CN207460582U - FPC plates - Google Patents

Abstract

The utility model provides a kind of FPC plates, including substrate, the pad being arranged in substrate and the circuit being electrically connected with pad, wherein, on the line covered with cover film, also, gap is provided between cover film and pad.Using the utility model, it can solve the problem of pad and cover film there are conducting particles in difference in height ACF not to be crushed.

Description

FPC plates

Technical field

The utility model is related to anisotropic conductive adhesive paste/technical field of membrane, more specifically, are related to a kind of electronics industry ACF It is designed with the Layout of FPC in Hot bar techniques.

Background technology

In electronics industry, some products will use ACF, and (Anisotropic Conductive Film, anisotropy are conductive Glue/film) technology.Wherein, ACF technologies specifically refer to, and PCB and FPC etc. is combined realization by ACF gluings to electrically conduct, PCB (Printed circuit board, the hardboard on ordinary meaning, printed circuit board (PCB)), FPC (Flexible Print Circuit, flexible PCB).

ACF is high to the design requirement of FPC, and the design of FPC directly affects the effect of ACF.Wherein, the non-patch regions of FPC Layer protecting film is all posted, this protective film is generally coverlay (cover film) or ink.Due to high between cover film and pad The presence of difference is spent, the conducting particles in the ACF glue of film edge is covered and there is a situation where not crush, and influences the effect of ACF pressings, Production yield is caused to decline, product reliability reduces.

To solve the above problems, the utility model provides a kind of new FPC plates.

Utility model content

In view of the above problems, the purpose of this utility model is to provide a kind of FPC plates, there is height with cover film to solve pad The problem of degree is poor, and conducting particles is not crushed in ACF.

FPC plates provided by the utility model are electrically connected including substrate, the pad being arranged in substrate and with pad Circuit, wherein, on the line covered with cover film, also, gap is provided between cover film and pad.

Furthermore it is preferred that structure be that pad is two rows, and cover film is arranged between two rows of pads.

Furthermore it is preferred that structure be that one end of circuit is provided with electrical connector, wherein, circuit by electrical connector with Pad connects.

Furthermore it is preferred that structure be the width of one end that electrical connector is connected with pad and being of same size for pad.

Furthermore it is preferred that structure be, electrical connector along pad Y direction be distributed.

Furthermore it is preferred that structure be that FPC plates pass through pad and the bonding fixations of ACF.

It was found from technical solution above, FPC plates provided by the utility model, by being set between pad and cover film Gap so as to eliminate difference in height between pad and cover film, avoids the pressure head during ACF is pressed from being pressed onto on cover film, FPC This design structure of plate can fundamentally avoid ACF from pressing incomplete situation, ACF pressing reliabilities be improved, so as to improve Product yield and product reliability.

Description of the drawings

By reference to the content of the explanation below in conjunction with attached drawing, and with the utility model is more fully understood, originally The other purposes and result of utility model will be more apparent and should be readily appreciated that.In the accompanying drawings：

Fig. 1 is the FPC plate structure schematic diagrams one according to the utility model embodiment；

Fig. 2 is the FPC plate structure schematic diagrams two according to the utility model embodiment；

Fig. 3 is the FPC plate structure schematic diagrams three according to the utility model embodiment；

Fig. 4 is according to the FPC plates of the utility model embodiment, ACF and pcb board glued construction schematic diagram.

Reference numeral therein includes：1st, substrate, 2, pad, 3, cover film, 4, gap, 5, circuit, 6, electrical connector, 7, First area, 8, ACF, 9, pcb board.

Identical label indicates similar or corresponding feature or function in all of the figs.

Specific embodiment

For pad on the existing FPC plates of foregoing proposition and cover film there are difference in height, conducting particles is not pressed in ACF The problem of broken, the utility model proposes a kind of new FPC plates, eliminate difference in height between pad and cover film.

Specific embodiment of the utility model is described in detail below with reference to attached drawing.

In order to illustrate the structure of FPC plates provided by the utility model, Fig. 1 to Fig. 4 is respectively from different perspectives to the knot of FPC plates Structure has carried out exemplary mark.Specifically, Fig. 1 shows the FPC harden structures one according to the utility model embodiment；Fig. 2 is shown According to the FPC harden structures two of the utility model embodiment；Fig. 3 shows the FPC harden structures according to the utility model embodiment Three；Fig. 4 shows the FPC plates, ACF and pcb board glued construction according to the utility model embodiment.

It is common shown as shown in Figure 1 to Figure 4, FPC plates provided by the utility model, including substrate 1, the weldering of setting on the base 1 Disk 2 and the circuit 5 being electrically connected with pad 2, wherein, covered with cover film 3 on circuit 5, also, in cover film 3 and pad Gap 4 is provided between 2.

It is two rows in the pad 2 that substrate 1 is set, and cover film 3 is arranged on two in the embodiment of the utility model Between arranging pad 2, two rows of pads 2 are both provided with gap 4 with cover film 3.In the utility model, the distribution of pad 2 can be with For L-type distribution or hollow distribution (i.e.：Surrounding is distributed), it is distributed, is required in pad 2 and cover film 3 regardless of pad 2 Between be provided with gap 4.

Wherein, it is necessary to explanation, set gap 4 purpose be in order to eliminate around pad between cover film 3 Difference in height avoids the pressure head during FPC plates and ACF pressings from being pressed onto on cover film.

This is because the distance between cover film and pad on existing FPC plates is 0.15mm or even smaller, therefore, There are difference in height between cover film and pad, in general, about there are the differences in height of 17um-37.5um with pad for cover film (this difference in height is the thickness possibility difference of theoretical value, the copper facing of different base material and glue, has wiring around pad or spreads the ground of copper Square difference in height is 17um, and without cabling or paving copper, difference in height is 32.5um around pad).

Therefore, because the presence of this difference in height, can cause the conducting particles in the ACF glue of covering membrane part not pressed Broken, pressing is incomplete, and there are reliability in terms of hidden danger, (this is because in bonding processes, the general ratio weldering to be pressed of pressure head Disk area is big, and due to the presence of this difference in height, pressure head has the risk being pressed on cover film, and pressing is caused to be not thorough, and partly leads Charged particle is not crushed, influences product yield and performance.

In the embodiment of the utility model, for there are the problem of, by being provided between pad 2 and cover film 3 Gap 4, i.e.,：In bonding processes, for pressure head when being pressed, pressure head leaks the region beyond pad 2, only can be gap The problem of 4 region, pressure head will not be pressed on cover film 3, be not thorough so as to avoid pressing, and partially electronically conductive particle is not crushed.

In addition, in the embodiment of the utility model, one end of circuit 5 is provided with electrical connector 6, wherein, pad 2 is logical Electrical connector 6 is crossed to be electrically connected with circuit 5.Wherein, the width phase of the width of one end that electrical connector 6 is connected with pad 2 and pad 2 Together, also, electrical connector 6 is distributed along the Y direction of pad 2.Wherein, it is necessary to explanation, the width of electrical connector 6 and pad 2 It spends identical one end to be located in gap 4, and extends out from gap 4, the extend out width of part gradually contracts from gap 4 It is small, and it is contracted to the equivalent width of circuit 5.

That is, one end that electrical connector 6 is connected with pad 2 is located in gap 4, electrical connector 6 can be circuit 5 A part, and the wiring in 4 does not allow to turn round in this gap, this is because gap 4 is to be not covered with film protection, wiring is Naked leakage, during in order to avoid pressing, short circuit occurs between different attribute circuit, does not allow to turn round by the circuit in gap 4 hereby It is set along the Y-axis of pad 2.

It is to sum up shown, in order to eliminate the difference in height of pad 2 and periphery, reduce in FPC plates and ACF bonding processes, in ACF Conducting particles pressure it is not broken or press halfway situation, improve ACF pressing reliabilities, improve product yield and reliability, because This utility model proposes a kind of new FPC plates, wherein, whether there is in the first area of substrate 17 any attribute wiring or Copper is spread, and gap 4 is set between the pad and cover film of FPC plates, while ensures circuit 5 in 4th area of the gap of electrical connector 6 It is distributed in domain along the Y direction of pad 2, short circuit will not occur between different attribute circuit 5 when being pressed with guarantee.

In addition, in the embodiment shown in fig. 4, FPC plates are by pad 2 and the bonding fixations of ACF8, and pcb board 9 is by setting The pad 2 and ACF8 put on it is bonded, i.e.,：FPC plates are bonded together by ACF8 and pcb board 9, and realization conducts.

By the above embodiment as can be seen that FPC plates provided by the utility model, by between pad and cover film Gap is set, so as to eliminate difference in height between pad and cover film, the pressure head during ACF is pressed is avoided to be pressed onto cover film On, this design structure of FPC plates can fundamentally avoid ACF from pressing incomplete situation, improve ACF pressing reliabilities, from And improve product yield and product reliability.

Described in an illustrative manner above with reference to attached drawing according to the utility model proposes FPC plates.But this field skill Art personnel should be appreciated that the FPC plates proposed for above-mentioned the utility model, can also not depart from the utility model content On the basis of make various improvement.Therefore, the scope of protection of the utility model should be determined by the content of appended claims.

Claims (6)

1. a kind of FPC plates, including substrate, the circuit for setting pad on the substrate and being electrically connected with the pad, It is characterized in that,

Covered with cover film on the circuit, also, gap is provided between the cover film and the pad.

2. FPC plates as described in claim 1, which is characterized in that

The pad is two rows, and the cover film is arranged between two rows of pads.

3. FPC plates as described in claim 1, which is characterized in that

One end of the circuit is provided with electrical connector, wherein, the circuit is connected by the electrical connector and the pad It connects.

4. FPC plates as claimed in claim 3, which is characterized in that

The width of one end that the electrical connector is connected with the pad is of same size with the pad.

5. FPC plates as claimed in claim 3, which is characterized in that

The electrical connector is distributed along the Y direction of the pad.

6. FPC plates as described in claim 1, which is characterized in that

The FPC plates pass through the pad and the bonding fixations of ACF.