CN206658331U - A kind of circuit board - Google Patents
A kind of circuit board Download PDFInfo
- Publication number
- CN206658331U CN206658331U CN201720396155.0U CN201720396155U CN206658331U CN 206658331 U CN206658331 U CN 206658331U CN 201720396155 U CN201720396155 U CN 201720396155U CN 206658331 U CN206658331 U CN 206658331U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- virtual
- virtual pad
- lateral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 241001232787 Epiphragma Species 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of circuit board, including the top layer and bottom being superimposed, the wherein lateral surface of top layer are provided with pad, and the lateral surface of bottom is provided with virtual pad, and virtual pad is oppositely arranged with pad, and virtual pad is isolated to be set.Because virtual pad is located at the lateral surface of bottom, when making FPC and PCB progress ACF pressings, power is acted on virtual pad, it will not act directly on FPC, make on FPC stress very little between adjacent two pad or do not stress, the especially isolated virtual pad set, its stress is not transferred to other position.Therefore the utility model circuit board, occur in the situation for avoided during ACF pressings stress deformation, circuit board will not be damaged, and improve the quality of product yield and product.
Description
Technical field
It the utility model is related to electronic technology field, more particularly to a kind of circuit board of raising ACF pressing reliabilities.
Background technology
As shown in Fig. 2 in electronics industry, some products to conducting resinl/film (ACF, Anisotropic Conductive
Film) technology, ACF technologies are that PCB6 and FPC5 etc. is combined realization and electrically conducted by the way that ACF is gluing.Circuit board 6 (PCB,
Printed circuit board), the hardboard on ordinary meaning；Circuit board 5 (FPC, Flexible Print Circuit) is logical
Chang Yiyi is flexible PCB.
Existing ACF glue set-up mode on FPC5 is that pad (PAD) 2, ACF positioned at FPC top layers 1 is set to FPC5
Meter requires high, and FPC5 design directly affects ACF effect.Layer protecting film 7 is all posted in the usual non-patch regions of FPC5, protects
The easy temperature distortion when ACF is pressed of cuticula 7, the yielding area of PI stress as shown in Figure 2, the effect of ACF pressings is influenceed, is led
Production yield is caused to decline, product reliability reduces.
Utility model content
For above-mentioned deficiency, technical problem to be solved in the utility model is：A kind of ACF is provided and presses bad risk
Low, the reliability of ACF pressings is high, product yield and the high circuit board of quality.
In order to solve the above technical problems, the technical solution of the utility model is：
A kind of circuit board, including the top layer and bottom being superimposed, the lateral surface of the top layer is provided with pad, described
The lateral surface of bottom is provided with virtual pad, and the virtual pad is oppositely arranged with the pad, and the virtual pad isolates
Set.
Preferred embodiment is that the lateral surface of the bottom is provided with diaphragm, and the virtual pad is corresponded on the diaphragm
Place offers pad windowing.
Preferred embodiment is that the structure for the pad that the virtual pad is set corresponding thereto is consistent.
Preferred embodiment is that the material of the virtual pad is copper.
Preferred embodiment is that the top layer and the bottom are followed successively by cover layer, copper facing and base material from outside to inside.
After adopting the above technical scheme, the beneficial effects of the utility model are：Because circuit board of the present utility model includes
The top layer and bottom being superimposed, the wherein lateral surface of top layer are provided with pad, and the lateral surface of bottom is provided with virtual pad,
Virtual pad is oppositely arranged with pad, is set wherein virtual pad is isolated.Because virtual pad is located at the lateral surface of bottom, make FPC
When carrying out ACF pressings with PCB, conducting resinl/film is coated on pad, power is acted on virtual pad, will not act directly on FPC
On, make on FPC stress very little between adjacent two pad or do not stress, the especially isolated virtual pad set, its stress will not
It is delivered to the other positions of FPC.Therefore circuit board of the present utility model, ACF press the reliability height that bad risk is low, and ACF is pressed,
Product yield and quality are high.
Because the lateral surface of bottom is provided with diaphragm, is corresponded on diaphragm and pad windowing is offered at virtual pad；Make
There is no diaphragm between adjacent two virtual pad, stress does not influence each other each other, further avoid stress deformation
Situation occurs.
The structure of the pad set corresponding thereto due to virtual pad is consistent；Virtual pad can uniformly bear to press during pressing
Power.
In summary, circuit board of the present utility model compared with prior art, solve in the prior art using conducting resinl/
When film bonds FPC and PCB, stress is yielding between ACF stitching operations make two pads adjacent on FPC, increases product fraction defective
Technical problem；And circuit board of the present utility model, ACF press the reliability height that bad risk is low, and ACF is pressed, product yield
With quality height.
Brief description of the drawings
Fig. 1 is the decomposition texture schematic diagram of the utility model circuit board；
Fig. 2 is structural representation when FPC and PCB is pressed in the prior art；
Structural representation when Fig. 3 is the utility model FPC and PCB pressing；
In figure：1-top layer, 2-pad, 3-bottom, 4-virtual pad, 5-FPC, 6-PCB, 7-diaphragm, 8-
Conducting resinl/film.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.
As shown in figures 1 and 3, a kind of circuit board, including the top layer 1 and bottom 3 being superimposed.The circuit of the present embodiment
Plate refers to FPC5, and its top layer 1 is followed successively by cover layer, copper facing and base material from outside to inside, and bottom 3 is also followed successively by covering from outside to inside
Film, copper facing and base material.The lateral surface of FPC5 top layers 1 is provided with pad 2, and the lateral surface of bottom 3 is provided with the virtual (NC of pad 4
PAD), virtual pad 4 is oppositely arranged with pad 2, and the isolated setting of virtual pad 4.The English of virtual pad of the present utility model
Refer to for NC PAD meaningless, without the meaning of electrical connection, NC is term commonly used in the art.What is be oppositely arranged leads weldering
Disk 2 and virtual pad 4, specifically pad 2 are located at top layer 1, and virtual pad 4 is located at the back side of pad 2, from FPC5 when ACF is pressed
The back side apply pressure.
The lateral surface of the present embodiment FPC5 bottoms 3 is provided with layer protecting film 7, is corresponded on diaphragm 7 equal at virtual pad 4
Offer pad windowing.Pad windowing makes do not have the connection of diaphragm 7 between adjacent two virtual pad 4, and stress does not have each other
Influence each other, further prevent the situation of stress deformation to occur.
As shown in figure 3, the virtual pad 4 that the FPC5 back sides are set, its structure and the structure of pad 2 set on FPC5 top layers 1
Unanimously.The pad 2 of the present embodiment is divided to two rows to set, and the pad 2 often arranged is evenly distributed, and virtual pad 4 is also to be divided to two rows to set
Put, often arrange that virtual pad 4 is also evenly distributed, and the pad corresponding thereto such as the shape of each virtual pad 4, thickness
2 is completely the same.When pressing, virtual pad 4 can bear whole pressure completely.The material of virtual pad 4 is copper in addition, isolated to set
The virtual pad 4 put, that is, prevent FPC5 stress deformations, and does not influence FPC5 performance.Certainly the material of virtual pad 4 is unlimited
Copper listed above, as long as not influenceing the performance of circuit board.
As shown in figures 1 and 3, the FPC5 of the utility model structure, when carrying out ACF pressings with PCB6, in FPC5 and
Conducting resinl/film 8 is coated on PCB6 pad 2.Pressure is acted on the virtual pad 4 at the FPC5 back sides, because virtual pad 4 has
Thickness, power is acted on virtual pad 4, make between the diaphragm 7 on FPC5, or adjacent two pad 2, do not stress or stress
Very little, the situation of stress deformation will not occur.The power acted on simultaneously on virtual pad 4, passes to the weldering set corresponding thereto
On disk 2, under the effect of the pressure, conducting resinl/film 8 on FPC5 and PCB6 pad is mutually glued pad 2, final complete
FPC5 and PCB6 gluing.Therefore circuit board of the present utility model, FPC5 and PCB6 is gluing to be combined realization realizing
While electrically conducting, FPC5 will not be damaged again, improve the quality and yield of product.And it is simple in construction, conducting resinl/film closes
It is easy to operate.
Preferred embodiment of the present utility model described above, it is all in this practicality not to limit the utility model
Any modification for being made within new spirit and principle, etc. the improvement of same board structure of circuit etc., should be included in this reality
Within new protection domain.
Claims (5)
1. a kind of circuit board, including the top layer and bottom being superimposed, the lateral surface of the top layer is provided with pad, its feature
It is, the lateral surface of the bottom is provided with virtual pad, and the virtual pad is oppositely arranged with the pad, and described virtual
Pad is isolated to be set.
2. circuit board according to claim 1, it is characterised in that the lateral surface of the bottom is provided with diaphragm, described
Corresponded on diaphragm and offer pad windowing at the virtual pad.
3. circuit board according to claim 1, it is characterised in that the pad that the virtual pad is set corresponding thereto
Structure it is consistent.
4. circuit board according to claim 1, it is characterised in that the material of the virtual pad is copper.
5. circuit board according to claim 1, it is characterised in that the top layer and the bottom are followed successively by cover from outside to inside
Epiphragma, copper facing and base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720396155.0U CN206658331U (en) | 2017-04-14 | 2017-04-14 | A kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720396155.0U CN206658331U (en) | 2017-04-14 | 2017-04-14 | A kind of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206658331U true CN206658331U (en) | 2017-11-21 |
Family
ID=60318532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720396155.0U Withdrawn - After Issue CN206658331U (en) | 2017-04-14 | 2017-04-14 | A kind of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206658331U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851974A (en) * | 2017-04-14 | 2017-06-13 | 歌尔股份有限公司 | A kind of circuit board and compression method |
-
2017
- 2017-04-14 CN CN201720396155.0U patent/CN206658331U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851974A (en) * | 2017-04-14 | 2017-06-13 | 歌尔股份有限公司 | A kind of circuit board and compression method |
| CN106851974B (en) * | 2017-04-14 | 2023-11-24 | 歌尔光学科技有限公司 | Circuit board and laminating method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201015 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171121 Effective date of abandoning: 20231124 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20171121 Effective date of abandoning: 20231124 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |