CN107864570A - A kind of circuit board and its manufacture method, electronic equipment - Google Patents
A kind of circuit board and its manufacture method, electronic equipment Download PDFInfo
- Publication number
- CN107864570A CN107864570A CN201711055475.0A CN201711055475A CN107864570A CN 107864570 A CN107864570 A CN 107864570A CN 201711055475 A CN201711055475 A CN 201711055475A CN 107864570 A CN107864570 A CN 107864570A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- pressure head
- size
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Abstract
The invention discloses a kind of circuit board and its manufacture method, electronic equipment, it is related to electronic device field.The manufacture method of circuit board includes：A circuit board substrate is provided, circuit board substrate includes at least one first FX；At least one electronic component is placed in the first FX；In the first FX, electronic component is pressed by least one pressure head, electronic component is fixed on the first FX, wherein, the summation of the size of at least one pressure head is less than or equal to the size of the first FX.Solved by the above method in the multiple electronic components of circuit board bonding, the problem of circuit board utilization ratio of spaces is not high.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of circuit board and its manufacture method, electronic equipment.
Background technology
In existing LCD (Liquid Crystal Display, liquid crystal display) product, COF generally can be all used
(Chip On Flex, or, Chip On Film, often claim chip on film) technology.That is, IC (integrated will be driven
Circuit, integrated circuit) the crystal grain mantle structure that is fixed on FPC (Flexible Printed Circuit, FPC)
Dress technology, it is the technology for engaging chip with flexible base plate circuit with soft additional circuit boards work encapsulation chip carrier.Then
Obtained finished product COF is solid by bonding (bonding) flow and PCB (Printed Circuit Board, printed circuit board)
Determine and realize COF and electrically connected with PCB.
When COF and PCB carries out bonding, generally use whole piece thermal head presses more COF and PCB bonding
Technique.In such a technique, the more regions between COF and PCB can not be used for placing element, so as to cause the PCB spaces of a whole page to utilize
Rate is low.
The content of the invention
The present invention solves the technical problem of a kind of circuit board and its manufacture method, electronic equipment is provided, can solve
The problem of certainly PCB utilization ratio of spaces is low.
In order to solve the above technical problems, one aspect of the present invention is：A kind of manufacturer of circuit board is provided
Method.The manufacture method of circuit board includes：A circuit board substrate is provided, circuit board substrate includes at least one first FX；
At least one electronic component is placed in the first FX；In the first FX, pass through at least one pressure head pair
Electronic component is pressed, and electronic component is fixed on the first FX, wherein, the size of at least one pressure head it is total
With the size less than or equal to the first FX.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of circuit board, circuit board are provided
Including circuit board substrate, circuit board substrate includes at least one first FX；At least one electronic component, it is placed on
In one FX；Wherein, electronic component is pressed by least one pressure head in the first FX, makes electronics
Component is fixed on the first FX；The summation of the size of at least one pressure head is less than or equal to the chi of the first FX
It is very little.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of electronic equipment is provided, wherein
Electronic equipment includes previously described circuit board.
The beneficial effects of the invention are as follows：Be different from the situation of prior art, the present invention by provide a kind of circuit board and its
Manufacture method, electronic equipment, the manufacture method of circuit board include：A circuit board substrate is provided, circuit board substrate includes at least one
Individual first FX；At least one electronic component is placed in the first FX；In the first FX, pass through
At least one pressure head presses to electronic component, electronic component is fixed on the first FX, wherein, it is at least one
The summation of the size of pressure head is less than or equal to the size of the first FX.The size for controlling pressure head by the above method makes its small
In or equal to circuit board the first FX, so as to improve the area utilization of circuit board.
Brief description of the drawings
Fig. 1 is a kind of schematic flow sheet of the embodiment of manufacture method one of circuit board of the present invention；
Fig. 2 is a kind of structural representation of the embodiment of circuit board one of the present invention；
Fig. 3 is a kind of structural representation of display panel in a kind of electronic equipment of the present invention；
Fig. 4 is the structural representation of the PCB of display panel shown in Fig. 3.
Embodiment
For make present invention solves the technical problem that, the technical scheme that uses and the technique effect that reaches it is clearer, below
The technical scheme of the embodiment of the present invention will be described in further detail with reference to accompanying drawing.
Refering to Fig. 1, Fig. 1 is a kind of schematic flow sheet of the embodiment of manufacture method one of circuit board of the present invention.Wherein circuit
The preparation method idiographic flow of plate is as follows：
Step S101：A circuit board substrate is provided, circuit board substrate includes at least one first FX.
Wherein, circuit board substrate can be PCB or FPC.Circuit board substrate includes at least one first in this step
FX, wherein the first FX is used to fix electronic component, electronic component is needed by pressure head pressure when fixing
Conjunction makes its fixation more firm.Such as IC or FPC is fixed by bonding techniques in the first FX.By IC or FPC
It is fixed on behind the first fixed position of circuit board and also IC or FPC is pressed by thermal head.
Wherein, circuit board substrate can also include two or more spaced first FX；Two
Also include the second FX between individual spaced first FX.Wherein, the second FX can be used for setting
Put electronic component.It can include resistance, electric capacity, connector, inductance, processing in the electronic component that the second FX is set
Device, switch, LED IC or FPC.Electronic component in second FX can be fixed by welding in circuit board substrate
On, can also be by glue on circuit board substrate.
Also include cleaning the first FX of circuit board in this step, clean and drying and processing, it is acted on
It is the oxide layer on the pad for remove circuit board substrate, prevents fixation of the oxide layer to electronic component from having an impact, make electronics
Component can be with circuit board substrate fixing-stable.
Step S102：At least one electronic component is placed in the first FX.
Wherein, electronic component includes PCB, FPC or IC.Electronic component can be pasted by glue in this step
In first FX, such as anisotropic conductive film (Anisotropic Conductive Film can be used；ACF) by electricity
Sub- component is pasted onto on the predeterminated position in the first FX, makes electronic component and circuit board electrical connection.
Step S103：In the first FX, electronic component is pressed by least one pressure head, makes electronics
Component is fixed on the first FX, wherein, the summation of the size of at least one pressure head is less than or equal to the first FX
Size.
After completing step S102 and at least one electronic component is fixed on into the first FX, pass through at least one pressure
Head presses to electronic component, electronic component is closely pasted together with circuit board, it is ensured that electronics member device
Part can firmly be pasted on circuit boards.
Wherein, the summation of the size of at least one pressure head is less than or equal to the size of the first FX.Need what is illustrated
It is that the size of pressure head is less than or equal to the size of the first FX when pressure head quantity is one；When pressure head quantity is one
During the above, the summation of the size of all pressure heads is less than or equal to the size of the first FX.So ensure that pressure head will not surpass
Go out the first FX.
Prior art is different from, the present invention proposes a kind of manufacture method of circuit board, pressed to electronic component
When, pressure head is made without departing from the first FX by the quantity and size that adjust pressure head, so that pressure head does not affect
Region beyond first FX, therefore electronic component can be set in the position beyond the first FX, so as to carry
The high utilization ratio of spaces of circuit board, while the size of circuit board can also be reduced, save the cost of material of circuit board.
In another embodiment, a kind of circuit board is proposed.With reference to figure 2, Fig. 2 is a kind of embodiment of circuit board one of the present invention
Structural representation.Circuit board 20 includes circuit board substrate 21, and at least one first fixed area is provided with circuit board substrate 21
Domain 211, electronic component 22 is set in the first FX 211.Wherein, by least one pressure head 23 to the first fixed area
Electronic component 22 in domain 211 is pressed, and electronic component 22 is fixed in the first FX 211, wherein at least
The summation of the size of one pressure head 23 is less than or equal to the size of the first FX 211.
Pass through such scheme, it can be ensured that pressure head 23 is without departing from the first FX 211 so that pressure head 23 is to electronics member device
When part 22 is pressed, the region beyond the first FX 211 is not interfered with, therefore can be in the first FX 211
Other electronic components are arranged in region in addition, improve the utilization ratio of spaces of circuit board substrate.
In the present embodiment, the summation of the size of at least one pressure head 23 is less than or equal to the chi of the first FX 211
It is very little., wherein it is desired to explanation is that the size of pressure head 23 is less than or equal to the first FX when the quantity of pressure head 23 is one
211 size；When the quantity of pressure head 23 is more than one, the summation of the size of all pressure heads 23 is less than or equal to the first fixed area
The size in domain 211.I other words when electronic component 22 of the pressure head 23 in the first FX 211 presses, it is all
Pressure head 23 is all without beyond the first FX 211.
In the present embodiment, circuit board substrate 21 can also include first FX 211 at least two intervals, each
Electronic component 22 in individual first FX 211 is pressed by least one pressure head 23 respectively.Wherein, two it is adjacent
The first FX 211 between region be the second FX 212, the second FX 212 can be used for setting electricity
Sub- component.By the way that electronic component is arranged in the second FX, the utilization ratio of spaces of circuit board substrate 21 is improved,
Production cost can be reduced.The electronic component of other positions on circuit board substrate can also be set simultaneously to the second fixed area
Domain 212, the size of whole circuit board 20 can be reduced, save design space.
Electronic component 22 in the present embodiment can be by glue in the first FX 211.For example, electronics is first
Device 22 can be fixed in the first FX 211 by bonding techniques.The idiographic flow of Bonding techniques is, to electricity
Road plate substrate 21 cleaned, is cleaned and drying and processing, removes the oxide layer of golden finger (pin) in the first FX 211；
Then golden finger surface be coated with ACF glue after by electronic component 22 be placed on ACF glue and make its golden finger with first fixation
Golden finger corresponds in region 211, electronic component 22 is fixed on the finally by thermal head pressing electronic component 22
In one FX 211.Wherein, electronic component 22 includes printed circuit board, FPC or integrated circuit.
In the present embodiment, electronic component is pressed using at least one pressure head 23, further, wherein arbitrarily
One pressure head 23 can include another pressure head being oppositely arranged with it, so as to form a press head group on circuit board
Electronic component pressed.By taking one of press head group as an example, the electronic component on circuit board is entered in this press head group
During row pressing, pressure head 23 presses on the surface of electronic component to electronic component, and another pressure head is arranged on circuit board and electricity
The back side of sub- component faying face, i.e. between circuit board 21 and electronic component 22 are arranged on into the two pressure heads, pass through two
Individual pressure head extrudes circuit board and electronic component respectively, reaches the effect on circuit boards by electronic component fixation.
Prior art is distinguished, the present embodiment proposes a kind of circuit board, and wherein circuit board includes circuit board substrate, circuit board base
Plate includes at least one first FX；At least one electronic component, electronic component are placed in the first FX；
Wherein, electronic component is pressed by least one pressure head in the first FX, is fixed on electronic component
First FX；The summation of the size of at least one pressure head is less than or equal to the size of the first FX.Pressed by adjusting
The size and number of head so that pressure head when being pressed to electronic component without departing from the first FX, therefore will not be to the
Place beyond one FX has an impact, so as to which electronic component is set to the position around the first FX
Put, improve the utilization ratio of spaces of circuit board.
The embodiment of the present invention also provides a kind of electronic equipment, and wherein electronic equipment includes circuit board described previously.Due to carrying
The high utilization ratio of spaces of circuit board, the size of circuit board can be reduced, therefore when carrying out structure design to electronic equipment
The design space of circuit board can be reduced, more spaces can be reserved other components of electronic equipment are configured.
Electronic equipment in the present embodiment can be a kind of display device, and display device includes display panel.Refer to Fig. 3
And Fig. 4, Fig. 3 are a kind of structural representations of display panel in the present embodiment, Fig. 4 is the PCB electricity of display panel shown in Fig. 3
The structural representation of road plate.Display panel 30 includes display portion 31, be connected in display portion 31 3 FPC32 and with 3
The PCB 33 that FPC32 is connected.Wherein PCB 33 can be realized by this 3 FPC32 with display portion 31
Electrical connection.FPC32 quantity is not construed as limiting in the present embodiment, in other embodiments FPC32 quantity can also be 1,2
It is individual or more than 3.
PCB 33 includes 3 the first FX 331 in the present embodiment, wherein each first FX 331
In be fixed with a FPC32.FPC32 can use first fixed area of the method as previously described fixed to PCB 33
In domain 331.I.e., there is provided a PCB 33,3 first that then 3 FPC32 are respectively fixed in PCB 33 consolidate
Determine the predeterminated position in region 331, this 3 FPC32 are pressed respectively by 3 pressure heads 34.Wherein all pressure heads 34
The first FX 331 of position correspondence is pressed without departing from it.Further, two adjacent the first FX 331
Between and the first FX 331 and the edge of PCB 33 between also there is the second FX 332, it is solid with first
Determine the component placing region 333 that region 331 is in beyond the same face the first FX 31 of removing and the second FX 32.Its
In the second FX 332 and component placing region 333 may be used to putting electronic device, the type of electronic component can
With including resistance, electric capacity, connector, inductance, processor, switch, LED IC or FPC.
Therefore, this programme is by controlling the size of pressure head 34 and making pressure head 34 without departing from the first FX 331, so that
Pressure head 34 do not interfere with the second FX 332, can cause originally can not putting electronic device the second FX
332 may also be used for setting electronic component, therefore improve the utilization ratio of spaces of PCB 33.Further, in PCB
In the case that the electronic component quantity and species that are set on circuit board 33 are constant, component placing region will can be originally arranged on
Electronic component in 333 is set into the second FX 332, reduces the electronics member device set in component placing region 333
The number of part, and then the size of component placing region 333 can be reduced, so that the size of whole PCB 33 can be reduced,
Therefore the utilization ratio of spaces of PCB 33 can further be improved.Meanwhile also may be used when carrying out structure design to display device
To reduce the design headspace of PCB 33, therefore other components of more spaces to display device can be reserved
It is configured.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
- A kind of 1. manufacture method of circuit board, it is characterised in that including：A circuit board substrate is provided, the circuit board substrate includes at least one first FX；At least one electronic component is placed in first FX；In first FX, the electronic component is pressed by least one pressure head, makes the electronics Component is fixed on first FX, wherein, the summation of the size of at least one pressure head is less than or equal to described The size of first FX.
- 2. manufacture method according to claim 1, it is characterised in that the circuit board substrate also includes at least two intervals First FX；First FX carries out pressing by a pressure head to the electronic component to be included：The electronic component is pressed by least one pressure head respectively in each described first FX Close.
- 3. manufacture method according to claim 2, it is characterised in that the circuit board substrate also includes adjacent positioned at two First FX between the second FX；The manufacture method also includes：Electronic component is arranged in second FX.
- 4. manufacture method according to claim 1, it is characterised in that electronic component is placed on first fixed area Step in domain includes：The electronic component is pasted onto in first FX by glue.
- 5. manufacture method according to claim 1, it is characterised in thatThe electronic component includes printed circuit board, FPC or integrated circuit.
- A kind of 6. circuit board, it is characterised in that including：Circuit board substrate, the circuit board substrate include at least one first FX；At least one electronic component, the electronic component are placed in first FX；Wherein, the electronic component is pressed by least one pressure head in first FX, made described Electronic component is fixed on first FX；The summation of the size of at least one pressure head is less than or equal to described the The size of one FX.
- 7. circuit board according to claim 6, it is characterised in that the circuit board substrate also includes at least two intervals First FX；Electronic component in each described first FX is pressed by least one pressure head respectively.
- 8. circuit board according to claim 7, it is characterised in thatThe circuit board substrate also includes the second FX between two adjacent first FX；Wherein, it is provided with electronic component in second FX.
- 9. according to the method for claim 6, it is characterised in that：The electronic component by glue in first FX, wherein, the electronic component include printing Circuit board, FPC or integrated circuit.
- 10. a kind of electronic equipment, it is characterised in that including the circuit board as described in wanting any one of 6-9 such as right.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711055475.0A CN107864570A (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and its manufacture method, electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711055475.0A CN107864570A (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and its manufacture method, electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107864570A true CN107864570A (en) | 2018-03-30 |
Family
ID=61696471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711055475.0A Pending CN107864570A (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and its manufacture method, electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107864570A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131253A1 (en) * | 2001-01-15 | 2002-09-19 | Yukihisa Kobayashi | Circuit board and method of manufacturing the same, and display device |
| CN101795541A (en) * | 2010-01-15 | 2010-08-04 | 友达光电股份有限公司 | Pressing device |
| JP2011243683A (en) * | 2010-05-17 | 2011-12-01 | Fujitsu Ltd | Electronic component mounting method, electronic component manufacturing method and electronic component, and electronic component manufacturing apparatus |
| DE102015210103A1 (en) * | 2015-02-10 | 2016-08-11 | Conti Temic Microelectronic Gmbh | Method for producing an electronic component and electronic component |
| CN107283989A (en) * | 2017-06-28 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Press fit device and the method for pressing colloid on a display panel |
| CN207410593U (en) * | 2017-10-31 | 2018-05-25 | 惠州市华星光电技术有限公司 | A kind of circuit board and electronic equipment |
-
2017
- 2017-10-31 CN CN201711055475.0A patent/CN107864570A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131253A1 (en) * | 2001-01-15 | 2002-09-19 | Yukihisa Kobayashi | Circuit board and method of manufacturing the same, and display device |
| CN101795541A (en) * | 2010-01-15 | 2010-08-04 | 友达光电股份有限公司 | Pressing device |
| JP2011243683A (en) * | 2010-05-17 | 2011-12-01 | Fujitsu Ltd | Electronic component mounting method, electronic component manufacturing method and electronic component, and electronic component manufacturing apparatus |
| DE102015210103A1 (en) * | 2015-02-10 | 2016-08-11 | Conti Temic Microelectronic Gmbh | Method for producing an electronic component and electronic component |
| CN107283989A (en) * | 2017-06-28 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Press fit device and the method for pressing colloid on a display panel |
| CN207410593U (en) * | 2017-10-31 | 2018-05-25 | 惠州市华星光电技术有限公司 | A kind of circuit board and electronic equipment |
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