WO2019216089A1

WO2019216089A1 - Film-lamination method, printed circuit board film-lamination method, and printed circuit board production method

Info

Publication number: WO2019216089A1
Application number: PCT/JP2019/015473
Authority: WO
Inventors: 田邊　剛; 真次朝山; 彰一味岡; 佐々木　俊介
Original assignee: 三菱電機株式会社
Priority date: 2018-05-07
Filing date: 2019-04-09
Publication date: 2019-11-14
Also published as: JPWO2019216089A1; JP6914435B2

Abstract

In this film-lamination method, a workpiece (4) is placed on a receiving tool (3) disposed inside a first chamber (1). A film (5) is set in such a manner that the interior of the first chamber (1) and the interior of a second chamber (2) are delimited. The film (5) is bonded to the surface of the workpiece (4) in a state in which the interior of the first chamber (1) is depressurized to a pressure that is 1/10 of the atmospheric pressure or lower. The portion of the film (5) sticking out from the workpiece (4) is cut off. In the cutting step, the film is cut from a break section (32) at which the main surface of the receiving tool (3) becomes discontinuous, the break section being provided in an outer peripheral section with respect to a plan view of the region of the receiving tool (3) where the workpiece (4) is placed.

Description

Film laminating method, printed circuit board film laminating method, and printed circuit board manufacturing method

The present invention relates to a film laminating method, a printed circuit board film laminating method, and a printed circuit board manufacturing method.

There is a technology for forming a protective film on a printed circuit board by applying a liquid resin material such as urethane or silicone to protect the environment of the printed circuit board. In addition, environmental protection means each purpose, such as moisture proofing, waterproofing, and corrosion-resistant gas. Moreover, there exists a technique which coat | covers a printed circuit board with a resin film as a protective film formation method to a printed circuit board. For example, in Japanese Patent Application Laid-Open No. 2008-284771 (Patent Document 1), a trimming process is performed in which unnecessary portions of a resin film attached to the surface of a molded object are cut and removed using a blade such as a cutter. By passing through the trimming step, a molded article covered with a film is obtained.

JP 2008-284771 A

As described above, in the technique disclosed in Japanese Patent Application Laid-Open No. 2008-284771, unnecessary portions of the film attached to the surface of the member are cut and removed by the blade after application. That is, the disclosed technique requires a complicated trimming process. Further, in manual work using a blade such as a cutter, there is a risk that a film in a portion that should not be cut off, such as a portion covering the workpiece, may be cut and damaged due to a work mistake.

The present invention has been made in view of the above problems. The object is to provide a film laminating method that can simplify the cutting process of unnecessary films and avoid the risk of cutting and damaging the film that should not be cut due to operational errors. Furthermore, it is providing the film lamination method of the printed circuit board using the said film lamination method, and the manufacturing method of a printed circuit board.

In the film laminating method according to the present embodiment, the object to be molded is placed on a receiving jig disposed in the first chamber. A film is placed between the first chamber and the second chamber above the first chamber so as to partition the first chamber and the second chamber. The film is coated on the surface of the molding object in a state where the pressure in the first chamber is reduced. After coating, the portion of the film that protrudes outside the molding is cut off. In the cutting process, the film is cut at a fracture portion where the main surface of the receiving jig is discontinuous, which is provided on the outer peripheral portion in plan view of the region where the molded object of the receiving jig is placed.

In the film laminating method according to the present embodiment, the object to be molded is placed on a receiving jig disposed in the first chamber. A film is placed between the first chamber and the second chamber above the first chamber so as to partition the first chamber and the second chamber. The film is coated on the surface of the molding object in a state where the pressure in the first chamber is reduced. After coating, the portion of the film that protrudes outside the molding is cut off. In the cutting process, the black body paint is applied so as to surround the outer periphery in a plan view of the area where the molding object of the receiving jig is placed, and the film is cut in the area where the black body paint is applied. Including the step of.

According to the present invention, an unnecessary film cutting process can be simplified by breaking the film from the broken portion of the receiving jig. Further, it is possible to avoid the risk of cutting and damaging the film that should not be cut due to work mistakes.

It is sectional drawing simplified in order to demonstrate the outline of the film laminating method of this Embodiment. It is a schematic sectional drawing which shows the aspect of the printed circuit board as a to-be-molded object shown by FIG. It is a schematic sectional drawing which shows the structure of the film coat | covered on a to-be-molded product. It is a schematic sectional drawing which shows the structure of the vacuum forming apparatus used for use of the film laminating method which concerns on Embodiment 1. FIG. 3 is a schematic plan view showing a first step of the film laminating method of Embodiment 1. FIG. 3 is a schematic cross-sectional view showing a second step of the film laminating method of Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a third step of the film laminating method of Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a fourth step of the film laminating method of Embodiment 1. FIG. 6 is a schematic cross-sectional view showing a fifth step of the film laminating method of Embodiment 1. FIG. 10 is a schematic cross-sectional view showing one step of the film laminating method of Embodiment 2. FIG. 6 is a schematic cross-sectional view showing one step of the film laminating method of Embodiment 3. FIG. FIG. 6 is a schematic plan view showing a mode corresponding to FIG. 5 of the first embodiment in the third embodiment. FIG. 7 is a schematic cross-sectional view showing a mode corresponding to FIG. 6 of the first embodiment in the fourth embodiment. FIG. 6 is a schematic plan view showing a mode corresponding to FIG. 5 of the first embodiment in the fourth embodiment. FIG. 12 is a schematic cross-sectional view showing an aspect corresponding to FIG. 11 of Embodiment 3 in Embodiment 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
First, an outline of the film laminating method of the present embodiment will be briefly described with reference to FIG. For convenience of explanation, an X direction, a Y direction, and a Z direction are introduced. FIG. 1 is a simplified cross-sectional view for explaining the outline of the film laminating method of the present embodiment. Referring to FIG. 1, in the film laminating method of the present embodiment, an apparatus having a first chamber 1 and a second chamber 2 is used. A receiving jig 3 is disposed in the first chamber 1. A workpiece 4 is placed on the receiving jig 3. A film 5 to be coated on the molding 4 is installed. At this time, although not shown in FIG. 1, the film 5 is disposed so as to be sandwiched between the first chamber 1 and the second chamber 2 thereabove. The film 5 is installed so as to partition the first chamber 1 and the second chamber 2. The first chamber 1 and the second chamber 2 are spaces that can be continuous. The continuous space formed in the first chamber 1 and the second chamber 2 is depressurized until it becomes a so-called vacuum state that is, for example, 1/10 or less of the atmospheric pressure.

Thereafter, for example, the inside of the second chamber 2 is pressurized, and at least the inside of the first chamber 1 is reduced to a pressure of 1/10 or less of the atmospheric pressure. In this state, as shown in FIG. 1, the film 5 is bonded to the surface of the molding 4. The receiving jig 3 includes a receiving jig main body portion 31, and the receiving jig main body portion 31 is formed with a fracture portion 32. The receiving jig main body 31 is supported by appropriately connecting the inner side and the outer side of the fracture portion 32. The fracture | rupture part 32 is formed in the outer peripheral part in planar view rather than the area | region where the to-be-molded product 4 is mounted among the receiving jig main-body parts 31. FIG. In the fracture | rupture part 32, the main surface of the receiving jig 3, ie, the main surface of the receiving jig main-body part 31, is discontinuous. At the fracture portion 32, the film 5 is cut. As a result, the portion of the film 5 that protrudes outward from the broken portion 32 in plan view is cut off. In other words, the part of the film 5 that protrudes outward from the molding object 4 in plan view is cut out. Next, each member shown in FIG. 1 will be described in detail with reference to FIGS.

FIG. 2 is a schematic cross-sectional view showing an embodiment of a printed circuit board as the molding shown in FIG. Referring to FIG. 2, molded object 4 as an object to be covered with film 5 in the present embodiment is, for example, a printed circuit board. The printed circuit board mainly includes a substrate 41, an integrated circuit 42, and an electronic component 43. Thus, in the present embodiment, a printed circuit board on which the electronic component 43 is mounted is used as the molding 4. Thereby, the effect of environmental protection can be exerted on the printed circuit board. Since the molding 4 is a printed circuit board, it may be referred to as a printed circuit board 4 below.

The substrate 41 has, for example, a flat plate shape having a main surface 41a and a main surface 41b on the opposite side. The main surface 41a and the main surface 41b have, for example, a rectangular shape and extend along the XY plane. The substrate 41 is formed, for example, by containing an epoxy resin in a glass cloth. Many elements such as transistors, diodes, capacitors, and resistors are mounted on the integrated circuit 42. The integrated circuit 42 includes a lead frame 42a. The lead frame 42 a electrically connects the elements included in the integrated circuit 42 and the substrate 41. The electronic component 43 is a component on which passive components other than the integrated circuit 42 are mounted.

The integrated circuit 42 and the electronic component 43 are joined to the conductor wiring 41 c formed on the main surface 41 a of the substrate 41 by, for example, a solder material 44. Specifically, the conductor wiring 41 c and the lead frame 42 a are electrically joined by the solder material 44. The electronic component 43 is electrically joined to the conductor wiring 41c by a solder material 44. The solder material 44 is preferably Sn—Ag—Cu solder. More specifically, the solder material 44 is preferably, for example, Sn-3.0Ag-0.5Cu.

FIG. 3 is a schematic cross-sectional view showing the structure of a film coated on a molding object. With reference to FIG. 3, the film 5 includes a resin film substrate 51, an adhesive 52, and a separator 53. The resin film substrate 51 is formed of a resin material such as acrylic resin. The thickness of the resin film substrate 51 is 50 μm or more and 500 μm or less. The resin film substrate 51 is affixed on the printed circuit board when it is desired to improve waterproofness, corrosion gas resistance, UV resistance, electromagnetic shielding or heat dissipation with respect to the printed circuit board. That is, the resin film substrate 51 is enhanced in properties such as the above-mentioned waterproof property by kneading other functional materials in the resin material constituting the resin film substrate 51. Alternatively, the resin film base 51 is formed by laminating a plurality of different materials by laminating a plurality of different materials, whereby the properties such as waterproofness are enhanced. As described above, the resin film base 51 is subjected to different treatments depending on the purpose of attaching the resin film base 51, thereby improving the properties such as the waterproof property.

The pressure-sensitive adhesive 52 is an adhesive part for attaching the resin film substrate 53 to the molding 4 or the like. The adhesive 52 is obtained by applying a silicone resin to the surface of the resin film substrate 51. The thickness of the adhesive 52 is 10 μm or more and 50 μm or less. The separator 53 is a release paper that is peeled off and removed from the film 5 when the resin film substrate 51 is attached to the molding 4 or the like. The separator 53 is a polyethylene terephthalate coated with fluorine.

FIG. 4 is a schematic cross-sectional view showing a configuration of a vacuum forming apparatus used for using the film laminating method according to the first embodiment. With reference to FIG. 4, the vacuum forming apparatus 100 mainly includes a first chamber 1 and a second chamber 2. The second chamber 2 is disposed immediately above the first chamber 1, and the second chamber 2 faces the upper side in the Z direction with respect to the first chamber 1.

The first chamber 1 includes a receiving jig 3, a first chamber body 11, a stage 12, a film set frame 13, and a pressure valve 14. The first chamber body 11 is a hollow casing that constitutes the entire first chamber 1 that is a part of the vacuum forming apparatus 100. A stage 12 and a film set frame 13 are arranged in a hollow portion inside the first chamber body 11.

The stage 12 is a member in which the receiving jig 3 is installed in the first chamber 1. The stage 12 has a placement portion 12a and a shaft portion 12b. The placing portion 12a is a flat plate-like portion disposed so that its main surface is along the XY plane. The receiving jig 3 or the like can be placed on the placing portion 12a. The receiving jig main body 31 has, for example, a flat plate shape having a main surface 31a and a main surface 31b on the opposite side. For example, the receiving jig 3 is placed on the stage 12 when the lower main surface 31 b of the receiving jig main body 31 comes into contact with the mounting portion 12 a. As shown in FIG. 4, the placement portion 12 a may be smaller in size in plan view than the

main surfaces

31 a and 31 b of the receiving jig main body portion 31.

The shaft portion 12b is a rod-like portion that extends downward from the center of the placement portion 12a in plan view. The shaft portion 12b can move the entire stage 12 including the placement portion 12a in the Z direction, that is, the vertical direction. Therefore, as shown in FIG. 4, a part of the shaft portion 12 b may protrude outside the first chamber main body 11.

The film set frame 13 is a member used for setting the film 5. The film set frame 13 has, for example, a rectangular frame shape in plan view. The film set frame 13 is preferably sized so that the entire receiving jig 3 can be accommodated in the hollow portion in the frame when the rectangular main surface is arranged along the XY plane. The film set frame 13 preferably has a size that can be accommodated in a space portion in the first chamber body 11 when the rectangular main surface is arranged along the XY plane. In the above description, the film set frame 13 is a member constituting the first chamber 1, but the film set frame 13 can be detached from the first chamber body 11.

The pressure valve 14 is a part that adjusts the pressure of the space in the first chamber body 11. For example, the inside of the first chamber body 11 can be brought into a high vacuum state by evacuating the inside of the first chamber body 11 from the pressure valve 14.

The second chamber 2 includes a second chamber body 21, a heater 22, and a pressure valve 23. The second chamber body 21 is a hollow casing that constitutes the entire second chamber 2 that is a part of the vacuum forming apparatus 100. A heater 22 is disposed in a hollow portion inside the second chamber body 21. As shown in FIG. 4, the heater 22 may be installed, for example, on the uppermost surface in the second chamber body 21. The pressure valve 23 is a part that adjusts the pressure of the space in the second chamber body 21. For example, by exhausting the inside of the second chamber body 21 from the pressure valve 14, the inside of the first chamber body 11 can be brought into a high vacuum state.

By placing the second chamber 2 on top of the first chamber 1, the space in the first chamber body 11 and the space in the second chamber body 21 are continuous. One space can be formed.

In the film laminating method of the present embodiment, a film roll setting unit 54 and a separator winding unit 55 are used. The film roll setting unit 54 is a member that is set in a state where the film 5 is wound. In other words, the film roll set part 54 is a member as a core around which the film 5 is wound. The separator winding unit 55 is a member that winds up the separator 53 that has been peeled off from the film 5. In other words, the separator winding unit 55 is a member as a core that winds and collects the separator 53. The film roll set unit 54 (where the film 5 is wound) and the separator winding unit 55 may be considered as members constituting the vacuum forming apparatus 100.

Next, the film laminating method of the present embodiment will be described in detail with reference to FIGS.

FIG. 5 is a schematic plan view showing a first step of the film laminating method of the first embodiment. Referring to FIG. 5, first, printed circuit board 4 in FIG. 2 is placed on upper main surface 31 a of receiving jig 3. As shown in FIG. 4, the receiving jig 3 may be arranged so as to be attached on the mounting portion 12 a of the stage 12 in the first chamber 1 from the beginning. However, the receiving jig 3 may be placed on the placement portion 12a of the stage 12 in the first chamber 1 after the printed circuit board 4 is placed. At any rate, in this process, the object to be molded 4 is finally placed on the receiving jig 3 disposed in the first chamber 1.

The printed circuit board is a molded object 4 shown in FIG. The receiving jig 3 is formed with a fracture portion 32 in which the upper main surface 31a is discontinuous. In the present embodiment, the fracture portion 32 is a groove portion formed by removing the receiving jig main body portion 31 as a base material of the receiving jig from the upper main surface 31a of the receiving jig 3. .

As shown in FIGS. 4 and 5, the groove portion as the fracture portion 32 of the receiving jig 3 of the present embodiment is from the upper main surface 31 a of the receiving jig 3 on the side opposite to the main surface 31 a, that is, the lower side. The receiving jig main body 31 is penetrated to the other main surface 31b. That is, in the present embodiment, the fracture portion 32 is a through hole formed in the receiving jig main body portion 31.

Further, as shown in FIG. 5, the breakage portion 32 is provided on the outer peripheral portion in a plan view of a region where the printed circuit board of the receiving jig 3 is placed. If the printed circuit board 4 has a rectangular shape in plan view, a broken portion 32 as a rectangular frame is formed just outside the rectangular edge. However, in FIG. 5, the breakage portion 32 as a through hole is formed in a part thereof with connection portions 33 that integrally connect the inside and the outside of the breakage portion 32 of the receiving jig main body portion 31 (total of 6 locations). Has been. The connection portion 33 is also formed as a recess, that is, a groove portion in which the receiving jig main body portion 31 is removed from the main surface 31 a in the depth direction, and functions as the fracture portion 32. For this reason, the connection part 33 is also regarded as a part of the fracture part 32 here. However, the connecting portion 33 does not penetrate the receiving jig main body portion 31. That is, in the connecting portion 33, the member of the receiving jig main body portion 31 whose thickness in the Z direction is thinner than that of the receiving jig main body portion 31 other than the fracture portion 32 is disposed. As described above, as shown in FIG. 5, the fracture portion 32 is preferably formed on the entire circumference of the outer peripheral portion in plan view of the printed circuit board 4.

As an example, the printed circuit board 4 shown in FIG. 5 has dimensions in the X direction and the Y direction of 50 mm or more and 400 mm or less. The printed circuit board 4 in FIG. 5 has a rectangular shape in which the dimension in the X direction is longer than the dimension in the Y direction. However, the printed circuit board is not limited to such a mode.

In the fracture portion 32 of the present embodiment, the width of the groove portion in the direction along the main surface 31a, that is, the X direction or the Y direction is 1 mm or more and 3 mm or less, and the depth in the Z direction intersecting the main surface 31a with respect to the width of the groove portion. The ratio is 5 or more. In addition, a width | variety means here the dimension of the direction which cross | intersects the direction where the fracture | rupture part 32 when it planarly views circulates the outer peripheral part of the to-be-molded product 4. FIG. If the width of the fracture portion 32 is 3 mm, the depth is 15 mm or more, for example 20 mm. Therefore, considering the size of the printed circuit board 4 described above, the maximum dimensions in the X direction and the Y direction in plan view of the fractured portion 32 are approximately 52 mm or more and 406 mm or less.

FIG. 6 is a schematic cross-sectional view showing a second step of the film laminating method of the first embodiment. Referring to FIG. 6, a film roll set unit 54 around which the film 5 is wound and a separator winding unit 55 are installed outside the first chamber 1 and the second chamber 2. A film set frame 13 is prepared. In this state, the film 5 (see FIG. 3) having the resin film substrate 51, the adhesive 52, and the separator 53 is pulled from the film roll set portion 54. The separator 53 which is a part of the pulled film 5 is peeled off from the adhesive 52. The separator 53 is collected by being wound around the separator winding portion 55. A portion of the film 5 excluding the separator 53, that is, a portion of the resin film base 51 and the adhesive 52 is attached to the film set frame 13. The film set frame 13 is disposed between the first chamber 1 and the second chamber 2 in a state where the film 5, that is, the resin film substrate 51 and the adhesive 52 are attached.

At this time, it is preferable that the film set frame 13 is disposed at a position where the entire receiving jig 3 is accommodated in the film set frame 13 in plan view. The film 5 may stick to the film 5 so as to protrude outside the film set frame 13 and overlap the seal portions of the first chamber 1 and the second chamber 2 in plan view.

FIG. 7 is a schematic cross-sectional view showing a third step of the film laminating method of the first embodiment. Referring to FIG. 7, the second chamber 2 is lowered in a state where the film set frame 13 and the film 5 attached thereto are arranged as shown in FIG. 6. As a result, the uppermost seal portion of the first chamber 1 and the lowermost seal portion of the second chamber 2 come into contact with each other, and the spaces in the first chamber 1 and the second chamber 2 are exposed to the outside. It becomes a closed space. At this time, the portion of the film 5 that protrudes outside the film set frame 13 may be sandwiched and fixed between the seal portions of the first chamber 1 and the second chamber 2. However, in this case, the film 5 is sandwiched between the first chamber 1 and the second chamber 2 so that gas does not leak and the atmospheric pressure control in the chamber is not hindered. Is preferred.

As described above, the film 5 is placed between the first chamber 1 and the second chamber 2 above the first chamber 1 so as to partition the first chamber 1 and the second chamber 2. The Specifically, as shown in FIG. 7, the film set frame 13 is installed at the top of the first chamber 1. As a result, the film 5 attached to the film set frame 13 is disposed approximately at the boundary between the first chamber 1 and the second chamber 2. If the film 5 is disposed entirely in a plan view in the first chamber 1 and the second chamber 2, the space in the first chamber 1 and the second chamber are formed by the film 5 disposed at the boundary portion between the two. The spaces in 2 are completely partitioned from each other.

FIG. 8 is a schematic cross-sectional view showing a fourth step of the film laminating method of the first embodiment. Referring to FIG. 8, the inside of first chamber 1 and the inside of second chamber 2 are reduced to a pressure of, for example, 1/10 or less of atmospheric pressure (10 ⁵ Pa). That is, the pressure is reduced so that the inside of the first chamber 1 and the second chamber 2 is in a so-called vacuum state. In the first chamber 1 and the second chamber 2, the pressure may be reduced to 1/100 or less of the atmospheric pressure, or may be reduced to 1/1000 or less of the atmospheric pressure. The pressure in the first chamber 1 and the second chamber 2 is reduced by a vacuum pump (not shown). Simultaneously with the depressurization, the film 5 (resin film substrate 51) in each chamber is heated to, for example, about 130 ° C. or more and about 220 ° C. or less by the heater 22 installed on the uppermost portion of the inner wall of the second chamber body 21. The Thereby, the resin film base material 51 is softened. The heater 22 is heated by, for example, near infrared rays or far infrared rays.

Then, stage 12 is raised. The stage 12 is preferably raised to a position where at least the receiving jig 3 is accommodated in a cavity in the frame of the film set frame 13. The ascending motion of the stage 12 is preferably performed by any one of an air cylinder, a hydraulic cylinder, and a servo cylinder, for example.

At the same time when the stage 12 is raised, air is supplied from the pressure valve 23 of the second chamber 2 into the second chamber body 21. Thereby, the inside of the second chamber body 21 is released to the atmosphere. At this time, if the space in the first chamber 1 and the space in the second chamber 2 are completely partitioned by the film 5, a pressure is applied between the second chamber 2 and the first chamber 1. The difference occurs. Thereby, a force is applied to the film 5 from the second chamber 2 side having a high pressure to the first chamber 1 side having a low pressure. The film 5 is pressed so as to be in close contact with the printed circuit board 4 on the first chamber 1 side, that is, the lower side. The upper surface of the printed circuit board 4 and the surface of the integrated circuit 42 and the like (see FIG. 2) mounted on the surface come into contact with the adhesive 52 and are covered with the resin film substrate 51.

In this manner, the film 5 is adhered, ie, coated on the surface of the printed circuit board 4 that is a molding object, in a state where at least the inside of the first chamber 1 is reduced to a pressure of 1/10 or less of the atmospheric pressure. Note that the second chamber 2 may also be depressurized to 1/10 or less of the atmospheric pressure.

FIG. 9 is a schematic cross-sectional view showing the fifth step of the film laminating method of the first embodiment. In particular, FIG. 9 shows an enlarged view of the receiving jig 3 and the printed circuit board 4 placed thereon. Referring to FIG. 9, after the printed circuit board 4 is contact-coated on the film 5 as shown in FIG. 8, if the atmospheric pressure is supplied into the second chamber 2 and the pressure continues to rise, the second chamber 2 The pressure difference between the inside and the inside of the first chamber 1 increases. As a result, the resin film substrate 51 covering the through-hole as the breaking portion 32 is pulled and broken by a higher pressure in the second chamber 2 than in the first chamber 1. As described above, the fracture portion 32 is formed on the outer side (outer peripheral portion) of the printed circuit board 4. For this reason, it will be in the state which can cut out the part of the film 5 which protruded on the outer side of the printed circuit board 4. FIG. The portion of the film 5 that protrudes to the outside of the printed circuit board 4 is easily cut out by a later process described later. As an example, the pressure in the first chamber 1 at this time is preferably about 0.01 kPa to about 0.5 kPa. Moreover, it is preferable that the pressure in the 2nd chamber 2 at this time is about 50 kPa or more and 150 kPa or less.

In order for the film 5 to be cut at the breaking portion 32 as described above, it is preferable that the pressure in the second chamber 2 is considerably larger than that in the first chamber 1. This is because a large downward tension is applied to the portion of the film 5 disposed on the fracture portion 32. Therefore, in the step of partially cutting the film 5 by cutting in FIG. 9, the difference in pressure in the second chamber 2 with respect to the pressure in the first chamber 1 is preferably maintained at 0.5 atm or more. .

Finally, air is supplied from the pressure valve 14 of the first chamber 1 into the second chamber body 21. Thereby, the inside of the second chamber body 21 is released to the atmosphere. The second chamber 2 is raised with both the first chamber body 21 and the second chamber body 21 returned to atmospheric pressure. Then, the printed circuit board 4 covered with the resin film substrate 51 is taken out.

In order to enable the film 5 to be cut as described above, the ratio of the depth b in the Z direction intersecting the main surface to the width a of the fracture portion 32 is preferably 5 or more. The ratio is more preferably 7 or more. Moreover, it is preferable that the width | variety a of the fracture | rupture part 32 is 1 mm or more and 3 mm or less. When the width a of the rupture portion 32, that is, the through hole is too narrow, it becomes difficult to break the resin film substrate 51 by biting the resin film substrate 51 downward at the rupture portion 32 and applying sufficient downward tension. On the other hand, when the width a of the fracture portion 32 is too wide, it is immediately after providing the differential pressure between the first chamber 1 and the second chamber 2, and at a time much earlier than the desired timing. The resin film base material 51 is broken. If it becomes like this, air will leak from the inside of the 2nd chamber 2 into the 1st chamber 1 after that through the fracture part of resin film substrate 51. For this reason, the pressure in the first chamber 1 immediately rises, and the difference in pressure from the second chamber 2 becomes small. If the breakage occurs before the resin film substrate 51 is coated on the printed circuit board 4, it becomes difficult to cover the resin film substrate 51 on the printed circuit board 4. This is because the resin film substrate 51 is coated on the printed circuit board 4 due to a pressure difference between the second chamber 2 and the first chamber 1. If the ratio of depth b to width a is less than 5, it becomes difficult to cut film 5 at fracture portion 32.

In addition, if the depth b with respect to the width a is increased to 7 or more, particularly 10 or more, the depth from the main surface 31a in the connecting portion 33 (see FIG. 5) can be set to 5 times or more of the width. Accordingly, the connecting portion 33 also has a function of cutting the film 5 in the same manner as the broken portion 32. Thereby, it can be made equivalent to providing the fracture | rupture part 32 in the perimeter of the outer peripheral part of the to-be-molded product 4. FIG.

Next, the effect of this Embodiment is demonstrated.
After the processing of FIGS. 5 to 9 according to the film laminating method of the present embodiment, the printed circuit board 4 coated with the resin film substrate 51 is taken out. At this time, the resin film substrate 51 is easily cut from the breakage portion formed in the region covering the breakage portion 32 where the main surface 31a of the receiving jig 3 is discontinuous by the recess. For this reason, it is not necessary to use a blade such as a cutter in the trimming process for cutting an unnecessary portion of the resin film substrate 51, and the trimming process can be easily performed. Further, since a blade such as a cutter is not used in the trimming step, the possibility of accidentally damaging the portion of the resin film base 51 that is coated on the printed circuit board 4 and should not be cut can be eliminated. Further, the resin film substrate 51 can be coated on the surface of the printed circuit board 4 by creating a pressure difference between the first chamber 1 and the second chamber 2.

In the present embodiment, the fracture portion 32 is formed on the entire circumference of the outer peripheral portion of the molding 4 in plan view. For this reason, in the process of FIG. Therefore, the trimming process can be made easier.

In the present embodiment, the tensile force applied to the film 5 by supplying the atmosphere into the second chamber 2 so that the pressure in the second chamber 2 is higher than the pressure in the first chamber 1 first. The film 5 is broken using the force. Such an operational effect is obtained by reducing the difference in pressure in the second chamber 2 from the pressure in the first chamber 1 to 0. 2 when the second chamber 2 is first released to the atmosphere (in the cutting step). It is obtained by maintaining at 5 atm or more.

Next, a modified example different from the above example that can be assumed in the present embodiment will be described. Effects similar to the above-described example can be obtained by the following modifications.

In the above description, it is assumed that the object 4 to be coated with the film 5 is a printed circuit board on which the electronic component 43 is mounted. However, the present invention is not limited to this, and a case of a mobile phone or a notebook computer may be used as the molding 4. Alternatively, an automobile interior panel or the like may be used as the molding 4.

In the present embodiment, the substrate 41 (see FIG. 2) may be formed of the following insulating material. That is, the substrate 41 may be formed of a glass nonwoven fabric. Or the board | substrate 41 may be formed with the material which made the paper base material etc. contain a polyimide resin and / or a phenol resin. The solder material 44 (see FIG. 2) is any solder selected from the group consisting of Sn—Cu solder, Sn—Bi solder, Sn—In solder, Sn—Sb solder, and Sn—Pb solder. It may be a material.

In the present embodiment, the resin film substrate 51 constituting the film 5 may be formed of any resin material such as polyethylene resin, polyimide resin, or fluororesin. The resin film substrate 51 is not limited to a single layer, and may have a multilayer structure including a plurality of layers. The adhesive 52 of the film 5 may be made of acrylic or urethane.

The film 5 does not necessarily include the adhesive 52. In that case, there exists an effect similar to the case where the adhesive 52 is included in said film 5 by apply | coating an adhesive agent to the resin film base material 51. FIG. Further, the adhesive 52 is not applied to the resin film substrate 51, but the resin film substrate 51 itself may have adhesiveness. Also in this case, the same effect as the case where the above-mentioned film 5 includes the adhesive 52 is produced.

In the present embodiment, the separator 53 included in the film 5 may be made of paper or polyethylene, or paper or polyethylene coated with fluorine.

In the above-described embodiment, the resin film substrate 51 is brought into close contact with the surface of the molding 4 using the vacuum molding apparatus 100. However, the present invention is not limited to this, and for example, a pressurizing method may be used in which the air pressure on the upper side in the Z direction of the resin film substrate 51 is higher than that on the lower side. Alternatively, for example, a method may be used in which a thermoplastic resin film is heated and softened and the weight of the resin film is used to closely adhere to the surface of the object to be molded.

Further, in the above, a pressure difference between both chambers is provided by first pressurizing the inside of the second chamber 2 after both the inside of the first chamber 1 and the inside of the second chamber 2 are evacuated. However, if the configuration of the vacuum forming apparatus 100 is possible, a process of reducing only the inside of the first chamber 1 to 1/10 or less of the atmospheric pressure while the inside of the second chamber 2 is maintained at the atmospheric pressure is performed. Also good. This is because the film 5 is broken by using the pressure difference between the second chamber 2 and the first chamber 1 in the present embodiment. In any case, in the present embodiment, the pressure of the chamber on the side (lower side) on which the molding object 4 is placed with respect to the film 5 is placed on the film 5. Less than the pressure in the side (upper) chamber.

Embodiment 2. FIG.
Hereinafter, the film laminating method of the present embodiment will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view showing one step of the film laminating method of the second embodiment. The process of FIG. 10 corresponds to the process of FIG. 9 in the first embodiment. FIG. 10 is an enlarged view of the receiving jig 3 and the printed circuit board 4 placed thereon as in FIG. Referring to FIG. 10, the present embodiment basically performs the same processes as those shown in FIGS. 5 to 9 of the first embodiment. For this reason, in FIG. 10, the same code | symbol is attached | subjected to the component same as FIG. 9, and the description is not repeated. However, in this Embodiment, the fracture | rupture part 34 is not the aspect which penetrates the receiving jig main-body part 31 from the main surface 31a to the main surface 31b. In the present embodiment, the fractured portion 34 in which the main surface 31a of the receiving jig 3 is discontinuous due to the concave portion is a groove portion from which the receiving jig main body 31 is removed so as to have a bottom inside the receiving jig main body 31. It is.

10, the width c of the groove in the direction along the main surface 31a is 1 mm or more and 3 mm or less, and the ratio of the depth d in the Z direction intersecting the main surface 31a to the width of the groove is 5 or more. It is. As an example, it is preferable that the width c is 2 mm and the depth is 10 mm.

In the present embodiment, the same effects as those of the first embodiment are basically obtained, and therefore the description thereof will not be repeated. Further, possible modifications of the present embodiment are basically the same as those of the first embodiment, and therefore the description thereof will not be repeated.

Embodiment 3 FIG.
Hereinafter, the film laminating method of the present embodiment will be described with reference to FIG. FIG. 11 is a schematic cross-sectional view showing one step of the film laminating method of the third embodiment. The process of FIG. 11 corresponds to the process of FIG. 9 in the first embodiment and the process of FIG. 10 in the second embodiment. FIG. 11 is an enlarged view of the receiving jig 3 and the printed circuit board 4 placed thereon, as in FIGS. 9 and 10. Referring to FIG. 11, the present embodiment basically performs the same processing as the steps shown in FIGS. 5 to 9 of the first embodiment. Therefore, in FIG. 11, the same components as those in FIGS. 9 and 10 are denoted by the same reference numerals, and the description thereof will not be repeated. However, in the present embodiment, the fractured portion 35 is a protruding portion in which the receiving jig main body portion 31 as the base material of the receiving jig 3 protrudes from the main surface 31 a of the receiving jig 3. In other words, the main surface 31a on the upper side of the receiving jig is discontinuous by the fractured portion 35 that is a convex portion. In this respect, the present embodiment is structurally different from the first and second embodiments in which the main surface 31a is discontinuous at the broken portion due to the recess. Summarizing the above embodiments, in the film laminating method of the first to third embodiments, a fracture portion in which the main surface 31a of the receiving jig 3 is discontinuous by a concave portion or a convex portion is used.

In FIG. 11, the fracture | rupture part 35 is formed so that it may extend upwards from the main surface 31a of the receiving jig main-body part 31. As shown in FIG. In addition, it is more preferable that the fracture | rupture part 35 has the shape where the width | variety becomes narrow gradually toward the front-end | tip part of the Z direction upper side from the root part of the Z-direction lower side, and the front-end | tip part has a sharp shape. However, the breakage portion 35 is not limited to the shape having the sharp tip portion, and may have a shape having substantially the same width from the root portion to the tip portion.

The fracture portion 35 preferably has a maximum width, that is, a ratio of the height f extending in the Z direction to the width e of the root portion in FIG. That is, the fracture portion 35 preferably has a root portion width e of 4 mm and a height f of 20 mm or more.

Also in the film laminating method of the present embodiment, the inside of the first chamber 1 and the inside of the second chamber 2 is depressurized and heated as in the other embodiments. Thereafter, the stage 12 (see FIG. 8) is raised, and the atmosphere is supplied into the second chamber body 21. As a result, a pressure difference between the second chamber 2 and the first chamber 1 is generated, whereby a force is applied to the film 5 from the high pressure second chamber 2 side to the low pressure first chamber 1 side. . The film 5 is pressed so as to be in close contact with the printed circuit board 4 on the first chamber 1 side, that is, the lower side. As a result, the film 5 is pressed so as to be in close contact with the surface of the convex fracture portion 35. At this time, the portion of the film 5 that is in close contact with the surface of the fracture portion 35 is pulled downward on the surface of the fracture portion 35 by the pressure from the second chamber 2 side to the first chamber 1 side. Then, the film 5 is broken at a sharp portion at the tip of the breaking portion 35. The subsequent steps are the same as the laminating method of the other embodiments.

FIG. 12 is a schematic plan view showing a mode corresponding to FIG. 5 of the first embodiment in the third embodiment. That is, in the third embodiment, the printed circuit board 4 of FIG. 2 is placed on the upper main surface 31a of the receiving jig 3 as in FIG. Referring to FIG. 12, this differs from FIG. The breakage portion 35 that is a projection portion with respect to the main surface 31a is formed in a substantially rectangular frame shape so as to surround the outer peripheral portion of the rectangular workpiece 4. However, it is preferable that the outer edges of the four corners of the fractured portion 35 are curved, particularly arcuate.

Also in the present embodiment, the same effects as those of the first and second embodiments are basically obtained, and therefore the description thereof will not be repeated. Further, possible modifications of the present embodiment are basically the same as those of the first and second embodiments, and therefore the description thereof will not be repeated.

Embodiment 4 FIG.
Hereinafter, the film laminating method of the present embodiment will be described in detail with reference to FIGS. FIG. 13 is a schematic cross-sectional view showing an aspect corresponding to FIG. 6 of the first embodiment in the fourth embodiment.

Referring to FIG. 13, also in the film laminating method of the present embodiment, the printed circuit board 4 as a molding object is placed on the receiving jig 3 arranged in the first chamber 1 as in the first embodiment. Is placed. A film 5 is placed between the first chamber 1 and the second chamber 2 above the first chamber 1 so as to partition the first chamber 1 and the second chamber 2. The inside of the first chamber 1 and the inside of the second chamber 2 are depressurized, and the inside of the second chamber body 21 is released to the atmosphere as the stage 12 is raised. In this way, the film 5 is coated on the surface of the printed circuit board 4 in a state where at least the inside of the first chamber 1 is decompressed. The portion of the film 5 that protrudes outside the printed circuit board 4 is cut off.

However, in the present embodiment, the black body paint 36 is applied to the outer peripheral portion in a plan view of the region where the printed circuit board 4 of the receiving jig 3 is placed so as to surround the outer peripheral portion. In this respect, the present embodiment is different from the first to third embodiments in which a fracture portion is provided at the outer peripheral portion in plan view of the region where the printed circuit board 4 of the receiving jig 3 is placed.

FIG. 14 is a schematic plan view showing an aspect corresponding to FIG. 5 of the first embodiment in the fourth embodiment. Referring to FIG. 14, the black body paint 36 is placed on the printed circuit board 4 from the outside in a plan view with the outer peripheral portion, that is, the end portion of the area on which the printed circuit board 4 is placed being the innermost end portion. It is applied on the main surface 31 a on the upper side in the Z direction of the receiving jig main body 31 so as to surround the area to be placed. Therefore, the black body paint 36 is applied so as to have a width from the outer peripheral portion, that is, the end portion of the region where the printed circuit board 4 is placed, toward the outside in a plan view.

FIG. 15 is a schematic cross-sectional view showing a mode corresponding to FIG. 11 of the third embodiment in the fourth embodiment. Referring to FIG. 15, this figure shows a state in which the film 5 is coated on the surface of the printed circuit board 4 with the black body paint 36 applied as shown in FIG. At this time, the black body paint 36 absorbs the infrared rays of the heater 22, so that the temperature rises. As a result, the temperature of the film 5 covering the black body paint 36, that is, the resin film base 51 and the adhesive 52, is softened by increasing the temperature as compared with the resin film base 51 and the adhesive 52 in other regions. That is, the film 5 covering the black body paint 36, that is, the resin film substrate 51 and the adhesive 52 has a lower strength than the resin film substrate 51 and the adhesive 52 in other regions, and is easily cut. Utilizing such a state, the film 5 immediately above is cut in the region where the black body paint 36 is applied. If it does in this way, the part of the film 5 which protruded to the outer side of the printed circuit board 4 will be cut out like other embodiment.

Next, the function and effect of this embodiment will be described. In the present embodiment, the black body paint 36 is applied as described above, and the portion of the film 5 stuck immediately above is easily cut off due to strength reduction due to heating and softening. For this reason, the black body paint 36 functions in the same manner as the

fracture portions

32, 34, and 35 of the other embodiments. Therefore, in the present embodiment, as in the other embodiments, it is not necessary to use a blade such as a cutter in the trimming process for cutting the unnecessary portion of the resin film substrate 51, and the trimming process can be easily performed. Further, since a blade such as a cutter is not used in the trimming step, the possibility of accidentally damaging the portion of the resin film base 51 that is coated on the printed circuit board 4 and should not be cut can be eliminated.

In the present embodiment, for example, the receiving jig 3 is prepared again when the film 5 is coated on the molding 4 having a different outer peripheral shape because the size or shape in plan view is different. There is no need. In such a case, it is only necessary to repaint the black body paint 36 on the same receiving jig 3 as the receiving jig 3 used so far. For example, when using the receiving jig 3 having a fracture portion as in the first to third embodiments, the receiving jig 3 having a fracture portion formed at a different position for each molding 4 having a different outer peripheral shape. It is necessary to prepare one by one. However, according to the present embodiment, a single receiving jig 3 can be used regardless of the type of the molding 4. For this reason, the manufacturing cost of the receiving jig 3 can be reduced, and a highly efficient film laminating method can be provided.

In the method of manufacturing the printed circuit board 4 according to the disclosure of each of the first to fourth embodiments described above, referring again to FIG. 2, the electronic component 43 and, for example, the integrated circuit 42 are provided on the substrate 41. The mounted printed circuit board 4 as a molding is prepared. The surface of the printed circuit board 4 is coated with the film 5, that is, the resin film substrate 51 using the film laminating method according to any one of the first to fourth embodiments. Thereby, the same effect as each said embodiment is acquired.

The features described in the embodiments described above (each example included in the embodiments) may be applied so as to be appropriately combined within a technically consistent range.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1. 1st chamber, 2nd chamber, 3 receiving jig, 4 molding object (printed circuit board), 5 film, 11 1st chamber body, 12 stage, 12a mounting part, 12b shaft part, 13 film set frame, 14, 23 pressure valve, 21 second chamber body, 22 heater, 31 receiving jig body, 31a, 31b, 41a, 41b main surface, 32, 34, 35 fracture, 33 connection 36 black body paint, 41 substrate, 41c conductor wiring, 42 integrated circuit, 43 electronic components, 44 solder material, 51 resin film substrate, 52 adhesive, 53 separator, 54 film roll set part, 55 separator take-up part, 100 Vacuum forming equipment.

Claims

A first step of placing a molding on a receiving jig disposed in the first chamber;
A film is placed between the first chamber and the second chamber above the first chamber so as to partition the first chamber and the second chamber. A second step;
A third step of covering the surface of the molding object with the film in a state where at least the inside of the first chamber is decompressed;
A fourth step of cutting out the portion of the film that protrudes outside the molding,
In the fourth step, the breakage portion provided on the outer peripheral portion of the receiving jig in the plan view of the region on which the workpiece is placed is discontinuous where the main surface of the receiving jig is discontinuous. A film laminating method in which the film is cut.
2. The film laminating method according to claim 1, wherein the fracture portion has a main surface of the receiving jig that is discontinuous due to a concave portion.
3. The film laminating method according to claim 2, wherein the fracture portion is a groove portion formed in the base material of the receiving jig from the main surface of the receiving jig.
The film laminating method according to claim 3, wherein the groove portion penetrates the base material from the main surface of the receiving jig to another main surface opposite to the main surface.
The width of the groove in the direction along the main surface is 1 mm or more and 3 mm or less, and the ratio of the depth in the direction intersecting the main surface to the width is 5 or more. 5. The film laminating method according to 4.
The film laminating method according to any one of claims 1 to 5, wherein the fracture portion is formed on the entire circumference of the outer peripheral portion in plan view of the molding object.
The film laminate according to any one of claims 1 to 6, wherein, in the fourth step, a difference in pressure in the second chamber with respect to pressure in the first chamber is 0.5 atm or more. Method.
2. The film laminating method according to claim 1, wherein the fracture portion has a discontinuous main surface of the receiving jig due to a convex portion.
9. The film laminating method according to claim 8, wherein the fractured portion is a protruding portion in which a base material of the receiving jig protrudes from the main surface of the receiving jig.
The film laminating method according to claim 8 or 9, wherein the fracture portion is formed on the entire circumference of the outer peripheral portion in plan view of the molding.
The film laminate according to any one of claims 8 to 10, wherein, in the fourth step, a difference in pressure in the second chamber with respect to pressure in the first chamber is 0.5 atm or more. Method.
A first step of placing a molding on a receiving jig disposed in the first chamber;
A film is placed between the first chamber and the second chamber above the first chamber so as to partition the first chamber and the second chamber. A second step;
A third step of covering the surface of the molding object with the film in a state where at least the inside of the first chamber is decompressed;
A fourth step of cutting out the portion of the film that protrudes outside the molding,
The fourth step includes a step of applying a black body paint so as to surround an outer peripheral portion in a plan view of a region where the molding object of the receiving jig is placed, and a region where the black body paint is applied. And laminating the film.
13. A method for laminating a printed circuit board, wherein a printed circuit board on which an electronic component is mounted is used as the object to be molded in the film laminating method according to any one of claims 1 to 12.
Preparing a printed circuit board as the molding by mounting electronic components on a substrate; and
A method for producing a printed circuit board, comprising: coating the surface of the printed circuit board with the film using the film laminating method according to any one of claims 1 to 12.