CN108260280A - A kind of FPC bending molding process - Google Patents
A kind of FPC bending molding process Download PDFInfo
- Publication number
- CN108260280A CN108260280A CN201711261829.7A CN201711261829A CN108260280A CN 108260280 A CN108260280 A CN 108260280A CN 201711261829 A CN201711261829 A CN 201711261829A CN 108260280 A CN108260280 A CN 108260280A
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- Prior art keywords
- bending
- fpc
- base material
- substrate
- molding process
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention discloses a kind of FPC bending molding process, belong to FPC circuit board technology fields.The FPC bending successful process of the present invention includes the following steps, Step 1: selection substrate material, the base material include intermediate base layer and the outer layer positioned at the intermediate base layer both sides, connected up on base material；Step 2: fit over film on the base material completed in wiring；Step 3: the printing on substrates pressure-sensing glue to fitting over film；Step 4: echo thermosetting glued membrane；Step 5: carrying out jet-bedding processing to substrate, and steel disc is bonded on substrate；Step 6: bending processing is carried out to substrate using bending jig；Step 7: the product of bending is pressed together, to obtain molding FPC.The FPC bending molding process of the present invention designs the technological process of a FPC bending and moldings, and the parameter of selection and the pressing of base material is controlled, so as to control the fluctuation of the overall printing precision and secondary printing of molding FPC for pressure-sensitive potential difference.
Description
Technical field
The invention belongs to FPC circuit board processing technique fields, more particularly, to a kind of FPC bending molding process.
Background technology
Present flexible circuit board FPC (Flexible Printed Circuit board) is usually by single side base
Material or two-sided base material (FCCL) processing form single sided board, dual platen and multi-layer board, and the processing process of existing FPC is：It opens
Material-drilling-black holes-plating-exposure imaging-exposure imaging-print pressure-sensing glue-echos the full slot of thermosetting glued membrane-punching-fitting steel disc-FPC
Bending, according to existing FPC processing technologys produce FPC, it is difficult to ensure secondary printing pressure-sensing glue overall printing precision and for
The fluctuation of pressure-sensitive potential difference.
Invention content
The technical problems to be solved by the invention are, provide a kind of FPC bending molding process, can be with Perceived control die pressing product
The variation range of pressure-sensitive potential difference after assembling avoids secondary printing pressure-sensing glue overall printing accuracy error and for pressure-sensitive electricity
The fluctuation of potential difference.
Solution is used by the present invention solves above-mentioned technical problem：A kind of FPC bending molding process is provided, including
Following steps, Step 1: selection substrate material, the base material includes intermediate base layer and positioned at the outer of the intermediate base layer both sides
Side layer, the intermediate base layer are 20um polyimides, and the outer layer is 12um copper, is connected up on base material；Step 2: connecting up
Film is fitted on the base material of completion；Step 3: the printing on substrates pressure-sensing glue to fitting over film；Step 4: echo thermosetting
Glued membrane；Step 5: carrying out jet-bedding processing to substrate, and steel disc is bonded on substrate；Step 6: using bending jig to substrate into
Row bending is handled；Step 7: the product of bending is pressed together, 200 DEG C of pressing-in temp, 150 ± 10 DEG C of observed temperature, reality
The pressure time is 20 ± 5s s, real pressure pressure is 10-15Kg, to obtain molding FPC.
As a further improvement of the above technical scheme, in step 1, after being connected up to base material, bending will be treated in advance
The copper in region is carved, to reduce stress during bending.
As a further improvement of the above technical scheme, it in step 1, after being connected up to base material, is opened up on base material
There is location hole, positioned when being handled so as to bending.
As a further improvement of the above technical scheme, it in step 1, after being connected up to base material, is set in wiring region
Put several tie points.
As a further improvement of the above technical scheme, in step 5, before echoing thermosetting glued membrane, in advance by thermosetting glued membrane
It is stored in 2-7 DEG C of temperature, humidity 50-70% environment, and glued membrane is returned before thermosetting glued membrane is echoed and is warmed to room temperature, Ran Houjin
Row echos processing.
As a further improvement of the above technical scheme, thermosetting glued membrane is echoed using preformer, pressing observed temperature 120 ±
10 DEG C, the retention time be more than 5ss, real pressure pressure 10-15Kg
The beneficial effects of the invention are as follows：
The FPC bending molding process of the present invention includes the following steps：Step 1: it is connected up on base material；Step 2: connecting up
Film is fitted on the base material of completion；Step 3: the printing on substrates pressure-sensing glue to fitting over film；Step 4: echo thermosetting
Glued membrane；Step 5: carrying out jet-bedding processing to substrate, and steel disc is bonded on substrate；Step 6: using bending jig to substrate into
Row bending is handled；Step 7: the product of bending is pressed together, to obtain molding FPC.The FPC of the present invention is bent into
The technological process of a FPC bending and moldings of type technological design, and the parameter of selection and the pressing of base material is controlled, it realizes
The overall printing required precision of molding FPC and the undulated control for pressure-sensitive potential difference.
Description of the drawings
Fig. 1 is the flow chart of the flexible FPC bending molding process of the present invention；
Fig. 2 (a) is the structure diagram before the FPC circuit board bendings of the present invention；
Fig. 2 (b) is the structure diagram after the FPC circuit board bendings of the present invention；
Fig. 3 is the structure diagram before single bending region bending in one embodiment；
Fig. 4 is the structure diagram before single bending region bending in another embodiment.
Specific embodiment
The technique effect of the design of the present invention, concrete structure and generation is carried out below with reference to embodiment and attached drawing clear
Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright part of the embodiment rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art is not paying
The other embodiment obtained under the premise of creative work, belongs to the scope of protection of the invention.In addition, it is arrived involved in patent
All connection/connection relations, not singly refer to component and directly connect, and refer to can according to specific implementation situation, by addition or
Couple auxiliary is reduced, to form more preferably coupling structure.Each technical characteristic in the present invention, before not conflicting conflict
Putting can be with combination of interactions.
Such as Fig. 1, show the flow chart of the FPC bending molding process of the present invention, include the following steps：S100, in base
Connected up on material, to be prepared into the flexible PCB for treating bending, it should be noted that when, base material includes middle layer and fixed
Outer layer in middle layer two sides.
Preferably, the material of two outer layers is copper, and the thickness of the copper coin of outer layer is 12um, and the material of middle layer is poly-
Acid imide, thickness 20um, it should be noted that polyimides is that a kind of reliability, flexibility, electric property etc. are comprehensive
The outstanding dielectric material of energy is handled the bending of PFC convenient for the later stage.
During due to carrying out bending processing to base material, the copper in the bending region of base material can cause bending region there are stress
Effect influences the bending effect of PFC, for this purpose, after wiring processing is carried out to base material, it preferably will be in the bending region of substrate
Copper etch away, to reduce stress.
In addition, on base material, the both sides of PFC be symmetrically arranged with location hole, when being bent to base material, make two after bending
The location hole of side overlaps, so as to ensure to bend precision.
S110 fits over film on the base material of wiring completion.
S120, in the printing on substrates pressure-sensing glue for being bonded cover film.
S130 after printing pressure-sensing glue, continues to echo thermosetting glued membrane on base material.Before thermosetting glued membrane is echoed, heat
Solid glue film is first in the ambient storage of temperature 2-7 degree, humidity 50-70%, when in use, first thermosetting glued membrane is taken out and rise again to
Room temperature tears glued membrane release paper after rising again, then fit in glued membrane on substrate surface according to position of positioning hole, then by glued membrane
It is pressed on base material, it should be noted that during positioning, glued membrane should be avoided to touch pressure-sensing glue position.
In the present embodiment, stitching operation carries out in than high preformer, and stitching operation is carried out according to specific parameter, setting
Temperature is 160 DEG C, and wherein observed temperature is 120 ± 10 DEG C, and the retention time is more than 5s, and the real pressure time is 15s, and real pressure pressure is
10-15Kg。
S140 carries out jet-bedding processing, and steel disc is bonded on base material to base material, and in the present embodiment, jet-bedding operation is punching
Full slot, for this purpose, being provided with tie point in bending region, tie point is set in a manner that dislocation is placed, and can be improved in this way
Whole pulling force, convenient for subsequently carrying out bending process, it is also possible to save the time subsequently cut and cost.
S150 carries out bending process.Before bending process, pre-set and bending that product to be bent matches is controlled
Tool, one layer of silica gel of surface bonding of the bending jig is filled, during subsequently to press, product be pressurized it is more uniform, meanwhile,
Jig surface is also bonded with release film and is isolated, and avoids hot-die glued membrane at high temperature, and excessive glue bonds the surface of jig, in addition,
Jig uses aluminium sheet material, to promote the heat-conducting effect of jig.
Preferably, before the bend, precheck the requirement whether bending jig, silica gel, thermosetting glued membrane etc. meet bending.
S160, the product completed to bending are pressed together, and in the present embodiment, this is pressed together is carried out using preformer
Pressing, during pressing, set temperature is 200 DEG C, and it is 150 ± 10 DEG C to ensure observed temperature, and real to press the time be 20 ± 5s, real pressure pressure
For 10-15Kg.
Such as Fig. 2, the structure diagram that bending and molding is carried out to the FPC of whole plate is shown, Fig. 2 (a) is the FPC plates before bending
Structure diagram, Fig. 2 (b) be bending after FPC plate structure schematic diagrams, wherein the FPC plates include whole plate 1, set in whole plate 1
4 FPC bending regions 10 are equipped with, such as Fig. 2 (a), on substrate 1, corresponding to symmetrically being set at two side positions of each bending region 10
Several location holes 100 are equipped with, in bending, for being positioned to the bending region 10, ensure the precision of bending, each bending
Several steel discs 101 are arranged at intervals in region 10, and the wherein one end alignment of several steel discs 103 is placed in the center line of bending region 10
On, in this way, during bending only bending processing need to be carried out along the end of several steel discs 101, carried out further with location hole 100 after bending
Localization process, can both ensure the precision of bending.
Such as Fig. 3, show the structure chart before single FPC bendings, lying copper region 11, lying copper region 11 are provided in bending region 10
Presence the stress being subject to during FPC bendings can be caused excessive, so as to influence the effect of bending, for this purpose, bending before will first cover copper
The copper in area 11 etches away, and then carries out bending processing, to reduce stress during bending,
Such as Fig. 4, during single FPC bendings, also dislocation is placed with several tie points 102 in each bending region 10,
Due in bending process, needing jet-bedding processing to be carried out to base material, and the jet-bedding process is to rush full slot, for this purpose, pre-setting connection
Point to ensure the pulling force at tie point position, can facilitate bending process, while also allow for subsequently cutting tie point,
Save process time.
It is presently preferred embodiments of the present invention to be illustrated, but the present invention is not limited to the embodiment above,
Those skilled in the art can also make various equivalent variations or replacement under the premise of without prejudice to spirit of the invention, this
Equivalent deformation or replacement are all contained in the application claim limited range a bit.
Claims (6)
1. a kind of FPC bending molding process, which is characterized in that include the following steps：
Step 1: selection substrate material, the base material include intermediate base layer and the outer layer positioned at the intermediate base layer both sides,
The intermediate base layer is 20um polyimides, and the outer layer is 12um copper, is connected up on base material；
Step 2: fit over film on the base material completed in wiring；
Step 3: the printing on substrates pressure-sensing glue to fitting over film；
Step 4: echo thermosetting glued membrane；
Step 5: carrying out jet-bedding processing to substrate, and steel disc is bonded on substrate；
Step 6: bending processing is carried out to substrate using bending jig；
Step 7: the product of bending is pressed together, 200 DEG C of pressing-in temp, 150 ± 10 DEG C of observed temperature, real pressure time
It is 10-15Kg for 20 ± 5s s, real pressure pressure, to obtain molding FPC.
2. FPC bending molding process according to claim 1, it is characterised in that：In step 1, connected up to base material
Afterwards, in advance the copper of area to be bent is carved, to reduce stress during bending.
3. FPC bending molding process according to claim 1, it is characterised in that：In step 1, connected up to base material
Afterwards, location hole is offered on base material, is positioned when being handled so as to bending.
4. FPC bending molding process according to claim 1, it is characterised in that：In step 1, connected up to base material
Afterwards, several tie points are set in wiring region.
5. FPC bending molding process according to claim 1, it is characterised in that：In step 5, echo thermosetting glued membrane it
Before, thermosetting glued membrane is stored in 2-7 DEG C of temperature, humidity 50-70% environment in advance, and by glued membrane before thermosetting glued membrane is echoed
It returns and warms to room temperature, then carry out echoing processing.
6. FPC bending molding process according to claim 1, it is characterised in that：Thermosetting glued membrane is echoed using preformer, is pressed
Close 120 ± 10 DEG C of observed temperature, the retention time is more than 5s, real pressure pressure 10-15Kg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711261829.7A CN108260280B (en) | 2017-12-04 | 2017-12-04 | FPC bending forming process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711261829.7A CN108260280B (en) | 2017-12-04 | 2017-12-04 | FPC bending forming process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108260280A true CN108260280A (en) | 2018-07-06 |
| CN108260280B CN108260280B (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711261829.7A Active CN108260280B (en) | 2017-12-04 | 2017-12-04 | FPC bending forming process |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109821938A (en) * | 2019-01-23 | 2019-05-31 | 深圳市中软信达电子有限公司 | A kind of processing method of novel bending steel disc |
| CN111146030A (en) * | 2020-01-10 | 2020-05-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of novel side key product |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080106400A1 (en) * | 2006-11-03 | 2008-05-08 | Hunter Steve B | Tamper respondent sensor and enclosure |
| CN101360386A (en) * | 2007-08-03 | 2009-02-04 | 富葵精密组件(深圳)有限公司 | Circuit board binding glue layer and circuit board comprising the glue layer |
| CN101945540A (en) * | 2009-07-09 | 2011-01-12 | 厦门达尔电子有限公司 | Flexibility circuit board FPC finger folding bonding method and special tool |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| US20120257307A1 (en) * | 2011-04-06 | 2012-10-11 | Kota Tokuda | Electronic component and electronic device |
| CN203661417U (en) * | 2014-01-14 | 2014-06-18 | 厦门爱谱生电子科技有限公司 | Flexible circuit board spliced board structure and punching mould |
| CN204031572U (en) * | 2014-07-02 | 2014-12-17 | 昆山圆裕电子科技有限公司 | Notebook computer flexible circuit board |
| US20160126010A1 (en) * | 2011-06-15 | 2016-05-05 | James Jen-Ho Wang | Flexible circuit assembly and method therof |
| CN206402539U (en) * | 2016-12-29 | 2017-08-11 | 深圳市新宇腾跃电子有限公司 | A kind of manual reflexed frocks of FPC DOME |
| CN107065423A (en) * | 2010-10-08 | 2017-08-18 | Lg伊诺特有限公司 | Three-dimensional image acquisition apparatus and its manufacture method |
| CN206575671U (en) * | 2017-01-20 | 2017-10-20 | 奥斯比电子（深圳）有限公司 | Point plate blast resistance construction of FPC plates |
-
2017
- 2017-12-04 CN CN201711261829.7A patent/CN108260280B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080106400A1 (en) * | 2006-11-03 | 2008-05-08 | Hunter Steve B | Tamper respondent sensor and enclosure |
| CN101360386A (en) * | 2007-08-03 | 2009-02-04 | 富葵精密组件(深圳)有限公司 | Circuit board binding glue layer and circuit board comprising the glue layer |
| CN101945540A (en) * | 2009-07-09 | 2011-01-12 | 厦门达尔电子有限公司 | Flexibility circuit board FPC finger folding bonding method and special tool |
| CN107065423A (en) * | 2010-10-08 | 2017-08-18 | Lg伊诺特有限公司 | Three-dimensional image acquisition apparatus and its manufacture method |
| US20120257307A1 (en) * | 2011-04-06 | 2012-10-11 | Kota Tokuda | Electronic component and electronic device |
| US20160126010A1 (en) * | 2011-06-15 | 2016-05-05 | James Jen-Ho Wang | Flexible circuit assembly and method therof |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| CN203661417U (en) * | 2014-01-14 | 2014-06-18 | 厦门爱谱生电子科技有限公司 | Flexible circuit board spliced board structure and punching mould |
| CN204031572U (en) * | 2014-07-02 | 2014-12-17 | 昆山圆裕电子科技有限公司 | Notebook computer flexible circuit board |
| CN206402539U (en) * | 2016-12-29 | 2017-08-11 | 深圳市新宇腾跃电子有限公司 | A kind of manual reflexed frocks of FPC DOME |
| CN206575671U (en) * | 2017-01-20 | 2017-10-20 | 奥斯比电子（深圳）有限公司 | Point plate blast resistance construction of FPC plates |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109821938A (en) * | 2019-01-23 | 2019-05-31 | 深圳市中软信达电子有限公司 | A kind of processing method of novel bending steel disc |
| CN111146030A (en) * | 2020-01-10 | 2020-05-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of novel side key product |
| CN111146030B (en) * | 2020-01-10 | 2022-02-08 | 深圳市景旺电子股份有限公司 | Manufacturing method of side key product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108260280B (en) | 2020-12-01 |
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