CN207340286U - Polyimides foamed substrate multi-layer board - Google Patents
Polyimides foamed substrate multi-layer board Download PDFInfo
- Publication number
- CN207340286U CN207340286U CN201721481331.7U CN201721481331U CN207340286U CN 207340286 U CN207340286 U CN 207340286U CN 201721481331 U CN201721481331 U CN 201721481331U CN 207340286 U CN207340286 U CN 207340286U
- Authority
- CN
- China
- Prior art keywords
- low
- wiring board
- froth bed
- foamed substrate
- bonding sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model belongs to antenna technical field, more particularly to a kind of polyimides foamed substrate multi-layer board.It solves the problems such as prior art design is unreasonable.This polyimides foamed substrate multi-layer board includes some pieces of wiring boards being parallel to each other, low-density polyimide froth bed is equipped between two pieces of adjacent wiring boards, bonding sheet is respectively equipped between two surfaces of low-density polyimide froth bed and the wiring board and the bonding sheet is the bonding sheet of 121 148 DEG C of sticking temperature, male-female engagement connection structure is equipped between the low-density polyimide froth bed and wiring board；The male-female engagement connection structure includes the pointed protrusion for setting assist side relative low density polyimide foam laminated, described pointed raised circle distribution and surround to form a circle, some location holes being inserted into one by one for the pointed protrusion are equipped with the one side of low-density polyimide froth bed relative line plate.
Description
Technical field
The utility model belongs to antenna technical field, more particularly to a kind of polyimides foamed substrate multi-layer board.
Background technology
Large-scale printed circuit feeder panel, the micro-strip day applied on airborne radar device, phased array system, remote sensing satellite etc.
Line and antenna array etc. are needed in these antenna circuit using having multilayer wire, it is necessary to part small printed circuit antenna
The multi-layer board of road plate.Traditional multi-layer board is high-density multi-layered harden structure, and base material is used as using high-density polyimide foaming,
Then wiring board and high-density polyimide foaming are connected by hot pressing technique (temperature is at 200 DEG C).
However, high-density polyimide foaming easily deforms during hot pressing, interlayer is then caused after deformation
Contraposition deviates, and can not ensure the accuracy of interlayer alignment.
Utility model content
The purpose of this utility model is in view of the above-mentioned problems, providing a kind of polyimides that can improve interlayer alignment precision
Foamed substrate multi-layer board.
To reach above-mentioned purpose, the utility model employs following technical proposal：This polyimides foamed substrate multi-layer board
Including some pieces of wiring boards being parallel to each other, low-density polyimide froth bed is equipped between two pieces of adjacent wiring boards,
Bonding sheet is respectively equipped between two surfaces of low-density polyimide froth bed and the wiring board and the bonding sheet is
The bonding sheet of 121-148 DEG C of sticking temperature, is equipped with male-female engagement between the low-density polyimide froth bed and wiring board
Connection structure；
The male-female engagement connection structure includes setting assist side relative low density polyimide foam laminated
Pointed protrusion, described pointed raised circle distribution and surrounds to form a circle, in low-density polyimide froth bed relative line
The one side of plate is equipped with some location holes being inserted into one by one for the pointed protrusion.
In above-mentioned polyimides foamed substrate multi-layer board, the pointed raised length is less than the thickness of wiring board
Degree.
In above-mentioned polyimides foamed substrate multi-layer board, the thickness of the low-density polyimide froth bed is more than
The thickness of wiring board.
In above-mentioned polyimides foamed substrate multi-layer board, the circuit plate thickness is more than the thickness of bonding sheet.
In above-mentioned polyimides foamed substrate multi-layer board, the line layer on each piece of wiring board is respectively positioned at wiring board
Upper surface.
In above-mentioned polyimides foamed substrate multi-layer board, the wiring board has four pieces.
Compared with prior art, the multiple-plate advantage of this polyimides foamed substrate is：
1st, the low-density polyimide froth bed combination bonding sheet of design, it can cause certainly to avoid the influence due to high temperature
The deformation that body occurs, can improve the aligning accuracy of interlayer.
2nd, the male-female engagement connection structure of design, it can realize the positioning in advance positioning and connection procedure, can be with
Further improve the aligning accuracy of interlayer.
3rd, it is simple in structure and easily fabricated.
Brief description of the drawings
Fig. 1 is structure diagram provided by the utility model.
Fig. 2 is male-female engagement attachment structure schematic diagram provided by the utility model.
In figure, wiring board 1, pointed raised 11, low-density polyimide froth bed 2, location hole 21, bonding sheet 3.
Embodiment
The present invention will be further described in detail with reference to the accompanying drawings and detailed description.
As shown in Figure 1, this polyimides foamed substrate multi-layer board includes some pieces of wiring boards 1 being parallel to each other, each piece of line
Line layer on road plate 1 is located at the upper surface of wiring board 1 respectively.
Ensure the distribution security of circuit.
Low-density polyimide froth bed 2 is equipped between two pieces of adjacent wiring boards 1, in low-density polyimide foam
It is sticking temperature 121-148 to be respectively equipped with bonding sheet 3 and the bonding sheet 3 between two surfaces of layer 2 and the wiring board 1
DEG C bonding sheet.
The design of low temperature bonding piece 3, which obviating the hot-melt adhesive paste when temperature is higher causes low-density polyimide to be steeped
The deformation of foam layer 2.
Secondly, the thickness of low-density polyimide froth bed 2 is more than the thickness of wiring board 1.
In addition, 1 thickness of wiring board is more than the thickness of bonding sheet 3.
Prioritization scheme, the wiring board 1 of the present embodiment have four pieces.
In order to further improve interlayer alignment precision, it is equipped between low-density polyimide froth bed 2 and wiring board 1 recessed
Convex mating connection structure；
Specifically, as shown in Fig. 2, male-female engagement connection structure includes setting 1 relative low density polyimides of assist side
Pointed raised the 11 of 2 one side of froth bed, pointed raised 11 circle distribution and surround to form a circle, sub- in low-density polyamides
The one side of 2 relative line plate 1 of amine froth bed is equipped with some for pointed raised 11 location holes 21 being inserted into one by one.
Pointed raised 11 length is less than the thickness of wiring board 1.
The low-density polyimide froth bed combination bonding sheet 3 of design, it can cause certainly to avoid the influence due to high temperature
The deformation that body occurs, can improve the aligning accuracy of interlayer.
Secondly, the male-female engagement connection structure of design, it can realize the positioning in advance positioning and connection procedure, can
To further improve the aligning accuracy of interlayer.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Described specific embodiment can be done various modifications or additions or using similar by belonging to those skilled in the art
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (6)
1. polyimides foamed substrate multi-layer board, it is characterised in that this antenna includes some pieces of wiring boards (1) being parallel to each other,
Low-density polyimide froth bed (2) is equipped between two pieces of adjacent wiring boards (1), in low-density polyimide froth bed
(2) it is sticking temperature to be respectively equipped with bonding sheet (3) and the bonding sheet (3) between two surfaces and the wiring board (1)
121-148 DEG C of bonding sheet, is equipped with male-female engagement and connects between the low-density polyimide froth bed (2) and wiring board (1)
Binding structure；
The male-female engagement connection structure includes setting assist side (1) relative low density polyimide foam layer (2) one side
Pointed raised (11), pointed raised (11) circle distribution and surround to form a circle, in low-density polyimide foam
The one side of layer (2) relative line plate (1) is equipped with some location holes (21) being inserted into one by one for pointed raised (11).
2. polyimides foamed substrate multi-layer board according to claim 1, it is characterised in that pointed raised (11)
Length be less than wiring board (1) thickness.
3. polyimides foamed substrate multi-layer board according to claim 1, it is characterised in that the low-density polyamides is sub-
The thickness of amine froth bed (2) is more than the thickness of wiring board (1).
4. polyimides foamed substrate multi-layer board according to claim 3, it is characterised in that the wiring board (1) is thick
Thickness of the degree more than bonding sheet (3).
5. polyimides foamed substrate multi-layer board according to claim 1, it is characterised in that on each piece of wiring board (1)
Line layer is located at the upper surface of wiring board (1) respectively.
6. polyimides foamed substrate multi-layer board according to claim 1, it is characterised in that wiring board (1) tool
There are four pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721481331.7U CN207340286U (en) | 2017-11-08 | 2017-11-08 | Polyimides foamed substrate multi-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721481331.7U CN207340286U (en) | 2017-11-08 | 2017-11-08 | Polyimides foamed substrate multi-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207340286U true CN207340286U (en) | 2018-05-08 |
Family
ID=62427620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721481331.7U Expired - Fee Related CN207340286U (en) | 2017-11-08 | 2017-11-08 | Polyimides foamed substrate multi-layer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207340286U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315142A (en) * | 2020-03-24 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Processing technology of MPI foam cotton mixed pressing plate |
-
2017
- 2017-11-08 CN CN201721481331.7U patent/CN207340286U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315142A (en) * | 2020-03-24 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Processing technology of MPI foam cotton mixed pressing plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180508 Termination date: 20201108 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |