal of the molding layer 20 covering the isolation layer 30.

In this embodiment, the edge of the PCB substrate 10 refers to a position of the PCB substrate 10 near the edge.

In the present embodiment, the isolation layers 30 are located at both left and right sides of the PCB substrate 10.

Generally, the area of the first region 11 is larger than the area of the second region 12. In the present embodiment, the PCB substrate 10 has a rectangular structure, and the first region 11 and the second region 12 have a rectangular structure.

In the embodiment, the PCB assembly can be used for manufacturing a product which is locally plastic-packaged by using the whole plastic packaging mold, and the product design, development and use are facilitated. Moreover, the purpose of local plastic package can be realized by using the integral plastic package mold, the compatibility of the mold to the size and the shape of a product can be increased, and the cost of adding the mold during the development of a new product is reduced.

The forming steps of the isolation layer 30 and the adhesive layer 40 on the surface of the PCB substrate 10 are: the first region 11 of the PCB substrate 10 is covered with the adhesive layer 40, and the second region 12 of the PCB substrate 10 is covered with the isolation layer 30.

In some other embodiments not shown in the drawings of the present application, the arrangement of the release layer 30 and the adhesive layer 40 is adjusted. The method comprises the following specific steps:

the first embodiment: the first region 11 is not provided with the bonding layer 40, but the second region 12 is provided with the isolation layer 30, because the bonding force between the plastic package layer 20 and the surface of the PCB substrate 10 is large, the plastic package layer 20 on the second region 12 can be smoothly taken down to realize local plastic package, and because the bonding pad can not be bonded with the plastic package layer 20, after the plastic package layer 20 on the second region 12 is taken down, the bonding pad can be directly exposed, the isolation layer 30 does not need to be removed, and the PCB packaging structure has the advantages of being simple in operation and low in cost.

The second embodiment: all set up adhesive linkage 40 at PCB base plate 10's whole surface, then in second region 12, set up one deck isolation layer 20 again at adhesive linkage 40's surface, the plastic-sealed layer 20 on realizing the second region 12 smoothly equally takes off, realize local plastic envelope, and because the pad can not bond with plastic-sealed layer 20, after taking off plastic-sealed layer 20 on the second region 12, the pad can directly expose, need not to get rid of isolation layer 30 again, have easy operation and advantage with low costs.

In another embodiment of the present invention, a power supply is provided, which includes a PCB assembly, the PCB assembly being the PCB assembly provided above. Therefore, the power supply can smoothly cut off the plastic package layer 20 on the second area 12 after plastic package is completed, local plastic package is realized, and the bonding pad can be directly exposed after the plastic package layer 20 on the second area 12 is taken down because the bonding pad is not bonded with the plastic package layer 20, so that the isolation layer 30 is not required to be removed, and the power supply has the advantages of simple operation and low cost.

In this embodiment, the power supply includes a plastic package power supply.

By the device provided by the embodiment, the purpose of local plastic package can be realized by utilizing the structure of the PCB substrate 10 without adopting a plastic package mold or removing glue substances after plastic package and cutting, and the device has the advantages of simple operation and low cost.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB assembly, comprising:

the PCB comprises a PCB substrate (10), wherein the surface of the PCB substrate (10) is divided into a first area (11) and a second area (12), and the second area (12) is provided with a pad;

plastic-sealed layer (20), plastic-sealed layer (20) cover first region (11) with on second region (12), be provided with isolation layer (30) in second region (12), isolation layer (30) dodge the pad sets up, plastic-sealed layer (20) pass through isolation layer (30) cover is in on second region (12), so that plastic-sealed layer (20) with the cohesion of isolation layer (30) is less than plastic-sealed layer (20) with the cohesion of first region (11).

2. The PCB assembly according to claim 1, wherein the first area (11) is provided with an adhesive layer (40), the molding layer (20) being connected with the first area (11) by the adhesive layer (40).

3. The PCB assembly of claim 2, wherein the adhesive layer (40) is attached to a surface of the PCB substrate (10) and the isolation layer (30) is attached to a surface of the PCB substrate (10).

4. The PCB assembly according to claim 2, wherein the first area (11) and the second area (12) are each provided with the adhesive layer (40), the adhesive layer (40) being connected to a surface of the PCB substrate (10) and being located between the isolating layer (30) of the second area (12) and the PCB substrate (10).

5. A PCB assembly according to any of claims 2 to 4, wherein the mould layer (20) is provided with a separation line (13), the adhesive layer (40) of the first area (11) and the barrier layer (30) of the second area (12) being located on either side of the separation line (13).

6. A PCB assembly according to any of claims 2 to 4, wherein the material of the adhesive layer (40) comprises printed ink.

7. A PCB assembly according to any of claims 1 to 4, wherein the material of the isolating layer (30) comprises silicone or metal or modified ink.

8. A PCB assembly according to any of claims 1 to 4, characterized in that the PCB substrate (10) comprises a resin substrate or a ceramic substrate.

9. The PCB assembly of any of claims 2 to 4,

the plastic package layers (20) are arranged on the upper surface and the lower surface of the PCB substrate (10), the bonding layers (40) are arranged on the upper surface and the lower surface of the PCB substrate (10), and the isolation layer (30) is arranged on at least one of the upper surface and the lower surface of the PCB substrate (10); and/or the presence of a gas in the gas,

the isolation layer (30) is located at the edge of the PCB substrate (10).

10. A power supply comprising a PCB assembly, wherein the PCB assembly is a PCB assembly as claimed in any one of claims 1 to 9.